FPGA & CPLD
製品 (6666)
EP2SGX30CF780C6 - Stratix II GX FPGA, 780-BGA, 30K LE | Intel (Altera)
The Intel (formerly Altera) EP2SGX30CF780C6 is a Stratix II GX Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (C6 speed grade, commercial temperature range), integrating approximately 33,880 logic elements, 1,369,728 bits of embedded memory, and 361 user I/O pins. The device belongs to the Stratix II GX family that combines a logic-rich fabric with up to 20 high-speed transceivers operating up to 6.375 Gbps, targeting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and Aurora. The C6 speed grade balances timing margin against power consumption, while the F780 BGA package provides sufficient ball pitch and signal integrity for designs with multi-gigabit serial links and wide parallel memory buses. Programmable via the Quartus II design suite and configured through enhanced passive/active configuration schemes, this part is widely used in prototyping and production hardware where deterministic high-speed serial I/O is required. The device is built on a 1.2 V core, 90 nm process technology with embedded multiplier blocks, TriMatrix memory structures, and DSP blocks optimized for high-throughput signal processing. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic, memory, and I/O resources can be programmed after manufacture, allowing hardware engineers to implement custom digital circuits, parallel processing pipelines, and high-speed interfaces without fabricating an ASIC. In the system hierarchy, an FPGA sits between a microcontroller and a custom ASIC: it provides far higher parallelism and I/O bandwidth than an MCU, while avoiding the non-recurring engineering cost of an ASIC. The Stratix II GX family specifically targets applications requiring both general-purpose logic and multi-gigabit transceivers, positioning it as a power-management-aware programmable alternative to discrete PHY plus FPGA solutions. Key features of the EP2SGX30CF780C6 include up to 6.375 Gbps transceiver data rate, 1.4 Mbits of embedded RAM (TriMatrix), dedicated 18x18 multipliers, and built-in PCI Express hard IP. The device supports DDR/DDR2/QDRII memory interfaces with dedicated DQS circuitry, dynamic phase alignment for source-synchronous interfaces, and signalTap II embedded logic analysis for in-system debug. The F780 package offers 361 user I/Os arranged in 8 I/O banks, providing flexible I/O standard support including LVDS, SSTL, HSTL, and LVCMOS at multiple voltages. Architecturally, the Stratix II GX employs an adaptive logic module (ALM) with 8 inputs per ALM, replacing the 4-input LUT architecture used in earlier Stratix families. This allows tighter logic packing and improved performance on wide fan-in functions. The transceiver blocks embed clock-data recovery (CDR), 8B/10B encoding/decoding, and word-alignment logic, offloading these functions from the fabric and freeing logic resources for application-level processing. Typical applications include wireless baseband processing, high-end test and measurement equipment, broadcast video infrastructure, and PCI Express endpoint cards for industrial control or data acquisition. The 6.375 Gbps transceivers also make it suitable for proprietary chip-to-chip links and backplane serial connectivity in storage or telecom systems. When designing with this device, ensure that the Quartus II fitter pin assignments respect each bank voltage (1.2 V to 3.3 V) and that the transceiver reference clocks are routed with controlled impedance. Thermal management is critical in F780 BGA packages because the bottom-side balls carry both signal and thermal dissipation; refer to the manufacturer thermal model for junction-to-case resistance when calculating heatsink requirements. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not found in the manufacturer datasheet, giving the engineer a single decision-ready resource for the EP2SGX30CF780C6.
EP2SGX30CF780C7 - Stratix II GX FPGA 33K LEs 780-BGA | Intel
The Intel (formerly Altera) EP2SGX30CF780C7 is a Stratix II GX family FPGA integrating 33,000 equivalent logic elements, 1.9 Mbits of embedded memory, and 4 full-duplex 3.125 Gbps multi-gigabit transceivers (MGTs) in a 780-pin flip-chip BGA package. Built on a 90nm process with 1.2V core operation, the device combines high-density programmable logic with embedded serial transceivers, making it a single-chip solution for high-speed serial I/O bridging, baseband processing, and protocol aggregation designs. What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that engineers can re-program after manufacture. The Stratix II GX family extends the Stratix II architecture with embedded multi-gigabit transceivers, positioning the device between pure logic FPGAs and structured ASSPs. Within the broader semiconductor taxonomy, the EP2SGX30CF780C7 belongs to: FPGA -> programmable logic -> digital ASIC alternative -> semiconductor IC. This hypernym chain is important for knowledge graph and AI-search entity matching. Key features include up to 4 transceivers operating from 600 Mbps to 3.125 Gbps, support for PCI Express x1/x4, Serial RapidIO, XAUI, Gigabit Ethernet, and SDI serial protocols without external PHY devices. The device also integrates 4 PLLs, 256 18x18 hardware multipliers (DSP blocks), and supports configuration via passive serial, fast passive parallel, passive parallel asynchronous, and JTAG modes. The CF780 package variant uses a wire-bond or flip-chip BGA with 780 balls on a 1.0 mm pitch. The Stratix II GX architecture uses Adaptive Logic Modules (ALMs) - each ALM contains two combined adaptive look-up tables (ALUTs) that can be partitioned into two independent 4-input LUTs or one 6-input LUT, providing finer-grained logic utilization than traditional 4-LUT FPGA architectures. The 90nm low-k dielectric process enables a 1.2V core voltage with sub-watt static power at room temperature, while I/O banks support 1.5V, 1.8V, 2.5V, and 3.3V standards. Typical applications include multi-gigabit serial backplane bridging, telecom framer/mapper ASIC replacement, military and aerospace signal processing, broadcast video routing, and PCI Express endpoint/root complex prototypes. The integrated transceivers are also well suited to test equipment where protocol-agnostic serial I/O is required. Designers in industrial imaging, medical imaging, and software-defined radio also benefit from the high DSP multiplier count combined with the serial bandwidth. A primary design consideration is power estimation: at 3.125 Gbps all 4 transceivers active, the EP2SGX30CF780C7 typically dissipates 3-5W from the transceiver supply and 0.5-1.5W from logic and clock resources, requiring a 6-8 layer PCB with dedicated power planes and 1oz copper on outer layers. The C7 speed grade provides faster Fmax than C6 but at higher static power. The C7N/C7 commercial temperature grade (0C to +85C) differs from I4/I5 industrial (-40C to +100C) variants. This page synthesizes Altera datasheet parameters, Stratix II GX handbook guidance, and drop-in alternative MPNs from the same Stratix II GX family not found in single-page distributor listings.
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I3 is a high-performance Field-Programmable Gate Array (FPGA) from the Stratix II GX family, delivering 33,880 logic cells / 33,880 Logic Array Blocks (LABs), up to 622.08 MHz internal frequency, and embedded transceivers in a 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) package. What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed serial interfaces on a single die. Stratix II GX sits in Altera's high-end transceiver-equipped FPGA hierarchy (Stratix II -> Stratix II GX -> Stratix III GX), built on a 90 nm CMOS process with 1.2 V core voltage. The 'GX' suffix specifically denotes integrated multi-gigabit transceivers, which differentiate this family from logic-only Stratix II devices. Key features include 33,880 logic cells, 361 user I/O pins, embedded 6.375 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and 90 nm CMOS process technology. The 'I3' suffix indicates an industrial temperature grade (–40 °C to +85 °C ambient), while 'CF780' designates the 780-ball flip-chip BGA package. The architecture combines ALM (Adaptive Logic Module) blocks with TriMatrix memory, supporting both distributed and block RAM. The integrated transceivers support common serial protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, while the 90 nm process balances die size and dynamic power for high-density designs. Total internal memory and DSP block counts scale with the 33,880-cell capacity. Typical applications include telecommunications line cards, high-end test and measurement equipment, broadcast video processing, and PCI Express-based add-in cards. The transceiver capability also makes it suitable for backplane aggregation and high-speed serial bridging between FPGAs. When designing with this device, pay close attention to the transceiver reference clock architecture, power-sequencing requirements (1.2 V core, separate transceiver and I/O rails), and signal-integrity guidelines for the 1.0 mm-pitch BGA. A multi-layer PCB with controlled-impedance routing is required to meet transceiver performance targets. This page synthesizes distributor availability, drop-in same-package alternatives from the Stratix II GX lineup, and practical design considerations that go beyond the manufacturer datasheet, helping engineers evaluate the part against newer Cyclone and Stratix families.
EP2SGX30CF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I4 is a high-performance Field-Programmable Gate Array (FPGA) from the Stratix II GX family, featuring 33,880 logic elements and 33,880 configurable logic blocks (CLBs) in a 780-ball FineLine BGA (FBGA) package. The device is built on a 90 nm CMOS process and operates at a maximum internal clock frequency of 622.08 MHz with a core supply voltage range of 1.15 V to 1.25 V. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and routing interconnects after manufacturing. FPGAs sit between fixed-function ASICs (higher performance, higher NRE cost) and microcontrollers (slower, lower cost) in the programmable logic hierarchy. The Stratix II GX sub-family specifically adds embedded multi-gigabit transceivers (MGTs), positioning it between the original Stratix II (logic-only) and the broader programmable logic taxonomy that ultimately derives from standard-cell ASIC families. Key features of the EP2SGX30CF780I4 include 33,880 logic elements, embedded transceiver channels supporting high-speed serial I/O, embedded memory blocks (M4K/M-RAM), embedded multipliers (DSP blocks), and 1.2 V core operation. The industrial temperature grade (I4 suffix) supports an operating range of -40 °C to +85 °C. The 780-ball FBGA package measures 29 x 29 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs. The Stratix II GX architecture uses an adaptive logic module (ALM) approach with a fixed 1.2 V core, distinguishing it from later 65 nm Stratix III/IV families. Embedded transceivers can support multi-gigabit serial protocols, and the device integrates dedicated hardware for DDR/DDR2 memory interfaces. The 90 nm process technology represents an earlier node generation relative to current 28 nm/14 nm Intel Cyclone and Stratix families. Typical applications include high-speed serial interface bridging, telecom line cards, industrial imaging and video processing, military radar prototyping, and embedded DSP pipelines. The combination of logic density, transceiver capability, and the industrial temperature grade makes this device a common choice for legacy long-life-cycle systems where re-design costs are prohibitive. When designing with this device, ensure the Quartus II design tool (or a compatible modern equivalent that still supports the legacy Stratix II family) is used. Power sequencing on the 1.2 V core rail must follow the Stratix II GX handbook guidance, and the FBGA-780 footprint requires multi-layer PCB stack-up with controlled-impedance routing for transceiver channels. This page synthesizes distributor pricing, drop-in same-family alternatives, application guidance, and design notes not collated in the original manufacturer datasheet.
EP2SGX30CF780I4N - 33.88K LE Stratix II GX FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I4N is a high-density Stratix II GX FPGA delivering 33,880 logic elements in a 780-ball FineLine BGA package with 1.0 mm ball pitch and a 29 x 29 mm body. Built on a 90 nm CMOS process with a 1.15 V to 1.25 V core supply, the device integrates up to 4 embedded transceivers capable of multi-gigabit serial I/O, making it a workhorse for high-bandwidth serial connectivity in legacy telecom and industrial backplane designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, routing interconnect, and dedicated hard IP into a single semiconductor die. FPGAs belong to the broader taxonomy of programmable logic devices (PLD), which also includes Complex Programmable Logic Devices (CPLD). Within digital semiconductors, FPGAs sit above fixed-function ASICs in flexibility and below them in per-unit cost. Stratix II GX sits within Intel's high-performance FPGA family, optimized for serial connectivity and DSP workloads. Key features of the EP2SGX30CF780I4N include 33,880 logic elements, up to 2.5 Mb of embedded memory, embedded 18 x 18 multipliers, four 3.125 Gbps transceivers (C4 speed grade), and support for external DDR/DDR2/QDR memory interfaces. The industrial temperature grade (-40C to +85C) and lead-free 780-pin FC-FBGA package make it suitable for harsh-environment embedded computing. The 'I4N' suffix denotes the industrial temperature range, speed grade 4, and lead-free termination. The architecture combines an ALM-based logic fabric with dedicated RAM blocks, DSP blocks, PLLs, and high-speed serial channels. This heterogeneous design lets the EP2SGX30CF780I4N implement both deeply pipelined datapath logic and low-latency control code simultaneously, while preserving multi-gigabit serial bandwidth for chip-to-chip links. Typical applications include 3G/4G baseband processing, multi-gigabit serial backplane bridging, industrial machine vision pipelines, military radar signal processing, and high-speed data acquisition. The on-chip transceivers eliminate the need for external serializer/deserializer ICs, reducing BOM cost and board area. When designing with the EP2SGX30CF780I4N, plan for Quartus II software support (13.0sp1 or earlier is recommended for legacy Stratix II GX devices), multi-rail decoupling per the pin connection guidelines, and thermal management of the 780-FBGA exposed die. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design notes that streamline Stratix II GX lifecycle decisions beyond the manufacturer datasheet.
EP2SGX30CF780I5N - 33.88K Logic Cells Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I5N is a high-performance Stratix II GX family Field-Programmable Gate Array (FPGA) featuring 33,880 logic cells, 609.76 MHz internal operation, and 622.08 MHz maximum clock frequency, housed in a 780-ball FC-FBGA package measuring 29 x 29 mm with 1 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader semiconductor integrated circuit hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs contain configurable logic blocks (CLBs), programmable interconnect, and I/O blocks that engineers can reconfigure post-manufacturing to implement custom digital logic, signal processing pipelines, or even soft processors. The Stratix II GX family specifically integrates high-speed serial transceivers alongside the programmable fabric, making it suited for wired communication, broadcast video, and defense applications where serial I/O bandwidth matters. Key features of the EP2SGX30CF780I5N include a 90 nm CMOS process technology, 1.2 V core supply operation, industrial-grade temperature range of -40C to +85C, embedded transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks, TriMatrix embedded memory, and enhanced clock management with phase-locked loops (PLLs). The 33,880 logic cells are organized into Logic Array Blocks (LABs) with a combinatorial delay of approximately 4.006 ns per LAB, enabling deterministic timing closure for high-speed designs. The 780-ball FC-FBGA (Fine-pitch Ball Grid Array, Flip-Chip) package provides the high pin density required for the device's wide I/O count and high-performance signaling. This BGA package is mounted via surface-mount reflow processes and requires X-ray inspection to verify solder joint integrity. The industrial temperature grade (suffix 'I') makes the part suitable for non-automotive industrial, telecom, and test equipment deployments. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom baseband processing, video broadcast and image processing pipelines, software-defined radio (SDR), military and aerospace signal processing, and ASIC prototyping where designers validate logic before committing to a mask set. When designing with this part, ensure your PCB layout supports flip-chip BGA escape routing with microvia or via-in-pad technology. Quartus II design software (legacy versions are still used for Stratix II GX) is required for synthesis, place-and-route, and bitstream generation. Verify transceiver reference clock jitter performance against your protocol's eye-mask requirements before committing to layout. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2SGX30DF780C3 - 33880 Logic Cells Stratix II GX FPGA | Altera
The Altera EP2SGX30DF780C3 is a 33880-logic-cell Stratix II GX family Field Programmable Gate Array (FPGA) fabricated on a 90nm CMOS process and housed in a 780-pin Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA, 29x29mm with 1.0mm ball pitch). It integrates 1694 Logic Array Blocks (LABs), 361 user I/Os, 1,369,728 bits of embedded RAM, up to 12 embedded 3.125 Gbps transceivers, and a hard-core Digital Signal Processing (DSP) block count supporting high-throughput signal processing. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> logic IC -> integrated circuit. The Stratix II GX family is positioned above Stratix II and below Stratix III in Altera's high-performance transceiver-equipped lineup, targeting applications that combine parallel logic fabric with multi-gigabit serial I/O. Key features include 33,880 logic elements, 1694 LABs, 1.37 Mbits of embedded memory, embedded 3.125 Gbps transceivers, dedicated DSP blocks, a robust PLLs/distributed clock tree, and 361 user I/Os. The 1.2V core operates across a commercial junction temperature range of 0C to +85C as the C3 speed grade. The 'C3' suffix indicates a specific speed bin and a commercial temperature grade per the Stratix II GX nomenclature. The architecture combines a 90nm low-k metal process with ALM-style adaptive logic modules and dedicated multiplier/accumulator blocks, which together deliver the high DSP throughput required by baseband, video, and packet-processing pipelines. Hard PCI Express hard IP blocks and external memory interfaces further accelerate system integration. Typical applications include high-speed serial backplane switching, telecom line cards, baseband processing, military/aerospace signal processing, ASIC prototyping, and high-end industrial imaging. Choose this device when your design needs integrated multi-gigabit transceivers plus substantial parallel DSP and memory resources on a single die. When designing with this part, validate signal-integrity margins on the 1.0mm-pitch BGA and follow Altera's Stratix II GX pin connection guidelines; JTAG (IEEE 1149.1) is supported for boundary-scan test. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and FPGA engineers a single-source decision view.
EP2SGX30DF780C3N - Stratix II GX FPGA, 33.9K LE, 780-FBGA | Intel
The Intel / Altera EP2SGX30DF780C3N is a Stratix II GX Field-Programmable Gate Array (FPGA) IC integrating 33,880 logic elements (LEs), 1,369,728 bits of embedded memory, and 361 user I/Os in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA, 29 x 29 mm, 1.0 mm pitch) package. Built on a 90 nm CMOS process with a 1.2 V core supply, the device belongs to the Stratix II GX family that combines a high-density logic fabric with up to 20 high-speed transceiver channels featuring embedded clock-data recovery (CRU) and SERDES at data rates up to 6.375 Gbps per channel. The device is qualified for industrial operating temperatures from -40 C to +85 C and supports JTAG boundary-scan configuration alongside in-system programmability. What is an FPGA with embedded transceivers? A Field-Programmable Gate Array is a programmable logic device that engineers configure after manufacturing, providing a flexible hardware platform that can implement any digital function up to its resource limits. When the fabric is augmented with multi-gigabit transceivers, the same silicon can drive high-speed serial links - backplane SerDes, fibre-channel, Serial RapidIO, PCIe, or custom chip-to-chip protocols - without external PHYs. The Stratix II GX family extends the general Stratix II architecture (logic array, TriMatrix memory, DSP blocks) with hardened PMA/PCS transceiver blocks and reference-clock PLL infrastructure, occupying a position above soft-logic-only FPGAs but below ASSPs in the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor). Key differentiating features of the EP2SGX30DF780C3N include 6.375 Gbps per-channel transceiver support, TriMatrix embedded SRAM blocks for flexible FIFO and buffer construction, dedicated DSP blocks for high-throughput multiplication and accumulation, and a 1.0 mm-pitch FC-FBGA package that enables dense board layout while supporting the high pin count needed for multi-channel serial interfaces and wide parallel buses. The C3 speed grade and N suffix indicate a commercial-temperature, lead-free, RoHS-compliant ordering option. The Stratix II GX architecture implements an ALM (Adaptive Logic Module) fabric rather than the classical 4-input LUT, giving finer-grained logic packing and shorter typical critical paths. TriMatrix memory provides three block sizes (MLAB, M512, M4K) with dedicated routing, allowing the FPGA to instantiate single-port, dual-port, shift-register, or ROM structures without consuming general logic. Embedded transceiver CRUs recover clock and data from inbound serial streams without external components. Typical applications include high-speed serial backplane bridging, telecom line-card aggregation, video-broadcast SDI/HD-SDI routing, military secure-radio baseband processing, and ASIC prototyping for protocols that require multi-gigabit serial I/O. Designers use the part when they need a moderate-density FPGA fabric plus 4-20 SERDES channels on a single die to replace a multi-chip PHY + FPGA solution. When laying out a board with the EP2SGX30DF780C3N, dedicate continuous ground and 1.2 V core supply planes under the package, route each transceiver differential pair with 100 ohm differential impedance and length matching to within the datasheet budget, and isolate the PLL analog supplies with their own filtered rails. The 780-ball FC-FBGA requires PCB fabrication with 1.0 mm-pitch vias and laser-drilled microvia stack-ups to fan out the inner balls. This page consolidates distributor pricing for the EP2SGX30DF780C3N, drop-in alternatives within the Stratix II GX family, and PCB-layout considerations specific to the 780-FBGA package - information that complements the manufacturer datasheet.
EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel
The Intel EP2SGX30DF780C4 is a high-density Stratix II GX family FPGA delivering 33,880 logic elements, 33,880 cells, and 1,694 LABs/CLBs in a 780-pin FineLine BGA (FBGA-780) package measuring 29 mm × 29 mm with 1 mm ball pitch. It integrates up to 20 embedded transceivers, 361 user I/Os, and 717 MHz core operation, supporting 1.2 V core voltage for demanding high-speed serial and parallel data-processing workloads. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the customer after manufacture. Within the broader taxonomy, the Stratix II GX belongs to the high-performance FPGA category, sitting between traditional PLDs and ASICs in cost-per-volume while delivering ASIC-class DSP, memory, and transceiver bandwidth. It functions as a system-on-chip engine for parallel DSP, packet processing, and high-speed I/O bridging in communications, imaging, and test systems. Key features include 1,694 LABs/CLBs and 33,880 logic elements, 20 embedded full-duplex transceivers with multi-gigabit capability, dedicated DSP blocks for high-throughput arithmetic, and 361 user I/Os with multi-standard support. The device targets -40 °C to +85 °C extended commercial operating range (C4 grade) and is fabricated on a 90 nm CMOS process for a balance of density and dynamic power. Architecturally, the Stratix II GX combines a row-and-column-based adaptive logic module (ALM) fabric with hard PCIe, memory controller IP, and multi-gigabit transceivers (MGTs), eliminating soft logic for the most timing-critical paths. The 90 nm CMOS process provides adequate headroom for the on-die PLL and clock tree while keeping static leakage manageable. Typical applications include high-end telecommunications line cards, software-defined radio (SDR), ASIC prototyping, broadcast video processing, and high-speed serial backplane bridging. The combination of 20 transceivers and 33.8K logic elements also makes it suitable for medical imaging pre-processors and defense radar front-ends. When designing with this device, careful attention must be paid to power-rail sequencing (1.2 V core, 2.5 V/3.3 V aux) and multi-layer PCB stack-up to keep transceivers within their SI budgets. The FBGA-780 demands a minimum of 6 PCB layers with controlled-impedance routing for the MGT channels. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for evaluation, sourcing, and BOM hardening.
EP2SGX30DF780C4N - Stratix II GX 30K LEs FPGA 780-FBGA | Altera
The Altera EP2SGX30DF780C4N is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) with integrated high-speed transceivers, offering 33,880 logic elements and 1,369,728 RAM bits in a 780-ball flip-chip BGA (780-FBGA, 29x29 mm, 1 mm pitch) package. According to the manufacturer datasheet, the device operates from a 1.15 V to 1.25 V core supply and supports up to 622 MHz internal frequency with a -40C to +85C commercial temperature range. The part is a CMOS FPGA fabricated in a 90 nm process, providing 361 user I/O pins and 1,694 logic array blocks (LABs). An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> high-performance transceiver FPGA. They are used wherever designers need parallel processing, custom I/O timing, hardware-accelerated DSP, or high-speed serial links that an ASIC, MCU, or DSP cannot economically deliver. The Stratix II GX family specifically targets applications that combine logic density with multi-gigabit transceivers (MGTs) for serial connectivity. Key features include embedded transceiver blocks supporting multiple serial protocols, dedicated DSP blocks for high-throughput signal processing, TriMatrix on-chip memory up to ~1.37 Mbits, and support for source-synchronous and high-speed external memory interfaces (DDR/DDR2/QDR). The device integrates up to 12 transceivers depending on package variant, with per-channel data rates suitable for PCIe, XAUI, Serial RapidIO, and custom serial links. The 780-FBGA package provides 361 user I/Os and a flip-chip thermal path for reliable operation at high toggle rates. Architecturally, Stratix II GX uses an ALM-based adaptive logic module that improves on prior 4-input LUT architectures, increasing effective logic density and reducing fabric congestion. The transceiver tiles are physically isolated and clocked independently from the core fabric, allowing parallel development of high-speed serial and parallel logic on the same die. Configuration is via SRAM, so the bitstream reloads from external flash or a host processor on every power-up. Typical applications include telecommunications line cards, software-defined radio baseband processing, high-speed serial protocol bridging, ASIC prototyping, and high-performance DSP pipelines. Engineers select Stratix II GX for designs that demand both high logic capacity and integrated multi-gigabit serial I/O without the cost and risk of an ASIC. When designing with this part, plan power-rail sequencing carefully because core (1.2 V), PLL analog, and transceiver supplies have separate tolerance bands; failure to sequence them can stress the transceivers during bring-up. Use the Quartus II design suite (legacy) or consult the Stratix II GX handbook for transceiver channel bonding and pre-emphasis settings. The device is now in legacy/EOL status, so verify long-term availability before committing to a new design. This page synthesizes distributor pricing, drop-in alternatives, lifecycle notes, and practical design guidance that the manufacturer datasheet alone does not provide.
EP2SGX30DF780C5 - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
The Intel (Altera) EP2SGX30DF780C5 is a Stratix II GX family Field-Programmable Gate Array with 33,880 logic elements (LEs), 1694 LABs/CLBs, and integrated 3.125 Gbps transceivers, housed in a 780-ball FineLine BGA package operating at 1.2V core with -40C to +85C commercial temperature grade and -5 speed grade timing. The device is fabricated in a 90nm CMOS process and delivers up to 609.76 MHz internal operation per the FindIC datasheet summary. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor integrated circuit whose logic fabric, routing, and I/O can be electrically programmed after manufacturing, making it part of the programmable logic hierarchy (FPGA -> PLD -> programmable logic -> semiconductor). FPGAs are widely used in applications requiring high-speed parallel processing, custom I/O protocols, and rapid prototyping where ASIC NRE costs are not justified. Stratix II GX parts specifically target high-speed serial I/O designs such as communications, broadcast video, and military/aerospace systems. Key features include 4 transceiver blocks supporting up to 3.125 Gbps per channel, dedicated DDR/DDR2/QDR memory interface hardware with read/write leveling, 16 global clock networks, and enhanced DSP blocks. The device integrates 4 PLL/DLL blocks per quadrant with reprogrammable phase shifts. The 780-ball FBGA (29 x 29 mm, 1 mm pitch) supports up to 361 user I/Os (per Mouser summary) for LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X interfacing. The Stratix II GX architecture uses an ALM (Adaptive Logic Module) structure rather than traditional 4-input LUTs, giving finer granularity and lower logic utilization. Transceivers operate from 600 Mbps to 3.125 Gbps with dynamic reconfiguration and support for PCI Express, Serial RapidIO, XAUI, and CPRI protocols. Configuration is via enhanced configuration plus error detection with CRC and watchdog timer. Typical applications include high-speed serial backplanes, broadcast video processing, telecom line cards, PCIe endpoint devices, and DSP co-processing. When designing with this device, ensure the PCB supports 1 mm-pitch BGA breakout with microvia or HDI stack-up, and reference Altera's Stratix II GX Handbook for transceiver channel placement and power distribution network design.
EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30DF780C5N is a high-performance Stratix® II GX Field Programmable Gate Array (FPGA) delivering 33,880 logic elements, 1,369,728 memory bits, and 361 user I/Os, integrated with up to 24 embedded transceivers supporting multi-gigabit serial interfaces. It is housed in a 780-ball flip-chip FineLine BGA (FC-FBGA) package measuring 29 mm x 29 mm with a 1.0 mm ball pitch, operating from a 1.2 V core supply at a commercial temperature grade of 0°C to +85°C and a -40°C to +85°C extended range. Internal clock networks can reach up to 622 MHz, and the part is fabricated on a 90 nm CMOS process. An FPGA is a semiconductor device whose logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM, as opposed to an ASIC where the function is fixed at tape-out. FPGAs sit in the wider hierarchy: programmable logic device (PLD) → field-programmable gate array (FPGA) → high-density FPGA with embedded transceivers. Stratix II GX parts are specialized for high-speed serial I/O (PCI Express, XAUI, Serial RapidIO, SerialLite II) and combine general-purpose fabric with hardened IP blocks, allowing a single chip to implement bridging, packet processing, and DSP functions that previously required an ASIC plus a discrete PHY. Key features of the EP2SGX30DF780C5N include 1,694 LABs/CLBs, 1694 logic array blocks, total RAM bits of 1,369,728, and an extended industrial operating temperature range. The 'C5' speed grade corresponds to the slower commercial tier while still enabling >600 MHz fabric operation; the 'N' suffix denotes a lead-free, RoHS-compliant finish. The Stratix II GX family supports dedicated DSP blocks, on-chip termination for high-speed transceivers, and the Quartus II design suite for synthesis, place-and-route, and bitstream generation. Architecturally, the device uses an adaptive logic module (ALM) based fabric with 8-input fracturable look-up tables, eight ALMs per LAB, and column-/row-based routing. Embedded transceivers operate from 600 Mbps to 6.375 Gbps depending on the protocol, with embedded PCS/PMA blocks for 8B/10B encoding, rate matching, and word alignment. The part supports source-synchronous DDR/DDR2/QDR II memory interfaces via dedicated DQS circuitry, making it well suited to high-bandwidth memory-to-logic bridging. Typical applications include telecom backplane line cards, broadcast video processing, military radar and signal intelligence, medical imaging front-ends, and ASIC prototyping. The combination of 33k logic elements and embedded multi-gigabit transceivers makes the EP2SGX30DF780C5N particularly attractive for protocols that are now legacy but still in service (XAUI, PCIe Gen1/Gen2, Serial RapidIO). A primary design consideration is power-supply sequencing - the 1.2 V core, 3.3V/2.5V/1.8V I/O banks, and PLL/transceiver auxiliary supplies must ramp in the order specified by the datasheet to avoid in-rush latch-up. PCB layout requires impedance-controlled 100 Ω differential traces for the transceiver channels and matched-length routing for DDR/DDR2 memory interfaces. This page synthesizes distributor pricing, lifecycle status, drop-in Stratix II GX alternatives with the same FC-FBGA-780 footprint, and practical Quartus II design notes not found in the manufacturer datasheet.
EP2SGX30DF780C6 - Stratix II GX FPGA 33.8K LEs | Altera
The Altera EP2SGX30DF780C6 is a member of the Stratix II GX family of high-density, high-performance field-programmable gate arrays (FPGAs) with embedded multi-gigabit transceivers, delivered in a 780-pin FineLine BGA package at commercial speed grade 6. The device integrates 33,880 logic elements, 1,369,728 RAM bits organized in 33,880 memory blocks, and 361 maximum user I/Os, providing a balanced mix of logic, memory and serial connectivity for bandwidth-intensive designs. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP such as block RAM, DSP blocks and (in this family) multi-gigabit transceivers. FPGAs sit at the top of the programmable-logic hierarchy - alongside CPLDs and structured ASICs - and are widely used to prototype, bridge, or pre-produce digital systems that require high I/O counts, parallel processing, or fast serial links. The Stratix II GX family extends that capability with up to 6.375 Gbps transceivers, hard PCI Express and other protocol IP, making the family a bridge between generic FPGAs and structured ASSPs. Key features of the EP2SGX30DF780C6 include 1,694 LABs/CLBs (per Mouser listing for the C4N sibling), 33,880 logic elements, dedicated 18-bit x 18-bit multiplier blocks, and Stratix II adaptive logic modules (ALMs) that pack two 4-input LUTs into a single 7-input equivalent. The device supports both 1.2V core and 1.5V/1.8V/2.5V/3.3V selectable I/O standards through programmable I/O banks, and it integrates multi-gigabit transceivers (MGTs) that handle protocols such as Serial RapidIO, XAUI, PCIe and custom serial interfaces up to 6.375 Gbps. The device is fabricated in a 90 nm process with a 1.2 V core supply, leveraging Altera's adaptive logic module architecture to achieve high logic density at lower power per LE than the original Stratix. Embedded hard IP (MGTs, memory controllers, DSP blocks) frees programmable fabric for application logic, so the part is often used to implement protocol bridging, baseband processing, and high-speed serial aggregation. Typical applications include high-speed serial interface aggregation (XAUI, PCIe, Serial RapidIO), telecom baseband and channel-card designs, military and aerospace signal processing, broadcast video processing, and ASIC prototyping. The 780-pin FBGA package supports 361 user I/Os with 8 Gbps-class serial links, making the device attractive for backplane and line-card designs that need many LVDS pairs plus multi-gigabit serial. When designing with the EP2SGX30DF780C6, plan power sequencing on the 1.2 V core rail, observe Stratix II GX decoupling and PCB layout guidelines from the family handbook, and verify transceiver reference-clock and PCB stack-up requirements against the device's high-speed channel budget. Designers should also confirm Quartus II support for the exact speed grade and pin-out revision before tape-out.
EP2SGX30DF780C7 - Stratix II GX FPGA 33.7K LE | Intel (Altera) | 780-BGA
The Altera (now Intel) EP2SGX30DF780C7 is a Stratix II GX field-programmable gate array (FPGA) that integrates 33,880 logic elements and 1,369,728 bits of embedded memory into a 780-ball fine-pitch BGA package, with up to 361 user I/O pins and dedicated high-speed serial transceivers optimized for serial connectivity and DSP-intensive designs. The part operates as a logic-density-optimized Stratix II GX variant with on-chip 6.375 Mbit RAM, four internal PLLs, 16 global clock networks, and embedded multiplier blocks supporting 18x18-bit signed/unsigned multiplication at up to 450 MHz. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that combines programmable logic blocks, programmable interconnect, and I/O cells on a single die. FPGAs belong to the broader hierarchy of programmable logic devices (PLD), within the taxonomy of logic ICs > integrated circuits > semiconductors. The Stratix II GX family extends the Stratix II architecture with up to 20 multi-gigabit transceivers (channel data rates to 6.375 Gbps), making the series targeted at high-speed serial I/O, DSP, and embedded processing applications. Key features of the EP2SGX30DF780C7 include 33,880 logic elements (LE), 1,369,728 RAM bits organized as 482 M512/M4K/M-RAM blocks, 24 DSP blocks implementing 192 18x18 multipliers, an FPGA speed grade of -7 (faster than -8), and a commercial operating temperature range of 0C to +85C. The -C7 speed grade denotes a faster timing closure option that allows higher Fmax on internal logic paths than the C5/C6 grades. The EP2SGX30DF780C7 uses a 90 nm process node with a 1.2 V core supply, an embedded transceiver serializer/deserializer (SERDES) tile that supports PCI Express, Serial RapidIO, XAUI, and CEI-6G physical layers, and a fine-pitch 780-ball BGA package with a 1.0 mm ball pitch. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and Joint Test Action Group (JTAG) modes with optional encryption via the EPC configuration device family. Typical applications of the EP2SGX30DF780C7 include high-speed serial interface bridging (PCI Express Gen1/Gen2 endpoints), digital signal processing cards in communications infrastructure, baseband processing in wireless base stations, ASIC prototyping, broadcast video processing, and software-defined radio front-ends. The 6.375 Gbps SERDES capability and abundant DSP blocks make it suitable for data plane packet processing. When designing with this FPGA, pay attention to transceiver reference clock jitter, PCB layer stack-up for BGA breakout, and the need for proper decoupling on every VCC rail. Quartus II software (version 9.0 and later) is the design environment, and the device requires a configuration flash memory if FPP/PS modes are used. This page synthesizes distributor pricing, same-brand Stratix II GX speed-grade alternatives, and PCB/thermal design guidance not found in the standalone datasheet.
EP2SGX30DF780C7N - 30K LE Stratix II GX FPGA 780-BGA | Altera
The Altera (now Intel) EP2SGX30DF780C7N is a member of the Stratix II GX family of high-performance FPGAs, delivering approximately 33,880 equivalent logic elements (LEs) and up to 1,369,728 bits of embedded memory in a 780-ball FineLine BGA package. Built on a 90 nm process, this device integrates dedicated 3.125 Gbps transceiver circuitry alongside the adaptive logic module (ALM) fabric, targeting high-speed serial I/O and digital signal processing designs. A Field Programmable Gate Array (FPGA) is a programmable logic IC whose internal lookup tables, flip-flops, routing, and hard IP blocks can be configured by the user after manufacture to implement arbitrary digital functions, ranging from simple glue logic to complete processor subsystems. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), with high-end FPGAs like Stratix II GX further embedding transceivers, DSP blocks, and large block RAMs to compete with ASICs in throughput-intensive applications. The -7 speed grade places this part in the standard-performance tier of the family, balanced for both timing closure and power. Key features include 361 user I/O pins, dedicated 3.125 Gbps multi-gigabit transceivers (MGTs), embedded multiplier blocks for DSP, and on-chip Phase-Locked Loops (PLLs) for clock management. The FineLine BGA-780 package supports high pin density with controlled-impedance signal integrity for parallel interfaces and serial links. The integrated transceiver hard IP allows designers to implement protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI without consuming general-purpose logic resources. Architecturally, Stratix II GX uses the ALM as its basic logic element, where each ALM contains two adaptive look-up tables (ALUTs) and four programmable registers, giving finer granularity than the 4-LUT structures used in earlier Stratix generations. The transceiver blocks include physical coding sublayer (PCS) and physical medium attachment (PMA) layers to handle 8b/10b encoding, clock data recovery, and serializer/deserializer functions. Combined with the Quartus II design toolchain, this part accelerates time-to-prototype for communication and signal-processing systems. Typical applications include high-speed serial backplanes, telecom line cards, wireless baseband processing, broadcast video routers, and military signal-processing systems. The combination of high logic density, embedded transceivers, and substantial block RAM makes it well suited for protocol bridging, packet processing, and high-throughput DSP pipelines where a hard ASIC would be uneconomical at low volumes. When designing with this device, engineers must allocate sufficient PCB layers (typically 10+ layers) to route the BGA-780 breakout and maintain signal integrity on the transceiver channels. Thermal management must account for the worst-case junction temperature under full transceiver utilization, and power estimation in Quartus II should be run early to size decoupling and the regulator tree correctly. This page synthesizes distributor availability, drop-in package-compatible Stratix II GX speed-grade and temperature-grade variants, and practical design notes not consolidated on any single manufacturer or distributor page.
EP2SGX30DF780I3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
The Intel EP2SGX30DF780I3N is a Stratix II GX family field-programmable gate array (FPGA) built on a 90 nm CMOS process, delivering 33,880 logic elements, 33,380 logic cells, and a maximum core clock frequency of 622.08 MHz (816.9 MHz internal) in a 780-ball plastic fine-pitch BGA (FBGA-780) package at 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as transceivers, memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), enabling parallel hardware customization that microcontrollers and DSPs cannot match in throughput. Key features include embedded high-speed transceivers up to 6.375 Gbps, dedicated DSP blocks for fixed- and floating-point arithmetic, up to 1.4 Mbits of on-chip TriMatrix memory, support for external memory interfaces including DDR2/QDRII+/RLDRAM II, and 361 user I/O pins. The device also includes 8 PLLs for clock synthesis and skew management, hot-socketing support, and SEU detection for soft-error mitigation in mission-critical systems. The Stratix II GX architecture uses an adaptive logic module (ALM) fabric that improves effective logic utilization versus older 4-LUT architectures. Combined with the embedded transceivers, this makes the EP2SGX30DF780I3N suitable for protocol bridging, baseband processing, and packet classification in line-card and backplane designs. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO), software-defined radio (SDR) baseband engines, video broadcast and imaging pipelines, and telecom line-card protocol termination. The wide transceiver bandwidth also suits test-and-measurement instrumentation such as protocol analyzers and digitizers. When designing with this device, plan thermal dissipation carefully - the FBGA-780 package requires a minimum 4-layer PCB with a continuous ground plane under the die for heat spreading. Quartus II is the supported development environment; ensure the design targets the I3N speed grade and industrial temperature range (-40C to +100C junction). This page synthesizes XAIPART internal pricing, drop-in same-package alternatives, and practical design notes that complement - not duplicate - the manufacturer Stratix II GX Device Handbook.
EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
The Intel EP2SGX30DF780I4 is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) with integrated transceivers, delivering 33,880 logic elements, 1,369,728 bits of embedded memory, and 361 user I/O pins in a 780-ball flip-chip BGA package (29x29 mm, 1 mm pitch). It is built on a 1.2 V / 90 nm CMOS process and is specified for the industrial temperature grade of -40C to +85C. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceiver blocks that can be rewired after manufacture to implement arbitrary digital functions. Stratix II GX sits in the hierarchy: FPGA -> programmable logic -> programmable logic device -> integrated circuit, with the GX suffix denoting integrated multi-gigabit transceivers for serial connectivity. Key features of the EP2SGX30DF780I4 include up to 622 MHz internal operation, embedded transceiver blocks supporting SERDES rates commonly used in Stratix II GX, dedicated DSP blocks for high-throughput arithmetic, and a fine-grained ALM (Adaptive Logic Module) architecture that improves logic utilization over previous generations. The device is supported by the Quartus II design toolchain. The architecture uses ALM-based logic elements with Look-Up Table (LUT) cores, true dual-port M4K and M-RAM memory blocks, and embedded 18x18 multipliers. On-chip PLLs provide clock synthesis and skew management, while the integrated transceivers handle physical-layer serialization at line rates up to 6.375 Gbps depending on the protocol profile. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol development, ASIC prototyping, and digital signal processing where transceiver density matters. The 780-ball FC-FBGA package supports the high I/O count and transceiver bandwidth the device provides. When designing with this part, plan power integrity carefully - Stratix II GX devices draw substantial current through multiple rails. Use Quartus II PowerPlay early estimates to size decoupling and thermal solution; verify I/O bank VCCIO assignments match your LVDS/SSTL/LVCMOS signaling before PCB layout. This page combines distributor pricing, same-family Stratix drop-in alternatives, and design notes that go beyond what is summarized on manufacturer or distributor product pages.
EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel
The Intel EP2SGX30DF780I4N is a high-density Stratix II GX family field-programmable gate array (FPGA) delivering 33,880 logic elements, 361 user I/O pins, and integrated 3.125 Gbps transceivers, housed in a 780-pin FBGA package measuring 29 mm x 29 mm with 1 mm ball pitch. Built on a 90 nm CMOS process and operating from a nominal 1.2 V core supply, the device reaches internal clock frequencies up to 622 MHz with maximum clocking capability rated at 717 MHz, placing it among the high-performance transceiver-bearing FPGAs of its generation. A field-programmable gate array (FPGA) is a reconfigurable semiconductor containing programmable logic blocks, routing channels, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit between fixed-function ASICs and software-programmable processors: they deliver ASIC-level parallelism with the ability to be reconfigured in-circuit. Within the power-management and embedded hierarchy, FPGAs are commonly classified as programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family is a transceiver-equipped sub-family of Stratix II, optimized for serial connectivity protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and SerialLite. Key features of the EP2SGX30DF780I4N include 33,880 logic elements, integrated multi-gigabit transceivers, dedicated DSP blocks for signal processing acceleration, embedded TriMatrix block RAM, support for multiple I/O standards including LVDS, and a -40C to +85C industrial operating temperature range. The "I4" speed grade and industrial temperature suffix make the part suitable for harsh-environment deployments, while the FBGA-780 package provides high-density interconnect for high-pin-count I/O and memory expansion. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) which combines fracturable look-up tables, adders, and registers into an 8-input equivalent block, improving logic packing density compared with the original Stratix family. The transceiver blocks support multiple protocols, while the surrounding fabric delivers fine-grained parallelism for DSP, packet processing, and bus interfacing. Typical applications for the EP2SGX30DF780I4N include telecommunications line cards, base-station signal processing, high-speed serial interface bridging, radar and sonar front-end processing, and industrial imaging pipelines. The transceiver-rich feature set particularly suits any design moving parallel data over a small number of high-speed serial lanes. When designing with this device, engineers must follow Intel/Altera's power-rail sequencing guidance and provide adequate decoupling on every VCC and VCCIO rail; the FBGA-780 package also requires multi-layer PCB stack-up with controlled-impedance traces for the transceiver channels.
EP2SGX30DF780I4NK - Stratix II GX FPGA 33.8K LE 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30DF780I4NK is a Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 bits of embedded memory, and up to 361 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. The device is fabricated on a 90 nm process, operates from a nominal 1.2 V core supply, and supports a maximum internal clock frequency of 717 MHz. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic function is defined after manufacture by the customer rather than at the foundry, sitting in the taxonomy of programmable logic devices (PLD) → FPGA → high-density FPGA. Stratix II GX devices extend this taxonomy by embedding multi-gigabit transceivers alongside the programmable fabric, targeting high-speed serial I/O for line cards, video bridging, and wireless baseband processing. Understanding the role of the FPGA class clarifies why parts such as EP2SGX30DF780I4NK are specified by logic-element count, memory block count, transceiver count, and package ball map rather than by a fixed function name. Key features of the EP2SGX30DF780I4NK include 1,694 logic array blocks (LABs) with adaptive logic module (ALM) architecture, 1,369,728 bits of embedded RAM arranged as TriMatrix memory blocks, four phase-locked loops (PLLs), and embedded high-speed transceivers capable of multi-gigabit operation. Industrial temperature grade (-40 °C to +100 °C) is indicated by the 'I' suffix, while 'N' denotes a lead-free / RoHS-compliant package and 'K' designates a specific speed grade or feature set per the Stratix II GX ordering code. Architecturally, Stratix II GX devices pair the ALM-based logic fabric with dedicated transceiver circuitry, supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 780-pin FC-FBGA with 1 mm ball pitch provides the routing density required for hundreds of user I/Os and multiple transceiver channels, while keeping the die-to-package electrical path short enough for multi-gigahertz signalling. Typical applications include high-speed serial interface bridging, telecommunications line-card backplanes, video broadcast infrastructure, military radar signal processing, and wireless baseband prototyping. Industrial temperature grade makes the EP2SGX30DF780I4NK suitable for outdoor telecom cabinets, factory automation controllers, and other non-thermally-controlled environments. When designing with this device, ensure the Quartus II design software version supports Stratix II GX (Quartus II v9.1 or later with appropriate service packs), and verify that PCB layout accommodates the 1 mm pitch BGA escape routing. Power-supply sequencing must respect the 1.2 V core, 3.3 V I/O, and transceiver supply rails, including proper PLL filtering. This page synthesizes distributor stock and pricing data, drop-in and same-family Intel Stratix II GX alternatives, and practical design notes that go beyond the manufacturer datasheet table.
EP2SGX30DF780I5N - 33,880 Cell Stratix II GX FPGA, FC-FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX30DF780I5N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) with 33,880 logic cells (33,380 logic elements) and 33880 Logic Array Blocks (LABs), built on a 90 nm CMOS process and housed in a 780-ball Fine-pitch Flip-Chip BGA package (FC-FBGA-780, 29 x 29 mm, 1 mm pitch). The device integrates up to 622.08 MHz internal clock frequency logic with embedded transceivers optimized for high-speed serial I/O, a core supply of 1.2 V, and industrial-grade -40C to +85C operating range. The "I5" speed grade and industrial temperature suffix make it suitable for harsh-environment networking, broadcast video, and defense applications. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs occupy the top of the programmable-logic hierarchy, sitting above CPLDs (which are simpler, lower-density, non-volatile devices) and below fixed-function ASICs in terms of integration density. The Stratix II GX architecture specifically embeds high-speed serial transceivers for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, enabling single-chip implementation of multi-gigabit serial interfaces without external PHYs. Key features of the EP2SGX30DF780I5N include 33,880 logic cells, multiple embedded transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput signal processing, abundant block RAM for buffering and packet storage, and the fine-pitch 29 mm FC-FBGA package for high signal integrity on dense multi-layer PCBs. Its industrial temperature grade and I5 speed grade place it in the higher-performance tier of the Stratix II GX family, well-suited to networking line cards, basestation baseband, and high-end test equipment. Typical applications include high-speed serial protocol bridging (PCI Express to Gigabit Ethernet, Serial RapidIO switching), DSP co-processing for radar, software-defined radio, telecom muxponders, and ASIC prototyping. Industrial-grade parts are also commonly used in long-life-cycle embedded systems such as avionics, defense radios, and process-control networking modules. When designing with this part, plan for multi-layer PCB stack-up with controlled-impedance serial channels, ample decoupling around the 780 BGA balls, and a Quartus II design flow with the Stratix II GX device library. Power sequencing, JTAG configuration, and thermal dissipation through the flip-chip BGA should be validated before high-volume release.
EP2SGX30DF780I7N - Stratix II GX 30K LEs FPGA | Intel | 780-BGA
The Intel EP2SGX30DF780I7N is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, integrating approximately 33,880 equivalent logic elements (LEs), 136,9728 bits of embedded memory, and dedicated 3.125 Gbps multi-gigabit transceivers (MGTs). Built on a 90 nm process with a 1.2 V core voltage, this device targets high-speed serial I/O, embedded processing, and DSP-intensive applications such as basestation line cards, video broadcast, and high-end test equipment. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O via a hardware description language (HDL) after manufacture. Stratix II GX belongs to Intel's (formerly Altera's) high-performance programmable logic hierarchy: FPGA -> programmable logic device -> semiconductor IC. The GX suffix designates the transceiver-enabled variant, distinguishing it from the logic-only Stratix II family and the lower-cost Cyclone series. FPGAs sit between ASICs and microcontrollers in design flexibility, offering ASIC-class throughput with microcontroller-class time-to-market. Key features of the EP2SGX30DF780I7N include up to 16 full-duplex multi-gigabit transceivers supporting CPRI, OBSAI, XAUI, PCIe, and Serial RapidIO protocols, on-chip TriMatrix memory of up to 1.37 Mbit distributed across M512, M4K, and M-RAM blocks, and up to 364 18x18 multipliers for DSP. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with up to 586 user I/O pins in this 780-pin BGA. The architecture combines adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient implementation of combinational and registered logic. Each ALM contains two adaptive LUTs, two programmable registers, and dedicated arithmetic carry chains, giving the device up to 33,880 LEs while improving logic utilization by roughly 25% versus the previous Stratix generation. The embedded transceivers operate from 600 Mbps to 3.125 Gbps with built-in PCS functions for 8B/10B encoding. Typical applications include wireless infrastructure (W-CDMA, LTE baseband processing), high-definition video editing systems, broadcast routers using HD-SDI or DVB-ASI, radar and signal-intelligence front-ends, PCI Express endpoint and root-complex designs, and serial RapidIO backplanes. The integrated transceivers eliminate the need for external PHY ICs in designs that previously required companion Gigabit Ethernet or XAUI chips. When designing with this device, pay close attention to power-rail sequencing, PCB stackup for BGA breakout, and thermal management. The 780-pin BGA requires at least a 6-layer PCB with controlled-impedance routing for the MGT differential pairs. JTAG and Active Serial configuration via EPCS16 or EPCS64 flash must be planned early; in-system programming through the JTAG header is recommended for prototype bring-up.
EP2SGX30F780C3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Altera
The Altera (Intel) EP2SGX30F780C3N is a high-performance Stratix II GX Field-Programmable Gate Array (FPGA) featuring 33,880 logic elements, 1,369,728 bits of embedded RAM, and 361 user I/O pins, housed in a 780-ball FineLine BGA (29x29 mm) surface-mount package. It operates at a core voltage of 1.2 V with 90 nm process technology and a maximum internal frequency of 816.9 MHz, delivering industry-leading transceiver-based signal processing for high-bandwidth serial I/O applications. A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic functions through SRAM-based configuration cells. FPGAs belong to the broader hierarchy of programmable logic devices (PLD), which itself is a branch of digital integrated circuits and ultimately a category of semiconductors. The Stratix II GX family is positioned at the upper tier of FPGA performance, integrating multi-gigabit transceivers directly onto the die to support protocols such as PCI Express, Serial RapidIO, XAUI, and 10 Gigabit Ethernet without external PHY chips. Key features of the EP2SGX30F780C3N include integrated transceiver channels running up to 6.375 Gbps, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 embedded transceivers arranged in quads, and a flexible logic structure with adaptive logic modules (ALMs) that replace the legacy 4-input LUT architecture of prior Stratix generations. Memory interfaces include external DDR2 support and on-chip TriMatrix memory with true dual-port and FIFO modes. Technically, the device is built on a 1.2 V core with 0.9 V PLL supply and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL across 16 I/O banks. Configuration is handled through passive serial, fast passive parallel, or JTAG modes, with built-in error detection via the CRC circuit and on-chip bitstream decryption for IP protection using 128-bit AES. Typical applications include 10G Ethernet line cards, wireless baseband processing, high-speed serial backplane bridging, broadcast video processing, and military/aerospace signal intelligence platforms where integrated transceivers reduce BOM and PCB area. The 780-FBGA package suits production hardware where thermal management uses forced-air or heatsink thermal solutions. Design consideration: route all 12 transceiver channels with controlled-impedance differential pairs (100 ohm differential) and keep lengths matched within the budget specified by the Quartus II transceiver toolkit. Use the Altera soft-copy transceiver macros from the IP library rather than designing your own PMA layer. This page consolidates distributor pricing, drop-in alternatives within the Stratix II GX family, and engineering design notes specific to the EP2SGX30F780C3N - information not aggregated on the manufacturer datasheet alone.
EP2SGX30FG780C7 - Stratix II GX 30K LEs FPGA with 4.6G Transceivers | Altera
The Altera (now Intel FPGA) EP2SGX30FG780C7 is a Stratix II GX family FPGA featuring approximately 33,880 equivalent logic elements, 2.1 Mbits of embedded RAM, and 4 embedded transceivers operating up to 6.375 Gbps, housed in a 780-pin FineLine BGA (FG780) package at the C7 speed grade (commercial, ~7 ns core logic delay class). This device integrates high-speed serial I/O alongside DSP blocks and TriMatrix memory, making it well suited for high-bandwidth wired communication, signal processing, and protocol bridging systems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hard IP such as transceivers, multipliers, and clock management circuitry. FPGAs occupy a position in the system hierarchy above general-purpose microcontrollers but below ASICs in non-recurring engineering cost, providing hardware-timed parallelism and reconfigurability. The Stratix II GX family specifically targets applications that combine parallel logic with multi-gigabit serial links, positioning it within the power-management and signal-chain ecosystem as a glue-and-processing layer. Key features include 33,880 logic elements, 192 (18x18) multipliers, 2.1 Mbits of TriMatrix embedded memory arranged as M512/M4K/M-RAM blocks, 364 user I/O pins, 4 multi-gigabit transceivers supporting up to 6.375 Gbps with support for PCI Express, Serial RapidIO, XAUI, and CEI-6G protocols, and dedicated clock management PLLs. The device operates from a 0.85 V core supply with separate transceiver, I/O, and auxiliary supplies. The EP2SGX30FG780C7 is fabricated on a 90 nm process with a copper interconnect stack and uses Altera's Adaptive Logic Module (ALM) architecture, which provides 8-input fracturable look-up tables delivering improved logic packing efficiency versus the older ALM-free Stratix ALUT architecture. Hard PCIe and CDR blocks allow simultaneous multi-protocol serial connectivity without consuming soft logic. Typical applications include PCI Express endpoint and root-complex designs, Serial RapidIO bridges for wireless baseband cards, XAUI-based 10G Ethernet aggregation, SD/HD-SDI broadcast video processing, and high-speed data acquisition backplanes. The 780-pin BGA package provides ample signal density for fan-out without requiring complex stacked-die solutions. When designing with the EP2SGX30FG780C7, plan signal integrity carefully - the 6.375 Gbps transceivers demand controlled-impedance differential routing with length matching inside ~5 mils and a 100-ohm differential reference. Use Altera's Quartus II design suite (legacy, Stratix II supported up to v13.x) for synthesis, place-and-route, and timing closure. This page consolidates distributor availability, drop-in FG780 alternatives within the Stratix II GX family, and Stratix II GX transceiver design notes not typically present in a single datasheet excerpt.
EP2SGX60CF484I4 - 60K LEs Stratix II GX FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP2SGX60CF484I4 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 2,544,192 bits of embedded memory, and 291 user I/Os in a 484-ball FineLine BGA (FBGA) package. Built on a 90 nm process and operating from a 1.2 V core supply, the device integrates up to 12 transceiver channels capable of multi-gigabit serial I/O, making it a turnkey solution for high-speed serial connectivity in communications, video broadcast, and storage systems. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together through a programmable interconnect fabric. FPGAs belong to the broader category of programmable logic devices (PLDs) within the Integrated Circuits > FPGA & CPLD family, and they sit alongside ASICs and microcontrollers as the three principal silicon platforms for digital hardware design. The Stratix II GX family specifically adds embedded transceivers, extending the general-purpose FPGA concept into serial-link-centric applications where ASIC-equivalent bandwidth would otherwise require months of custom design. Key features of the EP2SGX60CF484I4 include 3,022 Logic Array Blocks (LABs), 4 DSP blocks for hardware-accelerated multiplication, internal clock frequencies up to 732.1 MHz, and 12 full-dupelt mode dedicated transceivers supporting standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. The 23 x 23 mm 1.0 mm-pitch FBGA-484 package provides sufficient perimeter I/O for parallel external memory buses while keeping the ball array compatible with mainstream PCB manufacturing. The architecture combines ALM-based adaptive logic modules with TriMatrix embedded memory, allowing designers to trade logic density against block-RAM depth on a per-need basis. Hard IP blocks for transceivers, PLLs, and the DDR memory controller offload timing-critical tasks from the programmable fabric, freeing logic resources for user-defined processing and protocol stacks. Typical applications include wireless baseband processing, video broadcast encoding and routing, serial-backplane switching, high-speed data acquisition, and defense signal intelligence platforms. The combination of 12 transceivers and abundant parallel I/O makes the EP2SGX60CF484I4 especially attractive for line-card designs that must bridge multiple SERDES links to a parallel fabric. When designing with this device, plan the FPGA-to-transceiver channel allocation and reference-clock distribution up front, because the GX transceivers require precise 100-ohm differential layout and dedicated PLL blocks. Industrial temperature grade (I4 suffix) operation is qualified to -40 C to +100 C ambient, so verify your thermal design against worst-case power from all active transceivers. This page synthesizes distributor stock and pricing, package-compatible drop-in alternatives, and practical design guidance not found in the Altera datasheet alone, helping engineers validate sourcing and reuse options before committing to a new design.