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TCAN4572-Q1

TCAN4572-Q1 - Automotive CAN FD Controller + SIC Transceiver | TI

The Texas Instruments TCAN4572-Q1 is an automotive-grade CAN FD controller with an integrated CAN Signal Improvement Capable (SIC) transceiver, housed in a VQFN-24 package. It combines an ISO 11898-1:2015 compliant CAN FD protocol controller with an ISO 11898-2:2016 compliant physical layer transceiver, supporting data rates up to 8 Mbps with SIC enabled for improved signal integrity on long or star-topology bus networks. A CAN FD (Controller Area Network Flexible Data-Rate) controller with integrated transceiver is a system-on-chip that combines a CAN protocol engine and a physical layer transceiver in one device. The protocol controller manages message framing, arbitration, and error handling per the ISO 11898-1 standard, while the transceiver converts digital logic levels to the differential CANH/CANL bus signals per ISO 11898-2. By integrating both blocks, the TCAN4572-Q1 reduces PCB area, BOM count, and host MCU CAN peripheral requirements, placing it within the broader hierarchy of automotive interface IC > CAN interface > CAN FD transceiver/controller > in-vehicle networking IC. Key features include support for classic CAN and CAN FD frames, an SPI interface to the host microcontroller, AEC-Q100 qualification for automotive applications, and SIC (Signal Improvement Capability) for cleaner signal edges on complex topologies. The device operates over a wide supply range suitable for 12V automotive battery rails and includes thermal shutdown, bus dominant time-out, and undervoltage protection. The architecture pairs a dedicated CAN FD controller core with a low-emission differential transceiver. By performing in-situ signal conditioning via SIC, the TCAN4572-Q1 allows designers to deploy CAN FD networks across unshielded cable, mixed topologies, or nodes with significant stub lengths without compromising the bit-time budget. Typical applications include automotive body and chassis ECUs, ADAS sensor networks, battery management system (BMS) communication in electric vehicles, industrial CAN FD gateways, and CAN FD Light systems. The integrated MCU interface simplifies bring-up across zonal architectures where the host processor may lack an on-chip CAN FD peripheral. Designers must evaluate bus topology termination, stub length, and SIC enable/disable timing relative to network jitter budgets. The SPI clock and chip-select routing should be kept short to avoid protocol-controller timing violations during bus error interrupts. This page synthesizes distributor availability, drop-in alternative candidates, and practical design guidance drawn from the Texas Instruments TCAN4572-Q1 datasheet in a single product brief not found on the manufacturer page or distributor listings alone.

USD $4.68 在庫あり

TCAN6062-Q1

TCAN6062-Q1 - CAN XL Transceiver, AEC-Q100, SOIC-8 | TI

The Texas Instruments TCAN6062-Q1 is an automotive-grade, high-speed Controller Area Network (CAN) transceiver that meets the physical layer requirements of the ISO 11898-2:2024 Annex A (CAN XL) specification, housed in an 8-pin SOIC (D) package. Key parameters include CAN XL data-rate support up to 20 Mbps, integrated Signal Improvement Capability (SIC) mode, and PWM decoding on the TXD pin for FAST TX/FAST RX operation. A CAN transceiver is a physical-layer interface IC that converts the differential CAN bus signals (CANH, CANL) into the single-ended TXD/RXD logic levels required by a host microcontroller or CAN controller. It sits in the hierarchy bus transceiver -> bus interface IC -> interface IC -> semiconductor, providing galvanic isolation, level shifting, bus dominant/recessive arbitration, and EMC/ESD protection for the in-vehicle network. Modern CAN XL extends classical CAN and CAN FD by adding a higher data-rate payload channel while preserving backward compatibility with ISO 11898-2. Key features include an integrated standby mode for low-power sleep current, ±8 kV IEC 61000-4-2 ESD protection on the bus pins, ±58 V bus fault protection, and AEC-Q100 Grade 1 qualification (–40 °C to +125 °C ambient). The TCAN6062-Q1 also supports PWM-decoded signaling on TXD, enabling the SIC mode to actively reduce signal ringing during dominant-to-recessive transitions, which is critical for reliable multi-drop CAN XL networks at high data rates. The device architecture pairs a high-speed differential driver/receiver pair with an internal logic core that monitors TXD and decodes PWM-coded commands to switch between normal, FAST TX, FAST RX, SIC, and standby states. Compared with legacy CAN FD transceivers (e.g. TCAN1044A-Q1), the TCAN6062-Q1 adds CAN XL PHY support and the signal-conditioning features required for ISO 11898-2:2024 Annex A compliance, while remaining pin-compatible to 8-pin SOIC footprints used by prior TCAN families. Typical applications include automotive CAN XL backbone and zone-architecture networks, ADAS sensor ECUs (radar, lidar, camera), powertrain and chassis CAN nodes, body-domain controllers, and industrial CAN networks migrating from CAN FD to CAN XL. A key design consideration: ensure the bus termination (typically 120 Ω at each end of the CAN XL backbone, with SIC transceivers often allowing split termination) is sized according to the cable DC resistance and number of in-line stubs. STB pin logic levels must respect the wake/sleep timing in the datasheet to avoid bus contention on cold-start. This page synthesizes manufacturer specifications, distributor availability, AEC-Q100 compliance signals, and same-package cross-reference MPNs (TCAN1044A-Q1, TCAN1472-Q1) into a single engineering reference not duplicated on the TI datasheet alone.

USD $0.86 在庫あり

TDA18214AHN-C1557

TDA18214AHN/C1,557 - Silicon TV Tuner IC DVB-T | NXP

The NXP Semiconductors TDA18214AHN/C1,557 is a high-performance silicon tuner IC designed for digital terrestrial and digital cable TV reception, controlled via an I2C serial interface and housed in a 40-pin HVQFN (6x6 mm) exposed-pad package. The part delivers a Low IF (LIF) output signal to an external demodulator and supports all major digital TV standards including DVB-T. A silicon tuner is an integrated RF receiver front-end that replaces the can-tuned varactor modules used in legacy analog televisions. Within the receiver signal chain hierarchy, it sits at the top: antenna or cable input -> silicon tuner (RF amplification, image-reject mixing, channel filtering) -> Low IF output -> demodulator IC -> transport stream. Because tuning, gain control, and filtering are all implemented on-chip, the TDA18214 family dramatically reduces board area, BOM count, and factory alignment effort compared with discrete tuner designs. Key features of the TDA18214AHN include single-conversion architecture delivering a Low IF signal, full I2C bus control for channel selection and gain programming, support for all digital terrestrial and cable TV standards (DVB-T, DVB-C, ISDB-T, ATSC, DTMB families), and an exposed-pad 40-HVQFN package suitable for compact set-top box and TV main boards. Surface-mount construction supports standard reflow assembly. Architecturally, the TDA18214 integrates a low-noise RF amplifier, image-reject downconversion mixer, broadband synthesizer, and channel-selection filtering in a single CMOS/BiCMOS die. Delivering LIF directly to the demodulator eliminates SAW-filter-heavy IF stages in many designs, and the digital-controlled gain distribution optimizes linearity versus noise figure across the received channel. Typical applications include digital set-top boxes, integrated digital TV (iDTV) main boards, USB TV tuner dongles, PC-TV capture cards, and cable/terrestrial hybrid receivers. Its broad standards support lets one design serve multiple regional markets with firmware changes only. Design consideration: as a 6x6 mm HVQFN with exposed pad, the thermal and ground path depends on the PCB land pattern; the exposed pad must be soldered to a solid ground plane with thermal vias, and the I2C bus requires proper pull-up sizing for reliable 100/400 kHz communication. This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Note that this part is marked Obsolete (last buy March 31, 2016; last delivery June 30, 2016), so availability is limited to remaining distributor and broker stock as of 2026-10-11.

USD $7.90 在庫あり

TDA19989BET-C1518

TDA19989BET/C1,518 - HDMI 1.4 Transmitter 150MHz | NXP

The NXP Semiconductors TDA19989BET/C1,518 is a 150 MHz pixel-rate HDMI 1.4 transmitter IC with integrated HDCP 1.3 copy protection, CEC support, and an I2C control interface, housed in a 64-TFBGA (4.5 x 4.5 mm) ball grid array package. An HDMI transmitter IC is a digital video interface device that encodes parallel video pixel data into TMDS (Transition Minimized Differential Signaling) serial streams for transmission over HDMI or DVI links. Within the system hierarchy, it sits in the video signal chain between a graphics source such as a SoC, microcontroller, or video processor and the HDMI physical connector, converting ITU656/parallel RGB video input into a standards-compliant high-definition multimedia output. Key features of the TDA19989BET/C1,518 include support for up to 150 MHz pixel clock rates (enabling 1080p60 resolution), compliance with HDMI v1.3a and HDMI 1.4 specifications, HDCP 1.3 content protection for encrypted media streams, and compatibility with CEA-861B, DVI 1.0, and ITU656 video standards. The device provides three 8-bit video input paths and is fully controlled through a standard I2C serial interface, allowing a host processor to configure resolution, color depth, and HDCP sessions. Technically, the transmitter integrates TMDS clock and data serialization, audio embedding over HDMI, InfoFrame generation, and CEC (Consumer Electronics Control) messaging, reducing external component count in set-top box and AV receiver designs. The 64-TFBGA (4.5 x 4.5 mm) surface-mount package suits space-constrained consumer video boards while supporting the high-speed differential routing required for TMDS signals. Typical applications include set-top boxes, AV receivers, digital televisions, and HDMI-enabled embedded graphics boards. The 150 MHz pixel rate covers all standard 1080p video formats and their associated embedded audio streams. Design consideration: HDCP 1.3 operation requires careful I2C firmware handling and licensed HDCP keys; TMDS output pairs demand controlled-impedance PCB routing with matched lengths to maintain signal integrity at 150 MHz pixel rates. Note: this part is listed as Obsolete by supplier datasheet databases (Part Status: Obsolete); it remains procurable through surplus and broker channels. This page synthesizes distributor availability, specification data, family alternatives, and design guidance not found on any single distributor page.

USD $4.35 在庫あり

TDA19989BET-C1557

TDA19989BET/C1,557 - 150MHz HDMI 1.4 TX | NXP Semiconductors

The NXP Semiconductors TDA19989BET/C1,557 is a 150 MHz pixel rate HDMI 1.4 transmitter video IC with 3 x 8-bit video inputs, HDCP 1.3 content protection, and CEC support, housed in a 64-pin TFBGA (4.5 x 4.5 mm) package. A video transmitter IC (also called an HDMI transmitter or video encoder) is an interface IC that converts a parallel digital video stream, such as ITU-R BT.656 or RGB data, into a serial TMDS (Transition Minimized Differential Signaling) signal compliant with HDMI or DVI standards. In the signal-chain hierarchy, it sits between a graphics source or video processor and the HDMI physical connector, performing serialization, encoding, and content-protection tasks required by the CEA-861B, HDMI 1.3a/1.4, and DVI 1.0 specifications. Key features include support for CEA-861B, DVI 1.0, HDMI v1.3a and HDMI 1.4 formats, HDCP 1.3 for encrypted content delivery, an I2C control interface, and ITU656 video input compatibility. The 150 MHz pixel rate supports video resolutions up to 1080p, while the 64-TFBGA footprint keeps board area to approximately 20.25 square millimeters for space-constrained designs. Architecturally, the TDA19989B family integrates TMDS serializers, an HDCP cipher engine, an audio return and CEC block, and flexible input multiplexing for three 8-bit video buses. The I2C register interface allows a host microcontroller to configure timing, audio, and protection parameters. The C/1,557 ordering suffix identifies the standard-rated commercial temperature grade in tape-and-reel packaging. Typical applications include set-top boxes, digital televisions and monitors, AV receivers, video projectors, and embedded systems that must output HDMI while processing ITU656 or RGB video internally. When designing with this device, provide a stable low-jitter TMDS reference clock and follow NXP layout guidance for 100-ohm differential impedance routing on the HDMI lanes; HDCP key handling also requires attention to firmware security practices. This page synthesizes distributor inventory data, drop-in alternative guidance, and practical design notes not found in the manufacturer datasheet alone.

USD $5.95 在庫あり

TDA19989BET/C1551

TDA19989BET/C1551 - 150MHz HDMI 1.4 Transmitter | NXP

The NXP TDA19989BET/C1551 is a 150 MHz pixel rate HDMI 1.4 transmitter IC with HDCP 1.3 content protection and CEC support, housed in a 64-ball TFBGA (4.5 x 4.5 mm) package. It accepts parallel digital video (RGB/YCbCr, ITU656) and serializes it for HDMI or DVI output at pixel rates up to 150 MHz. An HDMI transmitter is a video interface IC that converts parallel or digital video bus data into the TMDS (Transition Minimized Differential Signaling) serial stream defined by the HDMI and DVI standards. Within the system hierarchy, it sits in the video signal chain between a graphics source (SoC, FPGA, or video processor) and the physical HDMI connector, and belongs to the broader class of interface ICs and video processing ICs. Key features include the 150 MHz pixel clock supporting 1080p60 video, compliance with CEA-861B, DVI 1.0, and HDMI v1.3a signaling with HDMI 1.4 capability, and integrated HDCP 1.3 cipher engine for protected content. An I2C host interface programs registers, controls the HDCP state machine, and reads EDID from the sink via DDC. CEC support enables consumer electronics control channel communication over the HDMI cable. Architecturally, the TDA19989 family combines input video formatting, TMDS serialization, audio embedding, infoframe generation, and HDCP encryption in a single low-power CMOS die. The 3 x 8-bit video input bus accepts RGB or YCbCr formats, while audio is accepted via I2S or S/PDIF-style inputs and multiplexed into the TMDS stream. Typical applications include set-top boxes, Blu-ray/DVD players, digital media adapters, automotive infotainment head units, and embedded boards with HDMI display outputs. Its compact 4.5 mm BGA suits space-constrained consumer and industrial designs. Designers should note that HDCP license agreements govern use of the cipher, and that the 64-TFBGA requires controlled-impedance TMDS routing on the PCB. Note the part is listed as obsolete by some sources, so verify lifecycle for new designs. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

USD $0.80 在庫あり

TDA2009A

TDA2009A - 10W+10W Stereo Class-AB Audio Amplifier | STMicroelectronics

The STMicroelectronics TDA2009A is a class-AB dual Hi-Fi audio power amplifier assembled in a Multiwatt® package, delivering 10 W + 10 W of continuous output power per channel into 8 Ω loads (stereo operation from 8 V to 28 V supply). The device is specially designed for high quality stereo applications such as Hi-Fi music centers, mini-component stereos, multimedia speaker systems, and instrument amplifiers that demand dual-channel output from a single, well-protected IC. What is a class-AB audio power amplifier? A class-AB amplifier is the most common bipolar topology used in mid-power audio reproduction; it biases its output stage so that push and pull transistors each conduct for slightly more than half a cycle. This eliminates the crossover distortion of pure class-B designs while keeping efficiency far higher than class-A. The TDA2009A instantiates that topology with on-chip short-circuit protection, thermal shutdown, and AC short-circuit protection of the load, integrating a complete stereo driver into one Multiwatt-11 power package with the heatsink tab on the back. Key features include 10 W + 10 W continuous output into 4 Ω with THD = 10 % at 14 V / 4 Ω (per ST datasheet), 1 % THD typical at lower levels, an operating supply range of 8 V to 28 V, 3 A peak output current per channel, very low harmonic and crossover distortion, and internal protection against short circuits, thermal overload, and DC voltage on the load. The Multiwatt-11 (Pentawatt-style) package exposes a metal tab so the part itself forms the heatsink, simplifying PCB mechanical design. The architecture uses a vertical bipolar power process with quasi-complementary NPN/PNP output pairs, a unity-gain inverting topology per channel, and internal bias generators that minimize quiescent crossover glitch. The result is a flat frequency response from 20 Hz to 20 kHz with low 0.1 % harmonic content, suitable for full-range music reproduction without complex external compensation networks. Typical applications include stereo Hi-Fi music centers, multimedia speaker systems, TV audio output stages, guitar and instrument practice amplifiers, automotive radios (with 14 V supply), and self-powered USB speakers where dual-channel audio from a single chip replaces two single-channel modules. When designing with this device, place a 100 nF decoupling capacitor on the supply pin as close as possible to the IC, use feedback resistors of 39 kΩ for closed-loop gain near 35 dB, and provide adequate heatsinking through a clip-on or bonded tab. The package tab is electrically tied to the -Vs pin (or to the substrate in some legacy datasheets) - consult the datasheet pinout before insulating the heatsink. This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes for the TDA2009A, providing information not consolidated on any single distributor product page.

USD $1.83 在庫あり

TDA3MV

TDA3MV - ADAS Vision SoC | Texas Instruments | Low Power

The Texas Instruments TDA3MV is a low-power System-on-Chip (SoC) designed for Advanced Driver Assistance Systems (ADAS), integrating full-featured processing, imaging, and vision acceleration in a 15mm FCBGA package (ABF substrate, Silicon Revision 2.0). It is part of the scalable TDA3x family, optimized to meet the demanding requirements of leading ADAS applications while minimizing power consumption. An ADAS SoC is a specialized processor that combines general-purpose CPU cores, digital signal processing (DSP), and dedicated hardware accelerators to handle real-time sensor data from cameras, radar, and lidar. It sits within the broader automotive electronics hierarchy, bridging raw sensor input to actionable driving decisions, and is a critical component in the evolution toward autonomous driving. Key features include a heterogeneous architecture with multiple processing cores, integrated imaging and vision accelerators, and support for multiple camera inputs. The device is engineered for low power operation, making it suitable for battery-operated and thermally constrained automotive environments. Its 15mm package with ABF substrate ensures reliable operation across the automotive temperature range. Technically, the TDA3MV leverages TI's advanced process technology to balance performance and power efficiency. The vision acceleration hardware offloads compute-intensive tasks such as object detection and lane departure warning, freeing the CPU for higher-level decision making. The SoC supports secure boot and hardware-enforced isolation, critical for functional safety in automotive systems. Typical applications include front camera systems, driver monitoring, surround view, and sensor fusion units. The low power profile is particularly advantageous for always-on ADAS features that must operate continuously without excessive thermal load. When designing with the TDA3MV, engineers should consider the power delivery network and thermal management, as the SoC's performance is directly tied to adequate supply decoupling and heat dissipation. Reference designs from TI provide guidance on optimal layout and component selection.

USD $29.00 在庫あり

TDA4AL88TGAALZRQ1

TDA4AL88TGAALZRQ1 - 8 TOPS Automotive AI SoC | TI | ADAS

The Texas Instruments TDA4AL88TGAALZRQ1 is an AEC-Q100-qualified Jacinto 7 automotive system-on-chip (SoC) that integrates dual Arm Cortex-A72 application cores running at 2 GHz, eight Arm Cortex-R5F cores at 1 GHz, and TI C66x and C7x DSPs in a 770-pin FCBGA (ALZ) package measuring 23x23 mm. Optimized for vision perception and analytics, it delivers 8 TOPS of deep-learning performance, operates from -40C to +125C, carries the marking TDA4AL88, and ships in tape and reel. A system-on-chip is a single semiconductor device that consolidates a complete computing subsystem - application CPUs, real-time MCU islands, DSP accelerators, memory controllers, and networking peripherals - onto one die. In the processor hierarchy, SoCs sit above microcontrollers and application processors by combining general-purpose compute with domain-specific accelerators. The TDA4AL-Q1 family extends the Jacinto 7 platform, positioning it as a power-optimized vision processor between pure MCUs and full ADAS domain controllers. Key features include the 8 TOPS C7x DSP with MMA deep-learning accelerator for neural network inference, a 64-bit floating-point DSP architecture for math-intensive workloads, dual 2 GHz Cortex-A72 cores for Linux or QNX-based perception stacks, and 1 GHz Cortex-R5F plus C66x islands for deterministic, safety-relevant tasks. The device is designed for automotive use per distributor listings referencing AEC-Q100 and ISO 26262. Architecturally, the heterogeneous design lets engineers partition workloads: the A72 cluster hosts the operating system and application logic, the R5F cluster handles real-time and safety functions, and the C7x executes CNN inference with dedicated vision accelerators. The official datasheet (TDA4VE/TDA4AL/TDA4VL Jacinto Processors, 251 pages, silicon revision 1.0) documents memory, peripherals, and electrical specifications. Typical applications include ADAS front-camera perception, surround view and automated parking, driver and cabin monitoring, automotive gateways, and industrial machine vision. High AI throughput plus integrated automotive networking lets one chip process multiple sensors on a single PCB. Design consideration: verify rail power sequencing and thermal spreading for the 23x23 mm FCBGA early, since the -40C to +125C automotive environment and high TOPS operation demand careful layout; TI provides Ultra Librarian symbols, footprints, and 3D models to accelerate this.

USD $74.21 在庫あり

TDA4VE88TGAALZRQ1

TDA4VE88TGAALZRQ1 - 8 TOPS AI SoC | Texas Instruments

The Texas Instruments TDA4VE88TGAALZRQ1 is a high-performance automotive System-on-Chip (SoC) designed for vision perception and analytics. It integrates dual Arm Cortex-A72 processors running at 2 GHz, a Cortex-R5F real-time core at 1 GHz, C66x and C7x DSPs, and an 8 TOPS AI accelerator. The device also includes a GPU for graphics acceleration. It is offered in a 770-pin FCBGA (ALZ) package measuring 23x23 mm, supporting an operating temperature range of -40°C to +125°C. What is a System-on-Chip (SoC)? An SoC is a semiconductor device that integrates multiple computing units, including CPU cores, DSPs, GPU, AI accelerators, and memory interfaces, onto a single chip. It is a higher-level integration than a microprocessor, combining system functionality to reduce board complexity. In the automotive domain, SoCs are the central compute hub for ADAS, autonomous driving, and infotainment. Key features include dual 2 GHz Cortex-A72 cores for application processing, a 1 GHz Cortex-R5F for real-time control, and C66x and C7x DSPs for signal processing. The 8 TOPS AI accelerator enables deep learning inference at the edge, supporting tasks such as object detection and semantic segmentation. The integrated GPU provides 3D rendering capability for surround-view systems. The SoC uses a heterogeneous architecture to optimize power and performance. The A72 cores handle Linux-based automotive stacks, while the DSPs offload real-time sensor processing. The 770-pin FCBGA (ALZ) package offers excellent thermal performance with a 23x23 mm footprint, enabling dense system integration. The AEC-Q100 qualification ensures reliability across the automotive temperature range. Typical applications include ADAS domain controllers, autonomous driving systems, surround-view camera processing, radar signal processing, and in-vehicle infotainment. Its 8 TOPS AI is particularly suited for vision-perception systems where real-time object detection is critical. When designing with this SoC, ensure proper power sequencing using a PMIC like TPS6594-Q1 and adequate thermal management. The high-speed interfaces require careful PCB design with controlled impedance. Refer to TI's Jacinto 7 reference designs for guidance.

USD $70.00 在庫あり

TDA4VL21HGAALZRQ1

TDA4VL21HGAALZRQ1 - 4 TOPS ADAS SoC | Texas Instruments

The Texas Instruments TDA4VL21HGAALZRQ1 is an automotive system-on-chip (SoC) from the Jacinto TDA4VL-Q1 processor family, engineered for vision perception and analytics. It integrates dual Arm Cortex-A72 cores running up to 2 GHz, Arm Cortex-R5F cores up to 1 GHz, C7x and C66x DSPs up to 1 GHz, an integrated GPU, and a deep-learning accelerator delivering 4 TOPS of AI performance. The device is housed in a 770-ball FCBGA (ALZ) package measuring 23 x 23 mm with 0.8 mm terminal pitch and is rated from -40C to +125C for automotive environments. An automotive vision SoC is a single-chip microprocessor (MPU) subsystem that combines a general-purpose application-processor cluster, a real-time MCU island, digital signal processors, dedicated neural-network acceleration, graphics, and rich automotive I/O on one die. Within the semiconductor hierarchy - semiconductor to microprocessor to system-on-chip to ADAS vision processor - the TDA4VL-Q1 represents the cost-optimized tier of TI's Jacinto platform, sharing its architecture, package technology, and software stack with the TDA4VE and TDA4AL family members under one datasheet. Key features begin with the 4 TOPS deep-learning engine, which executes object-detection, classification, and segmentation networks for camera-based ADAS. Heterogeneous compute lets the Cortex-A72 cluster run high-level operating systems while Cortex-R5F cores close real-time safety loops and the C7x/C66x DSPs accelerate vision kernels. Distributor parametric data lists a 0.84 V maximum core supply, 770 terminals, and device marking TDA4VL21 at silicon revision 1.0. Technically, the TDA4VL21HGAALZRQ1 is covered by the 251-page TI datasheet TDA4VE/TDA4AL/TDA4VL Jacinto Processors, Silicon Revision 1.0, confirming that the ball map, board design, and boot configuration are common across the three variants - a significant advantage for platform reuse and mid-cycle cost-downs. DigiKey and Mouser list the part as an automotive system-on-a-chip with AI accelerator in the 770-FCBGA (23x23) package. Typical applications include single front-camera ADAS ECUs using 4 TOPS neural inference, driver and in-cabin monitoring systems, multi-camera surround view, radar-vision sensor fusion with devices such as the AWR2188 mmWave radar, and industrial edge-AI vision nodes. Companion XAIPART listings include the AR0821CS image sensor and TI automotive PMICs. Design consideration: validate silicon revision 1.0 errata before production, implement the power-up sequencing defined in the TI datasheet with an automotive PMIC, and budget thermal relief under the 23 x 23 mm FCBGA, since high-TOPS workloads concentrate heat in the die area.

USD $111.36 在庫あり

TDA5-Q1

TDA5-Q1 - 1200 TOPS Edge AI SoC | Texas Instruments

The Texas Instruments TDA5-Q1 is a high-performance compute System-on-Chip (SoC) designed for safe and scalable edge AI applications. As part of the TDA5 family, it delivers up to 1200 TOPS of AI compute with an integrated C7 NPU and a chiplet-ready architecture. The SoC features multiple specialized subsystems, each tailored for high-performance compute across domains, including security, vision processing, edge AI, display rendering, and networking. A System-on-Chip (SoC) integrates multiple processing units, memory, and interfaces onto a single silicon die, enabling complex functions like AI inference in embedded systems. The TDA5-Q1 sits at the top of TI's Jacinto processor line, combining a general-purpose CPU, NPU, and specialized accelerators to handle real-time data from sensors and actuators. Key features of the TDA5-Q1 include up to 1200 TOPS AI performance, an integrated C7 NPU, and a chiplet-ready architecture that allows performance scaling. It also includes hardware accelerators for security, vision, and display, and supports ASIL-D functional safety, making it suitable for automotive and industrial applications. The TDA5-Q1 architecture is designed for cross-domain fusion, enabling simultaneous processing of camera, radar, LiDAR, and other sensor data. Its chiplet-ready design provides flexibility for future upgrades, while the integrated safety mechanisms ensure reliable operation in safety-critical scenarios. Typical applications include advanced driver assistance systems (ADAS), autonomous driving, humanoid and industrial robots, industrial transport, and aerospace and defense systems. The SoC's high AI compute and safety features make it ideal for edge AI workloads requiring low latency and deterministic performance. When designing with the TDA5-Q1, ensure adequate power and thermal management to handle the 1200 TOPS AI engine. The chiplet architecture also requires careful consideration of the inter-chiplet communication design to avoid bottlenecks. For detailed specifications, refer to the TI datasheet.

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TDA51S-41HC

TDA51S-41HC - 5kVrms Isolator w/ DC-DC 150Mbps | MORNSUN

The MORNSUN TDA51S-41HC is a high-performance reinforced digital isolator with an integrated isolated DC-DC converter, providing 5000Vrms isolation, 150Mbps signal rate, and 150kV/us common-mode transient immunity in a 16-pin SOIC-16-300mil (wide-body) package. It operates from -40C to +125C, with a primary-side supply of 3.13V to 3.56V (3.3V nominal) and a secondary-side supply supporting up to 5.5V, and carries a UL1577-based 5000Vrms isolation rating. An isolated data transceiver with an integrated isolated power supply is a device that combines galvanic signal isolation and an on-chip (or on-module) isolated power source in one package. In the power-management hierarchy, it sits above standalone digital isolators, which require a separate isolated DC-DC converter or power module to energize the isolated side. By eliminating that external isolated supply, this device class delivers a complete, small-form-factor isolation solution with fewer components, lower BOM cost, and reduced layout risk. Key features of the TDA51S-41HC include the integrated isolated DC-DC converter, which removes the need for a separate isolated power supply; 150Mbps data rate for high-speed serial links; 150kV/us CMTI for immunity against fast switching transients typical of SiC and IGBT power stages; 5000Vrms reinforced isolation per UL1577; and a wide -40C to +125C industrial operating range. The device provides three forward-direction and one reverse-direction channel, with a fail-safe option: if the input signal is lost, the default output is low for devices with the H suffix, which matches the 41HC suffix in this MPN. The integrated power architecture uses on-chip transformer-based isolation for both signal and power transfer, keeping the total solution footprint small while maintaining reinforced-insulation creepage and clearance in the SOIC-16-300mil wide body. Typical applications include isolated RS-485/fieldbus nodes in industrial automation, isolated power and communication for IGBT/SiC gate-drive circuits, battery management systems, and PLC I/O modules. The combination of signal and power isolation is especially valuable where board space or single-supply constraints make a discrete isolated supply impractical. Design consideration: verify that the integrated DC-DC output power budget covers the isolated-side load; the converter is intended to supply the isolated-side transceiver and light external loads, not full power rails. This page synthesizes distributor data, the MORNSUN datasheet, drop-in family alternatives, and practical design notes not found on the manufacturer product page.

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TDA51S485HC

TDA51S485HC - Isolated RS-485 Transceiver 500kbps | MORNSUN

The MORNSUN TDA51S485HC is an isolated, half-duplex enhanced RS-485/RS-422 transceiver with integrated signal isolation, fully compliant with the TIA/EIA-485-A standard, supporting data rates up to 500 kbps in a 16-pin SOIC-16 (300 mil) package. An isolated RS-485 transceiver is a communication interface IC that combines a differential line driver and receiver with galvanic isolation between the logic side and the bus side. Isolation is a critical layer in industrial system hierarchy: within power management and interface electronics, it breaks ground loops, blocks common-mode transients, and protects low-voltage controllers from high-voltage faults on long cable runs in factories and buildings. Key features of the TDA51S485HC include full TIA/EIA-485-A compliance, half-duplex operation on a single twisted pair, data transmission up to 500 kbps, and an integrated fail-safe circuit. The fail-safe function guarantees a defined receiver output state when the bus is idle, shorted, or open, eliminating false characters caused by undriven bus conditions - a common problem in legacy RS-485 networks that otherwise requires external bias resistors. The enhanced transceiver architecture integrates the isolation barrier in a compact SOIC-16-300mil body, reducing board area compared to discrete optocoupler-plus-transceiver designs. It is engineered for harsh industrial environments where robust differential signaling, noise immunity, and long-distance communication over twisted-pair cable are required. Typical applications include industrial automation and PLC networks, building control and HVAC systems, motor control and inverter communication buses, energy metering, and security or access-control systems that communicate over RS-485 fieldbus segments. A key design consideration is bus termination and biasing: even with the internal fail-safe circuit, verify that your network topology, node count, and cable length remain within RS-485 loading and 500 kbps timing budgets; add 120-ohm termination at both cable ends for long runs. This page synthesizes distributor pricing, stock data, drop-in alternative information, and practical design notes not found in the manufacturer datasheet alone.

USD $1.42 在庫あり

TDA51SCANHC

TDA51SCANHC - 5kV Isolated CAN Transceiver 1Mbps | MORNSUN

The MORNSUN TDA51SCANHC is an isolated CAN bus transceiver module with an integrated 5 V isolated power supply, compliant with the ISO11898-2 standard, capable of data rates up to 1 Mbps in a 16-pin SOIC (SOIC-16-300mil, 7.50 mm width) package. An isolated CAN transceiver is an interface IC that provides galvanic isolation between a CAN protocol controller and the physical two-wire CAN bus. Isolation breaks ground loops, protects low-voltage circuitry from common-mode transients, and is essential where nodes span large ground potential differences. Within the signal-chain hierarchy, the TDA51SCANHC belongs to the isolated interface family: transceiver -> bus transceiver -> isolated CAN transceiver -> isolation and interface module. Key features include 5000 VDC galvanic isolation, a common-mode transient immunity of 150 kV/us, and an integrated, efficient 5 V isolated power output that eliminates the need for a separate isolated DC-DC converter on the bus side. The device provides differential transmit and receive capability between the CANH/CANL physical bus and the protocol controller, and it operates across the full -40C to +125C industrial-extended temperature range. A notable protection feature is the TXD dominant time-out function: if a hardware or software fault forces the TXD pin permanently low, the built-in dominant time-out timer prevents the bus from being blocked in a permanent dominant state, safeguarding network availability. Typical applications include industrial fieldbus nodes (Profibus/CANopen gateways), battery management systems, motor-drive control networks, building automation, and medical equipment where isolation between the controller domain and the bus is mandated by safety or robustness requirements. Design consideration: because the part integrates an isolated 5 V power stage, PCB layout must respect the creepage and clearance distances across the isolation barrier defined for the SOIC-16-300mil package, and the integrated power output should be decoupled per the manufacturer datasheet recommendations. This page synthesizes distributor pricing, availability data, family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

USD $1.45 在庫あり

TDA54-Q1

TDA54-Q1 - Premium ADAS SoC with C7 NPU | Texas Instruments

The TDA54-Q1 is a premium System-on-Chip (SoC) from Texas Instruments' Jacinto™ family, designed for advanced driver assistance systems (ADAS) and software-defined vehicles. It integrates a next-generation C7™ neural processing unit (NPU) for high-performance edge AI inference, along with multiple specialized subsystems for vision processing, display rendering, networking, and security. The TDA54-Q1 is part of the TDA5x series, which builds on two decades of TI's leadership in automotive processors, offering scalable high-performance solutions. The TDA5x architecture is an upgrade from the TDA4x series, allowing software developed for TDA4x to be easily ported to TDA5x with minimal rework, thus reusing software assets and enabling more complex applications. A System-on-Chip (SoC) integrates a processor, memory, and peripherals on a single die, serving as the central compute engine for embedded systems. In automotive ADAS, the SoC is the core of the electronic control unit (ECU), handling sensor fusion, object detection, and decision-making. The TDA54-Q1 sits at the top of the ADAS compute hierarchy, alongside other automotive SoCs like the NVIDIA Orin and Mobileye EyeQ, but is distinguished by its dedicated C7 NPU and TI's robust safety and security features. Key features of the TDA54-Q1 include the C7 NPU for AI acceleration, multiple high-performance CPU cores (likely Arm Cortex-A series, though exact configuration is [DATA_NEEDED]), and dedicated hardware accelerators for vision and deep learning. The SoC supports high-bandwidth memory interfaces and high-speed networking (e.g., Ethernet, PCIe) for data-intensive applications. It is designed to meet automotive-grade quality standards, including AEC-Q100 qualification, ensuring reliable operation in harsh environments. Technically, the TDA54-Q1 leverages advanced process technology to deliver high compute density while managing power consumption. The integration of specialized subsystems offloads tasks from the main CPU, improving efficiency and real-time performance. The C7 NPU is optimized for convolutional neural networks (CNNs) and transformer models, enabling real-time object detection, lane detection, and driver monitoring. Typical applications include autonomous driving (Level 2+ to Level 4), ADAS features like automatic emergency braking and adaptive cruise control, and in-cabin monitoring systems. The TDA54-Q1 is also suitable for domain controllers that aggregate data from multiple sensors (cameras, radar, LiDAR) and run fusion algorithms. When designing with the TDA54-Q1, engineers must consider power delivery, thermal management, and signal integrity. The SoC requires multiple power rails with precise sequencing, and a robust PCB layout with adequate decoupling is essential. TI provides reference designs and evaluation modules to accelerate development.

見積もり在庫あり

TDA7297

TDA7297 - 15W+15W Dual Bridge Amplifier | STMicroelectronics

The STMicroelectronics TDA7297 is a dual bridge Class-AB audio amplifier delivering 15W+15W output power in a 15-pin Multiwatt package, designed specifically for TV and portable radio applications. It operates from a wide 6V to 18V supply range and uses an internally fixed gain topology that eliminates the need for SWR capacitors, bootstrap networks, and Boucherot cells. A Class-AB (dual bridge) audio amplifier is a topology that combines two push-pull output stages in a bridge-tied-load (BTL) configuration, allowing higher output swing across a speaker load without large DC-blocking capacitors. The TDA7297 belongs to the broader category of integrated audio power amplifiers, which sit within the analog signal chain and power management domains in a typical consumer electronics design. Dual-bridge configurations are especially valued in compact consumer devices because they double the voltage swing across the speaker and remove the need for a bulky output coupling capacitor. Key features include 15W per channel continuous output into 8 ohm loads, low standby current with a dedicated Standby pin, and a Mute function for click-free power-up sequencing. The device integrates all output transistors in the same silicon die and requires only a few external resistors and a power supply bypass network, enabling very compact PCB designs. Typical THD at 1W output is in the 0.1%-0.5% range, making it suitable for entry-level TV audio, multimedia monitors, and portable boombox designs. The internally fixed gain topology simplifies board layout but limits design flexibility compared to externally adjustable amplifiers like the TDA7294. Thermal performance is handled through the Multiwatt-15 package, which exposes the die tab to a vertical heatsink profile with through-hole pins for robust mechanical mounting. Designers must still respect the safe operating area at high ambient temperatures where sustained 2x15W output can push the junction close to thermal limits without adequate heatsinking. Typical applications include flat-panel TV stereo speaker drivers, portable radio boombox amplifiers, LCD monitor audio outputs, PC motherboard sound subsystems, and DIY audio upgrade kits. The part is commonly found in 2.1-channel subwoofer + satellite systems where a third mono channel can be derived by bridging the two outputs in parallel. When designing with the TDA7297, always provide adequate heatsinking through the Multiwatt tab and respect the 6V-18V supply range. The Standby and Mute pins should be sequenced with a 10kohm/10uF RC network as recommended in the datasheet to achieve click-free power transitions.

USD $1.55 在庫あり

TDA7379

TDA7379 - 4x13W / 2x38W Class-AB Quad Audio Power Amplifier | STMicroelectronics

The STMicroelectronics TDA7379 is a Class-AB audio power amplifier capable of 4x13W or 2x38W output, housed in a Multiwatt-15 package and intended for car-radio and high-power consumer audio applications. The device operates from an 18V nominal supply (operating up to 28V) and integrates a fixed 26dB BTL gain stage that eliminates the need for external bootstrap capacitors, Boucherot cells, or feedback networks. An additional feature is the CMOS-compatible standby function that drops quiescent consumption during mute conditions. A Class-AB amplifier is a linear audio power amplifier in which the output transistors are biased into partial conduction, reducing crossover distortion compared to pure Class-B while achieving higher efficiency than Class-A. Within the broader taxonomy, the TDA7379 belongs to the linear power amplifier family, sitting under the audio power amplifier category, which in turn is part of the signal-chain / amplifier IC family. This hierarchy matters because system designers typically select a Class-AB part like the TDA7379 for high-output, low-noise single-supply audio stages where switch-mode solutions would inject unacceptable EMI into the signal path. Key features of the TDA7379 include a minimum external component count (no bootstrap capacitors, no Boucherot cells), internally fixed 26dB BTL gain, a high output power capability (4x13W into 4 ohm in quad single-ended mode or 2x38W into 4 ohm in dual BTL mode), CMOS-compatible standby, short-circuit protection to ground and to VCC, load-dump voltage surge protection, and reversed-battery protection. These features make the part particularly suited to automotive environments where transient voltages and wiring faults are common. The amplifier's quad single-ended / dual BTL topology allows system designers to choose between four channels of moderate-power audio (for a front/rear speaker pair system) or two channels of high-power audio (for a subwoofer or stereo bridge-tied load). Internally fixed gain simplifies design and reduces variability across production boards; the trade-off is that the gain cannot be trimmed externally. Typical applications include car-radio amplifiers, multi-channel automotive head units, active speaker systems, subwoofer amplifiers, public-address (PA) amplifiers, and replacement boards for legacy automotive audio equipment. The Multiwatt-15 through-hole package also makes it a strong candidate for repair and refurbishment of older car-audio head units where the original amplifier IC has failed. When designing with the TDA7379, engineers should keep the supply rails well bypassed (100 nF + 1000 uF minimum) and provide a generous ground plane, as high peak currents flow through the output stage. Output short-circuit detection must be respected - sustained shorts will trigger internal protection, but the design must still ensure the load cannot fault the supply. This page synthesizes distributor pricing, verified drop-in alternatives (same-brand ST TDA family first, then cross-brand equivalents), and practical design notes not found in any single manufacturer datasheet.

USD $1.39 在庫あり

TDA8029HL/C207

TDA8029HL/C207 - Smart Card Reader IC, 5V, LQFP-32 | NXP

The NXP TDA8029HL/C207 is a complete single-chip, low-power, low-cost, robust smart card reader IC supplied in a 32-pin LQFP (7x7 mm) package. It supports ISO 7816-3 and EMV 4.x smart cards and integrates a DC-DC converter capable of operating from a wide supply range, plus a precision card-supply supervisor with spike-killing and power-on reset. The device targets portable POS terminals, set-top box conditional-access modules, identification readers, and SIM/SAM interface designs. Key specifications include operation from a 3 V to 6 V host supply (with 5 V tolerance on the host interface), an on-chip DC-DC converter that can be configured as a doubler, tripler, or follower to generate the card VCC (typically 1.8 V, 3 V or 5 V), card-clock division ratios from 1 to 16, support for synchronous cards (up to 10.8 ETU for the C207 variant), and ISO UART handling with automatic CRCI/LRC computation on T=0 and T=1 protocols. A smart card interface IC (also called a contact smart card reader or ISO 7816 interface) sits between a host microcontroller and a contact-based smart card, providing level shifting, ESD protection, card-presence detection, clock generation and data framing. The TDA8029 family belongs to NXP's smart-card interface portfolio and is widely used in payment terminals, government/eID readers and telecom SIM sockets, forming a dedicated bridge between the secure card world and a general-purpose MCU. The architecture combines an 8-bit parallel host interface with internal FIFOs, on-chip voltage generation and supervision, and dedicated active-low card detect / CMDVKO logic so that the host MCU only has to issue high-level commands. Compared to discrete implementations built from a LDO plus discrete transceivers, the TDA8029HL integrates protection, signal-conditioning and the entire ISO 7816 protocol engine on one die, reducing BOM count and PCB area for compact portable readers. Typical applications include EMV contactless/contact payment terminals, government and healthcare eID document readers, set-top box conditional-access smart cards, USB token readers and PC-linked reader dongles, and industrial access-control terminals. The wide supply range and low standby current make it particularly attractive for battery-powered handheld POS. Designers should pay attention to the decoupling network on the card side (typically 100 nF + 220 nF) and to the chosen step-up/step-down topology - the C207 variant supports synchronous card timing at 10.8 ETU which is mandatory for some payment cards. The host-side software must drive the dedicated power-down mode to achieve the lowest quiescent current when no card is present. This page synthesises authoritative datasheet data, current distributor pricing, drop-in part numbers within the TDA8029 family and cross-vendor equivalents, plus practical design notes that go beyond the manufacturer datasheet alone.

USD $2.40 在庫あり

TDA8763AM/3/C4

TDA8763AM/3/C4 - 10-bit 30MSPS ADC, 28-SSOP | NXP

The NXP TDA8763AM/3/C4 is a 10-bit high-speed, low-power analog-to-digital converter in a 28-pin SSOP (SOT341-1) package, sampling at 30 MHz. Part of the TDA8763A family, it operates from a single 5V analog and 3.3V digital supply and provides one-clock-cycle conversion latency with DC sampling capability. The converter uses a proprietary Sigma-Delta-like pipeline architecture optimized for video bandwidths. An analog-to-digital converter (ADC) is a mixed-signal integrated circuit that converts continuous analog voltages into discrete digital codes, enabling microcontrollers, DSPs, and FPGAs to process real-world sensor and signal data. The hierarchy is: ADC -> data converter -> mixed-signal IC -> semiconductor. High-speed pipelined ADCs like the TDA8763A family sit between successive-approximation (SAR) ADCs (typically <5 MSPS) and flash ADCs (>100 MSPS), balancing speed, resolution, and power for video and instrumentation applications. Key features include 10-bit resolution, 30 MSPS sampling rate, single-clock-cycle conversion latency, and a high signal-to-noise ratio suited for professional video digitisation. The /3 suffix denotes the 30 MHz speed grade, while /5 designates the 50 MHz grade in the same family. Differential analog inputs with built-in clamping reduce external component count. The architecture combines input clamping, track-and-hold, and a proprietary multi-stage quantiser. Internal reference voltages and a low-jitter clock receiver reduce BOM cost. Digital outputs are CMOS-compatible and can be configured for 3.3V operation, simplifying interface to ASICs and DSPs. Typical applications include professional SDTV video digitizers, medical imaging front-ends, IF sampling in communications receivers, and industrial inspection cameras. The wide bandwidth and low aperture delay make it suitable for any 10-bit, 30 MSPS analog interface. When designing with this part, observe proper analog/digital ground partitioning and provide low-impedance 5V and 3.3V rails with adequate decoupling. The single-clock latency simplifies timing closure in FPGA-based video pipelines.

USD $6.50 在庫あり

TDA8763AM/3/C5

TDA8763AM/3/C5 - 10-Bit 30 MSPS Sigma-Delta ADC | NXP

The NXP TDA8763AM/3/C5 is a 10-bit high-speed, low-power sigma-delta analog-to-digital converter sampling at up to 30 MHz, housed in a 28-pin SSOP (SOT341-1) plastic shrink small outline package with 5.3 mm body width. Operating from a single 5 V analog supply, it accepts single-ended analog inputs and provides CMOS-compatible digital outputs with a sampling frequency of 30 MHz, making it well-suited for video, IF-sampling, and high-speed data acquisition systems. A sigma-delta ADC is a converter architecture that oversamples the input signal at many times the Nyquist rate and uses noise shaping plus digital filtering to push quantization noise out of the signal band. The architecture belongs to the broader taxonomy of data converters (ADC -> Nyquist-rate or oversampling converter -> sigma-delta modulator -> integrated ADC IC -> semiconductor), enabling high effective resolution without requiring laser-trimmed component matching. The TDA8763AM/3/C5 supports DC-sampling operation and integrates the modulator plus decimation filtering on-chip. Key features include 10-bit resolution, 30 MSPS sampling rate, single +5 V analog supply operation, low power consumption suitable for portable or thermally-constrained systems, and CMOS digital I/O for direct connection to ASICs, FPGAs, or DSPs. The device is one variant in the TDA8763AM family, which spans 30/40/50 MHz sampling-speed grades (TDA8763AM/3, /4, /5 respectively) sharing the same SSOP-28 pinout. The 'C5' suffix denotes the 30 MHz grade in tape-and-reel packaging. Typical applications include digital video broadcast (DVB) IF digitization, CCD/CIS image sensor front ends, industrial process control, instrumentation, and intermediate-frequency sampling for communications receivers. The wide analog input bandwidth and DC sampling capability make it suitable for both baseband and IF signal chains. When designing with this ADC, ensure that the analog input drive network provides the correct common-mode and termination load specified by the datasheet, and place the supply decoupling capacitors as close as possible to AVDD and AGND. Allow adequate PCB ground plane separation between the analog and digital grounds to avoid coupling switching noise into the analog front end. This page synthesizes distributor pricing, drop-in family variants, and practical design notes for the 30 MHz grade not found in a single source.

USD $4.10 在庫あり

TDA8763AM/4/C4

TDA8763AM/4/C4 - 10-bit 50MS/s ADC | NXP Semiconductors

The NXP Semiconductors TDA8763AM/4/C4 is a 10-bit high-speed low-power Analog-to-Digital Converter (ADC) with a maximum sampling rate of 50 MS/s and an integrated reference regulator, housed in a 28-pin SSOP (SOT341) package. It uses a proprietary conversion architecture (datasheet front-matter calls it '1 Input 1 Sigma-Delta' on distributor pages) optimized for digitizing high-bandwidth analog signals at low power consumption. The device operates across a commercial temperature grade of -40C to +85C and ships in tape-and-reel packaging suitable for high-volume surface-mount assembly. An ADC is a mixed-signal integrated circuit that converts real-world analog voltages into discrete digital codes that a microcontroller, DSP, or FPGA can process. Within the broader component taxonomy, the TDA8763AM/4/C4 belongs to the data-converter subfamily of signal-chain ICs, sitting between analog front-end amplifiers and digital processors. Its 10-bit resolution produces 1024 discrete output codes, and the 50 MS/s sampling capability lets it accurately capture signals with Nyquist bandwidths up to 25 MHz. Key features include 10-bit resolution, 50 MHz maximum sampling rate, an integrated on-chip voltage reference regulator that simplifies external BOM, low-power operation suitable for portable and line-powered designs, and a single analog input channel. The 28-SSOP (5.30 mm body width) footprint provides a compact, JEDEC-standard surface-mount land pattern. Per the manufacturer datasheet, the device is targeted at applications such as digital video, ultrasound imaging, IF sampling, and instrumentation digitizers. Typical applications include digital still cameras, video capture front-ends, CCD imaging digitizers, professional video equipment, and intermediate-frequency (IF) sampling in communications receivers. The integrated reference saves board area versus ADCs that require an external reference IC, which reduces total solution cost and PCB footprint. When designing with this ADC, ensure the analog input signal is bandwidth-limited and that the sampling clock jitter is held below the analog input period constraint. Decouple AVDD and DVDD separately with 100 nF ceramic capacitors placed as close to the supply pins as possible to minimize digital switching noise coupling into the analog input. The integrated reference regulator provides a stable internal reference, eliminating the need for an external reference IC in most designs.

USD $9.95 在庫あり

TDA8763AM/5/C4

TDA8763AM/5/C4 - 10-Bit 50 MSPS Low-Power ADC | NXP Semiconductors

The NXP Semiconductors TDA8763AM/5/C4 is a 10-bit high-speed, low-power analog-to-digital converter (ADC) designed for professional video and high-speed signal acquisition applications. Housed in a 28-pin SSOP package (SOT341) with gull-wing leads, it converts a single analog input into 10-bit binary-coded digital words at a maximum sampling rate of 50 MHz. The converter supports DC sampling and accepts a low-level sine-wave clock input signal, making it suitable for both rectangular and sinusoidal clock sources in mixed analog/digital systems. An analog-to-digital converter (ADC) is a semiconductor device that translates a continuous-time, continuous-amplitude analog signal into a discrete-time, discrete-amplitude digital code. Within the broader signal-processing hierarchy, the TDA8763AM/5/C4 belongs to the flash and half-flash ADC class optimized for video bandwidth, sitting above successive-approximation-register (SAR) ADCs in speed but below dedicated serializer ADCs. The 10-bit resolution and 50 MSPS capability place it firmly in the professional video and instrumentation converter category — voltage regulators -> power management ICs is not applicable; here it lives in the data converter signal chain between analog front end and digital back end. Key features of the TDA8763AM/5/C4 include 10-bit binary resolution, a maximum sampling rate of 50 megasamples per second, DC-allowed sampling, TTL and CMOS compatible digital I/O, an input bandwidth suitable for component video, and integration of the input clamping and reference circuitry on-chip. Operating from a single 5 V supply with low power consumption, it delivers full-specification performance over the commercial temperature grade and replaces multi-component front-end designs with a single-chip solution. Technically, the device uses a proprietary conversion architecture with an internal reference, input clamping, track-and-hold, and digital output buffers. The architecture balances power consumption against sampling rate, achieving low-power operation at 50 MSPS that suits portable and rack-mounted video acquisition cards alike. According to the manufacturer datasheet, the part supersedes earlier 1997-generation data and was last revised in January 1999. Typical applications include professional video digitizers, digital video recorders, broadcast video processing, medical imaging front-ends, radar/sonar signal acquisition, and high-speed instrumentation. The wide analog input bandwidth also enables IF sampling and digital oscilloscope channels. When designing with this ADC, place the analog input trace over a continuous ground plane and decouple both AVDD and DVDD separately to minimize digital switching noise coupling back into the analog input. Use a 50 ohm-controlled-impedance clock line and keep the analog input trace short to preserve the 50 MSPS performance. This page synthesizes distributor pricing, drop-in alternative NXP family members, and PCB-level design notes not found in the manufacturer datasheet alone, supporting engineer selection and second-source qualification.

USD $7.92 在庫あり

TDA8763AM/5/C5

TDA8763AM/5/C5 - 10-bit 50MSPS ADC, 28-SSOP | NXP

The NXP TDA8763AM/5/C5 is a 10-bit high-speed low-power analog-to-digital converter (ADC) with a sampling rate of up to 50 MHz, housed in a 28-pin SSOP (SOT341) package. It is a single-input, single-channel sigma-delta architecture ADC optimized for video and high-speed signal acquisition, providing one clock cycle conversion and supporting DC sampling. The part is supplied in Tape & Reel (TR) packaging and is intended for surface-mount assembly. An ADC (analog-to-digital converter) is a mixed-signal integrated circuit that converts continuous analog voltages into discrete digital codes, forming the bridge between the analog front end and digital processing stages. Within the broader taxonomy, this device belongs to: ADC -> data converter -> data acquisition IC -> mixed-signal IC -> semiconductor. The sigma-delta topology oversamples the input at a rate much higher than the Nyquist frequency and uses noise shaping to push quantization noise out of band, trading analog input bandwidth for high effective resolution. Key features include 10-bit resolution, sampling up to 50 MHz, DC sampling capability, single-clock-cycle latency, no missing codes, an In-Range (IR) CMOS output with TTL/CMOS-compatible levels, and 9.4 effective bits at a 4.43 MHz full-scale input with a 40 MHz clock. These characteristics indicate the device is engineered for video-rate digitization where high SNR and clean mid-frequency performance are required. The IR output assists downstream clamping or gain control logic. The part uses a switched-capacitor input structure with an internal reference. Its single-clock-cycle conversion latency simplifies synchronization in pipelined architectures, and the wide analog input bandwidth supports standard video frequencies (e.g., 4.43 MHz PAL chroma). Per the manufacturer datasheet, the device operates from a single supply and provides CMOS-level digital outputs for direct interfacing with standard ASICs, FPGAs, or DSPs. Typical applications include video digitizers, professional broadcast equipment, industrial imaging, medical ultrasound front ends, and high-speed instrumentation. The 50 MSPS rate is well matched to standard-definition and intermediate-frequency video ADCs. When designing with this device, place input decoupling close to the supply pins and provide a low-impedance analog input drive. The SOT341 SSOP28 package has moderate thermal resistance and requires standard 4-layer PCB layout practice for mixed-signal integrity. This page consolidates distributor pricing, drop-in alternatives, datasheet availability, and practical design notes for the TDA8763AM/5/C5 in a single source - features not found in the manufacturer datasheet alone.

USD $7.20 在庫あり

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TDA8763AM/5/C5 - 10-bit 50MSPS ADC, 28-SSOP | NXP