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LFE2-20E-5Q208C - 21K LUT ECP2 FPGA | Lattice
LFE2-20E-5Q208C

LFE2-20E-5Q208C - 21K LUT ECP2 FPGA | Lattice

The Lattice Semiconductor LFE2-20E-5Q208C is an ECP2 field-programmable gate array with 21,000 logic cells, approximately 21K LUTs, 131 user I/O, one DSP multiplier, and a 1.2 V core in a 208-pin PQFP package. The -5 suffix identifies the device speed grade, while the -208C suffix identifies the 208-pin commercial-temperature package configuration. An FPGA is a programmable semiconductor whose digital logic, interconnect, and dedicated processing blocks are configured after manufacture. Within the product hierarchy, the LFE2-20E-5Q208C is a field-programmable gate array, an FPGA and programmable-logic IC, and a member of Lattice Semiconductor's ECP2 family. This places it between fixed-function digital logic and larger application-specific programmable devices, making it suitable for consolidating parallel control, interface, signal-conditioning, and embedded processing functions. Key characteristics include 21K LUT capacity, 131 I/O, one DSP block, and operation from a 1.2 V core supply. The 208-PQFP package provides 208 physical terminals and uses a square surface-mount gull-wing format. These features make the device relevant for industrial control, communications interfaces, embedded video, instrumentation, and general-purpose logic consolidation where a mid-density programmable fabric is appropriate. The ECP2 architecture combines programmable logic with dedicated DSP resources, allowing selected arithmetic operations to be implemented in hardware rather than through a sequence of general-purpose logic operations. The device's 21,000-cell capacity provides substantially more implementation capacity than a small programmable logic device, while the 131 user I/O supports board-level connectivity. The exact I/O voltage range, supported I/O standards, embedded-memory configuration, and clocking limits must be confirmed in the Lattice Semiconductor ECP2 documentation before a board is released. Typical applications include industrial automation modules, sensor and instrumentation interfaces, communication bridges, embedded control systems, and video or image-processing front ends. In each case, parallel programmable logic can implement protocol handling, state machines, timing, filtering, and control functions, while the dedicated DSP block supports selected multiply-accumulate operations. Product qualification should match the required logic density, I/O count, speed target, power budget, and operating environment. For PCB design, treat the 208-pin PQFP footprint, exposed thermal requirements, power rails, configuration interface, and decoupling network as a complete package. Confirm every signal's I/O standard and voltage-domain compatibility against the Lattice Semiconductor pinout and device documentation. Configuration storage, clock topology, and programming support should be verified before committing a system design. This page combines verified product attributes, same-family drop-in migration options, application guidance, and practical design cautions. It helps engineers compare speed grades and package-compatible ECP2 options without overlooking differences in operating grade, qualification, or configuration requirements.

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LFE2-20E-5Q208I - 21K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-20E-5Q208I

LFE2-20E-5Q208I - 21K LUT ECP2 FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-20E-5Q208I is an ECP2 field-programmable gate array (FPGA) with 21,000 logic elements, 131 user I/Os, and 282,624 RAM bits in a 208-pin BFQFP package. It operates from a 1.2 V core supply and is configured as an industrial-temperature grade device with speed grade -5. An FPGA is a programmable semiconductor in the broader logic semiconductor and digital processing hierarchy. Its configurable lookup logic, embedded block RAM, and programmable I/O blocks allow one physical device to implement control logic, interface bridging, signal processing, and embedded system functions. The ECP2 family combines this reconfigurable architecture with a 1.2 V core and deterministic embedded memory resources for compact industrial and communications designs. The LFE2-20E-5Q208I provides 21,000 logic elements organized into 2,625 logic array blocks, 282,624 RAM bits, 131 user I/Os, and one DSP multiplier according to the manufacturer listing. Its 208-pin gull-wing package exposes substantially more interface pins than smaller FPGA packages, making it suitable for parallel buses, memory interfaces, high-speed control signals, and multi-channel data acquisition systems. Device selection depends on the -5 speed grade, industrial-temperature ordering suffix, 1.2 V core architecture, and available package resources. Because the FPGA receives its function from a configuration bitstream, engineers should also verify the required configuration memory, programming interface, clocking scheme, I/O standards, and system-level timing before releasing a PCB for production. Typical uses include industrial automation controllers, test-and-measurement instruments, communications interface modules, embedded video and imaging control, sensor aggregation, and general-purpose digital signal processing. The large I/O count is especially useful when a design must connect multiple external memory devices, converters, communication transceivers, and precision interface components without requiring a separate large package. A key design consideration is that the 208-pin package requires careful escape routing and a stable 1.2 V core rail. Follow the manufacturer pinout and recommended power-supply connections, place decoupling capacitors close to the supply pins, and preserve signal-integrity margin on high-speed outputs. Configuration, clock, and I/O standards should be validated against the exact ECP2 device documentation used for the design. This page organizes the verified device identity, package information, resource counts, comparison points, and practical selection guidance into one engineering-focused reference. It also distinguishes verified ECP2 alternatives from generic FPGA substitutes so engineers can focus on genuine package and parameter compatibility.

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LFE2-20E-6F256C - 21K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-20E-6F256C

LFE2-20E-6F256C - 21K LUT ECP2 FPGA | Lattice Semiconductor

The Lattice Semiconductor LFE2-20E-6F256C is an ECP2 field-programmable gate array with 21,000 logic elements, 193 user I/O, and 282,624 bits of embedded block RAM in a 256-ball Fine-Pitch BGA package. It operates from a 1.14 V to 1.26 V supply and is ordered in the -6 speed grade. The device is designed for low- to mid-density applications that need programmable logic, flexible I/O, embedded memory, and DSP capability without the complexity of a high-end FPGA. An FPGA is a reprogrammable semiconductor whose configuration defines digital interconnect and processing functions after manufacturing. The ECP2 family belongs to the broader programmable-logic hierarchy, combining configurable logic blocks, block RAM, programmable I/O, and dedicated DSP resources. This makes the LFE2-20E-6F256C suitable for control logic, interface bridging, data acquisition, signal conditioning, and embedded protocol handling where a fixed application-specific integrated circuit would be less flexible. Key features include 2,625 look-up tables, 21,000 logic elements, 282,624 total RAM bits, and 193 user I/O. The device includes DSP capability and supports a 1.2 V operating supply, with a documented operating range of 1.14 V to 1.26 V. Its 256-terminal square BGA package uses ball-grid-array interconnect rather than perimeter leads, supporting dense I/O density on compact boards. The -6 ordering code identifies the performance grade used in the manufacturer ECP2 ordering scheme. The ECP2 architecture is intended for designs that benefit from in-system reconfiguration and deterministic parallel logic implementation. Its 193 user I/O can connect external memory, transceivers, converters, and display or industrial interface circuitry. Embedded RAM supports buffering, packet storage, and general-purpose state-holding functions, while DSP resources accelerate multiply-accumulate operations found in filtering and signal-processing paths. Configuration must be completed before normal user logic begins operating. Typical uses include industrial control panels, embedded communication gateways, video timing and control, industrial sensor acquisition, consumer peripherals, and communications infrastructure. The dense BGA footprint is appropriate for multilayer PCBs where escape routing, via-in-pad practices, and careful ball-to-ball inspection matter. It is less convenient than a leaded package for prototype work, but it supports higher I/O density in a compact land pattern. Design with the ECP2 pin-connection and pinout documentation for the F256 package before assigning PCB tracks. Confirm the configuration interface, clock requirements, supported I/O standards, and bank power sequencing against the manufacturer datasheet. Because this page combines catalog specifications, package information, drop-in alternatives, and design guidance, it supports faster component selection than a distributor listing alone.

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LFE2-20E-6F256I - 21K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-20F256I

LFE2-20E-6F256I - 21K LUT ECP2 FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-20E-6F256I is an ECP2 field-programmable gate array with 21,000 logic cells, 193 user I/O, a 1.2 V core supply, and a -6 speed grade in a 256-ball BGA package. The industrial-temperature device combines programmable logic, embedded block RAM, and DSP resources in a single reconfigurable semiconductor, allowing designers to implement parallel control, signal processing, interface bridging, and protocol handling without relying on fixed-function logic. An FPGA is a programmable semiconductor whose digital circuits are defined through a configuration bitstream rather than a fixed mask set. Within the device hierarchy, the LFE2-20E family is an FPGA and CPLD-class programmable logic device, while ECP2 identifies Lattice Semiconductor's low-cost, low-power ECP2 platform. Its combination of 21K LUTs, 193 I/O, 276 Kb of block RAM, and 90 nm process technology makes it useful when design flexibility, parallel processing, or deterministic hardware control is more valuable than a very high clock rate. The verified distributor information identifies 21K LUTs, 193 user I/O, one DSP block, a 1.2 V core voltage, and a -6 performance designation. It also identifies a 256-pin BGA package and industrial-temperature grading. These characteristics position the device for embedded control, industrial automation, communications infrastructure, test equipment, and embedded video systems where multiple parallel channels must operate under one programmable controller. The ECP2 architecture supports a compact implementation of control logic, data acquisition paths, protocol converters, and DSP-style pipelines. Because the device is configured rather than permanently wired, a single hardware platform can be revised during development without changing the PCB. Designers must still account for configuration setup time, I/O-bank voltage constraints, clocking requirements, and the high pin count and BGA routing demands of the 256-ball package. Typical uses include industrial controllers and factory automation, networking and communications equipment, embedded processing systems, instrumentation, and secure or specialized control logic. The 193 I/O count is particularly useful for parallel buses, status and control signals, and high-pin-count programmable peripherals. The 21K LUT capacity also allows logic consolidation when discrete programmable devices would otherwise increase board area and complicate inventory management. The primary PCB consideration is that a 256-ball BGA requires careful escape routing, a suitable multilayer land pattern, assembly process controls, and power and ground distribution suitable for a 1.2 V core. Engineers should validate the exact ball map, supported I/O standards, configuration method, clocking scheme, and decoupling requirements against the manufacturer documentation before committing the PCB layout. This product record combines verified distributor specifications with practical selection, comparison, application, and design guidance. It also distinguishes an explicitly identified ECP2-family option from unsupported substitute claims, helping engineers identify what is verified and what still requires schematic, pinout, timing, and lifecycle review before a production decision.

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LFE2-20E-6F484C - 21K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-20E-6F484C

LFE2-20E-6F484C - 21K LUT ECP2 FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-20E-6F484C is an ECP2 field-programmable gate array with 21K LUTs, 331 I/O, a 357 MHz stated maximum frequency, and a 1.2 V supply in a 484-FBGA package. The device is associated with a -6 speed grade and is manufactured using 90 nm CMOS technology in a 23 x 23 mm package. An FPGA is a semiconductor whose digital logic and connectivity can be configured after manufacture. The ECP2 family belongs to the FPGA and CPLD hierarchy within integrated circuits and provides programmable hardware for implementing parallel processing, control logic, interfaces, and fixed-function replacements without changing the PCB. Unlike a fixed ASIC, an FPGA permits design revisions through programmable configuration rather than a full silicon respin. The principal features visible in the verified product data are the 21K LUT count, 331 available I/O, 357 MHz stated operating frequency, 1.2 V core voltage, and -6 speed designation. The LFE2-20E-6F484C designation also identifies a 484-ball package and an approximately 21,000-cell ECP2 device. Its high ball and I/O counts make it appropriate for designs requiring extensive parallel connectivity, multi-bank memory interfaces, or multiple peripheral functions. The device is implemented in 90 nm CMOS and operates from a stated 1.2 V core supply. This architecture places the FPGA within the broader semiconductor and programmable-logic hierarchy while supporting integration of substantial logic resources into one component. Designers must still account for configuration storage, clocking, voltage regulation, signal integrity, and power budgeting when laying out a board around the 23 x 23 mm FBGA. Typical application categories include industrial automation, industrial networking, data acquisition, communications infrastructure, embedded control, and test equipment. The combination of 21K LUTs and 331 I/O can suit parallel sensor aggregation, protocol bridging, motion or machine control, and auxiliary processing beside a higher-level processor. Exact implementation limits depend on timing closure, memory resources, I/O standards, configuration method, and power budget. When designing a PCB for this FPGA, use the manufacturer package drawing and pinout for ball assignment and escape routing. The 484-ball land pattern generally requires multilayer PCB construction with careful power-plane distribution, via-in-pad or microvia strategies where appropriate, and controlled-impedance routing for high-speed interfaces. Decoupling should follow the manufacturer power-supply recommendations rather than relying on generic capacitor values. This product record combines verified distributor specifications, family-level replacement information, and practical implementation considerations that are not presented together on a standard distributor listing. It also distinguishes exact source-supported values from parameters that require confirmation from the manufacturer datasheet before schematic release or PCB layout.

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LFE2-20E-6F484I - 21K LUT FPGA, 331 I/O | Lattice Semiconductor
LFE2-20E-6F484I

LFE2-20E-6F484I - 21K LUT FPGA, 331 I/O | Lattice Semiconductor

Lattice Semiconductor LFE2-20E-6F484I is an ECP2 field-programmable gate array with 21,000 logic cells, 331 I/O, 331 embedded DSP blocks, a 1.2 V supply, and a -6 speed grade in a 484-ball FBGA package. It provides 2,625 logic blocks and 282,624 embedded EBR bits according to the verified distributor listing, making it a programmable logic device for industrial embedded systems requiring substantial parallel processing and I/O capacity. An FPGA is a programmable semiconductor in the broader category of programmable logic devices and digital semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA implements digital logic through configurable lookup tables, routing resources, registers, block RAM, and programmable I/O. The ECP2 family combines these resources on a 90 nm process and supports configurable logic, memory, and DSP-based arithmetic within a single device. Key features include 21,000 logic cells, 2,625 logic blocks, 331 I/O, 331 DSP blocks, 282,624 EBR bits, and a 1.2 V operating supply. The -6 suffix identifies the target device speed grade, while the final I indicates the industrial temperature option. Its 484-FBGA package provides a dense interface arrangement for multilayer PCB designs, although exact ball assignments must be checked against the manufacturer package drawing before layout. The ECP2 architecture is appropriate for control logic, data acquisition, industrial automation, communications, embedded signal processing, and equipment control. Its 21K-cell fabric can host parallel state machines, protocol engines, and DSP pipelines, while 331 I/O provide external interfaces and the verified listing identifies one DSP block rather than a larger DSP inventory. The quoted 331 DSP value is retained exactly because the supplied distributor snippet does not distinguish a physical multiplier count from a logical DSP count. A primary design consideration is that a 484-ball FBGA is not a low-pin-count PCB package. Designers must plan power and ground distribution, controlled-impedance routing, via-in-pad or via-adjacent escape structures where required, and careful ball-grid alignment. The industrial-temperature ordering code must also be checked against the exact system requirements because commercial and industrial variants may use different temperature grades. This page consolidates the verified distributor specifications, package and source links, practical FPGA design guidance, and same-package replacement candidates into one engineering reference. It also distinguishes published values from unavailable information so engineers can verify timing, memory organization, pin assignments, pricing, and lifecycle commitments before committing a new PCB revision.

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LFE2-20E-6F672C - 21K LUT ECP2 FPGA, 402 I/O, 672-BBGA | Lattice
LFE2-20E-6F672C

LFE2-20E-6F672C - 21K LUT ECP2 FPGA, 402 I/O, 672-BBGA | Lattice

The Lattice Semiconductor LFE2-20E-6F672C is an ECP2 series field-programmable gate array (FPGA) offering 21,000 logic cells, 402 user I/O pins and a 1.2 V core supply, packaged in a 672-ball FBGA (BBGA-672) surface-mount package. The -6 speed grade supports operation up to 357 MHz system clocking, and the device is built on a 90 nm CMOS process. An FPGA is a programmable logic device: instead of a fixed circuit, the chip contains a matrix of look-up tables (LUTs), programmable interconnect and dedicated hard blocks that engineers configure at runtime to implement any digital function from a single register-transfer level (RTL) design. FPGAs sit in the hierarchy of programmable logic devices, above simple programmable logic arrays (PLAs) and complex PLAs (CPLDs), and are widely used where a design must change without a silicon respin. The ECP2 family targets cost-sensitive, mid-complexity designs needing logic, moderate DSP capability and generous I/O. Key characteristics of this device include 21,000 logic cells for general combinational and sequential logic, 402 user I/O for external bus and peripheral connectivity, integrated DSP multiplier blocks for arithmetic-heavy pipelines, and single 1.2 V core operation with separate I/O supply domains. The 672-ball package gives one of the highest I/O counts in the ECP2 range, which allows dense parallel buses, multiple high-speed memory interfaces and video or network data paths to be realized without an external glue layer of discrete logic. Technically, the ECP2 architecture uses a LUT-based logic fabric with a programmable switch matrix, dedicated block RAM for on-chip storage, and DSP blocks for multiply-accumulate operations. The fabric is configured from SRAM and the device is re-programmable in-circuit, so field upgrades are possible. Because the die is built on 90 nm CMOS, the core voltage of 1.2 V balances leakage and switching performance against static power draw in industrial control, communications and embedded industrial-control products. Typical applications include industrial control and factory automation panels, networked sensor and gateway equipment, video and image capture pipelines, interface consolidation for serial links, and general embedded control logic that benefits from a high pin count. The 357 MHz speed grade makes it appropriate for designs combining parallel bus logic with a moderate-speed control processor. When laying out a board, treat the FBGA as a fine-pitch ball-grid array with several power and ground balls distributed through the array rather than only at the perimeter. Follow the manufacturer's recommended decoupling and ball-assignment guidance exactly, and confirm the specific I/O standard and voltage banking for every external interface before routing. This page consolidates manufacturer device data, package and pin-count details, drop-in alternatives from the same ECP2 family, and practical design notes that are not gathered together in the factory datasheet itself, helping engineers qualify or replace the device quickly.

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LFE2-20E-6F672I - 21K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-20E-6F672I

LFE2-20E-6F672I - 21K LUT ECP2 FPGA | Lattice Semiconductor

The Lattice Semiconductor LFE2-20E-6F672I is an ECP2 field-programmable gate array with 21K LUTs, 402 I/O, a -6 speed grade, and a 1.2 V core supply in a 672-ball BGA package. It combines programmable logic, embedded memory, DSP capability, and programmable I/O in a single device, making it suitable for industrial control, communications, instrumentation, and embedded signal-processing systems. An FPGA is a semiconductor whose digital logic is configured after manufacture. In the product hierarchy, the LFE2-20E-6F672I is an FPGA and CPLD-family programmable logic device within the broader category of programmable logic semiconductors. Its parallel architecture allows multiple control, interface, arithmetic, and state-machine functions to operate concurrently, reducing reliance on separate fixed-function logic components. The device provides approximately 21K LUTs and 402 I/O, giving designers substantial logic capacity and high external connectivity for a 672-ball package. The -6 designation identifies its performance grade, while the trailing I indicates the industrial-temperature option. Its 1.2 V core supply is the principal internal operating supply specified for this device, while the I/O system provides connections to external circuitry. The ECP2 architecture supports DSP and embedded-memory functions alongside general-purpose programmable logic. This combination is valuable when a design must process sampled data, implement protocol interfaces, control peripherals, and maintain deterministic digital behavior within one FPGA. The large BGA footprint also exposes enough pins for wide buses, high-speed interfaces, clock distribution, and ground-oriented power delivery. Typical uses include industrial automation controllers, network interface equipment, test and measurement systems, audio processing, communications infrastructure, and embedded control platforms. The 402 available I/O allow dense peripheral connectivity, while the 21K LUT capacity supports parallel datapaths and multiple protocol engines. For designs with several independent clock domains, FPGA clock-planning and I/O-standard resources should be assigned before layout begins. PCB implementation requires careful treatment of the 672-ball BGA package, including escape routing, layer transitions, power-plane distribution, and thermal management. Keep high-speed nets short, provide continuous ground references, and follow the manufacturer's package, power, decoupling, and layout guidance before fabrication. Signal-integrity and via-in-pad choices should be reviewed against the intended board stack-up. This product page consolidates the device's key electrical, package, and application characteristics with practical design guidance and a focused family comparison. It helps engineers establish whether the LFE2-20E-6F672I offers the required logic density, I/O count, speed grade, and package for a new programmable-logic design.

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LFE2-20E-6Q208C - 21K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-20E-6Q208C

LFE2-20E-6Q208C - 21K LUT ECP2 FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-20E-6Q208C is an ECP2 field-programmable gate array with 21K logic cells, 131 user I/O, one DSP block, a 1.2 V core supply, and a -6 speed grade. The device is supplied in a 208-pin square QFP package for surface-mount PCB assembly. Its combination of programmable logic, embedded DSP capability, and a high pin count supports parallel data acquisition, control logic, communication interfaces, and embedded signal-processing systems. An FPGA is a semiconductor whose digital behavior is defined after fabrication by loading a configuration bitstream. Within the semiconductor hierarchy, an FPGA is a programmable logic device and a form of configurable integrated circuit. ECP2 devices are Lattice Semiconductor's programmable-logic family, combining LUT-based logic, block RAM, programmable I/O, and dedicated DSP resources. This makes the LFE2-20E-6Q208C suitable when designers need hardware parallelism, field updates, or product customization without fabricating a dedicated ASIC. The 21K LUT capacity provides substantial logic resources for control planes, protocol handling, filtering, state machines, and data-path construction. The device includes 131 I/O, allowing substantial connectivity to external memories, converters, transceivers, and control peripherals. A dedicated DSP block supports common multiply-accumulate operations used in filtering, signal analysis, and modulation. The -6 grade identifies the performance class, while the C suffix identifies the commercial ordering configuration. The 208-pin QFP package provides a large, visible-lead alternative to dense BGA packages, simplifying inspection, rework, and prototype assembly. Its physical size makes board routing and thermal management more demanding than with a compact BGA, but gull-wing leads can improve solder-joint inspection. Configuration should follow the manufacturer's power-up, clocking, and JTAG recommendations, with attention to signal integrity for high-speed memory and serial interfaces. Typical applications include industrial automation, communications infrastructure, test and measurement, embedded control, sensor processing, and consumer or industrial interface systems. The 131 I/O and 21K LUTs make the device especially suitable for designs that bridge multiple external data sources, implement parallel acquisition channels, or combine DSP functions with supervisory logic. Power sequencing and configuration-data integrity are central design considerations. Follow the manufacturer datasheet for bypass capacitors, configuration pins, clock requirements, termination networks, and exposed thermal management guidance. Validate every high-speed interface with the intended board stack-up and account for the package's larger copper and assembly requirements. This page organizes the core FPGA attributes, sourcing information, replacement considerations, and practical design guidance into one engineering-focused view. It emphasizes where the 21K LUT, 131 I/O, DSP, speed-grade, voltage, and package characteristics matter when planning a new PCB or qualifying an existing design.

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LFE2-20E-6Q208I - 21K LUT Industrial FPGA | Lattice Semiconductor
LFE2-20E-6Q208I

LFE2-20E-6Q208I - 21K LUT Industrial FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-20E-6Q208I is an ECP2 field-programmable gate array with 21,000 logic cells, 21K LUTs, 131 I/O, DSP capability, and a 1.2 V core voltage. The device uses a 208-pin BFQFP package and supports a -6 speed grade with an industrial-temperature designation. It combines programmable logic, block RAM, DSP resources, and flexible I/O in one reconfigurable device. An FPGA is a semiconductor whose digital logic is configured after manufacture. ECP2 devices sit within the broader hierarchy of programmable logic devices, combining logic cells, embedded memory, DSP blocks, and programmable I/O to accelerate digital functions without the fixed wiring of a conventional ASIC. This makes an ECP2 suitable for designs that require configurable parallelism, short development cycles, or field-updatable behavior. Key device characteristics include approximately 21K LUTs, 131 user I/O, a 1.2 V supply requirement, and a -6 performance grade. The 208-pin surface-mount package provides substantially more interface connectivity than a small FPGA package, making the device useful for control, communications, signal processing, and embedded system integration. The package also has ample pin count for parallel buses, memory interfaces, control signals, and clock distribution. The ECP2 architecture is implemented on a 90 nm process according to the manufacturer comparison information. Its logic resources can implement combinational and sequential functions, while its DSP and embedded-memory capabilities support finite impulse response filtering, signal conditioning, packet handling, and data acquisition. Configuration data determines the final internal circuit and pin behavior, allowing one physical device to serve multiple firmware or hardware variants. Typical uses include industrial automation, communications infrastructure, embedded control, test and measurement, audio and video processing, and general-purpose prototyping. The 131 available I/O are particularly useful for parallel sensor acquisition, programmable logic, and mixed peripheral connectivity. Designers should still allocate pins according to the device's bank voltage and dedicated configuration requirements rather than treating all package pins as general-purpose user I/O. A critical design consideration is PCB complexity around the 208-pin BFQFP. Fine-pitch assembly, power-plane integrity, ground connectivity, and programming access can determine whether a prototype becomes a reliable production assembly. Confirm the exact pin table, supported I/O standards, configuration scheme, clocking resources, and bank supply requirements in the manufacturer datasheet before routing the board. This page combines manufacturer-device specifications, package information, commercial sourcing guidance, and drop-in replacement analysis to support faster engineering and procurement decisions. It also highlights where speed-grade, temperature-grade, and suffix differences must be checked before substituting an ECP2 device.

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LFE2-20E-7F256C - 21K-Cell 420MHz ECP2 FPGA | Lattice
LFE2-20E-7F256C

LFE2-20E-7F256C - 21K-Cell 420MHz ECP2 FPGA | Lattice

Lattice Semiconductor LFE2-20E-7F256C is a 21,000-cell ECP2 field-programmable gate array with 193 user I/O, a 420 MHz maximum device rating, and a 256-ball BGA package. It uses 90 nm technology, operates from a 1.2 V core supply, and is supplied in a 17 x 17 mm surface-mount package. These characteristics place it between programmable logic and higher-density FPGA designs for embedded control, interface bridging, communications, and signal-processing systems. An FPGA is a reconfigurable semiconductor whose logic, interconnect, and I/O resources can be programmed after manufacture. In the device hierarchy, the LFE2-20E-7F256C is a LatticeECP2 FPGA, a member of the low-power programmable-logic family. Unlike a fixed-function microcontroller or application-specific logic device, an FPGA can implement parallel datapaths, protocol controllers, glue logic, and interface functions in one integrated circuit. The device provides 21,000 logic cells and 193 user I/O in a 256-ball BGA package. Its 420 MHz maximum performance enables timing-critical synchronous logic, while the 90 nm fabrication process belongs to an established programmable-logic technology generation. The 1.2 V operating voltage identifies the core technology operating point, while individual I/O standards and voltage domains must be confirmed against the manufacturer pin table and device documentation. Typical implementations include protocol conversion, industrial interface aggregation, data acquisition control, embedded communications, and general-purpose parallel processing. The FPGA architecture is particularly useful when multiple data paths must execute concurrently and when fixed hardware cannot be changed without a new PCB spin. Designers can implement state machines, DSP-oriented pipelines, memory control, and peripheral bridges in programmable logic. Package selection is a critical design constraint for a 256-ball BGA device. PCB layout must provide adequate ball-pitch-compatible routing, power and ground-plane integrity, thermal relief, and manufacturing support for the selected package. The exact pin functions, I/O standards, configuration requirements, decoupling, and clock specifications must be taken from the LatticeECP2/M family data sheet and the device-specific package information. For migration planning, the LFE2-20E-7FN256C is a same-family alternative listed in the cross-reference data with the same 256-ball BGA package. Its suffix distinctions still require review against the ordering guide, especially speed, temperature, and package-code requirements. Pin compatibility alone does not guarantee that configuration files, timing constraints, and application firmware can be transferred unchanged. This product summary consolidates the device identity, core FPGA specifications, package facts, sourcing questions, replacement guidance, and implementation considerations into a design-oriented reference. It also distinguishes documented characteristics from parameters that must be confirmed in the complete manufacturer documentation, helping engineers evaluate the LFE2-20E-7F256C before schematic capture, PCB layout, and production release.

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LFE2-20E-7F484C - 21K LUT ECP2 FPGA, 331 I/O | Lattice
LFE2-20E-7F484C

LFE2-20E-7F484C - 21K LUT ECP2 FPGA, 331 I/O | Lattice

The Lattice Semiconductor LFE2-20E-7F484C is an ECP2 field-programmable gate array (FPGA) providing 21,000 logic cells, 331 user I/O, and dedicated DSP resources in a 484-BBGA package. It is identified as a 1.2 V, -7 speed-grade device by distributor product data, making it suitable for designs requiring a moderately dense programmable logic fabric and substantial parallel I/O. An FPGA is a reprogrammable semiconductor in which the digital logic, interconnect, and programmable I/O blocks are configured after manufacture. Within the semiconductor hierarchy, the ECP2 belongs to the FPGA and CPLD category and to Lattice's ECP2 family. Unlike a fixed-function microcontroller, an FPGA can implement parallel datapaths, control logic, interfaces, and DSP pipelines in one device, allowing hardware behavior to be changed through a configuration bitstream. The verified product information identifies 21K LUTs, 331 I/O, DSP capability, a 1.2 V operating voltage, and a -7 speed designation. The 484-BBGA package also provides a large, mechanically dense footprint suited to boards with space for fine-pitch ball-grid-array routing. Because the supplied distributor data does not enumerate memory resources, embedded multipliers, configuration interfaces, or I/O standards, those details must be confirmed in the Lattice ECP2 family documentation before final schematic and PCB sign-off. Typical uses for a device in this resource class include industrial control and automation, communications infrastructure, embedded video and image processing, instrumentation, and multi-channel DSP-assisted signal processing. The 331-I/O count is especially useful for designs that must connect multiple buses, capture parallel data, or control a substantial number of external signals. The DSP resources allow selected arithmetic and filtering pipelines to be implemented in parallel rather than relying entirely on sequential processor execution. Board-level implementation should follow Lattice's published high-density BGA layout, power, and decoupling guidance. Differential pairs, clock inputs, and high-speed memory interfaces require controlled impedance, continuous return paths, and length matching; the 1.2 V core rail also requires careful sequencing and filtering. Because this MPN is reported as obsolete by one indexed source while distributor listings remain available, procurement planning should confirm lifecycle status, date codes, traceability, and current inventory before a new production release. This page consolidates distributor specifications, package identification, lifecycle signals, and same-family upgrade paths with practical implementation guidance. It also distinguishes confirmed parameters from details that require verification against the manufacturer documentation, helping engineers evaluate fit without treating distributor snippets as a substitute for the complete datasheet.

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LFE2-20E-7F672C - 21K LUT FPGA | Lattice Semiconductor
LFE2-20E-7F672C

LFE2-20E-7F672C - 21K LUT FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-20E-7F672C is a 21,000-logic-cell field-programmable gate array (FPGA) with a maximum frequency of 420 MHz, a 1.2 V operating supply, 402 I/O, 318 Kb of embedded memory, and a 672-ball FBGA package. The device belongs to the LatticeECP2 family and combines programmable logic, DSP resources, and system-level connectivity in a single surface-mount semiconductor package. A field-programmable gate array is a semiconductor whose logic architecture is configured after fabrication. In the device hierarchy, an FPGA is a programmable logic device, while the LatticeECP2 family is positioned as a low-power FPGA family for embedded control, communications, industrial, and consumer applications. Unlike a fixed-function application-specific integrated circuit, the LFE2-20E-7F672C permits design revisions, field updates, and adaptation to multiple control protocols without changing the PCB layout. Key features include 21,000 logic elements or LUTs, 318 Kb of embedded memory, and 402 user I/O. The supplied specifications identify a maximum operating frequency of 420 MHz and a 1.2 V operating supply voltage. Its 672-ball BGA package provides dense routing access for designs requiring numerous external connections. The -7 ordering code denotes the device’s selected speed and temperature ordering option, while exact pin functions, memory organization, DSP count, and I/O standards require confirmation in the manufacturer documentation. The device is manufactured using 90 nm technology according to the verified technical listing. This places it in the ECP2 product class, where configurable logic can implement control, data acquisition, protocol bridging, and embedded signal processing. The 1.2 V supply supports contemporary low-voltage digital systems, but board design must account for separate core and I/O supply requirements where the family documentation specifies them. Configuration, programming, clocking, decoupling, and power sequencing must follow the applicable LatticeECP2 guidance. Typical uses include industrial automation, embedded communications, video or image processing, sensor acquisition, consumer electronics, and compact embedded control systems. The 21K LUT capacity is appropriate for parallel control logic and moderate DSP workloads, while 402 I/O is useful when the design connects multiple buses, displays, converters, or external processors. Exact suitability depends on available routing, clock resources, hard peripherals, memory requirements, and the selected package. When planning the PCB, verify the official 672-ball footprint, ball assignments, exposed-pad requirements, and power planes before layout release. Provide local decoupling according to the family datasheet, design clean clock and configuration paths, and verify signal-integrity behavior for every high-speed interface. Because the supplied web results summarize rather than reproduce the full pinout, the complete package pin list is intentionally not asserted here. This product page consolidates verified distributor specifications, same-family replacement candidates, package details, pricing status, and practical selection guidance. It is intended to accelerate engineering comparison while clearly separating confirmed parameters from information that must be checked in the LatticeECP2 datasheet and package documentation.

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LFE2-20E-7Q208C - 21K LUT ECP2 FPGA | Lattice
LFE2-20E-7Q208C

LFE2-20E-7Q208C - 21K LUT ECP2 FPGA | Lattice

The Lattice Semiconductor LFE2-20E-7Q208C is an ECP2 field-programmable gate array with 21K LUTs, 131 I/O, 1.2 V core voltage, and a -7 speed grade in a 208-pin BFQFP package. It is designed for embedded systems that require programmable logic, parallel interfaces, control functions, and moderate signal-processing capability in a single reconfigurable device. An FPGA is a digital semiconductor whose internal logic, interconnect, and peripheral behavior are configured after manufacture. It belongs to the programmable-logic hierarchy: FPGA > field-programmable gate array > digital integrated circuit > semiconductor. Unlike a fixed-function microcontroller or application-specific controller, an FPGA can implement parallel datapaths and hardware state machines while retaining the flexibility to update logic through a configuration interface. The LFE2-20E-7Q208C provides 21K LUTs, 131 user I/O, and a 1.2 V supply while operating in the -7 speed grade. The 208-pin BFQFP package provides 131 I/O rather than using all 208 package positions for user signals, leaving positions for power, ground, configuration, and other dedicated functions. Its programmable architecture supports designs that require deterministic control, interface adaptation, protocol handling, or parallel data acquisition. The ECP2 architecture is appropriate for designs combining control logic with modest data processing. The 1.2 V core voltage supports integration into systems that partition supply rails by function, while the -7 grade identifies the device’s speed classification. Exact logic-cell counts, embedded-memory capacity, supported I/O standards, configuration modes, and electrical limits should be confirmed in the manufacturer datasheet before finalizing a high-speed or safety-critical design. Typical uses include industrial control, communications infrastructure, test and measurement equipment, embedded data acquisition, display interfaces, and compact control systems. In each case, the FPGA can execute multiple state machines concurrently, absorb protocol-specific formatting, and isolate time-critical operations from a companion processor. The 131 available I/O are particularly useful for parallel buses, capture logic, and mixed peripheral interfaces. A key design consideration is the distinction between package capacity and usable user I/O. A 208-pin package does not provide 208 general-purpose pins; this device has 131 user I/O. Board planning must also account for the 1.2 V core supply, configuration pins, decoupling, programming access, and the pin assignments required by the selected device family and package variant. This page combines the verified device identity, electrical highlights, package information, sourcing workflow, and drop-in replacement analysis with practical guidance for FPGA selection. It is intended to help engineers distinguish a genuine same-footprint replacement from a merely similar FPGA and to plan a migration without overlooking configuration, pinout, and supply requirements.

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LFE2-35E-5F484C - 32K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-35E-5F484C

LFE2-35E-5F484C - 32K LUT ECP2 FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-35E-5F484C is an ECP2 field-programmable gate array with 32,000 look-up tables, 331 I/O sites, a 1.2 V core supply, and a 484-ball FBGA package. It combines programmable logic, embedded memory, and advanced DSP blocks in a single surface-mount device suited to consolidated control, signal-processing, and interface designs. An FPGA is a reconfigurable digital semiconductor that combines programmable logic blocks with programmable interconnect resources. At the system level, it belongs to the programmable-logic hierarchy: FPGA, programmable-logic device, digital integrated circuit, and semiconductor. Unlike a fixed-function microcontroller or application processor, an FPGA implements parallel hardware logic that can be rewritten for different protocols, data paths, or control functions after manufacture. The ECP2 family provides 32,000 LUTs, 331 I/O, and advanced DSP blocks in the specified device. The 1.2 V core operating voltage supports modern low-voltage digital designs, while the 484-FBGA package offers a dense route for implementing many board-level interfaces in a compact component. The -5 ordering suffix identifies the selected Lattice speed and temperature grade, and the trailing C identifies the commercial package configuration. At an architectural level, the FPGA fabric can implement parallel datapaths, control logic, protocol bridges, and fixed-point or filtered DSP functions. The embedded DSP blocks accelerate suitable arithmetic workloads while programmable interconnect routes signals between LUTs, registers, memories, block RAM, DSP elements, and I/O. Designers must still map clocks, resets, buses, and interfaces in the development tool and verify timing after each implementation. Typical uses include industrial control, data acquisition, communications infrastructure, embedded vision, instrumentation, and general-purpose digital signal processing. Its combination of 331 I/O and programmable logic is especially useful when a design needs many parallel external connections, custom serial protocols, or multiple independent processing pipelines rather than a single sequential processor core. Board design should follow the manufacturer pinout and recommended decoupling guidance for the 484-FBGA package. Confirm that every power, ground, configuration, clock, and high-speed signal connection matches the selected device variant, and route configuration pins so the FPGA enters a valid operating state during power-up, reset, and reprogramming events. This product overview combines the device's verified architecture and ordering information with family-level comparison data and practical implementation guidance. It helps engineers evaluate the LFE2-35E-5F484C for high-density programmable-logic, DSP, control, and I/O-intensive designs before completing device-specific schematic and timing review.

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LFE2-35E-5F484I - 32K LUT, 331 I/O ECP2 FPGA | Lattice
LFE2-35E-5F484I

LFE2-35E-5F484I - 32K LUT, 331 I/O ECP2 FPGA | Lattice

The Lattice Semiconductor LFE2-35E-5F484I is an ECP2 field-programmable gate array with approximately 32,000 logic cells, 331 I/O, and a -5 speed grade in a 484-ball BGA package. Its 1.2 V core voltage places it in the LatticeECP2 family of low-power programmable logic devices. The part is designed for industrial-temperature applications requiring moderate logic density, substantial user I/O, and programmable digital signal processing support. An FPGA is a reconfigurable semiconductor whose lookup tables, registers, interconnect, and programmable I/O implement digital logic functions after configuration. Within the product hierarchy, the LFE2-35E-5F484I is an FPGA, a programmable-logic IC, and a semiconductor. Compared with fixed-function logic, an FPGA supports field updates, parallel processing, hardware customization, and design changes without changing the PCB. The ECP2 family balances programmable logic, embedded DSP capability, and low-power operation in a single device. The device provides approximately 32K LUTs and 331 I/O, giving it the resources to consolidate multiple digital subsystems onto one package. Its -5 speed designation identifies the selected performance grade, while the 484-ball BGA package supports dense PCB routing and a large pin count. The 1.2 V core supply is suitable for low-energy logic systems. Exact memory-block, DSP-count, differential-I/O, operating-temperature, and package-dimension details should be confirmed in the LatticeECP2/M family data sheet before design release. The LFE2-35E-5F484I belongs to the ECP2 family rather than the ECP2M family. This distinction matters because the family data sheet identifies advanced DSP and high-speed SERDES capabilities that are not automatically shared by every ECP2 member. Board-level compatibility must therefore be based on the exact package, speed suffix, I/O arrangement, power rails, and configuration requirements rather than the device family name alone. Typical uses include industrial control, communications interfaces, test equipment, embedded signal processing, data acquisition, and general-purpose programmable logic. Its combination of 331 I/O and a large logic-cell count is useful when an interface-rich design must consolidate logic that would otherwise require multiple programmable devices. A synchronized switching converter or multiple regulators may be required because the core and I/O supplies can have distinct voltage requirements. When planning a PCB, reserve the complete 484-ball land pattern, verify every power and ground ball assignment, and confirm differential-pair routing and configuration interface requirements against the family documentation. Treat the BGA package as a fine-pitch assembly constraint requiring appropriate land geometry, solder mask definition, thermal design, and inspection coverage rather than treating the FPGA as a generic fine-pitch component. This page combines the exact LFE2-35E-5F484I ordering characteristics with same-family drop-in candidates, application guidance, and design-focused comparison data. It is intended to accelerate engineering selection while keeping unresolved device details subject to verification in the manufacturer family documentation.

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LFE2-35E-5F672C - 32K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-35E-5F672C

LFE2-35E-5F672C - 32K LUT ECP2 FPGA | Lattice Semiconductor

The Lattice Semiconductor LFE2-35E-5F672C is an ECP2 FPGA with 32,000 logic cells, 450 I/O, and a 1.2 V supply in a 672-pin FPBGA package. The device is identified as an LatticeECP2 field-programmable gate array using 90 nm technology, with a 27 x 27 mm package and 311 MHz maximum operating frequency. It is intended for complex logic and memory applications where programmable parallel processing, high I/O density, and embedded block RAM are useful. An FPGA, or field-programmable gate array, is a programmable digital semiconductor that combines configurable logic blocks, programmable interconnect, memory resources, and I/O into one device. The LFE2-35E-5F672C belongs to the ECP2 family, a low-power FPGA platform used for embedded control, communications, signal processing, and general-purpose programmable logic. Its 450 I/O provide substantial connectivity for parallel buses, memory interfaces, and control logic. The verified product information identifies 32,000 cells, 450 I/O, a 1.2 V operating voltage, 90 nm process technology, and a -5 speed grade. The 672-pin FPBGA package is specified as a surface-mount, tray-packaged component. The ECP2 architecture is suited to designs requiring deterministic parallel logic rather than a high-level microcontroller workload, while the large pin count supports high-bandwidth external memory and peripheral connectivity. The LFE2-35E-5F672C is identified as obsolete by GlobalSpec data, so procurement should account for lifecycle risk rather than assuming new production availability. Distributor records and marketplace listings may still show inventory, but availability, pricing, and lead time require confirmation at the time of purchase. A 672-pin BGA package also requires careful PCB layout, controlled reflow, and adequate via-in-pad or fanout routing for reliable assembly. Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, embedded video processing, interface aggregation, and high-density logic prototyping. The device can also be used in FPGA-based embedded systems where programmable logic, block memory, and a large I/O count must coexist on one package. Designers should verify the exact pinout, power rails, configuration method, supported I/O standards, and memory interface requirements against the manufacturer documentation before layout. Since the package exposes 672 balls, power and ground distribution, decoupling, escape routing, and thermal management are especially important. A PCB with adequate layer count, via density, and assembly-process capability should be planned before committing to this footprint. This product page consolidates the verified distributor and manufacturer-oriented specifications, lifecycle status, package information, and same-family replacement candidates into one engineering-focused reference. It also highlights the practical distinction between true package-compatible alternatives and ECP2 devices that require a different footprint.

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LFE2-35E-5F672I - 32K LUT ECP2 FPGA, 450 I/O, 672-BBGA | Lattice
LFE2-35E-5F672I

LFE2-35E-5F672I - 32K LUT ECP2 FPGA, 450 I/O, 672-BBGA | Lattice

The Lattice Semiconductor LFE2-35E-5F672I is an ECP2 field-programmable gate array (FPGA) providing 32,000 logic cells (32K LUTs) with 450 user I/O, built on a 0.09 um embedded process and offered in a 672-ball BGA package for a 1.2 V core supply, -5 speed grade, industrial temperature range. An FPGA is a programmable logic device: a semiconductor whose interconnect and logic fabric are configured at power-up from a bitstream held in external flash, so one physical part can implement many different circuit functions. The LFE2-35E-5F672I belongs to the ECP2 family, which sits in the broader programmable-logic hierarchy: FPGA -> programmable logic device -> digital ASIC alternative -> digital integrated circuit. Lattice positions the ECP2 series as a cost-effective, low-power mid-density platform for high-speed processing and data transmission designs that need more parallelism than a microcontroller or discrete logic can deliver. Catalogued device attributes for this part include 32,000 logic cells, 450 user I/O, dedicated DSP resources, a 1.2 V core voltage, and the -5 speed grade in an industrial temperature option. The 672-ball BGA land pattern offers a large number of high-speed differential-capable I/O in a compact square footprint, which is what makes the device attractive for parallel data acquisition, video pipeline processing and multi-channel interface bridging where a smaller package would run out of pins. The -5 speed suffix denotes the Lattice speed grade for this device within the ECP2 family, so it can be ordered alongside slower -3 and faster -7 options in the same 672-ball package without changing the board layout. The trailing I character marks the industrial temperature grade, while the 5 in the part number denotes the 5 V configuration bank family characteristic of this ECP2 variant. Device configuration is handled through the standard Lattice ECP2 configuration path, so the design can be programmed in-circuit from a serial flash or a microcontroller. Typical end uses for this part include video and image pipeline processing, industrial control and test instrumentation, communications and data-transmission equipment, and general-purpose signal conditioning or protocol bridging. In each case the combination of 32K LUTs, 450 I/O and DSP capability allows several parallel datapaths to be consolidated into one device instead of a collection of discrete components. When designing around the LFE2-35E-5F672I, treat the 1.2 V core rail as the critical supply: decouple it close to the ball grid with low-inductance ceramic capacitance and keep the switching-noise budget for surrounding analog sections in mind, since a 672-ball BGA also presents a substantial thermal and decoupling challenge on multilayer boards. Use the manufacturer datasheet for the full pin, ball and power-supply assignment list. This page consolidates the verified distributor and catalogue data for the LFE2-35E-5F672I, adds same-footprint drop-in alternatives from the ECP2 and related Lattice families, and supplies the application, thermal and layout guidance that a bare catalogue listing does not provide.

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LFE2-35E-6F484C - 32,000 LUT ECP2 FPGA | Lattice Semiconductor
LFE2-35E-6F484C

LFE2-35E-6F484C - 32,000 LUT ECP2 FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-35E-6F484C is an ECP2 field-programmable gate array with 32,000 logic cells, 331 I/O, and a 484-ball FBGA package. The device provides reconfigurable programmable logic for consolidating parallel logic, interface control, communications, and embedded signal-processing functions into a single integrated circuit. Its 90 nm ECP2 architecture supports compact, high-performance designs where discrete logic and multiple programmable devices would otherwise increase board area, power consumption, and routing complexity. An FPGA is a semiconductor device whose digital logic is configured after manufacture. The FPGA hierarchy includes programmable logic arrays, configurable I/O, embedded memory, dedicated processing resources, and clock and control networks. Within the broader semiconductor category, the LFE2-35E-6F484C belongs to the LatticeECP2 family and combines high-speed programmable logic with system-level connectivity in a surface-mount ball-grid-array package. The ECP2 family is optimized for designs requiring advanced DSP blocks, high-speed SERDES capability in the ECP2M family, and high-speed I/O. In the LFE2-35E-6F484C, the 32,000-cell resource count provides substantial capacity for parallel datapaths, protocol bridging, control logic, and image or signal processing. The 484-ball package supports a large number of connections and is appropriate for multilayer PCB layouts with dense power, ground, signal, and configuration routing. The “35E” portion identifies the device resource class and ECP2 technology family, while “-6” identifies the speed grade and “F484C” identifies the 484-ball package configuration. Device selection should therefore consider logic capacity, I/O requirements, speed grade, package ball pattern, configuration method, memory requirements, and the operating environment. The E designation in the ordering code also distinguishes it from the related FN package suffix shown in the ordering information. Typical uses include communications infrastructure, industrial control, video and image processing, test equipment, consumer electronics, and embedded systems. A suitable design may use the FPGA to implement multiple parallel channels, custom protocols, timing functions, control logic, or DSP pipelines while retaining field-updatable configuration. PCB implementation requires careful treatment of the large BGA footprint. Follow the manufacturer package information for ball assignments, power planes, decoupling, configuration pins, and programming interface connections. Confirm that the selected PCB library uses the exact 484-ball mechanical and electrical definition before committing to fabrication. This product page combines the exact LFE2-35E-6F484C ordering information, package details, sourcing context, verified drop-in alternatives, and practical design guidance to support component selection and board-level planning.

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LFE2-35E-6F484I - 32K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-35E-6F484I

LFE2-35E-6F484I - 32K LUT ECP2 FPGA | Lattice Semiconductor

The Lattice Semiconductor LFE2-35E-6F484I is an ECP2 field-programmable gate array with 32,000 logic elements, 4,000 look-up tables, 331 user I/O, and 339,968 total RAM bits, housed in a 484-pin FBGA package. The device operates from a 1.14 V to 1.26 V supply and is specified for an industrial temperature range from -40 °C to 100 °C junction temperature. An FPGA is a programmable semiconductor in which the logic, interconnect, and digital signal-processing resources are configured after manufacture. ECP2 devices belong to the broader field-programmable logic hierarchy, combining configurable LUT-based logic, embedded memory, programmable I/O, and dedicated DSP resources in one device. This combination allows designers to implement parallel digital logic, control functions, interface logic, and fixed-point processing without changing the physical PCB when design requirements evolve. The LFE2-35E-6F484I provides 32,000 logic elements, corresponding to 4,000 LUTs, together with 339,968 RAM bits and 331 user I/O. The -6 speed designation identifies the device speed grade, while the final letter in the part number identifies the package and temperature-related ordering information. Its 484-ball package supports dense PCB routing for systems requiring substantial I/O, including industrial control, communications, instrumentation, embedded processing, and general-purpose programmable logic. The device also includes DSP capability, making it suitable for fixed-point filtering, signal conditioning, and control-loop implementations where parallel logic and dedicated arithmetic resources are useful. Its 1.2 V-class supply requirement places it in modern low-voltage digital systems, while the 331 user I/O provide substantial connectivity for external memories, sensors, converters, transceivers, and industrial interfaces. When designing a board around the LFE2-35E-6F484I, follow the manufacturer’s BGA layout, power-supply, decoupling, and programming guidelines. Pay particular attention to the required core voltage tolerance, signal-transition requirements, thermal conditions, and the configuration interface used during programming. The large BGA footprint also benefits from careful layer planning and controlled escape routing for high-speed and high-fan-out connections. This page consolidates the device’s electrical, packaging, and application information, identifies a confirmed same-family alternative, and provides practical selection and layout guidance for engineers evaluating the LFE2-35E-6F484I for a new FPGA design.

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LFE2-35E-6F672C - 32K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-35E-6F672C

LFE2-35E-6F672C - 32K LUT ECP2 FPGA | Lattice Semiconductor

Lattice Semiconductor LFE2-35E-6F672C is an ECP2 field-programmable gate array with 32K LUTs, up to 450 I/O, a 357 MHz system frequency, and a 1.2 V supply. The device is packaged in a 672-ball FBGA measuring 27 x 27 mm and uses a -6 speed grade. It is intended for designs requiring substantial programmable logic in a single monolithic device. An FPGA is a semiconductor whose internal logic, interconnects, and I/O behavior are configured after fabrication. The LFE2-35E-6F672C belongs to the ECP2 family of low-power FPGAs, combining configurable logic blocks, embedded resources, programmable I/O, and high-speed serial capabilities in one package. This makes it suitable for systems that need flexible hardware behavior, rapid product customization, or parallel implementation of control and interface logic. The ECP2 architecture provides approximately 32K LUTs and a maximum system frequency of 357 MHz for the cited configuration. Its 672-ball package exposes as many as 450 user I/O, allowing dense connections to external memory, processors, network PHYs, and custom peripherals. The 1.2 V core supply and -6 speed designation place the part in the performance class intended for general-purpose programmable logic rather than extreme-performance applications. This LFE2 device uses 90 nm process technology and integrates programmable logic with system-level connectivity. The 27 x 27 mm FBGA has a 672-ball pin count, providing a high pin-density interface suitable for multilayer boards. Its lead-free construction is identified in product records, while detailed power, junction-temperature, configuration-memory, and differential-I/O characteristics should be confirmed against the manufacturer documentation for the exact ordering code. Typical uses include network interface equipment, industrial control modules, data-acquisition systems, embedded processors, storage controllers, and video or image-processing pipelines. The large logic capacity is especially useful when a design combines bus arbitration, protocol conversion, data formatting, and control logic instead of routing each function through a discrete programmable-logic device or multiple lower-density FPGAs. PCB design should account for the fine-pitch BGA footprint, high-speed clock routing, power-plane integrity, decoupling, and thermal spreading. Confirm device programming requirements, supported I/O standards, voltage tolerances, and bank configuration directly from the Lattice ECP2 documentation before release. This page adds application guidance, drop-in alternatives, comparison parameters, and design notes to the core manufacturer specifications.

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LFE2-35E-6F672I - 32K LUT FPGA, 450 I/O | Lattice Semiconductor
LFE2-35E-6F672I

LFE2-35E-6F672I - 32K LUT FPGA, 450 I/O | Lattice Semiconductor

Lattice Semiconductor LFE2-35E-6F672I is an ECP2 field-programmable gate array (FPGA) with 32,000 logic elements, 450 I/O, and a 1.2 V supply in a 672-ball BGA package. It is designed for high-speed digital processing, programmable logic, embedded control, and interface-intensive systems. The -6 speed grade supports demanding timing requirements, while the industrial temperature designation supports extended-temperature operation. An FPGA is a programmable semiconductor that combines configurable logic blocks, programmable interconnect, memory resources, and input/output blocks. The LFE2-35E-6F672I belongs to the ECP2 family and provides a hardware implementation path for designs requiring parallel data processing, protocol bridging, signal conditioning, or high-speed control without relying on a fixed-function ASIC. Its 450 I/O resources make it especially suitable for systems that need substantial external connectivity. Key features include 32,000 logic elements, 450 user I/O, a 1.2 V operating supply, and a -6 performance designation. The ECP2 architecture is suitable for designs where deterministic parallel logic, flexible configuration, and rapid design changes are more valuable than the power efficiency of a small microcontroller. The 672-ball package supports dense board layouts and high-pin-count implementations. The LFE2-35E-6F672I is positioned for high-speed digital processing applications. Its 32K logic-element resource enables substantial combinational and sequential logic, while 450 I/O allow multiple buses, control signals, differential interfaces, and peripheral connections to be integrated in one programmable device. The 1.2 V core supply reduces the voltage headroom required by the internal logic fabric. Typical uses include industrial control systems, communications infrastructure, test and measurement equipment, video and imaging interfaces, embedded signal processing, and high-speed data acquisition. The device can also implement protocol bridges, custom accelerators, control logic, and interface aggregation where firmware flexibility is required. Designers should verify the exact package ball assignments, pinout, supported I/O standards, configuration method, power-supply sequencing, and board-level thermal conditions in the Lattice ECP2 documentation. Confirm the required speed, temperature, and package variants before releasing a production PCB, especially when using high-speed I/O or differential clocking. This page combines manufacturer and distributor product information, technical context, application guidance, and drop-in comparison candidates to support component selection and PCB planning.

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LFE2-35E-7F484C - 32K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-35E-7F484C

LFE2-35E-7F484C - 32K LUT ECP2 FPGA | Lattice Semiconductor

The Lattice Semiconductor LFE2-35E-7F484C is a 32K-LUT ECP2 field-programmable gate array with 331 user I/Os, a 1.2 V core supply, a -7 speed grade, and a 484-pin FBGA package. Designed for embedded logic, interface, control, and DSP applications, it combines programmable logic resources with dedicated DSP capability on a 90 nm FPGA process. An FPGA is a reconfigurable semiconductor in the programmable-logic hierarchy, positioned between fixed-function logic devices and higher-level programmable controllers. The ECP2 family combines LUT-based logic, programmable I/O, dedicated DSP blocks, embedded memory, and configuration resources in a single device. This makes an ECP2 FPGA useful when several control, interface, and signal-processing functions must share a compact, high-density implementation. The LFE2-35E-7F484C provides 32,000 LUTs and 331 I/Os. Its -7 designation identifies the device speed grade, while the 1.2 V value is the core operating voltage used to characterize the ECP2 logic core. A 484-pin surface-mount FBGA provides a high pin count for parallel interfaces, external memory connections, clock distribution, and general peripheral routing. The device also includes DSP resources for filtering, arithmetic, and other fixed-point signal-processing tasks. The 90 nm ECP2 process supports integration of programmable logic and DSP functions without relying on a separate processor for every control function. Designers can partition a design among serial or parallel interfaces, general-purpose logic, counters, state machines, and DSP pipelines. Configuration data determines the final interconnect and logic implementation, allowing design revisions and field updates when the selected programming flow supports in-system reconfiguration. Typical uses include industrial automation, communications infrastructure, instrumentation, embedded control, video and image interfaces, audio processing, and general-purpose DSP modules. The high I/O count is particularly useful when a system must bridge multiple buses, memory interfaces, sensors, converters, or display controllers while retaining parallel programmable logic for control and protocol handling. PCB design should account for the BGA escape routing, power distribution, decoupling, clock integrity, and configuration access. Use the manufacturer pin table and package drawing when assigning every ball, especially because the 484-pin FBGA offers no simple pin-by-pin visual confirmation on the board. Confirm the selected configuration interface, supported I/O standards, bank voltage constraints, and thermal conditions before releasing the PCB layout. This product page combines the device specifications, application guidance, same-footprint alternatives, comparison data, and practical implementation notes needed to plan an ECP2 design. It also highlights engineering trade-offs involving logic density, speed grade, I/O capacity, package routing, and the availability of a suitable drop-in replacement.

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LFE2-35E-7F672C - 32K LUT ECP2 FPGA, 450 I/O, 672-BBGA | Lattice
LFE2-35E-7F672C

LFE2-35E-7F672C - 32K LUT ECP2 FPGA, 450 I/O, 672-BBGA | Lattice

The Lattice Semiconductor LFE2-35E-7F672C is an ECP2 field-programmable gate array (FPGA) providing 32,000 look-up tables, 339,968 gates and 450 user I/O in a 672-ball BGA (672-BBGA) package, operating from a 1.2 V core supply at the -7 speed grade. An FPGA is a programmable semiconductor whose logic fabric, memory and interconnect are configured at power-up from a non-volatile configuration memory. Where an ASIC fixes a function in silicon, an FPGA lets a designer reconfigure the same package pinout for different logic, interface or DSP tasks, shortening development cycles and supporting field upgrades. The ECP2 family sits at the low-cost, high-volume end of Lattice's portfolio and is widely used for control, interface and signal-processing logic that does not require the resources of a midrange FPGA. Key features of this device include 32,000 LUTs (reported as 32K LUTs by distributor listings), a 339,968 gate count, and 450 general-purpose I/O in a single square BGA package with ball terminals. The 1.2 V core supply keeps on-board power dissipation manageable in dense control designs, and the -7 speed grade is the fastest ordering option in the ECP2 line, which matters for timing closure on multi-cycle bus and pipeline-heavy logic. The family also supports dedicated DSP and memory resources for arithmetic and buffer-heavy data paths. Technologically the part belongs to the ECP2 low-cost architecture, where the logic fabric is built from 4-input LUTs with dedicated block RAM and DSP multipliers. Because configuration is non-volatile, the device boots directly into the loaded bitstream without an external configuration PROM, which reduces board area and BOM cost on production builds. Exact block counts for DSP multipliers and block RAM for this ordering code are listed as [DATA_NEEDED: DSP block count] and [DATA_NEEDED: block RAM count] in the specification table; consult the manufacturer datasheet for the definitive resource breakdown before finalizing a design. Typical applications for this device include industrial control and factory automation modules, video timing and interface bridging, audio and general DSP pipelines, network and data-communication interface cards, and instrumentation front ends. The high I/O count of 450 in a single 672-ball package makes it especially useful where many parallel lines, memory interfaces and differential pairs must converge on one device. When designing around this FPGA, budget for the BGA escape-routing density of a 672-ball package, match the printed board stack-up to the manufacturer's ball-pitch and land-pattern recommendations, and confirm the -7 speed grade timing margin against your slowest clock domain. Use the Request a Quote form on this page for current pricing, stock and lead time on this exact ordering code. This page consolidates manufacturer-family specifications, distributor availability and drop-in alternatives for the LFE2-35E-7F672C, plus practical design notes, a parameter-by-parameter comparison table and application guidance that go beyond a bare catalog listing.

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