LFE2-35E-6F672C - 32K LUT ECP2 FPGA | Lattice Semiconductor
部品番号: LFE2-35E-6F672C ✓ 生産中LFE2-35E-6F672C 概要
An FPGA is a semiconductor whose internal logic, interconnects, and I/O behavior are configured after fabrication. The LFE2-35E-6F672C belongs to the ECP2 family of low-power FPGAs, combining configurable logic blocks, embedded resources, programmable I/O, and high-speed serial capabilities in one package. This makes it suitable for systems that need flexible hardware behavior, rapid product customization, or parallel implementation of control and interface logic.
The ECP2 architecture provides approximately 32K LUTs and a maximum system frequency of 357 MHz for the cited configuration. Its 672-ball package exposes as many as 450 user I/O, allowing dense connections to external memory, processors, network PHYs, and custom peripherals. The 1.2 V core supply and -6 speed designation place the part in the performance class intended for general-purpose programmable logic rather than extreme-performance applications.
This LFE2 device uses 90 nm process technology and integrates programmable logic with system-level connectivity. The 27 x 27 mm FBGA has a 672-ball pin count, providing a high pin-density interface suitable for multilayer boards. Its lead-free construction is identified in product records, while detailed power, junction-temperature, configuration-memory, and differential-I/O characteristics should be confirmed against the manufacturer documentation for the exact ordering code.
Typical uses include network interface equipment, industrial control modules, data-acquisition systems, embedded processors, storage controllers, and video or image-processing pipelines. The large logic capacity is especially useful when a design combines bus arbitration, protocol conversion, data formatting, and control logic instead of routing each function through a discrete programmable-logic device or multiple lower-density FPGAs.
PCB design should account for the fine-pitch BGA footprint, high-speed clock routing, power-plane integrity, decoupling, and thermal spreading. Confirm device programming requirements, supported I/O standards, voltage tolerances, and bank configuration directly from the Lattice ECP2 documentation before release. This page adds application guidance, drop-in alternatives, comparison parameters, and design notes to the core manufacturer specifications.
ドロップイン代替品: LFE2-35E-6F672C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LFE2-35E-6F672C （同一形状・フットプリント）.
LFE2-35E-6F672I
✅ ドロップイン価格はお問い合わせください
データシートを見る →LFE2-35E-6FN672C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFE2-35E-7FN672I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFE2-20SE-7F672C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFE2-35E-6F672C 最大定格＆電気的特性
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Capacity | 32K LUTs |
| System Frequency | 357 MHz |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| Maximum User I/O | 450 I/O |
| Cell Count | 35,000 cells |
| Process Technology | 90 nm |
| Package Type | 672-ball FBGA |
| Package Code | FBGA-672 |
| Package Dimensions | 27 x 27 mm |
| Terminal Count | 672 terminals |
| Terminal Form | Ball |
| Package Shape | Square |
| 実装タイプ | Surface mount |
| Shipping Format | Tray |
| Lead-Free Construction | Lead free |
LFE2-35E-6F672C square ピン配置ガイド
LFE2-35E-6F672C (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LFE2-35E-6F672C.
詳細は データシート をご参照ください。
主な用途
LFE2-35E-6F672C の用途: 6 件s: Industrial Control Logic, Data-Acquisition and Signal Conditioning, Network Interface Equipment, Video and Image Processing, Storage and Interface Aggregation, Programmable Embedded Control.
Industrial Control Logic
The LFE2-35E-6F672C fits industrial controllers that combine sequencing, machine-state monitoring, interlocks, and data acquisition in one programmable device. Its 32K LUT capacity provides substantial logic space, while as many as 450 I/O can connect sensors, actuators, counters, and communication transceivers. The 357 MHz system-frequency figure accommodates timing-sensitive control and datapath functions without requiring a separate processor for every protocol task. Use the manufacturer pinout for the 672-ball FBGA and choose the ordering suffix that covers the installation's ambient-temperature range. Distributed control is especially practical when the design needs deterministic field updates while maintaining a single board-level programmable architecture.
Data-Acquisition and Signal Conditioning
The LFE2-35E-6F672C is appropriate for data-acquisition front ends that must coordinate converters, switches, memory, and digital filtering. The 32K LUTs can implement parallel conditioning and buffer-control logic, and the 450-I/O ceiling supports multiple converters, clocks, triggers, and status signals. The 357 MHz device-class frequency is useful for pipeline and parallel-data functions, although actual throughput depends on the selected memory interface and external data-rate limits. Place acquisition and control paths in separate clock domains when appropriate, constrain all timing paths, and validate converter and switch timing against the exact Lattice timing constraints.
Network Interface Equipment
The LFE2-35E-6F672C suits protocol converters, packet processors, and network-interface modules where multiple data paths must terminate in a single FPGA. Its 32K LUT capacity can support framing, header processing, buffering, and control logic, while up to 450 I/O provide connectivity for transceivers and external processors. The 1.2 V core supply and 672-ball FBGA demand careful plane allocation, but the high pin count provides substantial board-level connectivity. Match every high-speed I/O to the manufacturer's supported standards and impedance constraints, and check timing at the target line rate rather than relying solely on the 357 MHz system-frequency figure.
Video and Image Processing
The LFE2-35E-6F672C can implement parallel pixel pipelines, color conversion, synchronization, and control logic in compact imaging modules. Its 35,000-cell, 32K-LUT ECP2 configuration provides enough parallel resources for moderate-resolution data movement and auxiliary processing, while the 672-ball package exposes numerous connections to image sensors, frame memory, and display controllers. The design must still meet external memory bandwidth and video-timing limits, which can dominate performance. Use synchronous clocking, constrained I/O timing, and source-synchronous routing techniques appropriate to the selected Lattice devices and board stack-up.
Storage and Interface Aggregation
The LFE2-35E-6F672C is useful for storage controllers, bus bridges, and adapters that combine legacy and modern interfaces. The 32K LUT capacity can host arbitration, command translation, status tracking, and test logic, while the large 450-I/O limit simplifies connections among controllers, memories, and connectors. The 1.2 V core device should be supported by a low-impedance power plane and local decoupling to prevent logic and I/O activity from disturbing sensitive timing paths. Confirm supported memory-interface combinations, I/O voltage tolerances, and clock-domain relationships in the manufacturer documentation before finalizing the system architecture.
Programmable Embedded Control
The LFE2-35E-6F672C can serve as the programmable control core in an embedded subsystem that handles boot sequencing, watchdog behavior, peripheral arbitration, and bus decoding. Its 32K LUTs allow dedicated logic to operate alongside a processor rather than burdening that processor with every time-critical task. Up to 450 I/O provide connectivity to processors, memories, and specialized peripherals, while the 357 MHz system-frequency reference supports moderate-speed real-time control. Partition the design into clearly timed clock domains, define startup behavior for every I/O, and confirm configuration loading, boot timing, and peripheral ownership with the Lattice implementation flow.
エンジニアリング参考データ: LFE2-35E-6F672C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LFE2-35E-6F672I | LFE2-35E-6FN672C | LFE2-35E-7FN672I | LFE2-20SE-7F672C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 672-ball FBGA, 27 x 27 mm | 672-ball FBGA | 672-ball FBGA | 672-ball FBGA | 672-ball FBGA |
| Speed Grade | -6 | -6 | -6 | -7 | -7 |
主な差別化要因
- Higher logic and timing specification within the compared ECP2 choices （vs LFE2-20SE-7F672C)
- Closest same-family ordering alternative with matching core resource class （vs LFE2-35E-6FN672C)
- Direct commercial-versus-industrial grade choice （vs LFE2-35E-6F672I)
- One-grade performance distinction within the same 35K ECP2 package family （vs LFE2-35E-7FN672I)
設計ノート
Treat the 672-ball FBGA as a high-density routing and power-delivery problem. Follow the Lattice Semiconductor package drawing and recommended land pattern for ball diameters, solder-mask clearance, and pad-stack definitions. Assign continuous ground and power planes, place local decoupling close to supply balls, and provide adequate escape-routing channels from the inner-ball array. Confirm layer count and via geometry with the board fabricator because a mechanically valid footprint can still produce opens or shorts when escape routes are constrained.
Separate high-speed clocks, memory interfaces, and sensitive inputs from noisy I/O regions, and use the manufacturer's supported I/O standards to define impedance and termination. The 357 MHz system-frequency figure does not define every external interface rate, so each clock domain needs its own timing constraint. Use length matching where required by the selected interface, preserve continuous reference planes beneath high-speed routes, and validate differential pairs against the pin-description table rather than inferring polarity or pin function from package position.
Design the 1.2 V core rail and every external I/O supply as a complete power-distribution network. Verify the exact voltage, tolerance, sequencing, and current limits against the manufacturer documentation for LFE2-35E-6F672C. Place bulk and high-frequency decoupling according to the reference design, keep switching supplies and inductors away from sensitive pins, and test voltage droop at the device under worst-case I/O activity. Ground-reference return paths should remain short because a low-noise rail cannot correct a shared-impedance disturbance created in the PCB.
Do not treat similar ECP2 suffixes as automatically interchangeable. Check the full ordering code for logic density, speed grade, temperature class, package, and any suffix-specific electrical or qualification differences. In particular, LFE2-35E-6FN672C and LFE2-35E-7FN672I require confirmation against the manufacturer part table even though their 672-ball packages align. Also avoid estimating unused BGA-ball functions from generic package drawings; use the exact pin-description table and verify every power, ground, configuration, and I/O connection.
コンプライアンス情報
The device is identified as lead free. RoHS, REACH, halogen-free, conflict-minerals, and automotive-qualification statements require current manufacturer documentation for the exact ordering code.