PIC32MX550F256H-50I/MR - 50MHz 256KB Flash 32-bit MCU | Microchip
MPN: PIC32MX550F256H-50I/MR ✓ AktifPIC32MX550F256H-50I/MR Ringkasan
A 32-bit microcontroller (MCU) is an integrated processor core, program memory, data memory, and peripherals on a single die. Within the broader taxonomy of embedded semiconductors, this device belongs to the application-specific microcontroller category, which itself sits inside the integrated circuit (IC) hierarchy of power-managed mixed-signal processors used in embedded systems. Microcontrollers in the PIC32MX class target HMI (human-machine interface) applications with audio, graphics, and touch peripherals.
Key differentiating features include Peripheral Pin Select (PPS) for flexible signal routing, dual CAN 2.0B modules with DeviceNet addressing, 16-channel 10-bit ADC at 1 Msps, and a Charge Time Measurement Unit (CTMU) for capacitive touch. The integrated USB 2.0 Full-Speed OTG controller enables device/host/OTG roles without external PHY. The 64-pin QFN package supports compact PCB layouts while exposing ample I/O for parallel interfaces.
Architecturally, the device uses a MIPS32 M4K Harvard-style core with 5-stage pipeline, separate instruction and data paths, hardware multiply/divide, and zero overhead looping. The 50 MHz core provides 83 DMIPS, sufficient for protocol stacks and moderate DSP loads. The integrated DMA controller offloads data movement from the CPU.
Typical applications include industrial control with CAN bus connectivity, USB-based human interface devices, audio playback systems using I2S codecs, and low-cost graphics terminals with PMP-driven LCDs. The PPS remapping and dual CAN modules make it suitable for automotive body electronics and building automation.
When designing with this MCU, allocate at least one 10uF bulk and one 0.1uF decoupling capacitor adjacent to each power pin pair, route the 50 MHz crystal traces symmetrically, and use a 4-layer PCB with continuous ground pour under the QFN thermal pad to manage dissipation.
This page consolidates distributor pricing, drop-in same-package alternates, and practical design considerations beyond the manufacturer datasheet to accelerate sourcing and design-in decisions.
Alternatif penggantian untuk PIC32MX550F256H-50I/MR — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC32MX550F256H-50I/MR (sama faktor bentuk dan footprint) — berbeda di dalam Package, USB, Operating Temperature, Parallel Master Port (PMP), ADC.
PIC32MX570F512H-50I/MR
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX550F256H-50I/PT
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX550F256HT-50I/MR
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX550F256H-V/MR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC32MX570F512L-50I/MR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC32MX450F256H-50I/MR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC32MX550F256H-50I/MR Rating Maksimal & Karakteristik Listrik
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| Data SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Paket | 64-pin QFN (9x9 mm) |
| Tipe Mounting | Surface Mount |
| Suhu Kerja | -40C to +85C (Industrial) |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | CAN 2.0B active with DeviceNet addressing |
| I2S / SPI | Two I2S and up to four SPI modules |
| PMP | Parallel Master Port with dual read/write buffers |
| Peripheral Pin Select | Yes (PPS remap) |
| ADC | 10-bit, up to 1 Msps, 16 channels |
| Touch Sensing | CTMU (Capacitive Touch) |
| DMA | Yes |
| Status RoHS | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020) |
Konfigurasi Pin PIC32MX550F256H-50I/MR
| Pin produk 1 | RB15 — I/O port B bit 15 |
| Pin produk 2 | VSS — Ground reference |
| Pin produk 3 | VDD — Supply voltage 2.3-3.6V |
| Pin produk 4 | RB14 — I/O port B bit 14 |
| Pin produk 5 | RB13 — I/O port B bit 13 |
| Pin produk 6 | RB12 — I/O port B bit 12 |
| Pin produk 7 | RB11 — I/O port B bit 11 |
| Pin produk 8 | RB10 — I/O port B bit 10 |
| Pin produk 9 | RB9 — I/O port B bit 9 |
| Pin produk 10 | RB8 — I/O port B bit 8 |
| Pin produk 11 | RB7 — I/O port B bit 7 |
| Pin produk 12 | RB6 — I/O port B bit 6 |
| Pin produk 13 | RB5 — I/O port B bit 5 |
| Pin produk 14 | RB4 — I/O port B bit 4 |
| Pin produk 15 | RB3 — I/O port B bit 3 |
| Pin produk 16 | RB2 — I/O port B bit 2 |
| Pin produk 17 | RB1 — I/O port B bit 1 |
| Pin produk 18 | RB0 — I/O port B bit 0 |
| Pin produk 19 | VSS — Ground reference |
| Pin produk 20 | VDD — Supply voltage 2.3-3.6V |
| Pin produk 21 | RF0 — I/O port F bit 0 |
| Pin produk 22 | RF1 — I/O port F bit 1 |
| Pin produk 23 | RD11 — I/O port D bit 11 |
| Pin produk 24 | RD10 — I/O port D bit 10 |
| Pin produk 25 | RD9 — I/O port D bit 9 |
| Pin produk 26 | RD8 — I/O port D bit 8 |
| Pin produk 27 | RD7 — I/O port D bit 7 |
| Pin produk 28 | RD6 — I/O port D bit 6 |
| Pin produk 29 | RD5 — I/O port D bit 5 |
| Pin produk 30 | RD4 — I/O port D bit 4 |
| Pin produk 31 | RD3 — I/O port D bit 3 |
| Pin produk 32 | RD2 — I/O port D bit 2 |
| Pin produk 33 | RD1 — I/O port D bit 1 |
| Pin produk 34 | RD0 — I/O port D bit 0 |
| Pin produk 35 | RC15 — I/O port C bit 15 |
| Pin produk 36 | RC14 — I/O port C bit 14 |
| Pin produk 37 | RC13 — I/O port C bit 13 |
| Pin produk 38 | VSS — Ground reference |
| Pin produk 39 | VDD — Supply voltage 2.3-3.6V |
| Pin produk 40 | RC12 — I/O port C bit 12 |
| Pin produk 41 | RC11 — I/O port C bit 11 |
| Pin produk 42 | RC10 — I/O port C bit 10 |
| Pin produk 43 | RC9 — I/O port C bit 9 |
| Pin produk 44 | RC8 — I/O port C bit 8 |
| Pin produk 45 | RC7 — I/O port C bit 7 |
| Pin produk 46 | RC6 — I/O port C bit 6 |
| Pin produk 47 | RC5 — I/O port C bit 5 |
| Pin produk 48 | RC4 — I/O port C bit 4 |
| Pin produk 49 | RC3 — I/O port C bit 3 |
| Pin produk 50 | RC2 — I/O port C bit 2 |
| Pin produk 51 | RC1 — I/O port C bit 1 |
| Pin produk 52 | RC0 — I/O port C bit 0 |
| Pin produk 53 | RA15 — I/O port A bit 15 |
| Pin produk 54 | RA14 — I/O port A bit 14 |
| Pin produk 55 | RA9 — I/O port A bit 9 |
| Pin produk 56 | RA10 — I/O port A bit 10 |
| Pin produk 57 | RA7 — I/O port A bit 7 |
| Pin produk 58 | RA6 — I/O port A bit 6 |
| Pin produk 59 | RA5 — I/O port A bit 5 |
| Pin produk 60 | RA4 — I/O port A bit 4 |
| Pin produk 61 | RA3 — I/O port A bit 3 |
| Pin produk 62 | RA2 — I/O port A bit 2 |
| Pin produk 63 | RA1 — I/O port A bit 1 |
| Pin produk 64 | RA0 — I/O port A bit 0 |
Aplikasi Umum
PIC32MX550F256H-50I/MR cocok untuk 6 aplikasis: USB Audio Device (USB Headset / Speakerphone), Industrial CAN Node (Building Automation, Body Electronics), Graphics Terminal with PMP-driven LCD, Capacitive Touch HMI Panel, IoT Sensor Hub with USB Diagnostic Port, Automotive Body Electronics (Non-Circuit Infotainment).
USB Audio Device (USB Headset / Speakerphone)
The PIC32MX550F256H-50I/MR fits USB audio class designs because it integrates a USB 2.0 Full-Speed OTG controller plus two I2S modules, removing the need for a dedicated audio bridge IC. At 50 MHz and 83 DMIPS, the MIPS M4K core comfortably handles isochronous USB audio endpoints, sample-rate conversion, and basic DSP such as AEC or EQ at 48 kHz. The 256 KB Flash accommodates USB stack plus I2S driver, while 64 KB SRAM buffers stereo 16-bit/48 kHz streams without overrun.
Direkomendasikan
Industrial CAN Node (Building Automation, Body Electronics)
The PIC32MX550F256H-50I/MR is engineered for CAN-based industrial nodes with its integrated CAN 2.0B active controller supporting DeviceNet addressing filters. Engineers can attach the MCU directly to a CAN transceiver like MCP2551 without an external CAN controller, saving BOM cost. The 50 MHz core and 83 DMIPS run CANopen or DeviceNet stacks with margin for application logic. PPS allows flexible assignment of CAN RX/TX pins, easing PCB layout in dense enclosures.
Direkomendasikan
Graphics Terminal with PMP-driven LCD
The PIC32MX550F256H-50I/MR drives small graphical LCDs through its Parallel Master Port (PMP) with dual read/write buffers, allowing sustained frame buffer updates without CPU stall. At 50 MHz, it can refresh QVGA (320x240) panels over an 8-bit PMP bus while leaving headroom for touch processing via the CTMU peripheral. The 64 KB SRAM holds compact frame buffers without external memory. PPS allows flexible mapping of PMP data lines.
Direkomendasikan
Capacitive Touch HMI Panel
The PIC32MX550F256H-50I/MR integrates the Charge Time Measurement Unit (CTMU) for self- and mutual-capacitive touch sensing, supporting up to 16 touch channels without an external touch controller. Combined with the on-chip 10-bit ADC, it can read both touch and analog sliders in a single scan cycle. PPS routes the CTMU outputs to any GPIO, which simplifies PCB layout of touch electrodes under a glass overlay.
Direkomendasikan
IoT Sensor Hub with USB Diagnostic Port
The PIC32MX550F256H-50I/MR aggregates analog and digital sensors in industrial IoT hubs using its 16-channel 10-bit ADC, four UARTs, and USB OTG for diagnostic access. The 50 MHz core runs MQTT-SN or CoAP stacks over UART-to-WiFi bridges. PPS allows I2C, SPI, and UART to be remapped to any GPIO, enabling flexible sensor board layouts without respinning the PCB.
Direkomendasikan
Automotive Body Electronics (Non-Circuit Infotainment)
The PIC32MX550F256H-50I/MR's industrial -40C to +85C rating and CAN 2.0B controller suit body-electronics modules such as seat controllers, mirror adjusters, and lighting nodes when full AEC-Q100 is not required. The integrated PMP and CTMU can drive LED matrix clusters with capacitive touch. The 64-pin QFN package is compact enough for behind-panel mounting in 12V vehicle subsystems.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC32MX550F256H-50I/MR — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC32MX570F512H-50I/MR | PIC32MX570F512L-50I/MR | PIC32MX450F256H-50I/MR | PIC32MX550F256HT-50I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9) | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same |
| Flash Memory | 256 KB | 512 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | CAN 2.0B | CAN 2.0B | CAN 2.0B | No CAN | CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferensiator Kunci
- Integrated CAN 2.0B with DeviceNet addressing (vsPIC32MX450F256H-50I/MR)
- 50 MHz vs 40 MHz sibling (vsPIC32MX550F256H-I/MR)
- 256 KB Flash with USB OTG and PMP dual buffers (vsPIC32MX270F256H-50I/MR)
Catatan Desain
Estimated: at 50 MHz CPU and 3.3V supply, the core draw is approximately 30 mA (1.6 mA/MHz per Microchip family datasheet). Place one 10uF X7R ceramic bulk capacitor at the regulator output and 0.1uF decoupling within 5 mm of every VDD/VSS pair. For USB applications, also decouple the VBUS line with a 10uF tantalum and protect VBUS with a TVS diode.
The 64-pin QFN (9x9) has a center EP pad that must be soldered to a continuous ground copper pour on the PCB to meet thermal and electrical performance. Without the EP pad soldered, the die temperature can rise 15-20C above ambient at full CPU load. For 4-layer PCBs, use 2 oz copper on top and bottom layers under the device, with stitched vias through the inner ground plane.
Route the 8 MHz primary oscillator traces (OSC1/OSC2) symmetrically with respect to ground, keeping them shorter than 10 mm and away from USB and switching power traces. The optional 32.768 kHz secondary oscillator should use a guard ring tied to analog ground. Both crystal traces must be referenced to a continuous ground plane on the adjacent layer with no signal traces crossing.
Do not confuse the '-50I/MR' suffix: the '-50' denotes 50 MHz, 'I' denotes industrial -40C to +85C temperature, and 'MR' denotes the 64-pin QFN (9x9) package. A common mistake is to specify the 40 MHz '-I/MR' variant when 50 MHz performance is required. Also, when migrating to the PIC32MX570F512H-50I/MR, update the linker script to reflect the new memory map - the larger Flash starts at the same base address but extends higher.
Informasi Konformitas
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive applications.
