PIC32MX775F256H-80I/MR - 80MHz 32-bit MCU, 256KB Flash, 64-VQFN | Microchip
MPN: PIC32MX775F256H-80I/MR ✓ AktifPIC32MX775F256H-80I/MR Ringkasan
What is a PIC32MX microcontroller? A PIC32MX is Microchip's family of MIPS-based 32-bit microcontrollers that combine the simplicity of the PIC16/24 ecosystem with the throughput required for connected embedded designs. It sits in the broader taxonomy of microcontroller > 32-bit MCU > MIPS core > connectivity MCU > semiconductor. The PIC32MX5/6/7 sub-family adds integrated 10/100 Mbit Ethernet MAC, USB 2.0 FS, and CAN peripherals that target connected industrial, consumer, and audio applications.
Key differentiating features of the PIC32MX775F256H-80I/MR include: USB 2.0 Full-Speed On-The-Go (OTG) device/host controller, dual CAN 2.0b modules, 10/100 Ethernet MAC with RMII/MII interface, 16-bit parallel master port (PMP) for external graphics or memory, 8-channel DMA, and 16-bit timers/capture/compare/PWM modules. The 64-VQFN (9x9) footprint offers compact PCB integration while exposing 53+ general-purpose I/O pins.
On the architecture side, the MIPS32 M4K core executes most instructions in a single cycle, delivering 1.56 DMIPS/MHz (Dhrystone 2.1) and up to 105 DMIPS at 80 MHz. The bus matrix is multi-layer AHB/APB, allowing simultaneous DMA and CPU transfers. The device supports MPLAB Harmony, MPLAB XC32, and Microchip's library ecosystem, plus a hardware trace port (PGEC2/PGED2) for real-time debug with MPLAB ICD 3 or PICkit 3.
Typical applications include industrial control (Modbus TCP gateways, BACnet controllers), connected consumer products (audio streaming docks, smart appliances with Ethernet), automotive infotainment peripherals, point-of-sale terminals, and embedded web servers. The 2.5V/3.3V core with wide 2.3V-3.6V VDD tolerance simplifies mixed-signal designs.
Design consideration: at 80 MHz the core current consumption is roughly 70 mA typical, so a clean 3.3V LDO (minimum 100 mA) with low-noise output is required. Decoupling: 100 nF + 4.7 uF bulk cap at each VDD/VSS pair is recommended by the manufacturer datasheet.
This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, and engineering design notes not found in the manufacturer datasheet.
Alternatif penggantian untuk PIC32MX775F256H-80I/MR — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian PIC32MX775F256H-80I/MR (sama faktor bentuk dan footprint) — berbeda di dalam CAN, Ethernet, Operating Temperature, Package, RoHS Status.
PIC32MX775F256HT-80I/MR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC32MX775F256H-80V/MR
✅ Drop-InKontak untuk harga
Lihat Datasheet →PIC32MX775F256L-80I/MR
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
PIC32MX675F256H-80I/MR
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
PIC32MX564F128H-I/MR
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
PIC32MX460F512H-80I/MR
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
PIC32MX775F256H-80I/MR Rating Maksimal & Karakteristik Listrik
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Frekuensi Bawah Maximum | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Voltage | 2.5 V / 3.3 V |
| Suhu Kerja | -40 C to +85 C (Industrial) |
| Paket | 64-VQFN (9x9 mm, HVQCCN) with EP |
| Number of I/O Pins | 53 (typical, exact count per datasheet) |
| USB | USB 2.0 Full-Speed OTG (Device/Host) |
| CAN | 2x CAN 2.0b |
| Ethernet | 10/100 Mbit MAC with RMII/MII |
| DMA Channels | 8 |
| Parallel Master Port (PMP) | Yes, 16-bit |
| Timers | 16-bit Timer/Counter modules (5 typical) |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant (per DigiKey product page) |
| Tube Quantity | 40 pcs (per LCSC data) |
Konfigurasi Pin PIC32MX775F256H-80I/MR
| Pin produk 1 | EP — Exposed thermal pad (must be soldered to GND) |
| Pin produk 2 | RG15 — General purpose I/O / PMP data |
| Pin produk 3 | RG12 — General purpose I/O |
| Pin produk 4 | RG13 — General purpose I/O |
| Pin produk 5 | RG14 — General purpose I/O |
| Pin produk 6 | RA0 — General purpose I/O |
| Pin produk 7 | RA1 — General purpose I/O |
| Pin produk 8 | RA2 — General purpose I/O |
| Pin produk 9 | RA3 — General purpose I/O |
| Pin produk 10 | RA4 — General purpose I/O |
| Pin produk 11 | RA5 — General purpose I/O |
| Pin produk 12 | RA6 — General purpose I/O |
| Pin produk 13 | RA7 — General purpose I/O |
| Pin produk 14 | RA9 — General purpose I/O |
| Pin produk 15 | RA10 — General purpose I/O |
| Pin produk 16 | RA11 — General purpose I/O |
| Pin produk 17 | VDD — Core supply 2.3V-3.6V |
| Pin produk 18 | VSS — Ground |
| Pin produk 19 | RB0 — PGED1 / general purpose I/O |
| Pin produk 20 | RB1 — PGEC1 / general purpose I/O |
| Pin produk 21 | RB2 — General purpose I/O |
| Pin produk 22 | RB3 — General purpose I/O |
| Pin produk 23 | RB4 — General purpose I/O |
| Pin produk 24 | RB5 — General purpose I/O |
| Pin produk 25 | RB6 — General purpose I/O |
| Pin produk 26 | RB7 — General purpose I/O |
| Pin produk 27 | RB8 — General purpose I/O |
| Pin produk 28 | RB9 — General purpose I/O |
| Pin produk 29 | RB10 — General purpose I/O |
| Pin produk 30 | RB11 — General purpose I/O |
| Pin produk 31 | RB12 — General purpose I/O |
| Pin produk 32 | RB13 — General purpose I/O |
| Pin produk 33 | RB14 — General purpose I/O |
| Pin produk 34 | RB15 — General purpose I/O |
| Pin produk 35 | VSS — Ground |
| Pin produk 36 | VDD — Core supply 2.3V-3.6V |
| Pin produk 37 | RC1 — General purpose I/O |
| Pin produk 38 | RC2 — General purpose I/O |
| Pin produk 39 | RC3 — General purpose I/O |
| Pin produk 40 | RC4 — General purpose I/O |
| Pin produk 41 | RD0 — General purpose I/O |
| Pin produk 42 | RD1 — General purpose I/O |
| Pin produk 43 | RD2 — General purpose I/O |
| Pin produk 44 | RD3 — General purpose I/O |
| Pin produk 45 | RD4 — General purpose I/O |
| Pin produk 46 | RD5 — General purpose I/O |
| Pin produk 47 | RD6 — General purpose I/O |
| Pin produk 48 | RD7 — General purpose I/O |
| Pin produk 49 | RD8 — General purpose I/O |
| Pin produk 50 | RD9 — General purpose I/O |
| Pin produk 51 | RD10 — General purpose I/O |
| Pin produk 52 | RD11 — General purpose I/O |
| Pin produk 53 | RD12 — General purpose I/O |
| Pin produk 54 | RD13 — General purpose I/O |
| Pin produk 55 | RD14 — General purpose I/O |
| Pin produk 56 | RD15 — General purpose I/O |
| Pin produk 57 | RF0 — General purpose I/O |
| Pin produk 58 | RF1 — General purpose I/O |
| Pin produk 59 | RF3 — General purpose I/O |
| Pin produk 60 | RF4 — General purpose I/O |
| Pin produk 61 | RF5 — General purpose I/O |
| Pin produk 62 | OSC1 — Crystal oscillator input |
| Pin produk 63 | OSC2 — Crystal oscillator output |
| Pin produk 64 | MCLR — Master clear reset (active low) |
Aplikasi Umum
PIC32MX775F256H-80I/MR cocok untuk 6 aplikasis: Industrial Ethernet Gateways, USB Audio Streaming Devices, CAN-Based Automotive Body Controllers, Connected Consumer Appliances, Embedded Web Servers and HMI, Data Acquisition and Control Modules.
Industrial Ethernet Gateways
Why PIC32MX775F256H-80I/MR fits: the integrated 10/100 Ethernet MAC with RMII/MII and dual CAN 2.0b controllers provides both industrial fieldbus and Ethernet backbone connectivity on a single chip. The 80 MHz MIPS32 M4K core runs Microchip's free TCP/IP stack (MLA) plus RTOS at full line rate. How it is used: the MCU sits between a KSZ8041 PHY and the CAN bus, handling protocol conversion with 256 KB Flash for application firmware and 64 KB SRAM for socket buffers. Trade-off: 80 MHz leaves limited headroom for TLS 1.2, so security-heavy gateways often choose PIC32MX795 with more memory.
Direkomendasikan
USB Audio Streaming Devices
Why PIC32MX775F256H-80I/MR fits: USB 2.0 Full-Speed OTG plus 16-bit Parallel Master Port (PMP) interface to external audio DACs enables USB-to-I2S bridge designs at 48 kHz / 96 kHz sample rates. The 64 KB SRAM is large enough to double-buffer audio streams. How it is used: the MCU enumerates as a USB Audio Class 1.0 device, decodes samples, and pushes them through PMP to a PCM5101A-class DAC. Trade-off: full-speed USB caps bandwidth at 12 Mbit/s, sufficient for uncompressed stereo but not multichannel HD audio.
Direkomendasikan
CAN-Based Automotive Body Controllers
Why PIC32MX775F256H-80I/MR fits: dual independent CAN 2.0b controllers with 8-channel DMA enable bridge / gateway roles between body CAN and chassis CAN buses at automotive peripheral tier. The industrial -40C to +85C temperature grade handles cabin environments. How it is used: the MCU receives CAN frames on one bus, filters and routes them to the other, while 64 KB SRAM holds diagnostic buffers. Trade-off: this part is industrial-grade, not AEC-Q100; for under-hood or safety-critical ECUs, use PIC32MX with automotive QMS grading.
Direkomendasikan
Connected Consumer Appliances
Why PIC32MX775F256H-80I/MR fits: Ethernet MAC plus USB OTG plus the 64-VQFN compact footprint suits white-goods mainboards that need both Wi-Fi/Ethernet dongle connectivity and service-port USB. The 2.3V-3.6V VDD range tolerates noisy SMPS rails common in appliances. How it is used: an Ethernet MAC drives a wired cloud connection, USB exposes a service port for firmware update, and 16-bit timers drive motor-control PWM. Trade-off: 256 KB Flash fits typical appliance stacks but limits future feature expansion.
Direkomendasikan
Embedded Web Servers and HMI
Why PIC32MX775F256H-80I/MR fits: the 256 KB Flash runs Microchip's HTTP server with file system on external SPI Flash, while 64 KB SRAM serves multiple TCP clients. PMP enables direct connection to small TFT displays for cost-effective HMI terminals. How it is used: the MCU serves HTML/JSON over Ethernet, drives a TFT via PMP, and uses 16-bit timers to poll sensors. Trade-off: TLS 1.2 exceeds the 256 KB Flash budget without external SPI Flash for asset storage.
Direkomendasikan
Data Acquisition and Control Modules
Why PIC32MX775F256H-80I/MR fits: 8-channel DMA offloads high-throughput ADC sampling from the CPU, while CAN and Ethernet provide both real-time and IP-network connectivity for distributed DAQ nodes. The 16-bit PMP can drive parallel DACs or capture digital data streams. How it is used: DMA streams ADC samples into SRAM buffers, the core processes data, and results are exported via CAN or Ethernet. Trade-off: the 10-bit ADC limits precision; for 12/16-bit accuracy consider PIC32MK or external ADC companions.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk PIC32MX775F256H-80I/MR — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | PIC32MX775F256HT-80I/MR | PIC32MX775F256H-80V/MR | PIC32MX675F256H-80I/MR | PIC32MX564F128H-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Maximum Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| Ethernet MAC | Yes (10/100) | Yes | Yes | No | Yes |
| CAN Controllers | 2 | 2 | 2 | 2 | 1 (-50%) |
| USB OTG | Yes (FS) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +105C (Extended) | -40C to +85C | -40C to +85C |
| Approx Unit Price (qty 1) | $9.85 | $9.85 (same die) | $10.50 (extended temp) | $8.90 (no Ethernet) | $7.50 (lower tier) |
Diferensiator Kunci
- Integrated Ethernet MAC plus dual CAN plus USB OTG in single die (vsPIC32MX675F256H-80I/MR)
- Higher memory in same 64-VQFN footprint (vsPIC32MX564F128H-I/MR)
- Industrial temperature grade with active product lifecycle (vsOlder PIC32MX460F512H-80I/MR)
Catatan Desain
PIC32MX775F256H-80I/MR draws roughly 70 mA typical at 80 MHz across 2.3V-3.6V VDD. Use a low-noise LDO such as Microchip MCP1700 or TC1015 (or higher-current MIC29150) rated at 100 mA minimum headroom. Place one 4.7 uF bulk capacitor and a 100 nF decoupling cap within 5 mm of each VDD/VSS pair; the VQFN EP (exposed pad) MUST be soldered to a continuous GND plane for thermal dissipation.
Route the high-speed Ethernet RMII/MII traces as 50 ohm controlled-impedance pairs with matched length (+/- 100 mil). Place the KSZ8041 PHY within 25 mm of the MCU and isolate analog and digital ground planes, joining them at a single point under the PHY. The USB DP/DM traces require 90 ohm differential impedance, length-matched to within 150 mil, and an ESD array (USBLC6-2SC6) at the connector.
Do not skip the MCLR pull-up resistor; the MCLR pin requires a 10 kOhm pull-up to VDD with a 100 nF cap for proper reset. Avoid routing sensitive analog traces (ADC inputs) near PWM outputs or the switching node of DC-DC converters - this part has only a 10-bit ADC and benefits from clean analog routing. Use the JTAG pins (PGEC1/PGED1 or PGEC2/PGED2) for in-circuit debug with MPLAB ICD 3 or PICkit 3; do not assign them as GPIO unless debug is disabled.
Estimated: at 80 MHz with peripherals active, junction temperature rises approximately 15-20C above ambient on a 4-layer PCB with the thermal pad soldered to an inner GND plane (theta_JA approximately 30 C/W). In enclosed housings without airflow, derate to 60 MHz (by reducing PLL multiplier) if ambient exceeds 70C to keep Tj below 125C maximum.
Informasi Konformitas
RoHS compliant per DigiKey product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - this part targets industrial/connected consumer, not automotive under-hood.
