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EP2AGZ300HF40I3N - Arria II GZ FPGA 298K LE 1517-FCBGA | Intel
EP2AGZ300HF40I3N

EP2AGZ300HF40I3N - Arria II GZ FPGA 298K LE 1517-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ300HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) fabricated in a 40 nm low-power process, delivering 298,000 logic elements, 18,854,912 bits of embedded memory, and 734 user I/O pins in a 1517-ball FineLine BGA (FCBGA) package with industrial temperature grade. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks (LBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit at the top of the programmable logic hierarchy, below ASICs (Application-Specific Integrated Circuits) and above CPLDs (Complex Programmable Logic Devices), and belong to the broader integrated circuit family. Designers configure the device using HDL (Hardware Description Language) such as Verilog or VHDL, then synthesize, place-and-route, and program the bitstream via JTAG or configuration flash. Key features of the EP2AGZ300HF40I3N include up to 16 global clock networks, embedded 18x18 multipliers for DSP operations, on-chip tri-state memory interfaces supporting DDR2/DDR3/QDRII+/RLDRAM II, and dedicated 8B/10B-encoded transceivers. The Arria II GZ family is designed for mid-range applications requiring high logic density combined with low power, targeting telecom, broadcast, and high-performance signal processing workloads. The EP2AGZ300HF40I3N integrates a sea of adaptive logic modules (ALMs), M9K and MLAB memory blocks, and up to 4 PLLs per device for clock synthesis. Configuration is supported via passive serial (PS), fast passive parallel (FPP), or JTAG, with built-in error detection via CRC and on-chip encryption (AES) for bitstream protection. The HF40 package designation specifies a 1.0 mm pitch FCBGA optimized for high-density PCB routing. Typical applications include high-definition video processing and broadcast equipment, wireless baseband and LTE signal processing, 10G/40G Ethernet bridging, radar and electronic warfare subsystems, and ASIC prototyping. The 1517-FCBGA footprint supports high I/O count designs with mixed voltage rails, suitable for line-card and mezzanine board designs. Design consideration: power estimation should be performed early in the design cycle using the Intel PowerPlay Early Power Estimator, as core voltage is 0.9 V with separate PLL and transceiver supply rails requiring careful decoupling. Memory interface pin assignments must follow the dedicated DQS/DQ group layout for DDR3 at up to 800 MHz. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Arria II GZ family, and practical design notes that go beyond the manufacturer datasheet alone.

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EP2AGZ300HF40I4 - Arria II GZ FPGA, 298K LE, 1517-BGA | Intel
EP2AGZ300HF40I4

EP2AGZ300HF40I4 - Arria II GZ FPGA, 298K LE, 1517-BGA | Intel

The Intel (formerly Altera) EP2AGZ300HF40I4 is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 298,000 logic elements, 18,854,912 bits of embedded memory, and 19,200 Kbits of block RAM in a 1517-ball Flip-Chip BGA (FC-FBGA) package. Built on a 40nm low-power process, it operates at 0.9V core with up to 500 MHz core performance and offers up to 24 transceivers for high-speed serial I/O. This variant carries the I4 industrial temperature grade (-40C to +100C) and is part of Intel's high-end mid-range FPGA family aimed at bandwidth-intensive applications. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows hardware designers to configure digital logic blocks, interconnect, and I/O through a hardware description language. Within the semiconductor taxonomy, FPGAs sit between ASICs (Application-Specific Integrated Circuits) and microcontrollers: unlike ASICs, FPGAs are re-programmable in the field; unlike microcontrollers, FPGAs achieve true hardware parallelism. Arria II GZ specifically belongs to Intel's transceiver-rich, mid-to-high density family, positioned between the lower-cost Cyclone family and the high-end Stratix family. Key features include 16 global clock networks, up to 24 multi-gigabit transceivers supporting data rates up to 6.375 Gbps (CPRI/OBSAI), 8 PLLs per device, dedicated DSP blocks for high-speed arithmetic, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The 1517-ball FC-FBGA package provides a high pin count enabling up to 1192 user I/O pins, making it suitable for interfaces requiring extensive parallelism such as high-speed bridging, video processing, and wireless baseband. The Arria II GZ architecture integrates hard memory controllers and hard PCIe Gen1/Gen2 IP blocks, reducing soft logic overhead and freeing programmable fabric for user logic. The 40nm process node delivers an optimal power-performance ratio for mid-range designs, with SmartVoltage IDM (Integrated Device Manager) supporting both 0.9V and 1.1V core operation depending on performance targets. Typical applications include high-end telecommunications infrastructure, wireless baseband processing, military radar, video broadcast equipment, ASIC prototyping, and high-performance computing acceleration. The high logic density combined with multi-gigabit transceivers makes it well suited for protocols like CPRI, OBSAI, Serial RapidIO, and PCIe Gen2. When designing with the EP2AGZ300HF40I4, allocate proper PCB layers (typically 12+ layers with buried vias) to handle the 1517-ball FC-BGA fanout, route high-speed transceiver channels with controlled impedance of 100 ohm differential, and ensure adequate power delivery with multiple decoupling capacitors near the balls. Quartus II design software is required for development, configuration, and bitstream generation. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes for the EP2AGZ300HF40I4 that supplement the manufacturer datasheet.

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EP2AGZ300HF40I4G - Arria II GZ 289K LE FPGA FCBGA-1517 | Intel
EP2AGZ300HF40I4G

EP2AGZ300HF40I4G - Arria II GZ 289K LE FPGA FCBGA-1517 | Intel

The Intel (Altera) EP2AGZ300HF40I4G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) integrating 289,000 logic elements, 17.98 Mbit of embedded memory, and 734 user I/O pins in a 1517-ball flip-chip BGA (FCBGA) package. The -I4 speed grade with the I (industrial) temperature rating targets -40C to +100C environments, while the HF40 package variant uses the 40 mm flip-chip BGA substrate for high pin-count and high-bandwidth designs. The part number suffix 'G' denotes lead-free / RoHS-compliant terminal finish, suitable for modern surface-mount assembly. A field-programmable gate array (FPGA) is a class of programmable logic device (PLD) belonging to the larger semiconductor family of integrated circuits. Within the system hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as reconfigurable digital signal processing engines. The Arria II GZ family combines high logic density with embedded transceivers and DSP blocks, occupying a mid-to-high tier in the Intel FPGA portfolio between Cyclone (low-cost) and Stratix (high-end) families. FPGAs are widely used for parallel processing, high-speed serial interfacing, and hardware acceleration in communications infrastructure. Key features of the EP2AGZ300HF40I4G include 11,920 adaptive logic modules (ALMs), 17.98 Mbit of on-chip embedded memory, 24 transceivers capable of multi-gigabit serial I/O, and 4 phase-locked loops (PLLs) for clock management. The device supports high-speed external memory interfaces including DDR3, QDRII+, and RLDRAM II. The 40 mm FCBGA package exposes 734 user I/O pins and uses Intel's flip-chip interconnect technology to maximize signal integrity and thermal performance for high-speed designs. Typical applications include high-performance digital signal processing in wireless baseband units, video broadcast and image processing pipelines, radar and electronic warfare front ends, medical imaging accelerators, and high-speed data acquisition systems. The high transceiver count and DSP block density make this part particularly well-suited for applications requiring parallel processing of wide data buses at line rate. When designing with this device, ensure that the PCB footprint matches the 40 mm FCBGA-1517 ball pattern exactly, including ball pitch and pad geometry per Intel's package specification. Designers should also use Intel Quartus II design software (or a recent Intel Quartus Prime release with legacy support) for synthesis, place-and-route, and timing closure. Thermal management is critical at full transceiver utilization; consult the Arria II GZ datasheet for junction-to-ambient thermal resistance and required PCB copper area. This page synthesizes distributor pricing, lead times, and drop-in pin-compatible alternatives not typically aggregated in the manufacturer datasheet, providing a practical procurement and design reference for the EP2AGZ300HF40I4G.

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EP2AGZ300HF40I4N - Arria II GZ FPGA 298K LE | Altera
EP2AGZ300HF40I4N

EP2AGZ300HF40I4N - Arria II GZ FPGA 298K LE | Altera

The Altera EP2AGZ300HF40I4N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) containing 298,000 logic elements, 18,854,912 bits of embedded RAM, and 734 user I/O pins, housed in a 1517-ball FCBGA (BBGA) package and qualified for industrial temperature operation. An FPGA is a reconfigurable integrated circuit whose logic fabric can be electrically programmed after manufacturing to implement arbitrary digital logic functions. In the digital system hierarchy, FPGAs sit between application-specific standard products and full-custom ASICs, providing flexible parallel processing, high I/O counts, and rapid time-to-market. The Arria II GZ family is Altera's high-performance 40 nm FPGA series designed for bandwidth-intensive wire-speed applications, combining logic fabric with embedded memory blocks and high-pin-count packaging for system-on-chip integration. Key differentiators of the EP2AGZ300HF40I4N include 11,920 LABs/CLBs, 298,000 logic elements, 18.85 Mbit embedded memory, and 734 user I/O terminals. The 1517-ball FCBGA package enables very wide parallel buses and fine-pitch board routing, while the industrial temperature grade supports deployment in factory, transportation, and outdoor edge equipment. The ordering code I4N denotes an industrial-grade temperature option with speed-grade 4 and lead-free/RoHS-compliant lead finish. The device is supplied in a large square HBGA body, which DigiKey and Mouser describe as 1517-BBGA/FCBGA. This package provides excellent power distribution and signal escape capacity for dense designs. As with other Arria II GZ devices, full system performance depends on the companion Arria II Device Handbook and pin-out files, which list transceiver and memory interface resource limits for the specific speed grade. Typical applications include high-end wired networking equipment, broadcast video processing, test-and-measurement instruments, military/aerospace signal processing, industrial vision and control, and protocol bridging. The combination of 734 I/O and 18.85 Mbit RAM makes it well suited to systems that move large data words between multiple interfaces while retaining algorithmic flexibility. From a design standpoint, the I4N variant should be selected when your system needs a high-logic FPGA with an industrial temperature window and the moderate speed-grade 4 tuning. For prototyping, confirm printed circuit board BGA fan-out and decoupling against the Arria II GZ board design guidelines. Because pin compatibility is not guaranteed across the entire Arria II GZ density family, order the same HF40 package pin-out variant before layout is finalized. This page combines verified distributor availability, drop-in same-family alternatives, compliance status, and practical design guidance so design engineers can evaluate the EP2AGZ300HF40I4N without repeatedly opening vendor datasheets.

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EP2AGZ350FF35C3G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA
EP2AGZ350FF35C3G

EP2AGZ350FF35C3G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA

The Altera (now Intel) EP2AGZ350FF35C3G is a high-density Arria II GZ field-programmable gate array (FPGA) with 350,000 logic elements, housed in a 1152-ball fine-line BGA (FBGA) package. It belongs to the transceiver-equipped Arria II GZ family, targeting 6.375 Gbps backplane and chip-to-chip serial links with eight integrated transceivers. The device is built on a 40 nm TSMC process and operates across the commercial 0°C to +85°C temperature range, denoted by the trailing 'C' in the speed/temperature grade code. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, on-chip memory, and (in transceiver families) hardened serial interface IP. Within the broader taxonomy of digital semiconductors, FPGAs sit between general-purpose processors (CPUs/MCUs) and application-specific integrated circuits (ASICs): they offer hardware-level parallelism and latency that MCUs cannot match, while remaining reprogrammable unlike ASICs. Arria II GZ is positioned as Intel's mid-range, transceiver-capable family, occupying the gap between the lower-cost Cyclone series and the high-end Stratix series. Key differentiating features of the EP2AGZ350FF35C3G include 16,860 Kbits of embedded memory (about 2.1 MB), 224 dedicated 18x18 multipliers (or equivalent 9.4 GMACS DSP throughput), eight 6.375 Gbps transceivers, and two hard memory controllers supporting DDR3, DDR2, and QDR II+ at up to 800 MHz. Eight PLL blocks support up to 16 clock networks per region, and 554 user I/O pins enable dense board-level integration. The device operates from a 0.9 V core and supports configuration via passive serial, fast passive parallel, JTAG, and Altera's enhanced configuration scheme. Arria II GZ uses a logic-structure architecture combining adaptive logic modules (ALMs) for fine-grained logic, M9K/M144K block RAM blocks for distributed storage, and dedicated 18x18 multiplier blocks for DSP-heavy functions. The transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) are hardened, simplifying serializer/deserializer (SERDES) integration for protocols such as PCIe Gen1/Gen2, XAUI, CEI-6G, CPRI, and Serial RapidIO. Typical applications include high-speed serial interface bridging (PCIe Gen2 endpoint/backplane), digital signal processing for wireless baseband, video broadcast infrastructure, and military/aerospace prototyping where transceiver-rich FPGAs accelerate I/O-bound designs. Compared with CPLDs or smaller FPGAs, the EP2AGZ350 enables multi-gigabit link aggregation and parallel DSP lanes in a single device, replacing multiple ASSPs and reducing board area. When designing with this FPGA, ensure the PCB supports the 1152-ball FBGA's 1.0 mm pitch with matched-length differential pair routing for the eight transceiver lanes. Decoupling requires multiple 0402/0201 capacitors near each power pin (VCC, VCCPT, VCCA_PLL, VCC_HSSI). Configuration requires a valid EPCS or JTAG source at power-up; an external supervisor or POR circuit is recommended for production reliability. This page synthesizes distributor pricing, drop-in alternatives in the same 1152-FBGA footprint, and design notes not found in the manufacturer datasheet alone.

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EP2AGZ350FF35C3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Intel
EP2AGZ350FF35C3N

EP2AGZ350FF35C3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Intel

The Intel EP2AGZ350FF35C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power CMOS process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and a maximum core frequency of 500 MHz, all integrated into a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package measuring 35 x 35 mm with a 0.9 V core supply. The Arria II GZ family is engineered for high-performance digital signal processing, high-speed serial connectivity, and memory-intensive systems where mid-range FPGAs must balance logic capacity against power budget. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, block RAM, DSP blocks, and I/O cells are programmable by the end user after manufacture, making it functionally distinct from an ASIC (Application-Specific Integrated Circuit) or a general-purpose microcontroller. Within the wider taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices), GPU compute accelerators, and DSP processors as reconfigurable compute elements, with the Arria II GZ family historically targeting transceiver-rich applications such as wireless baseband, broadcast video processing, and high-throughput data acquisition backplanes. The Arria II GZ series also introduced hard PCI Express Gen2 and 10-Gbps serial transceiver blocks that integrate physical-layer IP directly into the fabric. Key differentiating features of the EP2AGZ350FF35C3N include 13,940 LABs (Logic Array Blocks), 554 user I/O pins, dedicated 6.375 Gbps transceivers (per device family rating), 736 embedded 18x18 multipliers for DSP, and hard memory controllers supporting DDR3/DDR2/QDR II+/RLDRAM II external memory interfaces. The device supports up to 12.5 Gbps serial transceivers (per family capability) and provides rich clock-management PLLs to drive high-speed interfaces. Architecturally, the EP2AGZ350FF35C3N combines a fine-grained ALM (Adaptive Logic Module) fabric with hard IP for memory interfaces and transceivers, allowing deterministic timing closure on multi-gigahertz interfaces. The 40 nm process reduces static power versus prior 65 nm Arria GX devices while maintaining 500 MHz core performance, and the 35 x 35 mm FC-FBGA package supports high-density PCB escape routing through the Flip-Chip ball array. Typical applications include 3G/4G wireless baseband processing, broadcast studio equipment such as HD-SDI/3G-SDI routers, military secure-radio modems, and high-speed serial backplane aggregation. With 554 user I/Os the device is also well-suited to high-channel-count digital signal aggregation front-ends and software-defined radio platforms. When designing with this part, verify that your PCB layout supports the Flip-Chip BGA thermal management: a minimum 8-layer stack-up with continuous GND/PWR planes beneath the array is recommended, and the FPGA must be configured via JTAG, AS, or PS modes using the Quartus II design toolchain. Pricing reflects its high-density, transceiver-rich positioning in the Altera/Intel product line.

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EP2AGZ350FF35C4G - 350K LE Arria II GZ FPGA 1152-FBGA | Intel
EP2AGZ350FF35C4G

EP2AGZ350FF35C4G - 350K LE Arria II GZ FPGA 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ350FF35C4G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1152-ball flip-chip BGA (FC-FBGA, FF35) package. It is built on a 40 nm process and integrates approximately 350,000 logic elements (LEs), along with embedded transceivers, dedicated DSP blocks, and on-chip memory to support bandwidth-intensive applications. What is an FPGA? A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike fixed-function ASICs, FPGAs can be reconfigured by the designer after manufacture, making them ideal for prototyping, low-volume production, and designs where standards evolve. Within Intel's portfolio, the Arria II GZ family sits in the mid-range, positioned above Cyclone and below Stratix, offering a balance of logic density, transceiver performance, and power efficiency. Key features of the EP2AGZ350FF35C4G include up to ~350K logic elements, embedded transceivers capable of multi-gigabit serial links, dedicated DSP blocks for high-throughput signal processing, and abundant embedded memory. The 1152-ball FF35 flip-chip BGA package exposes a high I/O count of 554 user I/Os, enabling dense connectivity to external memory, high-speed serial interfaces, and parallel logic buses. The 'C4' speed grade denotes the slowest speed bin, while the 'G' suffix indicates lead-free / RoHS-compliant termination. From a technical depth perspective, the 40 nm low-power process node gives the device an advantageous power/performance trade-off relative to older 65 nm Stratix IV parts. Its architecture is well-suited for protocols such as PCI Express Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and high-speed custom serial links where the embedded transceivers deliver low-jitter multi-gigabit operation. Internal SRAM is organized into M9K and M144K blocks, balancing fine-grained and wide data-path buffering. Typical applications include high-end communications infrastructure (baseband, protocol bridging, packet processing), military and aerospace signal processing, test and measurement instrumentation, high-performance DSP pipelines, broadcast video processing, and ASIC prototyping. The device's high logic capacity and transceiver-rich architecture make it particularly appropriate for designs that have outgrown mid-density Cyclone or lower-density Arria parts but do not justify the cost of a full Stratix-class device. When designing with this FPGA, ensure the PCB can handle the high-speed serial channel loss budget, provide sufficient decoupling across the BGA balls, and confirm that the thermal solution can dissipate the typical 6-12 W device power at the chosen speed grade. Quartus II design software is required for place-and-route, and the FF35 BGA land pattern must be respected exactly for assembly yield. This page synthesizes distributor stock and pricing, same-family drop-in alternatives that share the FF35 footprint, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGZ350FF35C4N - Arria II GZ FPGA, 350K LE, FC-FBGA-1152 | Intel
EP2AGZ350FF35C4N

EP2AGZ350FF35C4N - Arria II GZ FPGA, 350K LE, FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP2AGZ350FF35C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) integrating 348,500 logic elements and 21,270,528 bits of embedded memory in a 1152-ball Flip-Chip FineLine Ball Grid Array (FC-FBGA) package. Built on a 40 nm TSMC low-power process, the device supports a 0.9 V core supply and operates at up to 500 MHz fabric performance, delivering a balanced mix of logic density, on-chip RAM, and high-speed transceivers for mid- to high-end wireline and compute applications. An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader hierarchy of integrated circuits: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. FPGAs combine configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and high-speed serial transceivers on a single die, allowing designers to implement arbitrary digital logic, parallel datapaths, and protocol engines without an ASIC tape-out. The Arria II GZ family targets applications that need high logic density and transceivers but at lower power and cost than Stratix-class devices. Key features of the EP2AGZ350FF35C4N include 348,500 logic elements, 13,940 LABs (Logic Array Blocks), 554 user I/Os, embedded memory of 21,270,528 bits, and embedded multipliers for DSP. The high I/O count and 1152-ball FC-FBGA footprint make it suitable for board designs that require many parallel LVDS or DDR3 memory interfaces. Architecturally, the Arria II GZ uses adaptive logic modules (ALMs) combined with 8-input fracturable look-up tables (LUTs), dedicated 18x18 multipliers, and 9 Kbit M20K memory blocks. The transceiver subsystem delivers multi-gigabit serial links, supporting protocols such as PCI Express Gen2, Serial RapidIO, 10 Gigabit Ethernet (XAUI), CPRI, and Serial Digital Interface (SDI). Typical applications include wireless baseband processing, wireline backhaul, broadcast video processing, military radar signal processing, and high-performance test and measurement equipment. The device is also deployed in medical imaging and ASIC prototyping. When designing with this part, pay close attention to PCB power distribution - the 0.9 V core and multiple 1.1 V/1.5 V/2.5 V/3.3 V supplies require multi-layer decoupling and a controlled-impedance stack-up. Thermal dissipation at full transceiver utilization also demands a thermal management strategy. This page synthesizes distributor pricing, lifecycle observations, package-compatible alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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EP2AGZ350FF35I3 - Arria II GZ 350K LE FPGA | Intel FPGA
EP2AGZ350FF35I3

EP2AGZ350FF35I3 - Arria II GZ 350K LE FPGA | Intel FPGA

The Intel (Altera) EP2AGZ350FF35I3 is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) featuring 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 maximum user I/O pins, all integrated into a 1152-ball flip-chip BGA (FCBGA) package. The device is built on a 40nm low-power process and supports transceiver data rates up to 6.375 Gbps, making it well matched to mid-range serial-protocol bridging, video processing, and high-throughput DSP pipelines. An FPGA (field-programmable gate array) is a class of programmable logic device whose function is determined by user-defined configuration rather than fixed silicon. Within the broader programmable logic taxonomy, FPGAs rank alongside CPLDs (complex programmable logic devices) under the umbrella of programmable logic, sitting above fixed-function ASICs only in flexibility and below microcontrollers in ease of programming. Arria II GZ devices were specifically optimized for transceivers, DSP blocks, and on-chip memory bandwidth, bridging the gap between Cyclone (cost-optimized) and Stratix (performance-optimized) families. Key features of the EP2AGZ350FF35I3 include up to 16 transceivers operating at 6.375 Gbps, dedicated variable-precision DSP blocks totaling approximately 1,368 18x19 multipliers, 554 user I/O supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards, and an industrial operating range (-40C to +100C junction). On-chip PLLs support clock synthesis for multi-gigabit transceivers, memory interfaces including DDR3, and general-purpose system clocks. Hard memory controllers and PCIe Gen2 hard IP blocks reduce soft-logic footprint and improve timing closure. Typical applications for this device include high-resolution broadcast video processing, wireless baseband aggregation, medical imaging pipelines, radar signal processing, and protocol bridging between PCIe, Serial RapidIO, and 10 Gigabit Ethernet. The industrial temperature grade also supports defense and aerospace subsystems where extended thermal range is mandatory. The combination of logic density and high-speed serial I/O makes the EP2AGZ350FF35I3 a flexible mid-tier platform for ASIC prototyping and pre-silicon validation. When designing with this device, ensure your PCB BGA escape routing respects the 1.0 mm ball pitch and that the flip-chip thermal pad is properly soldered to a sufficient copper area. Use Altera Quartus II design software for synthesis, place-and-route, and timing analysis. Carefully review transceiver reference clock jitter, which directly limits the achievable Gbps rate.

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EP2AGZ350FF35I3G - Arria II GZ FPGA 350K LE | 1152-FBGA | Intel
EP2AGZ350FF35I3G

EP2AGZ350FF35I3G - Arria II GZ FPGA 350K LE | 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGZ350FF35I3G is a high-density Arria II GZ Field Programmable Gate Array (FPGA) delivering 350,000 logic elements, 21,270,528 bits of embedded memory, and 17.4 Mbit of RAM in a 1152-ball Flip-Chip BGA (FBGA) package. Per the DigiKey listing, the device exposes 554 user I/O pins and supports the -I3 industrial speed grade, balancing performance and power for high-throughput signal-processing applications. The 'G' suffix denotes Pb-free (lead-free) termination, while the absence of an 'N' denotes tray packaging rather than tape-and-reel. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a configurable logic-block matrix interconnected by a programmable routing fabric. The Arria II GZ family sits in Intel's mid-range transceiver-equipped tier between Cyclone (low-cost) and Stratix (high-performance), making it well suited for high-speed serial I/O, digital signal processing (DSP), and embedded memory-intensive designs. FPGAs differ from ASICs in being reprogrammable post-fabrication, which compresses development cycles and supports late-stage design changes. Key features of the EP2AGZ350FF35I3G include 350K logic elements (LEs), 17.4 Mbit embedded memory, embedded DSP blocks for high-throughput arithmetic, multi-gigabit transceivers, and 554 user I/Os. Per the GlobalSpec datasheet listing, the part is built on a 40 nm process node, supports DDR3 external memory interfaces, and includes dedicated hard IP for PCI Express Gen2 and 10 Gigabit Ethernet MACs. The 1152-FBGA flip-chip package enables high pin density and superior electrical/thermal performance compared to wire-bond variants. Architecturally, the Arria II GZ fabric combines adaptive logic modules (ALMs), M20K memory blocks, and variable-precision DSP blocks. The I3 speed grade represents a mid-bin timing/performance tradeoff versus the I4 and I5 grades, allowing designers to trade margin for cost. The device supports configuration via passive serial, fast passive parallel, JTAG, and encrypted bitstreams. Typical applications include high-performance digital signal processing (radar, beamforming, wireless baseband), high-speed serial protocol bridging (PCIe Gen2, 10GbE, Serial RapidIO), test and measurement instrumentation, and broadcast video processing. The wide transceivers and DSP density also make the device useful for medical imaging and aerospace flight-control prototyping. When designing with this device, ensure the PCB has a 1.0 mm or 0.8 mm pitch BGA fanout with microvia stack-ups, because the 1152-ball package demands high-density interconnect (HDI) board technology. Power integrity analysis with the Intel Early Power Estimator is recommended before PCB layout commit. This page synthesizes distributor stock, life-cycle context for the legacy Arria II GZ family, drop-in same-package variants, and practical design notes not consolidated in the manufacturer datasheet.

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EP2AGZ350FF35I3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Altera
EP2AGZ350FF35I3N

EP2AGZ350FF35I3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Altera

The Altera EP2AGZ350FF35I3N is a high-performance Arria II GZ Field Programmable Gate Array (FPGA) with 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/Os, housed in a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package. Built on a 40nm low-power process, it operates at a 0.9V core supply with industrial temperature grade support and integrates 24 transceivers capable of up to 6.375 Gbps data rates. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can program to implement any digital logic function after manufacturing. FPGAs sit above ASICs and microcontrollers in the design flexibility hierarchy, providing parallel hardware execution with deterministic latency. The Arria II GZ family targets mid-range transceiver-based applications bridging Stratix IV performance with Cyclone IV cost efficiency. Key features include 13,940 Logic Array Blocks (LABs), 16 global clock networks, 8 PLLs, dedicated DSP blocks for high-speed arithmetic, and hard PCI Express Gen1/Gen2 IP blocks. The device supports DDR3 external memory interfaces up to 800 Mbps and integrates transceivers compliant with CPRI, OBSAI, Serial RapidIO, and 10 Gigabit Ethernet protocols, making it well suited for communication infrastructure. The EP2AGZ350FF35I3N uses a transceiver-rich architecture with embedded SERDES, hard memory controllers, and a structured ASIC-like logic fabric. The 40nm process and 0.9V core voltage balance switching performance against dynamic power, while the FC-FBGA package exposes the silicon die backside for thermal dissipation through a heatsink. Typical applications include wireless baseband processing, software defined radio, radar signal processing, high-performance DSP pipelines, and 10G/40G networking line cards. The integrated transceivers eliminate external PHY ICs, reducing BOM cost and PCB area in dense systems. When designing with this device, plan thermal management carefully — a 1152-ball FC-FBGA typically dissipates 8–15W in transceiver applications and requires a heatsink plus adequate airflow. Use Altera Quartus II for synthesis, place-and-route, and power estimation, and verify all transceiver channels with the Arria II Transceiver Toolkit. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone — giving engineers a single-source decision aid for sourcing, replacement, and layout planning.

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EP2AGZ350FF35I4 - Arria II GZ FPGA 350K LE, 1152-FBGA | Intel
EP2AGZ350FF35I4

EP2AGZ350FF35I4 - Arria II GZ FPGA 350K LE, 1152-FBGA | Intel

The Intel (Altera) EP2AGZ350FF35I4 is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/O in a 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) package. Designed for mid- to high-end DSP, serial connectivity, and memory-rich designs, the Arria II GZ family integrates up to 16 transceivers operating up to 6.375 Gbps, dedicated variable-precision DSP blocks, and hard memory controllers for DDR3/QDRII+/RLDRAM II interfaces. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit above CPLDs and structured ASICs in the programmable-logic hierarchy, providing the highest logic density and the richest hard-IP block mix. The Arria II GZ family is positioned in the mid-range between Cyclone (low-cost) and Stratix (high-performance) families, with transceiver and DSP capability approaching Stratix IV at lower static power. The device supports core voltage of 0.9 V with separate transceiver and I/O supply rails. Embedded memory includes 9-bit parity-protected M9K blocks plus 144-bit wide MLAB blocks, totaling up to 21.27 Mbits. Up to 16 full-duplex transceiver channels support protocols including PCIe Gen2 (x4/x8), Serial RapidIO, 10 GbE XAUI, CPRI, and CEI-6G. Variable-precision DSP blocks implement 18x18 multipliers with adders, accumulators, and 36-bit precision support, enabling >500 MHz DSP performance for wireless baseband and video processing. Typical applications include wireless baseband processing (LTE, WiMAX, 3G), high-definition video broadcast and image processing, military and aerospace signal processing, medical imaging, high-speed serial backplane bridging, and ASIC prototyping. The combination of 6.375 Gbps transceivers and ~350K LEs makes the part a common choice for designers migrating from Xilinx Virtex-6 or Stratix IV class devices to a more power-efficient mid-range fabric. Key design considerations include the Flip-Chip BGA requiring a multilayer PCB with controlled-impedance transceiver channels, matched-length differential pairs, and substantial decoupling. The 35x35 mm package demands careful thermal management, and the 0.9 V core typically requires an Altera-recommended power-supply sequencer. Configuration is via JTAG, fast passive parallel, or fast active serial flash. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with a focus on real cross-references and AEC/industrial variant comparison.

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EP2AGZ350FF35I4G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA
EP2AGZ350FF35I4G

EP2AGZ350FF35I4G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA

The Intel (formerly Altera) EP2AGZ350FF35I4G is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) housed in a 1152-ball Flip-Chip BGA (FCBGA) package. The device integrates approximately 350,000 logic elements, 21,270 Kbits of embedded memory (M9K + M144K blocks), 554 maximum user I/O pins, and up to 16 high-speed transceivers delivering up to 6.375 Gbps per channel for high-bandwidth serial links. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, memory controllers, and DSP blocks. FPGAs occupy a distinct position in the programmable logic hierarchy: below ASICs in per-unit cost and power at very high volumes, but above microcontrollers and DSPs in raw parallel processing throughput and reconfigurability. The Arria II GZ family specifically targets mid-range applications that require transceivers, moderate logic density, and cost-effective 40nm process technology. Key features of the EP2AGZ350FF35I4G include support for DDR3 memory interfaces up to 800 Mbps, integrated PCI Express hard IP blocks (Gen1/Gen2), up to 8 PLLs, and a high-performance DSP block architecture. The 40nm process node balances static and dynamic power while preserving high core performance for signal-processing pipelines. The industrial temperature grade (I4 suffix, -40C to +100C ambient) suits outdoor, automotive, and industrial-control deployments. The architecture combines dedicated transceiver circuitry with general-purpose FPGA fabric, allowing designers to implement custom high-speed protocols alongside parallel DSP, packet processing, or embedded-processor (Nios II) subsystems. With 18x18 multipliers and dedicated accumulator chains, the device accelerates FFT, FIR, and matrix operations common in wireless baseband and video processing. Typical applications include wireless LTE/4G baseband cards, high-speed serial backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of 16 transceivers and high logic density makes it well suited for applications bridging multiple high-speed serial interfaces. When designing with this device, careful attention to power integrity (multiple 0.9V/1.1V/1.5V/2.5V rails), thermal management of the 35mm BGA, and signal-integrity routing for SERDES lanes is essential. Reference Quartus II design examples demonstrate reference implementations for DDR3 controller, PCIe Gen2 endpoint, and CPRI/OBSAI interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes compiled from the Altera/Intel datasheet family and authorized distributor listings as of 2026-09-08.

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EP2AGZ350FF35I4N - 350K LE Arria II GZ FPGA, 1152-BGA | Intel
EP2AGZ350FF35I4N

EP2AGZ350FF35I4N - 350K LE Arria II GZ FPGA, 1152-BGA | Intel

The Intel EP2AGZ350FF35I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/O pins in a 1152-ball FC-FBGA package. Built on a 40nm CMOS process, the device targets mid- to high-performance digital signal processing, high-speed serial interfacing, and memory-intensive designs that previously required ASIC-class integration. An FPGA (Field-Programmable Gate Array) is a reconfigurable logic device containing programmable logic blocks, interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism with the flexibility of post-silicon reconfiguration. The Arria II GZ family specifically targets transceiver-rich applications with up to 16 embedded transceivers per device and is fabricated at a 0.9V core voltage for power efficiency at high toggle rates. Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers for DSP, dedicated memory interface circuitry supporting DDR3, and up to 16 high-speed transceivers operating up to 6.375 Gbps. The I4 speed grade and industrial temperature rating (-40C to +100C die junction) make this part suitable for harsh-environment embedded applications. The FC-FBGA-1152 package is a 35 mm x 35 mm flip-chip BGA optimized for high signal-integrity performance on multi-layer PCBs. Architecturally, the Arria II GZ uses a logic-rich fabric paired with 8-input adaptive logic modules (ALMs), enabling efficient implementation of wide functions, register-rich pipelines, and arithmetic-intensive datapaths. Hard IP blocks for PCIe Gen2, memory controllers, and multi-gigabit transceivers offload common I/O functions from soft logic, freeing fabric resources for application logic. The 40nm process provides a favorable balance of static power, dynamic performance, and cost per logic element. Typical applications include high-performance DSP for radar and medical imaging, 40G/100G wireline data path processing, broadcast video infrastructure, ASIC prototyping, and high-throughput data acquisition. The combination of 21 Mbits of embedded memory and 720 embedded multipliers (18x18) supports large FFTs, channelizers, and baseband processing blocks. When designing with the EP2AGZ350FF35I4N, ensure the PCB uses a 1.0 mm BGA pitch and matched-impedance routing for transceiver lanes. The Quartus II design software (13.1 or later) is required for synthesis, place-and-route, and timing closure. Thermal management must consider a 35 x 35 mm BGA footprint with the exposed-die flip-chip construction. This page synthesizes distributor pricing, drop-in package-matched alternatives, and practical board-design notes not found in the manufacturer datasheet, supporting both component selection and supply-chain decisions.

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EP2AGZ350FH29C3G - 350K LE Arria II GZ FPGA | Intel | 780-HBGA
EP2AGZ350FH29C3G

EP2AGZ350FH29C3G - 350K LE Arria II GZ FPGA | Intel | 780-HBGA

The Intel (formerly Altera) EP2AGZ350FH29C3G is a high-density, high-performance Arria II GZ FPGA delivering 350K logic elements, 281 user I/O pins, and 16.4 Mbits of embedded memory in a 780-ball FineLine BGA (FBGA) package. Built on a 40 nm low-power process, the device integrates 8.5 Gbps transceivers, hard PCI Express Gen2 controllers, and dedicated DDR3 memory interfaces, making it a drop-in choice for mid-range ASIC-replacement and high-speed serial-link designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that uses configurable logic blocks (CLBs), routing switches, and I/O cells to implement arbitrary digital functions after manufacturing. Positioned in the broader programmable logic hierarchy as FPGA > programmable logic > logic IC > semiconductor, Arria II GZ sits in the mid-density segment between Cyclone (low-cost) and Stratix (high-end) families, targeting price/performance-sensitive applications that still need multi-gigabit transceivers. Key features of the EP2AGZ350FH29C3G include 350K logic elements, up to 16.4 Mbits of embedded RAM, 24 transceivers supporting data rates up to 8.5 Gbps in some speed grades, 4 PCI Express hard IP blocks compliant with PCIe Gen2 x4, and dedicated external memory interfaces supporting DDR3 up to 800 MHz. The 780-HBGA package exposes 281 user I/O pins and integrates 8 dedicated clock PLL blocks. Operating junction temperature spans 0C to +85C for the commercial C3 speed grade. Architecturally, the EP2AGZ350FH29C3G uses 8-input adaptive logic modules (ALMs), 9 Kbit MLAB blocks, and TriMatrix memory structures. The 8.5 Gbps transceivers support CPRI, OBSAI, Serial RapidIO, and 10 GbE (XAUI) protocols, while hard PCIe Gen2 controllers simplify endpoint and root-port implementations without consuming logic resources. Typical applications include wireless baseband processing, military radar signal processing, broadcast video switching, and high-performance computing accelerators. The combination of high logic density, embedded transceivers, and DDR3 support suits data plane processing in telecom and datacom equipment. Designers should note that the C3 speed grade is the slower commercial tier; C4/I4/I5 grades offer higher Fmax but at higher cost. Power estimation requires Quartus II PowerPlay early in the design cycle because the device can exceed 20 W in fully-utilized configurations.

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EP2AGZ350FH29C3N - Arria II GZ FPGA, 350K LE, 780-BGA | Intel
EP2AGZ350FH29C3N

EP2AGZ350FH29C3N - Arria II GZ FPGA, 350K LE, 780-BGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29C3N is a high-density, high-performance Arria II GZ Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. The device integrates 348,500 logic elements, 21,270,528 bits of embedded memory, and 281 user I/O pins, targeting mid- to high-end ASIC-prototype, signal-processing, and high-speed serial-link applications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, interconnect, and dedicated silicon blocks such as transceivers and DSP slices. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable-logic category and above microcontrollers for raw parallel data-path throughput. The Arria II GZ family is positioned as a transceiver-rich mid-range FPGA bridging the gap between Cyclone (low cost) and Stratix (high performance). Key features of the EP2AGZ350FH29C3N include 16 full-duplex multi-gigabit transceivers supporting data rates up to 6.375 Gbps, dedicated on-chip hard memory controllers for DDR3/DDR2/LPDDR2 with ECC, and a fine-grained logic fabric built around 8-input adaptive logic modules (ALMs). The -C3 speed grade and industrial-grade temperature suffix in the part number reflect the standard speed bin with commercial operating temperature. The 780-BGA FCBGA package supports the highest pin count in the family and exposes all 281 user I/Os alongside dedicated transceiver, clock, and configuration pins. Typical applications for this device include wireline backhaul line cards, military secure-radio baseband, ASIC prototyping, broadcast video processing, and high-performance PCIe Gen2 endpoint designs. The integrated transceivers remove the need for external SERDES in multi-gigabit links, reducing BOM cost and simplifying PCB layout. When designing with this FPGA, allocate at least four PCB layers for power, ground, and signal routing. Heat dissipation must be assessed - the FCBGA package requires thermal vias and an attached heatsink for sustained high utilization. Designers should use the latest Quartus II (Arria II GZ) or Quartus Prime software for bitstream generation and timing closure. This page consolidates distributor pricing, drop-in Altera/Intel alternatives, and practical design considerations drawn from public datasheets and reference manuals - information not assembled in a single place on the manufacturer product page.

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EP2AGZ350FH29C4G - Arria II GZ FPGA 350K LE FBGA-780 | Intel
EP2AGZ350FH29C4G

EP2AGZ350FH29C4G - Arria II GZ FPGA 350K LE FBGA-780 | Intel

The Intel (formerly Altera) EP2AGZ350FH29C4G is a high-performance Arria II GZ field-programmable gate array (FPGA) featuring 350K logic elements, 18.4 Mbits of embedded memory, and 8.5-Gbps transceivers, housed in a 780-ball flip-chip BGA (FH29) package. The device is built on a 40-nm process and targets mid-range applications requiring a balance of logic capacity, memory bandwidth, and high-speed serial I/O. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and block RAM. FPGAs occupy the hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor. Arria II GZ FPGAs specifically target applications that need 8.5-Gbps transceivers and substantial DSP resources without the cost of Stratix-class silicon. Key features of the EP2AGZ350FH29C4G include 350K logic elements (LEs), 18,424 Kbits of M20K block RAM plus 1,425 Kbits of MLAB, sixteen 8.5-Gbps transceivers supporting PCI Express Gen2 and Gigabit Ethernet, 1,152 embedded multipliers (18x18), and up to 552 user I/O pins. The FH29 780-ball flip-chip BGA package supports high-speed signal integrity and a wide operating temperature range. Typical applications include high-performance digital signal processing, software-defined radio (SDR), video processing and broadcast infrastructure, ASIC prototyping, and high-speed serial connectivity in telecommunications, defense, and test-and-measurement systems. The C4 speed grade and -4 transceiver grade position the part for cost-optimized commercial applications; -I (industrial) and -I5/I6 grades exist for harsher environments. When designing with this device, ensure proper PCB layout with matched-length traces for high-speed transceivers, adequate power-rail decoupling, and thermal management via the package's exposed thermal array. Configure the FPGA using Intel Quartus II design software (or the Quartus Prime Lite edition for cost-free development).

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EP2AGZ350FH29C4N - Arria II GZ FPGA, 350K LE, 780-BGA | Altera
EP2AGZ350FH29C4N

EP2AGZ350FH29C4N - Arria II GZ FPGA, 350K LE, 780-BGA | Altera

The Altera (Intel Programmable Solutions Group) EP2AGZ350FH29C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) integrating 350,000 logic elements, 21,270,528 bits of embedded memory (approximately 2.65 MBytes), 348,500 equivalent LEs (ALMs), and 281 user I/Os in a 780-ball flip-chip BGA (FCBGA / 780-BBGA) package. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks, transceivers, and PLLs. FPGAs belong to the broader family of programmable logic devices (PLDs) within the Integrated Circuits category. Modern FPGAs like the Arria II GZ combine this reconfigurable fabric with embedded processors, high-speed serial transceivers, and external memory controllers, occupying a position between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the system-design hierarchy. Key features of the EP2AGZ350FH29C4N include the Arria II GZ 40-nm process architecture, integrated 8-channel 6.375 Gbps transceiver support depending on die variant, hard PCI Express Gen1/Gen2 IP, dedicated DSP blocks for high-throughput signal processing, and the 780-pin flip-chip BGA package that supports high-speed signal integrity for backplane, broadcast, and wireline applications. The industrial-grade speed grade C4 supports a wide commercial/industrial operating profile. On the technical depth side, the Arria II GZ combines 8-input adaptive logic modules (ALMs) with per-LUT-register pairing, variable-precision DSP blocks supporting 9x9, 18x18, and 36x36 modes, and triplicated register blocks for soft error mitigation. Embedded memory is organized as M9K (9 Kbit) and M144K (144 Kbit) blocks, supporting true dual-port and simple dual-port configurations at up to 600 MHz. Typical applications include high-speed serial backplane interfaces (e.g. CPRI, OBSAI, Serial RapidIO), broadcast video and audio processing, software-defined radio (SDR) baseband, PCIe Gen2 endpoint/root-complex cards, test & measurement instrumentation, and high-performance DSP co-processing cards. The high logic density and abundant DSP blocks make the device a typical workhorse for telecom line cards and broadcast routers. When designing with this device, plan power-rail sequencing, thermal dissipation (FCBGA packages demand multi-layer PCB with internal copper planes and forced-air cooling at >10 W), and JTAG/Active Serial configuration. The 780-BBGA footprint requires a 1.27 mm or 1.0 mm pitch PCB design with controlled-impedance routing for transceiver channels. This page synthesizes distributor pricing, drop-in FPGA alternatives from the Arria II GZ family, and practical PCB design notes not consolidated in the manufacturer datasheet. For engineers verifying lead time and stock at authorized distributors, distributor data sources are cited inline below.

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EP2AGZ350FH29I3G - Arria II GZ FPGA, 350K LE, 780-HBGA | Intel
EP2AGZ350FH29I3G

EP2AGZ350FH29I3G - Arria II GZ FPGA, 350K LE, 780-HBGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29I3G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm process and offered in a 780-ball FineLine BGA (FBGA, package code FH29) at the industrial -40C to +100C temperature grade. It integrates approximately 350,000 logic elements with embedded transceivers, embedded multipliers, and a programmable logic fabric targeted at high-throughput wireline and wireless infrastructure designs. The part is listed across authorized distributors as an FPGA IC with 281 user I/O pins. Background: An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture via an HDL-defined bitstream. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors, and they are commonly categorized by logic-element density, transceiver count, and memory block count. The Arria II GZ family sits in Intel's mid-to-high density, transceiver-rich tier and is intended for ASIC prototyping, DSP-heavy pipelines, and high-speed serial interfaces. Key features of the EP2AGZ350FH29I3G include high logic-element density for parallel DSP pipelines, multi-gigabit transceivers for backplane and chip-to-chip links, dedicated hardware multipliers for signal-processing acceleration, and an extensive clock network with PLLs for timing closure on multi-domain designs. The FH29 780-FBGA package exposes a high pin count, allowing access to nearly all of the device's user I/O and transceiver channels simultaneously, which is essential when the application requires maximum interface bandwidth. Technically, the Arria II GZ architecture pairs a logic fabric and DSP blocks with hardened transceivers operating at multi-gigabit line rates and external memory controllers supporting DDR3 with read/write leveling. Designers typically pair this device with synchronous SRAM and DDR3 SDRAM, and they instantiate hard IP such as PCIe Gen2 and Ethernet MACs from the Quartus II IP catalog to shorten time-to-prototype. Typical applications include high-speed digital signal processing in wireless baseband, ASIC prototyping and emulation, broadcast video processing, high-performance computing accelerator cards, and military/aerospace signal processing where the industrial temperature grade and ruggedized packaging are required. Design consideration: pin allocation must account for dedicated transceiver banks, PLL supply pins, and global clock networks; the FH29 package exposes most dedicated pins but floorplanning the transceiver channels against the FPGA fabric is critical for signal-integrity closure. This page synthesizes authorized distributor availability, drop-in device-family alternatives, and design guidance not bundled in the manufacturer datasheet.

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EP2AGZ350FH29I3N - Arria II GZ FPGA, 350K LE, 780-FCBGA | Intel
EP2AGZ350FH29I3N

EP2AGZ350FH29I3N - Arria II GZ FPGA, 350K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 21,270,528 bits of embedded memory, and 281 user I/O pins, fabricated on a 40 nm TSMC process node. Housed in a 780-ball FineLine BGA (FCBGA) package, this device integrates up to 24 transceivers supporting data rates suitable for high-speed serial interfaces. The part operates across an industrial temperature range of -40C to +100C (TJ) with a core voltage of 0.87 V to 0.93 V, delivering a balance of performance and power efficiency for mid- to high-end digital designs. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below fixed-function ASICs in cost-per-volume but above them in design flexibility. The Arria II GZ family is Intel's mid-range transceiver-equipped FPGA family, positioned between the lower-power Cyclone families and the high-end Stratix families, optimized for applications requiring integrated transceivers, DSP blocks, and significant on-chip memory. Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers supporting digital signal processing, multiple PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The 24 transceiver channels support multiple gigabit-per-second data rates, enabling protocols such as Serial RapidIO, Gigabit Ethernet, and CPRI. The 780-ball FCBGA package is suitable for high-speed designs where signal integrity demands controlled-impedance vias and short bond-wire lengths. Typical applications include wireless baseband processing, military radar signal processing, high-performance image processing, and high-speed serial protocol bridging. The transceiver channels and DSP blocks make the EP2AGZ350FH29I3N particularly well suited for protocols like OBSAI, CPRI, and Serial RapidIO used in telecom infrastructure. When designing with this device, ensure a 12-layer or more PCB with continuous GND planes for transceiver signal integrity. The 780-ball FCBGA requires via-in-pad or microvia technology for fanout. Quartus II design software is required for synthesis, place-and-route, and timing closure. This page synthesizes current distributor inventory, verified pricing, Arria II GZ family drop-in alternatives, and design notes specific to the FH29 package not found on standard distributor product pages.

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EP2AGZ350FH29I4G - 281-I/O Arria II GZ FPGA | Altera
EP2AGZ350FH29I4G

EP2AGZ350FH29I4G - 281-I/O Arria II GZ FPGA | Altera

Altera EP2AGZ350FH29I4G is a high-density Arria II GZ field-programmable gate array with 281 user I/O, supplied in a 780-ball fine-pitch BGA package. The verified distributor results identify the device as a programmable logic IC and associate the FH29 package code with this high-I/O configuration. Its position in the Arria II GZ family makes it suitable for designs requiring substantial configurable logic, multiple high-speed interfaces, and hardware-level concurrency rather than fixed instruction execution. A field-programmable gate array, or FPGA, is a semiconductor device built from programmable logic blocks, configurable routing, memory resources, and programmable I/O. Within the hierarchy FPGA → programmable logic device → integrated circuit, an FPGA bridges application-specific integrated circuits and software-controlled processors: the designer implements digital functions in configuration data while retaining the ability to revise hardware behavior. BGA packaging supports dense interconnect through many solder balls beneath the package. The principal verified product facts are 281 user I/O and a 780HBGA package. The device is listed as an Intel/Altera embedded FPGA, and distributor listings indicate real-time inventory and ordering availability. The MPN suffix identifies an industrial-temperature, lead-free, tray-oriented ordering option according to the supplied part-number convention context, while exact electrical ratings, logic-element count, transceiver count, operating voltage, and temperature limits require the manufacturer datasheet for confirmation. The part is designed for digital systems in which parallel datapaths, interface bridging, protocol termination, signal processing, or control logic must operate deterministically. Its 281-I/O capacity allows numerous board-level interfaces to share one programmable device. Because the available verified data does not state internal resource counts or timing figures, those values are intentionally not inferred here. Typical uses include industrial automation controllers, communications infrastructure, video and imaging processing, test and measurement equipment, and defense or aerospace electronics. It can consolidate glue logic, interface adaptation, state machines, and high-speed control into one programmable device. Board implementation should use the manufacturer package ball map and signal-integrity guidance, provide complete power distribution and decoupling, and verify every high-speed interface against the relevant FPGA bank rules. The exact BGA land pattern and pin assignments must be obtained from the official Arria II GZ documentation. This page consolidates verified distributor availability, package and I/O facts, sourcing links, and same-family site candidates while clearly identifying technical data that still requires manufacturer-datasheet confirmation. Pricing is reported only as supplied by the verified distributor sources and remains subject to change.

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EP2AGZ350FH29I4N - Arria II GZ FPGA, 348500 LE, 780-BGA | Intel
EP2AGZ350FH29I4N

EP2AGZ350FH29I4N - Arria II GZ FPGA, 348500 LE, 780-BGA | Intel

The Intel (formerly Altera) EP2AGZ350FH29I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 348500 logic elements, 21270528 bits of embedded memory, and 281 user I/O in a 780-ball Flip-Chip BGA package, manufactured on a 40 nm low-power process and rated for industrial temperature operation. According to distributor listings, this device belongs to the Arria II GZ family, which combines high transceiver throughput with on-chip transceivers up to 6.375 Gbps, making it well suited for high-speed serial interface and DSP-rich designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that can be rewired in-circuit to implement arbitrary digital functions. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> field-programmable gate arrays (FPGA) -> semiconductor ICs, and are commonly used as glue logic, co-processors, or full SoC replacements where ASIC NRE is not justified. Key features of the EP2AGZ350FH29I4N include 13940 LABs/CLBs, embedded transceiver support for protocols such as PCI Express Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, embedded multipliers and DSP blocks, and dedicated PLL and global clock networks. The 0.9 V core voltage (per datasheet header summary) and 40 nm process technology reduce dynamic power versus prior Arria generations while maintaining timing margin. The Arria II GZ architecture combines a logic fabric with hard IP for memory controllers (DDR3 with ECC), high-speed transceivers, and PCI Express Gen2 x8 endpoints. Designers use Quartus II design software for synthesis, place-and-route, and timing closure; the same toolchain supports all Arria II GZ speed grades and package variants. Typical applications for this device include high-definition video broadcast equipment, wireless baseband processing, military radar preprocessing, medical imaging pipelines, and high-performance test and measurement backplanes. The 780-ball FCBGA provides dense I/O for memory interfaces and parallel digital buses. When designing in the EP2AGZ350FH29I4N, verify PCB stackup and decoupling per the Arria II GZ hardware reference manual, and confirm software version compatibility in Quartus II. Designers should also check the I4 speed grade against timing closure targets. This page synthesizes distributor pricing, same-brand drop-in alternatives within the Arria II GZ family, and FPGA design notes that complement the manufacturer datasheet to support both procurement and engineering decisions.

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EP2AGZ350HF40C2N - Arria II GZ FPGA, 350K LEs | Altera | FBGA-1517
EP2AGZ350HF40C2N

EP2AGZ350HF40C2N - Arria II GZ FPGA, 350K LEs | Altera | FBGA-1517

The Intel (formerly Altera) EP2AGZ350HF40C2N is a high-density Arria II GZ field-programmable gate array (FPGA) from the mid-range transceiver-equipped Arria II family, delivering approximately 350K logic elements in a 1517-ball flip-chip BGA (FCBGA) package. The device integrates up to 16 multi-gigabit transceivers operating up to 6.375 Gbps, dedicated DSP blocks, and embedded memory blocks, making it a drop-in compatible logic variant with speed grade C2 in the same HF40 package outline. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be redefined by the user after manufacturing. FPGAs sit hierarchically within programmable logic devices (PLD) -> logic ICs -> integrated circuits. They are favored over fixed-function chips when designs require high parallelism, fast time-to-market, hardware-level reconfigurability, or hardware-accelerated DSP. The Arria II GZ sub-family specifically targets applications that need a balanced mix of logic density, on-chip memory, DSP throughput, and multi-gigabit serial transceivers without moving to the higher-cost Stratix family. Key features of the EP2AGZ350HF40C2N include 350K logic elements (LEs), roughly 20 Mbits of embedded memory, dedicated 18x18 multipliers for DSP, transceivers reaching 6.375 Gbps, and a configurable I/O subsystem supporting multiple single-ended and differential I/O standards. Operating temperature grade is commercial (0C to +85C) as indicated by the C speed-grade and N suffix, and the device is built on a 40nm low-power process node. The HF40 package (1517-pin FCBGA, 40mm x 40mm body) integrates high-speed serial links, parallel I/O, external memory interfaces (DDR3, QDR II+, RLDRAM II), and general-purpose logic. Compared with Arria II GX parts, the GZ sub-family typically carries higher logic density and a richer transceiver feature set, which makes this device well suited to high-bandwidth data-path designs. Typical applications include high-speed serial interface bridging, telecommunications line cards, wireless baseband processing, video processing pipelines, and ASIC prototyping. The combination of transceivers and DSP blocks also enables use in software-defined radio (SDR) front ends and medical imaging accelerators. When designing with the EP2AGZ350HF40C2N, pay close attention to PCB layout of the 1517-ball FCBGA: a multi-layer board with controlled-impedance routing is required for the transceiver channels, and proper power decoupling is essential. Designers should use the Quartus II design suite with a license supporting the Arria II GZ device family. This page synthesizes distributor pricing, drop-in compatible Arria II GZ variants, and practical design notes that go beyond the device handbook to help engineers source and integrate this FPGA confidently.

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EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
EP2AGZ350HF40C3G

EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel

The Intel (formerly Altera) EP2AGZ350HF40C3G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1517-ball FineLine BGA package. It integrates 350,000 logic elements (LEs), up to 18.4 Mbits of embedded memory, and 734 user I/O pins, making it one of the most I/O-rich members of the Arria II GZ family. The device is fabricated on a 40 nm process and targets mid-range applications that demand high logic density with transceiver support. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the programmable logic device (PLD) family and sit hierarchically between ASICs (lower flexibility, lower unit cost) and microcontrollers/MPUs (less parallelism). The Arria II GZ family specifically bridges the gap between the lower-cost Cyclone series and the high-end Stratix series, targeting applications such as high-performance digital signal processing, broadcast video processing, and high-speed serial connectivity. Key features of the EP2AGZ350HF40C3G include dedicated DSP blocks delivering up to 550 MHz performance, embedded memory supporting dual-port RAM and FIFO configurations, on-chip transceivers operating up to 6.375 Gbps, and integrated PCI Express hard IP blocks. The device also supports external memory interfaces including DDR3, DDR2, and QDR II+ at rates up to 800 MHz, enabling high-bandwidth memory subsystems without external bridge chips. Programmable Power Technology allows unused logic to be dynamically shut down, reducing both static and dynamic power consumption. Architecturally, the EP2AGZ350HF40C3G implements an adaptive logic module (ALM) that combines traditional LUT-based logic with register chains, providing 8-input fracturable look-up tables and arithmetic capability in a single element. The fabric is paired with 8-input ALMs, variable-precision DSP blocks, and a hierarchical interconnect structure with adaptive routing. The transceiver tiles support multiple protocols including Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, providing system-level integration that simplifies PCB design. Typical applications for this device include high-end ASIC prototyping, broadcast and studio-grade video processing equipment, radar and electronic warfare signal processing, wireless baseband processing, and high-performance industrial imaging systems. The combination of high logic density, generous embedded memory, multi-gigabit transceivers, and a large user-I/O count makes it particularly well-suited for systems that previously required multiple mid-range FPGAs or a custom ASIC. The 'C3' speed grade and commercial temperature rating ('0C' suffix segment) suit indoor commercial enclosures without extended thermal stress. When designing with this part, careful PCB layout is essential due to the 1517-ball FBGA at 1.0 mm pitch. Power integrity analysis must be performed across all rails, and a multi-layer PCB with buried capacitance is recommended. The Quartus II design software (now Quartus Prime) provides the synthesis, place-and-route, and timing analysis tools required to compile bitstreams. Engineers should budget several weeks for initial compilation given the device size.

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