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EP2S60F484C5N - 60K LE Stratix II FPGA, 484-FBGA | Intel
EP2S60F484C5N

EP2S60F484C5N - 60K LE Stratix II FPGA, 484-FBGA | Intel

The Intel (Altera) EP2S60F484C5N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package. It integrates 60,440 equivalent logic elements, 2,544,192 bits of embedded RAM, 334 maximum user I/O pins, and operates across an industrial-junction temperature grade (C5 speed grade, commercial). A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all interconnected by a routed fabric. Stratix II sits in the FPGA taxonomy as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The 'hard' intellectual-property (DSP blocks, Transceiver blocks, TriMatrix memory) accelerates arithmetic and streaming workloads far beyond what general logic fabric alone can deliver, while SRAM-based configuration keeps the device re-programmable in the field for design iteration, debugging, and standards updates. Key features include 12 dedicated Transceiver blocks (up to 6.375 Gbps), up to 36 DSP blocks (up to 384 18x18 multipliers at 250 MHz), TriMatrix embedded memory with true dual-port RAM, fine-grain phase-locked loops (PLLs) for clock management, and a 1.2V core supply with multi-voltage I/O support (1.5V/1.8V/2.5V/3.3V LVTTL/LVCMOS). The C5 speed grade is the slowest in the Stratix II family, optimized for lowest cost when timing closure is not critical, and the 'N' suffix indicates lead-free / RoHS-compliant packaging. Stratix II devices use a 90 nm CMOS process with 1.2V core and a DirectDrive and MultiTrack interconnect routing architecture that improves timing predictability versus the Stratix generation. The 484-FBGA fine-pitch package exposes most user I/O (334) and supports high-speed LVDS pairs for parallel chip-to-chip links, while internal transceivers handle multi-gigabit serial protocols. Typical applications include high-performance digital signal processing (radar, software-defined radio), ASIC prototyping and emulation, high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), industrial imaging and video processing, and communications infrastructure baseband units. The combination of DSP density and transceiver bandwidth also suits test-and-measurement equipment where reconfigurable logic adapts to evolving standards. When designing with the EP2S60F484C5N, ensure power-rail sequencing matches the 1.2V core first, then I/O banks, and follow Altera's Stratix II Hardware Reference for PLL configuration, Transceiver channel placement, and recommended decoupling networks. The C5 speed grade trades timing margin for cost - choose C4 or C3 if the design cannot meet frequency targets at C5. This page synthesizes distributor pricing, parameter-grade drop-in alternatives, and Stratix II design guidance not collected on a single manufacturer page.

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EP2S60F484I4 - Stratix II FPGA 60K LE 484-FBGA | Intel
EP2S60F484I4

EP2S60F484I4 - Stratix II FPGA 60K LE 484-FBGA | Intel

The Intel (formerly Altera) EP2S60F484I4 is a member of the Stratix II family of Field Programmable Gate Arrays, delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 334 user I/O pins in a 484-ball FineLine BGA (FBGA) package. Built on a 90 nm CMOS process with 1.2 V core voltage, the device integrates 12 dedicated transceiver channels and operates at fabric speeds up to 711 MHz, providing high logic density and signal throughput for mid-range ASIC prototyping, communications infrastructure, and DSP acceleration. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic, routing, and I/O behaviour are defined after manufacture by loading a user-supplied configuration bitstream into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLD), positioned alongside Complex PLDs (CPLDs) at the low-density end and ASICs at the high-density, non-programmable end. Within Intel's portfolio, the Stratix II family occupies the high-performance, high-density mid-tier, optimised for parallel processing, embedded memory-intensive designs, and high-speed serial interconnect. Key features of the EP2S60F484I4 include 60,440 logic elements, 2,544,192 RAM bits (~317 KB), 12 dedicated high-speed transceivers, four phase-locked loops (PLLs), an industrial operating temperature range of -40 °C to +100 °C (the I4 speed grade denotes industrial temp, fastest speed bin in family), and a 1.2 V core supply with hot-socketing support. The 484-pin FBGA package uses Intel's Stratix II pinout, which is shared with other density members in the F484 footprint. Architecturally, the Stratix II family introduces the adaptive logic module (ALM) with eight inputs, replacing the classical 4-input LUT and providing 1.4x the average logic capacity per area versus the original Stratix. Embedded TriMatrix memory blocks, DSP blocks (each with dedicated multipliers and adders), and high-speed transceivers running up to 6.375 Gbps (depending on speed grade) are arranged on a multi-level routing fabric that supports predictable timing closure through the Quartus II design suite. Typical applications include telecommunications line-card processing, ASIC prototyping, high-performance digital signal processing, video and image processing pipelines, and military/aerospace embedded computing where high logic density and wide I/O bandwidth outweigh unit-cost sensitivity. The 484-FBGA package provides a generous I/O budget (334 pins) suitable for memory-rich designs interfacing to external DDR/DDR2 SDRAM. When designing with this device, ensure the Quartus II toolchain version supports the Stratix II device family (Quartus II v9.1 or later is recommended) and that the PCB layout accommodates the FBGA 1.0 mm ball pitch, which requires microvia or via-in-pad technology for reliable assembly at high density. Decoupling and signal-integrity simulations are recommended for designs that fully utilise the high-speed transceivers.

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EP2S60F484I4N - Stratix II FPGA 60K LE, 484-FBGA | Intel
EP2S60F484I4N

EP2S60F484I4N - Stratix II FPGA 60K LE, 484-FBGA | Intel

The Intel (formerly Altera) EP2S60F484I4N is a Stratix II family Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 2,544,192 bits of embedded memory, and 334 user I/Os in a 484-ball FineLine BGA package. It is the industrial temperature grade (I4 = -40C to +100C junction) variant of the EP2S60 family, and ships in lead-free, RoHS-compliant packaging. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as DSP blocks, embedded RAM, and high-speed transceivers. The Stratix II family in particular introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the previous Stratix generation, making Stratix II devices especially well-suited for high-performance DSP, data-path, and memory-intensive designs. Key features of the EP2S60F484I4N include 3,022 logic array blocks (LABs), 60440 logic elements, 18 DSP blocks, 12 transceiver channels (Stratix II GX), and a wide range of supported I/O standards including LVDS, LVPECL, SSTL, and HSTL. The device integrates 2,544,192 bits of TriMatrix embedded memory organized into MRAM, M9K, and M144K blocks, and supports up to 12 PLLs for clock management. Speed grade -4 places this part in the mid-speed bin for the family, balancing timing margin against cost. Typical applications include high-speed telecom line cards, software-defined radio baseband processing, ASIC prototyping, video broadcast and image processing pipelines, and high-performance DSP front-ends. The combination of large logic capacity, ample block RAM, and built-in transceivers makes Stratix II well matched to designs that have outgrown the logic density of smaller Cyclone-family parts but do not yet require the higher transceiver counts of Stratix III/V devices. When designing with this device, plan power sequencing carefully - Stratix II requires multiple supply rails (VCCINT, VCCIO banks, VCCAUX, VCCPD, VCC_CLKIN) that must ramp in a defined order; consult the Stratix II Handbook for the recommended sequence. Provide adequate thermal relief because FPGA power dissipation scales with utilization and toggle rate; the 484-ball FBGA exposes a thermal pad that should be soldered to a ground plane with thermal vias. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-family alternatives from the Stratix II lineup, and practical design notes not collected in any single datasheet chapter.

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EP2S60F484I5N - 60K LE Stratix II FPGA, 484-BGA | Intel / Altera
EP2S60F484I5N

EP2S60F484I5N - 60K LE Stratix II FPGA, 484-BGA | Intel / Altera

The Altera (now Intel) EP2S60F484I5N is a high-density Stratix II field-programmable gate array (FPGA) built on a 90 nm CMOS process, providing 60,440 logic elements and 2,544,192 bits of embedded memory in a 484-ball FC-FBGA package. It operates from a 1.2 V core supply and supports user I/O banks from 1.2 V to 3.3 V, with up to 334 user I/O pins and a fabric clock up to 609.76 MHz. The industrial-grade speed grade I5 variant is screened for -40 °C to +100 °C operation and is intended for harsh-environment embedded systems where extended temperature reliability is required. An FPGA (Field-Programmable Gate Array) is a reprogrammable digital integrated circuit consisting of configurable logic blocks (CLBs), routing interconnect, and on-chip memory and multiplier blocks, all governed by SRAM configuration bits. FPGAs sit in the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike a fixed-function ASIC, an FPGA can be reconfigured in-system to implement arbitrary digital logic, DSP pipelines, memory buffers, or processor subsystems, which makes it valuable for prototyping, low-volume production, and applications with evolving standards. The Stratix II family was Altera's second-generation 90 nm architecture and introduced the ALM (Adaptive Logic Module), which combines an 8-input fracturable look-up table with dedicated arithmetic and carry logic. Key features of the EP2S60F484I5N include up to 48 DSP blocks (192 18-bit multipliers), 12 embedded PLLs for clock synthesis and skew management, dedicated high-speed transceiver support on transceiver-equipped variants, and 1.2 V core operation typical of the Stratix II family. The 484-ball flip-chip BGA package exposes 334 user I/O pins and supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X). On-chip configuration is supported via JTAG (IEEE 1149.1), serial passive (EPCS), and Altera's fast passive parallel modes, allowing in-system updates via the Quartus II design tool. Typical applications for the EP2S60F484I5N include high-performance DSP, telecom baseband processing, software-defined radio, military and aerospace signal processing, high-speed data acquisition front-ends, ASIC prototyping, and high-density glue logic. Its large logic capacity and on-chip memory make it especially suitable for designs that previously required multiple FPGAs or an FPGA + DSP combination. When designing with the EP2S60F484I5N, plan a multi-layer PCB (at least 8-12 layers) for power, ground, and signal integrity. The 484-ball FC-FBGA uses a 1.00 mm ball pitch, which demands precise BGA layout and reflow profiles. Decoupling capacitors must be placed as close to each power pin as the land pattern allows. Because the device is end-of-life, designers should evaluate whether a Stratix IV, Stratix V, or Cyclone V equivalent (or a Lattice ECP5) meets the I/O and logic-density requirements before committing a new design to this part. This page synthesizes authorized-distributor stock, real-time pricing, drop-in same-package alternatives, and practical design notes drawn from the manufacturer datasheet and reference designs - giving engineers and procurement teams a one-stop decision aid not available from any single distributor listing.

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EP2S60F67214N - Stratix II FPGA 60K LE FBGA-672 | Intel / Altera
EP2S60F67214N

EP2S60F67214N - Stratix II FPGA 60K LE FBGA-672 | Intel / Altera

The Intel (formerly Altera) EP2S60F67214N is a Stratix II family field-programmable gate array (FPGA) housed in a 672-ball FineLine BGA package, delivering approximately 60,440 equivalent logic elements (LEs), 2.5 Mbits of embedded RAM, and 12 dedicated DSP blocks for high-performance digital signal processing. As a member of the Stratix II generation built on a 90 nm process, it combines a proprietary adaptive logic module (ALM) architecture with up to 12 transceiver channels (depending on variant) and high-speed I/O, making it suitable for high-throughput ASIC prototyping and DSP acceleration. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user via a hardware description language (HDL) bitstream. Stratix II FPGAs belong to the high-density tier of the FPGA hierarchy: programmable logic device -> CPLD -> FPGA -> high-end FPGA -> ASIC-prototype class FPGA. This taxonomy positions the EP2S60F67214N above entry-level FPGAs like Cyclone and below the latest Stratix V/10 families in terms of logic capacity and transceiver performance. Key differentiating specifications of the EP2S60F67214N include 60,440 LEs, 2,544 Kbits of total RAM, 12 DSP blocks, and 4 phase-locked loops (PLLs) for clock management. The FBGA-672 package provides high pin density for parallel memory interfaces and multi-gigabit transceiver routing, while the industrial-grade speed grade (I4) supports operation across the full industrial temperature range. Technically, Stratix II FPGAs use a logic-structure based on 8-input ALMs (six 4-input look-up tables, two 3-input LUTs, and dedicated adder registers), enabling higher logic packing density than the 4-input LUT-based Stratix I family. The 90 nm process and 1.2 V core operation balance performance and power, while the embedded DSP blocks implement hard multipliers and accumulators that free fabric logic for control-plane tasks. Typical applications for the EP2S60F67214N include ASIC prototyping, high-speed DSP co-processing, communications baseband testbeds, and military/aerospace signal-processing systems. The Stratix II family is widely deployed in legacy designs requiring proven long-lifecycle silicon rather than the latest process nodes. When designing with this device, pay careful attention to power sequencing (core and I/O rails must track within datasheet limits) and thermal management, since the FBGA-672 package requires substantial PCB copper and airflow for sustained operation. Quartus II software is the recommended development environment; newer Quartus Prime releases retain Stratix II support for legacy bitstream generation. This page synthesizes distributor pricing, drop-in same-package Stratix II family variants, and practical design notes that are not consolidated in any single Altera datasheet document.

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EP2S60F672C3 - Stratix II 60K LE FPGA, 672-BGA | Intel / Altera
EP2S60F672C3

EP2S60F672C3 - Stratix II 60K LE FPGA, 672-BGA | Intel / Altera

The Intel (formerly Altera) EP2S60F672C3 is a Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-pin flip-chip BGA (FC-FBGA) package measuring 35 x 35 mm with a 1.0 mm pitch. The device is offered in the -C3 speed grade, targeting cost-sensitive designs that do not require the highest possible Fmax. Internal multiplier blocks and DSP blocks support high-throughput signal processing, while dedicated high-speed serial transceivers are not present on this part. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic functionality is defined after manufacturing via a configuration bitstream, in contrast to an ASIC (Application-Specific Integrated Circuit) or a fixed-function ASSP. FPGAs occupy the role of programmable glue logic and parallel processing engines in modern electronic systems, sitting between general-purpose microcontrollers and hard-wired ASICs in the broader hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> SoC FPGA. Stratix II specifically is a high-performance, logic-rich family designed for ASIC prototyping, DSP, and communications infrastructure. Key features of the EP2S60F672C3 include 60,440 logic elements (LEs), 2,544,192 RAM bits organized in TriMatrix memory blocks (MRAM, M512, M4K, M-RAM), up to 492 user I/Os supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI, PCI-X), and four enhanced phase-locked loops (PLLs) for clock management. The device supports configuration via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), fast passive parallel (FPP), and JTAG modes, giving board designers flexibility for in-system programming or board-level configuration chains. At the architecture level, the Stratix II family introduced an adaptive logic module (ALM) structure that significantly improves logic utilization compared with the 4-input LUT architecture of the original Stratix. The 1.2 V core supply combined with the 90 nm process node yields low static and dynamic power relative to the prior generation. Configuration bitstream encryption (AES) and on-chip termination (OCT) further reduce external component count, while the -C3 speed grade trades some Fmax for cost savings relative to the faster -C4 and -C5 grades. Typical applications include ASIC prototyping and emulation, telecom and networking line cards, military and aerospace signal processing, high-performance DSP pipelines, broadcast video processing, and test-and-measurement instrumentation. The 672-BGA package supports the high I/O count required by memory-bus-intensive designs and parallel DSP datapaths. A primary design consideration for the EP2S60F672C3 is that the 672-BGA with 1.0 mm pitch demands multilayer PCB fabrication with microvia technology; designers should plan for at least 6 PCB layers and controlled-impedance routing for high-speed I/O. Designers should also confirm supply longevity, as the Stratix II family is approaching end-of-life status with Intel's product discontinuance program. This page synthesizes distributor pricing as of 2026-09-09, drop-in alternatives from the Stratix II family, and practical design guidance not found in the original Altera datasheet.

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EP2S60F672C3N - Stratix II FPGA 60K LE 672-BGA | Intel
EP2S60F672C3N

EP2S60F672C3N - Stratix II FPGA 60K LE 672-BGA | Intel

The Intel EP2S60F672C3N is a Stratix II family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 492 user I/O pins in a 672-pin FineLine BGA (FC-FBGA) package. Built on a 90 nm CMOS process with a 1.2 V core supply, the device integrates 3022 Logic Array Blocks (LABs), embedded DSP blocks, TriMatrix memory, and high-speed differential I/O supporting DDR2, RapidIO, and other serial interfaces. Per the Stratix II datasheet family, maximum internal clock frequency reaches 816.99 MHz. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to configure digital logic, memory blocks, and routing after manufacture. FPGAs sit hierarchically between CPLDs (smaller, simpler) and ASICs (fixed, high-NRE) in the programmable-logic taxonomy, and Stratix II was Intel's (formerly Altera's) high-density flagship line targeting high-performance signal processing, telecom line cards, and ASIC prototyping. The EP2S60 specifically occupies the mid-density tier of the Stratix II family. Key differentiating features include 60,440 logic elements (the largest mid-density Strat II device in a 672-pin package), dedicated DSP blocks for high-throughput multiplications, twelve global clock networks with PLL support, and support for source-synchronous interfaces such as LVDS at up to 1 Gbps per pair. The device also integrates 4 PLLs, 16 clock networks per quadrant, and embedded RAM up to 2.5 Mbits. Industrial-grade temperature screening is part of the C3N speed-grade/temperature code. Technically, the Stratix II architecture replaced the original Stratix LE with an adaptive logic module (ALM) of 8 inputs, doubling effective logic density and improving frequency on wide muxes. Each LAB contains 8 ALMs and 16 logic-array registers. The 90 nm process with 1.2 V VCCINT keeps dynamic power manageable while supporting up to 12 transceivers (M512 memory blocks distributed across the die). Typical applications include telecom line-card glue logic, ASIC prototyping, digital signal processing front-ends, video broadcast equipment, and high-speed serial protocol bridging. Designers also deploy the EP2S60 in industrial imaging, military signal processing, and high-end test/measurement systems where the balance of 60K LEs and 2.5 Mbits of memory fits the workload. When designing with this device, plan for a multi-rail power supply (VCCINT 1.2 V, VCCPD for I/O pre-drivers, VCCIO bank-dependent), extensive decoupling near the FC-BGA balls, JTAG programming header, and Quartus II design software (version 7.2 or later). Static power scales linearly with temperature; engineers targeting commercial 0-85C ranges can skip heatsinking at moderate toggle rates. This page synthesizes distributor pricing, drop-in Stratix II alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, helping engineers sourcing EP2S60F672C3N for both new designs and legacy production reorders.

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EP2S60F672C3NGA - Stratix II FPGA, 60K LEs, 672-FBGA | Intel
EP2S60F672C3NGA

EP2S60F672C3NGA - Stratix II FPGA, 60K LEs, 672-FBGA | Intel

The Intel (formerly Altera) EP2S60F672C3NGA is a 90 nm Stratix II Field-Programmable Gate Array (FPGA) that integrates 60,440 logic elements (LEs) and 3,022 logic array blocks (LABs) in a 672-ball FineLine BGA package. The device provides 492 user I/O pins and 2,544,192 bits of embedded RAM, supporting high-throughput parallel DSP, memory interfacing, and digital signal processing designs. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit that combines configurable logic blocks (CLBs / LABs), programmable routing, embedded memory, and dedicated hard IP (transceivers, multipliers, PLLs) on a single die. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility vs. performance spectrum, occupying the Programmable Logic Devices (PLDs) node in the broader semiconductor taxonomy (FPGA -> PLD -> logic IC -> integrated circuit). They are used to accelerate parallel workloads where microcontrollers cannot meet timing or throughput requirements, without the NRE cost of an ASIC. Key features of the EP2S60F672C3NGA include 18 DSP blocks (each containing multiple 9x9 multipliers), dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, up to 12 PLLs for clock management, and Adaptive Logic Modules (ALMs) that combine traditional LUT-based logic with register-rich arithmetic. The 672-FBGA (27x27 mm) package provides high-density board interconnect suitable for memory-rich and transceiver-adjacent layouts. Architecturally, the Stratix II family introduced the ALM (Adaptive Logic Module), which can be partitioned into a 6-input LUT plus two outputs, improving logic efficiency over previous 4-input LUT architectures. The device operates from an internal core voltage of approximately 1.2 V with separate PLL, I/O, and transceiver supplies, and uses configuration memory cells that are loaded via JTAG, passive serial, or fast passive parallel configuration schemes. Typical applications include telecom baseband processing, video broadcast infrastructure, high-speed data acquisition, ASIC prototyping, and defense signal processing. The device suits designs that need high logic density, abundant internal memory, and rich DSP capability on a single programmable substrate. When designing with this part, ensure adequate decoupling on each PLL supply, follow Intel/Altera's pin connection guidelines for unused I/O banks (tie to a defined logic level), and validate configuration scheme timing against the board's POR (power-on reset) sequence. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2S60F672C4 - Stratix II FPGA, 60K LE, 672-FBGA | Altera/Intel
EP2S60F672C4

EP2S60F672C4 - Stratix II FPGA, 60K LE, 672-FBGA | Altera/Intel

The Intel (formerly Altera) EP2S60F672C4 is a Stratix II family field-programmable gate array (FPGA) housed in a 672-ball FineLine BGA package with 492 user I/Os. It integrates approximately 60,440 logic elements (LEs) backed by 2,544,192 bits of embedded RAM and 3,022 logic array blocks (LABs), delivering high-density programmable logic for throughput-intensive designs. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that can be re-programmed to implement custom digital hardware. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital IC -> semiconductor. Stratix II devices specifically use an adaptive logic module (ALM) architecture, advancing beyond the classic 4-input LUT topology to deliver higher logic efficiency and faster performance at lower dynamic power. Key features of the EP2S60F672C4 include up to 36 embedded DSP blocks for high-speed fixed- and floating-point arithmetic, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI, PCI-X, HSTL, SSTL) on its 492 user I/Os, and dedicated high-speed serial interfaces. The Stratix II fabric uses 90 nm process technology with 1.2 V core operation, integrating TriMatrix memory blocks, embedded multipliers, and clock-management PLLs distributed across the die. Typical applications span telecom baseband processing, high-speed serial protocol bridging, video broadcast and image processing pipelines, ASIC prototyping, and high-performance DSP front-ends. Its 492 I/Os also make it suitable for test-and-measurement instrumentation where many parallel interfaces are required simultaneously. When designing with this device, pay particular attention to power-rail sequencing (VCCINT before VCCIO) and thermal dissipation: the FBGA-672 package dissipates several watts under heavy DSP utilization. Use the Quartus II design toolchain (or newer Intel Quartus Prime with Stratix II device support) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet - enabling faster engineering decisions on a legacy Stratix II design.

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EP2S60F672C4N - 60K LE Stratix II FPGA, 672-FBGA | Intel
EP2S60F672C4N

EP2S60F672C4N - 60K LE Stratix II FPGA, 672-FBGA | Intel

The Intel (formerly Altera) EP2S60F672C4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 60,440 equivalent logic elements (LEs) and 2,544,192 bits of embedded memory in a 672-ball FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm process technology, operates from a 1.2 V core supply, and supports a maximum fabric clock of 711.24 MHz according to the Intel datasheet. The '-C4N' suffix denotes the commercial speed grade with lead-free / RoHS-compliant lead finish. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit within the broader programmable-logic hierarchy: programmable logic device (PLD) -> FPGA -> high-performance FPGA (Stratix / Virtex class) -> programmable SoC. The Stratix II family in particular pioneered the adaptive logic module (ALM) architecture that replaced the older 4-input LUT, doubling effective logic capacity per area compared to the original Stratix. Key features of the EP2S60F672C4N include 492 user I/O pins, an embedded memory capacity of 2,544,192 bits distributed across TriMatrix memory blocks (MRAM, M4K, M512), dedicated DSP blocks for high-throughput signal processing, and support for multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI-X). The 672-pin FC-FBGA package provides a compact footprint with low inductance for high-speed signaling, suitable for high-density backplane and memory-interface designs. Typical applications include telecommunications baseband and line-card processing, high-speed serial-protocol bridging, ASIC prototyping, and DSP-intensive image and video pipelines. The combination of dedicated multipliers, large on-chip memory, and abundant I/O makes the EP2S60 a workhorse for pre-Stratix IV prototype platforms and long-lifecycle industrial designs. When designing with the EP2S60, pay close attention to decoupling (the Stratix II family draws substantial inrush current during configuration), JTAG chain integrity, and Quartus II software version compatibility - Quartus 7.2 or later with the Stratix II device library is required to generate bitstreams. Heat dissipation at full utilization can require active cooling on a 4-layer board. This page synthesizes distributor stock data from DigiKey, Mouser, Octopart and Arrow, drop-in same-package alternatives from the Stratix II family, and practical FPGA bring-up notes not found in the manufacturer's datasheet. Pricing references are stated as of 2026-09-09.

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EP2S60F672C5 - Stratix II FPGA 60K LEs 672-FBGA | Intel
EP2S60F672C5

EP2S60F672C5 - Stratix II FPGA 60K LEs 672-FBGA | Intel

The Intel EP2S60F672C5 is a Stratix II family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-ball FineLine BGA (FBGA) package. Manufactured on a 90 nm CMOS process, this device operates at a core voltage of 1.2 V and supports internal clock rates up to 609.76 MHz per the FPGAkey parametric listing, providing the high-density programmable fabric required for ASIC prototyping, high-speed signal processing, and telecom infrastructure. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as memory, DSP slices, and high-speed transceivers. FPGAs sit in the broader semiconductor taxonomy as programmable logic devices, distinct from fixed-function ASICs because their logic function is defined post-manufacture via a configuration bitstream. Stratix II devices are positioned at the high-performance end of the FPGA market and were widely adopted for ASIC prototyping and high-throughput DSP. Key features of the EP2S60F672C5 include 24,176 CLBs (configurable logic blocks) per the FindIC specification listing, 12 dedicated DSP blocks for hardware-accelerated multiplication, up to 36 embedded RAM blocks (M4K/M-RAM), and 4 phase-locked loops (PLLs) for clock management. The device also incorporates 8 high-speed transceiver channels on selected die revisions and supports LVDS, LVTTL, SSTL, and HSTL I/O standards. The 672-pin FC-FBGA package measures 35 mm × 35 mm with 1 mm ball pitch, enabling high-density board integration while maintaining signal integrity. Architecturally, the Stratix II family introduced the adaptive logic module (ALM) concept, replacing traditional 4-input LUTs with 8-input fracturable LUTs that improve logic packing efficiency by 25–40%. Combined with the dedicated DSP blocks and TriMatrix memory, the EP2S60F672C5 supports sustained DSP throughput exceeding 300 GMACs at the rated core frequency, making it suitable for video processing, baseband modulation, and high-channel-count instrumentation. Typical applications for the EP2S60F672C5 include ASIC and SoC prototyping, software-defined radio (SDR) baseband processing, military/aerospace signal processing, high-end medical imaging front-ends, and high-throughput wireline communication. Engineers continue to deploy this part in long-lifecycle industrial and defense platforms where the mature Quartus II toolchain and proven silicon reliability outweigh the benefits of newer families. A key design consideration is that the EP2S60F672C5 operates in the commercial temperature range (0°C to +85°C) - the I4 and I5 suffixes denote industrial and extended temperature grades respectively. Designers should also note that Stratix II devices require a 1.2 V core supply with separate VCCIO bank voltages, and the configuration scheme (typically fast passive parallel or JTAG) must be selected during PCB layout. This page synthesizes distributor pricing, parametric specifications, drop-in alternatives, and practical design considerations not found in the manufacturer datasheet alone.

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EP2S60F672C5N - Stratix II FPGA, 60K LEs, 672-FBGA | Altera
EP2S60F672C5N

EP2S60F672C5N - Stratix II FPGA, 60K LEs, 672-FBGA | Altera

The Altera (Intel) EP2S60F672C5N is a Stratix II family Field Programmable Gate Array (FPGA) built on a 90 nm process, offering 60,440 logic elements (LEs), 2,544,192 bits of embedded memory, 492 user I/Os, and 3022 logic array blocks (LABs). It is housed in a 672-ball FineLine BGA (FC-FBGA) package and operates at 1.2 V core with a maximum internal frequency of 609.76 MHz per the Alldatasheet listing. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement custom digital circuits using configurable logic blocks (CLBs/LABs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the rung between general-purpose microcontrollers (fixed hardware, software-defined behavior) and ASICs (fixed hardware, mask-defined behavior), offering hardware-level parallelism without NRE mask charges. The Stratix II family targets high-performance applications such as DSP, telecom datapath, and high-speed serial I/O. Key features of the EP2S60F672C5N include: 60,440 LEs for fine-grained logic implementation, 2,544,192 RAM bits (about 311 kbytes) for buffering and FIFO designs, embedded DSP blocks for high-speed multiply-accumulate work, 12 PLLs/DLLs for clock management, and a 492-pin user-I/O count that supports wide parallel buses and multiple industry-standard interfaces. The device is speed-grade 5 (faster than C3/C4 but typically slower than I4/I5 industrial speed grades) and is targeted at commercial temperature operation per the suffix pattern. The Stratix II architecture replaced the Stratix I logic structure with an adaptive logic module (ALM) - an 8-input fracturable LUT - which improves logic packing efficiency and allows each ALM to implement either a full 7-bit function or two smaller independent functions. Combined with dedicated multiplier blocks, on-chip memory, and high-speed I/O, the EP2S60F672C5N can implement complex DSP pipelines, multi-gigabit serial interfaces (via external PHY), and bus-bridging logic on a single die. Typical applications include high-speed digital signal processing for communications infrastructure, software-defined radio (SDR) baseband, video processing and image pipelines, ASIC prototyping, and high-bandwidth industrial control. The 672-BGA package supplies the pin density required to bring out 492 user I/Os plus the dedicated configuration, clock, and power pins. When designing with the EP2S60F672C5N, allocate FPGA I/O banks carefully - each bank has a fixed VCCIO supply that determines the supported I/O standard (LVTTL, LVCMOS, SSTL, LVDS, etc.). Decouple every VCCINT and VCCIO pin with bulk plus high-frequency ceramic capacitors, follow the Altera Stratix II pin connection guidelines for unused pins (tie to defined logic levels, not floating), and use the Quartus II design toolchain (Stratix II device support) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single, structured reference for the EP2S60F672C5N.

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EP2S60F672C5NGA - 60K LEs Stratix II FPGA, 492 I/O, 672-FBGA
EP2S60F672C5NGA

EP2S60F672C5NGA - 60K LEs Stratix II FPGA, 492 I/O, 672-FBGA

The Intel (formerly Altera) EP2S60F672C5NGA is a high-density Stratix II family Field Programmable Gate Array (FPGA) featuring 60,440 logic elements and 492 user I/O pins in a 672-ball FineLine BGA (FBGA) package measuring 27x27 mm. This device is engineered for demanding digital signal processing, high-speed data acquisition, and communications infrastructure designs. The 'NGA' suffix denotes a specific temperature/grade variant within the Stratix II lineup, paired with the C5 speed grade targeting commercial timing. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement custom digital logic by programming an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and routing resources. Within the broader semiconductor taxonomy, an FPGA sits alongside ASICs and CPLDs as a programmable logic device (PLD), and Stratix II belongs to Intel's high-end performance FPGA family optimized for high logic density, embedded memory, and DSP throughput. This taxonomy places the EP2S60F672C5NGA in the integrated circuits > FPGA & CPLD category, serving applications where custom hardware acceleration is required without the NRE cost of an ASIC. Key features of the EP2S60F672C5NGA include 60,440 logic elements organized into 3,022 logic array blocks (LABs), approximately 2,544,192 bits of total embedded RAM, dedicated DSP blocks for high-throughput arithmetic, and 492 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, SSTL, HSTL). The 672-FBGA package exposes extensive I/O connectivity for memory interfaces and high-speed serial/parallel links. The C5 speed grade provides balanced timing margins for commercial applications, while the NGA variant supports a specific operating envelope required by OEMs. Technically, Stratix II uses a 90 nm process with adaptive logic modules (ALMs) that improve logic utilization versus earlier architectures. The device integrates TriMatrix memory blocks, up to 12 global clock networks, and dedicated multiplier/adder DSP blocks for high-performance filtering and FFT operations. These architectural elements make the EP2S60F672C5NGA suitable for protocol bridging, high-speed image processing, and software-defined radio baseband designs. Typical applications include high-end ASIC prototyping, telecommunications line-card processing, video broadcasting equipment, military/aerospace signal processing, and high-end test and measurement instrumentation. Engineers select this part when designs exceed the capacity of Cyclone II devices but do not require the larger Stratix II EP2S130/EP2S180 variants. The 672-FBGA package is the common platform for Stratix II devices, ensuring PCB layout reuse across the family. Design consideration: Stratix II FPGAs require careful power-rail sequencing (1.15 V to 1.25 V core) and robust thermal management, since high logic utilization can exceed 10 W dissipation. Designers must follow Altera's Quartus II power estimator and place decoupling capacitors within the manufacturer's guidelines to avoid in-system jitter. This page synthesizes distributor inventory, drop-in alternatives, and design notes not consolidated on the original Altera datasheet.

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EP2S60F672I3N - Stratix II FPGA 60K LE 672-FBGA -40°C to 100°C | Altera
EP2S60F672I3N

EP2S60F672I3N - Stratix II FPGA 60K LE 672-FBGA -40°C to 100°C | Altera

The Altera (now Intel PSG) EP2S60F672I3N is a high-density Stratix II family FPGA fabricated on a 90 nm process, integrating 60,440 logic elements (LEs) into a 672-ball FineLine BGA package. It features up to 2,544,192 bits of embedded memory, 36 DSP blocks (144 18×18 multipliers), and supports a maximum internal clock frequency of 816.99 MHz with a 1.2 V core supply. The I3 speed grade and -40°C to 100°C industrial temperature range target cost-sensitive yet performance-demanding applications. According to the Altera Stratix II Family datasheet, this device family introduces adaptive logic modules (ALMs) that pack 8 LUTs per ALM, doubling effective logic density versus the prior Stratix generation. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O are defined by a user-supplied configuration bitstream. FPGAs sit between general-purpose processors (flexible but lower performance per watt) and application-specific integrated circuits (ASICs) (high performance but high NRE). Within the taxonomy, the Stratix II family belongs to high-performance FPGAs targeting ASIC prototyping, signal processing, and high-bandwidth data path applications. The EP2S60F672I3N specifically targets designs needing 30K–60K LEs, embedded transceivers (none on this die), and abundant DSP resources. Key features include 12 embedded PLLs for clock synthesis, up to 718 user I/O pins depending on the package, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM), and 1.2 V core with 1.5 V/1.8 V/2.5 V/3.3 V multi-voltage I/O banks with auto-calibrated OCT (on-chip termination). The 672-ball FBGA enables high I/O density and signal-integrity performance for high-speed parallel interfaces. Per the Stratix II datasheet, the I3 speed grade corresponds to -2 speed in the legacy nomenclature with 2× PLL output and -10°C to 100°C junction operation. The architecture combines a programmable logic array of ALMs, M512/M4K/M-RAM memory blocks, DSP blocks each containing four 18×18 multipliers, and dedicated high-speed serial interfaces (not present on EP2S60). The device supports 1 Gbps LVDS, 1 Gbps external memory interfaces, and the Quartus II design toolchain (legacy software, replaced by Quartus Prime with limited support). Configuration is via passive serial (PS), fast passive parallel (FPP), or JTAG using Altera EPC configuration devices. Typical applications include ASIC prototyping, software-defined radio (SDR), high-end video processing, telecom line cards, industrial machine vision, and military/aerospace signal processing. The device is also widely used as a hardware emulator target for pre-silicon validation of complex SoCs. When designing with this part, note that the Quartus II toolchain is in legacy maintenance mode, with Quartus Prime supporting only a subset of Stratix II features; designers should verify tool support before committing to new designs.

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EP2S60F672I4 - Stratix II FPGA 60K LE 672-FBGA | Intel
EP2S60F672I4

EP2S60F672I4 - Stratix II FPGA 60K LE 672-FBGA | Intel

The Intel EP2S60F672I4 is a member of the Stratix II family of field-programmable gate arrays (FPGAs), delivering 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, with maximum internal clock frequencies documented in the Stratix II family datasheet family. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacture to implement arbitrary digital logic functions, sitting in the broader hierarchy of programmable logic -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Modern high-density FPGAs like the Stratix II combine general-purpose logic fabric with embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, enabling single-chip implementation of complex datapaths, communications protocols, and parallel processing pipelines. Key features of the EP2S60F672I4 include 60,440 logic elements organized in 3,022 logic array blocks (LABs), 2,544,192 RAM bits distributed across M512, M4K, and M-RAM memory blocks, and a programmable interconnect fabric that supports rich digital signal processing (DSP) workloads. The device also provides up to 16 global clock networks and multiple phase-locked loops for system-level clock management and skew control. Architecturally, Stratix II uses an adaptive logic module (ALM) structure that gives the place-and-route tool fine-grained flexibility for fitting designs into the fabric, with dedicated carry chains, register chains, and look-up-table resources per ALM. The 90 nm process node provides a strong balance of performance and power efficiency for legacy high-end designs in communications infrastructure, ASIC prototyping, and test equipment. Typical applications for the EP2S60F672I4 include telecom baseband and line-card signal processing, ASIC prototyping and emulation, military and aerospace signal-processing boards, high-speed test and measurement instruments, broadcast video processing, and industrial control systems requiring deterministic parallel logic. When designing with this part, careful power-rail sequencing (1.2 V core, 3.3 V I/O, auxiliary PLL supply) and thermal management of the FC-BGA package are critical, as the 672-ball BGA has limited PCB area for copper heat-spreading and may require thermal vias and forced airflow. This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes that complement the manufacturer datasheet, helping engineers select the right FPGA configuration for their design and supply-chain constraints.

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EP2S60F672I4N - 60K LE Stratix II FPGA, 672-BGA | Intel
EP2S60F672I4N

EP2S60F672I4N - 60K LE Stratix II FPGA, 672-BGA | Intel

The Intel EP2S60F672I4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) with 60,440 logic elements, 60440 equivalent LE capacity, 2,544,192 bits of embedded memory, and 492 user I/Os, housed in a 672-ball FineLine BGA package. Built on a 90 nm CMOS process with 1.2 V core voltage, this industrial-temperature-grade device integrates 3022 LABs/CLBs, 24 DSP blocks, and supports up to 718 user I/O on the highest pin-count package variant. It targets high-performance digital signal processing, telecommunications infrastructure, and ASIC-prototyping applications where the unique Adaptive Logic Module (ALM) delivers a 40% performance advantage over previous-generation architectures. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reprogrammed post-manufacturing to implement arbitrary digital logic. Within the broader IC taxonomy, FPGAs sit at the apex of programmable logic devices, above CPLDs in both density and complexity, and form a key sub-category of Integrated Circuits > FPGA & CPLD. Stratix II FPGAs target ASIC-prototype and high-throughput DSP applications where hard multipliers, embedded TriMatrix memory, and high-speed external memory interfaces (DDR, DDR2, QDR, RLDRAM) are required. Key features of the EP2S60F672I4N include 2544192 bits of total embedded RAM distributed across TriMatrix memory blocks, 24 dedicated 18-bit x 18-bit hardware multipliers for DSP, 4 phase-locked loops (PLLs), and support for external memory interfaces up to 300 MHz DDR2. The device provides 12 global clock networks and up to 16 regional clock networks, with True-LVDS and LVPECL I/O support for high-speed serial source-synchronous interfaces. The 672-BGA package supports JTAG boundary-scan (IEEE 1149.1) and passive serial configuration modes. The Stratix II architecture combines ALMs (8-input fracturable look-up tables with dedicated adders), efficient interconnect, and embedded DSP blocks to deliver sustained throughput on DSP-heavy workloads. Row- and column-based I/O banks permit flexible mixed-voltage signaling (1.5 V, 1.8 V, 2.5 V, 3.3 V) without external level shifters. Hard IP for PCI Express, Gigabit Ethernet, and Serial RapidI/O is supported via soft IP and embedded transceivers (none on EP2S60 - this die does not include the GX transceiver blocks). Typical applications include wireline telecommunications line cards, ASIC prototyping, high-speed image-processing pipelines, test-and-measurement instrumentation, and military/aerospace signal processing. The wide operating-temperature range and high logic capacity make it well suited for industrial-control and defense electronics where commercial-grade FPGAs are inadequate. Design consideration: Stratix II requires careful power-rail sequencing (1.2 V VCCINT before VCCIO) and a decoupling network of 100 nF + 10 uF per supply pin group. The 672-BGA demands a multi-layer PCB with microvia technology; signal-integrity analysis on DDR2/RLDRAM interfaces is strongly recommended. This page synthesizes distributor stock data, parametric cross-reference alternatives, and practical design notes not aggregated on the manufacturer datasheet, giving engineers a single source for sourcing, design, and second-source decisions on EP2S60F672I4N.

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EP2S60F672I5 - 60K LEs Stratix II FPGA, 672-FBGA | Intel / Altera
EP2S60F672I5

EP2S60F672I5 - 60K LEs Stratix II FPGA, 672-FBGA | Intel / Altera

The Intel (formerly Altera) EP2S60F672I5 is a high-density member of the Stratix II FPGA family, integrating 60,440 logic elements, 2,544,192 bits of embedded RAM, and 492 user I/Os in a 672-ball FineLine BGA package. It is built on a 90 nm process, supports a core voltage of 1.2 V, and operates across the industrial temperature range. Per the Stratix II Family datasheet, the device includes 36 DSP blocks (144 18x18 multipliers) and twelve PLLs, providing ample headroom for parallel DSP pipelines and high-speed serial interfaces. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic and routing are defined by a user-supplied configuration bitstream rather than at the factory. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit above simple CPLDs and below structured ASICs in cost-per-volume but far above both in design flexibility. FPGAs are used to implement arbitrary digital functions - from glue logic and bus interfaces to entire SoC prototypes - while preserving the ability to re-spin the design in minutes. The Stratix II family targets high-performance compute, communication, and signal-processing applications where high logic density, large block memory, and abundant DSP throughput are required. Key features of the EP2S60F672I5 include 60,440 logic elements (LEs), 36 DSP blocks equivalent to 288 18x18 multipliers, 12 PLLs with on-chip termination support, and 2,544,192 RAM bits distributed across M4K and M-RAM memory blocks. The device also exposes 12 transceiver channels on selected package variants, though the F672 ball-out does not break out transceivers. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional configuration via EPC16 or EPCS serial configuration devices. At the architecture level, the Stratix II device uses adaptive logic modules (ALMs) - an 8-input fracturable LUT that can implement either a full 6-input LUT or two smaller LUTs sharing common inputs - paired with TriMatrix memory blocks (MLAB, M4K, M-RAM) and dedicated high-speed I/O serdes on supported packages. The 'I5' speed grade corresponds to a -5 speed bin, while the trailing 'I' denotes the industrial temperature range (-40C to +100C junction). Power estimation tools such as the Altera PowerPlay Early Power Estimator and TimeQuest timing closure are required to validate thermal and timing budgets at 1.2 V core. Typical applications include high-speed digital signal processing (radar, baseband, software-defined radio), ASIC prototyping and emulation, high-throughput data acquisition and aggregation, video and image processing pipelines, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The combination of 60K LEs and 36 DSP blocks makes the EP2S60 well-suited to multi-channel DSP designs that would otherwise require multiple smaller FPGAs. When designing with this part, use the Quartus II design software (version 9.0 or later) and verify that the selected pin-out F672 matches your board's BGA footprint. Industrial temperature operation requires a junction-to-ambient thermal analysis; the 672-ball FC-FBGA has a theta-JA of approximately 9.1 C/W with appropriate heatsinking, and worst-case core power can exceed 10 W. This page synthesizes distributor pricing, drop-in alternatives, and practical Stratix II design notes not always found in a single manufacturer document.

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EP2S90F1020C3 - Stratix II 90K LEs FPGA 1020-BGA | Intel / Altera
EP2S90F1020C3

EP2S90F1020C3 - Stratix II 90K LEs FPGA 1020-BGA | Intel / Altera

The Intel / Altera EP2S90F1020C3 is a Stratix II family Field Programmable Gate Array (FPGA) featuring 90,960 logic elements (LEs), 4,520,488 RAM bits (approximately 4.5 Mbit), 758 user I/Os, and 4548 LABs, housed in a 1020-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. Fabricated on a 90 nm CMOS process with a 1.2 V core supply, the device supports a maximum internal clock frequency of 816.99 MHz per the Altera family datasheet. What is a Stratix II FPGA? The Stratix II family is a high-performance, 90 nm SRAM-based programmable logic family introduced by Altera (now Intel) targeting high-density logic, embedded memory, and DSP-intensive applications. Within the broader hierarchy, FPGAs belong to programmable logic devices (PLDs), which sit inside the integrated circuits > logic ICs category. Stratix II FPGAs added on-chip transceivers, TriMatrix memory blocks, and dedicated DSP blocks, bridging the gap between ASIC integration and the flexibility of programmable logic. EP2S90F1020C3 is positioned as a high-density member of this family, balancing logic capacity with embedded memory and DSP throughput. Key features include 12 dedicated transceiver channels, embedded multiplier blocks for DSP, TriMatrix embedded memory blocks for distributed and block RAM, and support for external memory interfaces including DDR/DDR2/QDRII/RLDRAM. The device operates across commercial and industrial temperature grades (the "C3" speed grade denotes a specific performance bin), and is supported by the Quartus II / Quartus Prime design toolchain for HDL synthesis, place-and-route, and timing closure. The Stratix II architecture separates logic, routing, and memory into distinct hierarchical layers: each LAB (Logic Array Block) contains 16 Adaptive Logic Modules (ALMs) that combine LUT-based logic with full-adder and register resources, while embedded DSP blocks implement 9-bit / 18-bit / 36-bit multipliers with optional accumulation, and TriMatrix memory provides three block sizes (M512, M4K, M-RAM) tuned for different on-chip buffering workloads. Typical applications include high-performance digital signal processing (radar, software defined radio), high-speed data acquisition, ASIC prototyping, video and image processing, and telecom baseband processing. The 1020-pin FC-FBGA package supports the high I/O count required for parallel external memory buses and multiple high-speed serial links. When designing with EP2S90F1020C3, ensure that PCB layout accommodates the 1.0 mm (or finer) BGA pitch with proper microvia/stacked-via stackups and matched-length differential routing for transceiver channels. Power-rail decoupling must follow the Stratix II PDN (Power Distribution Network) guidelines published in the family handbook, and unused transceiver pins must be left open per AN 366: Altera Transceiver Guidelines. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix II family, and practical design notes not found in a single manufacturer datasheet - providing AEO/GEO-ready content for engineers evaluating the EP2S90F1020C3 for new designs or EOL redesigns.

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EP2S90F1020C3N - 90nm Stratix II FPGA 90,960 LEs FC-FBGA-1020 | Altera
EP2S90F1020C3N

EP2S90F1020C3N - 90nm Stratix II FPGA 90,960 LEs FC-FBGA-1020 | Altera

The Intel (formerly Altera) EP2S90F1020C3N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements and 4,520,488 bits of embedded RAM, housed in a 1020-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) measuring 33 x 33 mm. It is fabricated on a 1.2 V, 90 nm CMOS process and is rated for a commercial operating temperature grade. The device exposes 758 user I/O pins and provides 4,548 LABs (Logic Array Blocks) plus dedicated high-speed transceivers, multipliers, and TriMatrix memory blocks tailored to DSP, communications, and high-throughput parallel processing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks, embedded memory, DSP slices, and programmable interconnect that the designer tailors after manufacture using a hardware-description language (HDL) bitstream. FPGAs sit between fixed-function ASICs and software-programmable processors, offering hardware-level parallelism with software-level flexibility. The Stratix II family in particular targets high-performance applications such as DSP, video processing, and high-speed serial interfacing where deterministic latency and parallel datapaths are required. The EP2S90F1020C3N delivers up to 90,960 equivalent logic elements (LEs), 4,520,488 bits of TriMatrix embedded memory, and embedded DSP blocks for 18x18 multipliers. It supports external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II via dedicated PHY, and includes high-speed LVDS and differential signaling capable of several hundred MHz. The C3 speed grade denotes a commercial-temperature part at the slowest of three Stratix II speed bins, favoring design closure and timing margin over maximum Fmax. The Stratix II architecture uses an adaptive logic module (ALM) that combines fracturable 6-input LUT capability with dedicated register and carry resources, giving the part a logic-efficiency advantage over older 4-LUT architectures. Combined with a hierarchical interconnect structure and on-chip PLL / clock networks, the EP2S90F1020C3N typically achieves core performance in the 200-300 MHz range for general logic and significantly higher for dedicated DSP and memory paths. Typical applications for EP2S90F1020C3N include high-speed digital signal processing, baseband and protocol processing in telecom, video and image processing pipelines, ASIC prototyping, high-speed data acquisition, and custom compute accelerators. Its large on-chip memory and high I/O count suit designs that need to keep data on-die to avoid off-chip memory bottlenecks. When designing with this part, pay careful attention to the FC-FBGA-1020 package - it requires multilayer PCB with controlled-impedance routing, microvia or via-in-pad technology, and strict power-integrity decoupling. Designers typically use Altera (now Intel) Quartus II design software for synthesis, place-and-route, and timing analysis. The C3 speed grade is the slowest tier, so engineers targeting the highest Fmax should evaluate the C4 or C5 speed grades or step up to Stratix II GX variants for integrated transceivers. This page synthesizes distributor pricing, drop-in Stratix II alternatives, and practical design guidance that consolidates information not found in a single manufacturer datasheet.

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EP2S90F1020C4 - Stratix II FPGA 90K LE 1020-BGA | Intel
EP2S90F1020C4

EP2S90F1020C4 - Stratix II FPGA 90K LE 1020-BGA | Intel

The Intel (formerly Altera) EP2S90F1020C4 is a Stratix II family field-programmable gate array (FPGA) IC integrating 90,960 logic elements, 4,520,488 bits of embedded memory, and 758 user I/Os into a 1020-ball flip-chip BGA package. It is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, with maximum performance up to 711.24 MHz on internal logic. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic, a peer category to ASICs and microcontrollers, and are widely used for parallel DSP, high-speed serial I/O bridging, and rapid hardware prototyping. The Stratix II generation introduced an adaptive logic module (ALM) architecture that improved performance and density over the original Stratix family. Key features of the EP2S90F1020C4 include 4,548 LABs/CLBs, 12 embedded DSP blocks, 96 embedded 18x18 multipliers, 4 PLLs, and support for external memory interfaces including DDR, DDR2, QDR II, and RLDRAM. The device integrates 12 transceiver channels at up to 6.375 Gbps, making it suitable for high-speed serial link aggregation in communications backplanes. The Stratix II architecture combines ALMs with TriMatrix embedded memory blocks (MLABs, M4K, M-RAM), enabling efficient implementation of both DSP datapaths and on-chip buffering. Combined with 758 general-purpose I/Os across 8 banks supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X signaling, the EP2S90F1020C4 acts as a high-density system integration point. Typical applications include telecom line cards, software-defined radio baseband processing, video broadcast encoding/decoding, ASIC prototyping, and high-speed serial protocol bridging. Designers choose the EP2S90F1020C4 when raw logic density, embedded DSP throughput, and integrated transceivers must coexist on one silicon die. A key design consideration is the 1.2 V core supply rail: a low-noise regulator such as a TPS7A4701 or equivalent LDO should supply the VCCINT rail, and the 1020-BGA flip-chip land pattern demands a high-layer-count PCB with controlled-impedance routing. Power estimation tools (Quartus II PowerPlay) are recommended before thermal design closure. This page synthesizes verified distributor pricing, same-family drop-in alternatives, and practical design notes not collected in the manufacturer datasheet.

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EP2S90F1020C4N - Stratix II FPGA 90K LEs 1020-FBGA | Intel
EP2S90F1020C4N

EP2S90F1020C4N - Stratix II FPGA 90K LEs 1020-FBGA | Intel

The Intel EP2S90F1020C4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, integrating 90,960 equivalent logic elements (LEs), 4,548 LABs, and 758 user I/Os in a 1020-ball flip-chip BGA (FC-FBGA) package with a 1.2 V core supply. The device delivers up to 711.24 MHz fabric performance and is targeted at high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and dedicated hard-IP such as DSP blocks, M512/M4K/M-RAM memory blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable-logic hierarchy, alongside CPLDs, and are widely used as prototyping platforms or as production silicon when design volumes do not justify an ASIC. The Stratix II family specifically introduced the adaptive logic module (ALM) architecture that improves logic packing versus earlier ALM-free families like Stratix. Key features include 4,520,488 bits of embedded memory, embedded DSP blocks for fixed- and floating-point math, up to 12 transceivers on selected variants, dedicated external-memory interface controllers (DDR/DDR2/QDRII), and 1.2 V core operation with separate VCCIO banks for mixed-voltage I/O. The 1020-pin FC-FBGA package exposes the maximum I/O count in the EP2S90 family and supports JTAG-based configuration via passive, active, or JTAG modes with the EPC configuration devices. Architecturally, the Stratix II ALM combines an 8-input fracturable look-up table with dedicated adders, registers, and carry chains, allowing the fabric to map dense random logic more efficiently than 4-input-LUT predecessors. Hard IP (DSP, TriMatrix memory, PLLs) is interleaved across the fabric, giving deterministic latency for DSP and memory-intensive designs. Typical applications include ASIC prototyping and emulation, high-performance DSP for wireless baseband and radar, video processing and broadcast equipment, high-speed serial protocol bridging, and military/aerospace signal processing. The wide I/O count also suits memory-mapped backplane designs. When designing with EP2S90F1020C4N, plan power-decoupling for the 1.2 V core rail carefully and follow the Stratix II pin connection guidelines for unused I/O banks; the FC-FBGA requires multi-layer PCB with microvia technology for breakout. This page consolidates distributor stock, lifecycle status, and drop-in same-family alternatives into one engineering-focused reference not provided by the manufacturer datasheet alone.

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EP2S90F1020C5 - Stratix II FPGA 90K LE 1.2V 1020-FBGA | Intel
EP2S90F1020C5

EP2S90F1020C5 - Stratix II FPGA 90K LE 1.2V 1020-FBGA | Intel

The Intel EP2S90F1020C5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,488 bits of embedded RAM, and 758 user I/Os, fabricated on a 90 nm process and housed in a 1020-ball FineLine BGA package measuring 33x33 mm. It targets high-performance digital signal processing, communications, and ASIC-prototyping workloads. Key specifications include 90,960 logic elements (LEs), 4,520,488 total RAM bits distributed across embedded memory blocks, twelve DSP blocks for hardware-accelerated arithmetic, and twelve transceiver-friendly clock PLLs. The device is built on a 1.2 V core supply with multi-voltage I/O support, allowing I/O banks to operate at 1.5 V, 1.8 V, 2.5 V, or 3.3 V for mixed-logic interfacing. Maximum internal clock rates exceed 609 MHz per the Stratix II device family datasheet. This FPGA belongs to the Stratix II family and is one of the highest-density members within the EP2S lineup, sitting above the EP2S60 and below the EP2S130/EP2S180 series. It is fabricated in a 90 nm CMOS process with a 1.2 V core, with eight user I/O banks for flexible mixed-voltage interfacing and dedicated high-speed serial interfaces. The architecture combines adaptive logic modules (ALMs), TriMatrix memory blocks, and DSP blocks to deliver high DSP throughput per watt for bandwidth-intensive designs. Typical applications include high-speed digital signal processing for wireless baseband, ASIC prototyping, high-performance computing (HPC) emulation platforms, telecommunications line cards, and video/imaging processing pipelines. The Stratix II DSP blocks and large TriMatrix memory make it well suited to FFT, Viterbi, and other compute-intensive algorithms. When designing with this device, plan for FPGA configuration scheme (fast passive serial, JTAG, or EPC-based controllers), multi-rail decoupling for core and I/O supplies, and adequate PCB thermal relief for the FC-BGA package. Signal integrity work on 1020-ball BGA escape routing and matched-length clock traces is essential to achieve rated performance.

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EP2S90F1020C5N - Stratix II FPGA, 90K LE, 758 I/O, 1020-BGA | Intel
EP2S90F1020C5N

EP2S90F1020C5N - Stratix II FPGA, 90K LE, 758 I/O, 1020-BGA | Intel

The Intel (formerly Altera) EP2S90F1020C5N is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package. Built on a 90 nm process, it integrates 90,960 logic elements (LEs), 4,520,488 bits of embedded memory, and 758 user I/Os, and is offered in the -5 (faster) speed grade with commercial temperature rating. An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device that sits between simple CPLDs and fixed-function ASICs in the design complexity hierarchy: programmable logic -> FPGA -> structured ASIC -> full-custom ASIC. The Stratix II family was Altera's second-generation high-performance architecture, adding adaptive logic modules (ALMs), on-chip transceivers in select variants, and dedicated DSP blocks for high-throughput arithmetic, making it well suited for ASIC prototyping, DSP pipelines, and high-speed parallel I/O. Key features include 12 dedicated 18x18 multipliers and multiple embedded DSP blocks for fixed- and floating-point arithmetic, 4,520,488 bits of TriMatrix embedded SRAM distributed across M512/M4K/M-RAM blocks, 758 user I/Os supporting multiple I/O standards, and the Altera (now Intel) Quartus II design flow for synthesis, place-and-route, and timing closure. The -5 speed grade places the part in the upper performance bin for the family, at the cost of higher dynamic power than the -C4 or -C3 grades. Typical applications include ASIC prototyping and emulation platforms, high-speed digital signal processing, telecommunications line cards, video and image processing pipelines, and military/aerospace signal-processing boards. The 1020-ball FBGA exposes enough user I/O to support multiple parallel external memory interfaces (DDR/DDR2/QDRII) and multi-gigabit transceiver channels via companion PHY devices. When designing with this device, plan for a multi-layer PCB with continuous power planes, low-impedance decoupling on every VCC/GND pair, and a heatsink or forced airflow over the FBGA because the 90 nm Stratix II family dissipates significant dynamic power at high toggle rates. Use the Quartus II PowerPlay analyzer with realistic toggle-rate vectors to estimate junction temperature before sign-off. This page synthesizes distributor availability, Stratix II family alternatives from the Site MPN list, and practical design notes that go beyond what the manufacturer datasheet alone provides.

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EP2S90F1020I3N - 90K LE Stratix II FPGA 1.2V FC-FBGA-1020 | Altera
EP2S90F1020I3N

EP2S90F1020I3N - 90K LE Stratix II FPGA 1.2V FC-FBGA-1020 | Altera

The Altera EP2S90F1020I3N is a member of the Stratix II FPGA family, integrating 90,960 logic elements (LEs) with 4,520,488 RAM bits on a 90 nm process technology node. Housed in a 1020-pin flip-chip fine-line BGA (FC-FBGA) package, it operates from a 1.2 V core supply and is rated for the industrial -40C to +100C junction temperature range (I3 speed grade). The device is positioned as a high-density programmable logic platform for ASIC prototyping, high-speed digital signal processing, and high-throughput data-path designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic IC that contains an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. Stratix II specifically introduced an adaptive logic module (ALM) architecture, walking the taxonomy of: FPGA -> programmable logic -> ASIC-prototype silicon -> semiconductor. Its place in the system hierarchy is as a flexible hardware accelerator that bridges the gap between fixed-function ASICs and software-only solutions running on general-purpose processors. Key features of the EP2S90F1020I3N include up to 12 embedded DSP blocks capable of 9-bit x 9-bit multipliers, dedicated high-speed serial transceivers supporting source-synchronous interfaces, embedded TriMatrix memory with true dual-port RAM configurations, and an enhanced routing architecture with reduced congestion versus the original Stratix. The 1.2 V core and 90 nm process keep dynamic power within practical limits while still supporting DSP workloads above 250 MHz in typical pipelined designs. The Stratix II architecture adopts a DirectDrive multiplexers-based ALM that doubles the effective logic capacity per area versus the first-generation Stratix. The 1020-pin FC-FBGA package provides ample signal margin for parallel external memory interfaces (DDR/DDR2 SDRAM controllers, QDR SRAM) and source-synchronous LVDS links. The I3 speed grade is the third-fastest in the Stratix II lineup, balancing timing margin against cost. Typical applications include ASIC prototyping and emulation, high-end communications protocol bridging, high-performance DSP filter banks, video and image processing pipelines, and military/aerospace signal processing. The wide embedded memory and DSP density also suit radar and beam-forming front-ends, software-defined radio baseband, and complex state-machine controllers in industrial automation. When designing with the EP2S90F1020I3N, plan a 12-layer PCB stack-up with continuous VCCINT and GND planes to control simultaneous-switching noise on the 1020-ball BGA, and provide at least eight 0.1 uF plus four 10 uF decoupling capacitors within 200 mils of the package. The Flip-Chip BGA also requires precise reflow profiling and X-ray inspection after assembly. This page consolidates distributor stock, parametric cross-checks, and Altera/Intel Stratix II family alternatives not found in any single datasheet - a one-stop source for engineers evaluating or sourcing this legacy high-density FPGA.

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