EP2AGZ350FH29I3N - Arria II GZ FPGA, 350K LE, 780-FCBGA | Intel
部品番号: EP2AGZ350FH29I3N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4550 | $45,500.00 |
| 100 | $4125 | $412,500.00 |
| 500 | $3850 | $1,925,000.00 |
| 1,000 | $3550 | $3,550,000.00 |
EP2AGZ350FH29I3N 概要
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below fixed-function ASICs in cost-per-volume but above them in design flexibility. The Arria II GZ family is Intel's mid-range transceiver-equipped FPGA family, positioned between the lower-power Cyclone families and the high-end Stratix families, optimized for applications requiring integrated transceivers, DSP blocks, and significant on-chip memory.
Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers supporting digital signal processing, multiple PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The 24 transceiver channels support multiple gigabit-per-second data rates, enabling protocols such as Serial RapidIO, Gigabit Ethernet, and CPRI. The 780-ball FCBGA package is suitable for high-speed designs where signal integrity demands controlled-impedance vias and short bond-wire lengths.
Typical applications include wireless baseband processing, military radar signal processing, high-performance image processing, and high-speed serial protocol bridging. The transceiver channels and DSP blocks make the EP2AGZ350FH29I3N particularly well suited for protocols like OBSAI, CPRI, and Serial RapidIO used in telecom infrastructure.
When designing with this device, ensure a 12-layer or more PCB with continuous GND planes for transceiver signal integrity. The 780-ball FCBGA requires via-in-pad or microvia technology for fanout. Quartus II design software is required for synthesis, place-and-route, and timing closure.
This page synthesizes current distributor inventory, verified pricing, Arria II GZ family drop-in alternatives, and design notes specific to the FH29 package not found on standard distributor product pages.
ドロップイン代替品: EP2AGZ350FH29I3N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ350FH29I3N （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, RoHS Status, Logic Elements (LE).
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ350FH29I3G
✅ ドロップイン✓ 在庫あり
$1450 / 個
データシートを見る →EP2AGZ350FH29C4N
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP2AGZ350FH29C3N
✅ ドロップイン✓ 在庫あり
$1920 / 個
データシートを見る →EP2AGZ300FH29I3N
✅ ドロップイン✓ 在庫あり
$1380 / 個
データシートを見る →EP2AGZ350FF35I3N
✅ ドロップイン✓ 在庫あり
$3598.1 / 個
データシートを見る →EP2AGZ350FH29I3N 最大定格＆電気的特性
| Series | Arria II GZ |
| Logic Elements | 348,500 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory | 21,270,528 bits |
| User I/O Count | 281 |
| Number of I/O | 281 |
| パッケージ / ケース | 780-BBGA, FCBGA |
| ピン数 | 780 |
| Process Technology | 40 nm |
| Core Voltage | 0.87 V to 0.93 V |
| 動作温度 | -40C to +100C (TJ) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| RoHS Compliance | Lead-Free / RoHS Compliant |
EP2AGZ350FH29I3N 780-bbga, fcbga ピン配置ガイド
EP2AGZ350FH29I3N (780-bbga, fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGZ350FH29I3N.
詳細は データシート をご参照ください。
主な用途
EP2AGZ350FH29I3N の用途: 7 件s: Wireless Baseband Processing, Military Radar Signal Processing, High-Performance Image Processing, High-Speed Serial Protocol Bridging, Test and Measurement Instrumentation, Broadcast Video Processing, Industrial Control and Automation.
Wireless Baseband Processing
The EP2AGZ350FH29I3N's 348,500 logic elements and 24 transceiver channels provide ample processing capacity for multi-standard wireless baseband designs including LTE, WiMAX, and proprietary OFDM protocols. Its 21 Mbits of embedded memory supports large constellation buffers and channel estimation tables, while the 18x18 multipliers enable FFT and FEC decoding pipelines. Industrial temperature grade allows outdoor base-station deployment. Placed on a 12-layer PCB with continuous GND planes, the device delivers deterministic latency across serial RapidIO and CPRI links to baseband cards.
おすすめ
Military Radar Signal Processing
The 350K logic element density of EP2AGZ350FH29I3N is well suited to phased-array radar signal processing where multiple channels of pulse compression, MTI filtering, and Doppler processing must execute in parallel. The integrated transceiver channels aggregate digitized antenna signals at multi-Gbps rates, while DSP blocks accelerate complex multiplications in beamforming computations. The industrial -40C to +100C temperature range and ruggedized FCBGA package meet defense environmental requirements. Engineers pair the FPGA with high-speed ADCs and DACs via LVDS or JESD204B interfaces.
おすすめ
High-Performance Image Processing
The EP2AGZ350FH29I3N integrates 348K logic elements with 18x18 multipliers, supporting real-time image processing pipelines such as convolution, color-space conversion, and edge detection on multi-megapixel video streams. The 21 Mbits embedded memory accommodates multi-line frame buffers required by video scaling algorithms, while PCIe hard IP enables direct attachment to image sensor front-ends or host processors. Industrial temperature grade suits outdoor surveillance and machine-vision deployments where ambient conditions vary widely.
おすすめ
High-Speed Serial Protocol Bridging
The EP2AGZ350FH29I3N's 24 full-duplex transceiver channels support bridging between protocols such as Serial RapidIO, CPRI, OBSAI, 10 Gigabit Ethernet, and PCIe Gen2 at line rates up to 6.375 Gbps per channel. This protocol flexibility suits applications such as telecom backhaul aggregation, test and measurement equipment, and storage area networks where multiple serial standards must coexist. The integrated hard IP blocks for PCIe and transceivers reduce logic utilization for protocol logic, freeing fabric for application-layer processing.
おすすめ
Test and Measurement Instrumentation
The EP2AGZ350FH29I3N suits high-end test and measurement equipment where parallel DSP processing, large memory capacity, and flexible I/O are critical. The 350K logic elements support deep pattern generation, real-time protocol analysis, and multi-channel acquisition pipelines, while the transceiver channels aggregate data from multiple test ports. Industrial temperature range enables bench-top and portable instrument deployment. Quartus II design software allows custom measurement IP integration for proprietary test algorithms.
おすすめ
Broadcast Video Processing
The EP2AGZ350FH29I3N handles broadcast video formats including uncompressed HD-SDI, 3G-SDI, and emerging 4K/UHD workflows where real-time color correction, scaling, and frame-rate conversion are required. Its 24 transceivers aggregate multiple SDI streams at 3 Gbps per channel, while embedded memory buffers multiple video frames for temporal processing. Industrial temperature grade supports equipment room and field deployment. The 780-FCBGA package fits into ATCA or AdvancedMC carrier boards with controlled-impedance routing for SDI signals.
おすすめ
Industrial Control and Automation
The EP2AGZ350FH29I3N's industrial temperature range, deterministic latency, and 281 user I/O pins suit demanding industrial control applications such as multi-axis motion control, PLC, and real-time Ethernet switching. Its logic capacity supports complex state machines and custom protocol stacks like EtherCAT, PROFINET, or SERCOS, while transceivers enable high-speed deterministic networking. Robust FCBGA package withstands industrial shock and vibration environments. Quartus II design software supports industrial safety certification workflows such as IEC 61508 SIL development.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ350FH29I3N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ350FH29I3G | EP2AGZ350FH29C4N | EP2AGZ350FH29C3N | EP2AGZ300FH29I3N | EP2AGZ350FF35I3N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Package | 780-FCBGA (FH29) | 780-FCBGA (FH29) - same | 780-FCBGA (FH29) - same | 780-FCBGA (FH29) - same | 780-FCBGA (FH29) - same | 780-FCBGA (FF35) - same |
| Logic Elements | 348,500 | 348,500 - same | 348,500 - same | 348,500 - same | 300,000 (-14%) | 348,500 - same |
| Embedded Memory | 21,270,528 bits | 21,270,528 bits - same | 21,270,528 bits - same | 21,270,528 bits - same | Lower memory (-15%) | 21,270,528 bits - same |
| Speed Grade | I3 (Industrial) | I3 (Industrial) - same | C4 (Commercial, slower) | C3 (Commercial, faster) | I3 (Industrial) | I3 (Industrial) |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C (Industrial) - same | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Mid-range Arria II GZ with integrated 24 transceivers （vs EP2AGX260EF29I3N (Arria II GX, 260K LE))
- Industrial temperature grade variant within same package （vs EP2AGZ350FH29C3N (Commercial 0C to 85C))
- Same 780-FCBGA FH29 package across density variants （vs EP2AGZ300FH29I3N (300K LE variant))
設計ノート
The EP2AGZ350FH29I3N FCBGA package requires careful thermal management since the 780-ball array exposes only the die backside through the package. Apply a thermal interface material (TIM) between the package top and a heatsink with at least 4 C/W thermal resistance. For forced-air cooling, provide a minimum 200 LFM airflow across the device. The industrial temperature range to +100C junction requires derating; monitor junction temperature via the internal temperature-sensing diode accessible through the JTAG interface during operation.
The 780-ball FCBGA at 1.0 mm ball pitch requires microvia or via-in-pad PCB technology for fanout. Use a high-density interconnect (HDI) stackup with at least 1-2-1 or 2-4-2 microvia layers. Maintain continuous GND planes directly under the device to provide a low-impedance return path for high-speed transceiver signals. The transceiver channels require 100-ohm differential controlled-impedance routing, with intra-pair skew less than 5 mil to meet multi-Gbps signal integrity requirements.
The EP2AGZ350FH29I3N requires multiple supply rails: VCC (0.87-0.93 V core), VCCPD, VCCPT (3.0 V), VCCA (2.5 V), VCCR/VCCT (1.1-1.5 V for transceivers), and VCCIO for I/O banks. Estimated: at full transceiver utilization with 50% logic toggling, total power consumption can reach 15-20 W. Use a multi-phase buckler controller with adequate bulk decoupling (220 uF polymer plus 10 uF ceramic per supply rail) placed within 50 mm of the device for reliable operation. Follow the pin connection guidelines for unused supply pins.
Transceiver channels on EP2AGZ350FH29I3N operate at up to 6.375 Gbps, requiring strict attention to differential pair routing. Maintain 100-ohm differential impedance, keep intra-pair skew below 5 mil, and avoid right-angle bends. Series AC-coupling capacitors (100 nF) must be placed between TX and RX pins when connecting to another device. Reference the Altera Transceiver Architecture volume of the device datasheet for eye mask, jitter, and pre-emphasis programming guidelines specific to your protocol.
Common pitfalls when using EP2AGZ350FH29I3N include incorrect power-up sequencing (VCC must ramp before VCCPD/VCCA per the datasheet), missing MSL handling precautions (the FCBGA is moisture-sensitive and requires pre-bake before reflow), and configuration mode pin strapping errors (MSEL pins must be set correctly for the desired configuration scheme - AS, PS, JTAG, or Fast Passive Parallel). Verify all configuration-related pins including nCONFIG, nSTATUS, CONF_DONE, and CLKUSR before PCB layout finalization.
コンプライアンス情報
RoHS compliant per Altera/Intel product page and DigiKey listing. Not AEC-Q100 qualified (not applicable for FPGAs of this class). Reach SVHC compliance confirmed per Intel product regulatory documentation.