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製品 (174)
OM-O2P - Omega2+ WiFi IoT Module, 2.4GHz, 580MHz | Onion
The Onion Corporation OM-O2P is the Omega2+ System-On-Module (SOM), a compact Linux-based IoT computer integrating a 580 MHz MIPS 24KEc SoC, 128 MB DDR2 memory, 32 MB on-board flash, and a 2.4 GHz 802.11 b/g/n WiFi transceiver in a through-hole module form factor designed for breadboard and docking-station prototyping. What is a System-On-Module? A System-On-Module (SOM) is a small, self-contained computing module that integrates a microprocessor, memory, wireless radios, and power management onto a single PCB, exposing interfaces through pin headers. SOMs sit in the hierarchy between a microcontroller (no OS, single-purpose) and a single-board computer (full I/O on one board). The Omega2+ family targets the IoT edge node category, offering Linux programmability in a footprint smaller than a credit card, suitable for connected-device prototyping. Key features include 802.11 b/g/n WiFi with on-board PCB antenna, hardware cryptographic support, hardware-accelerated microSD slot accepting SDXC cards up to 2 TB at up to 300 MB/s, and 15 GPIO pins for peripheral integration. The OM-O2P draws approximately 260 mA at 3.3 V under typical WiFi-active load, supports firmware updates over the air (FOTA), and exposes USB 2.0, I2C, I2S, SPI, and UART interfaces through the 2x15 2.54 mm pin header. Technically, the OM-O2P is built around the MediaTek MT7688AN MIPS-based WiFi SoC, which combines a 580 MHz MIPS 24KEc CPU core with an integrated 802.11n MAC/baseband/radio. This single-chip architecture keeps the BOM compact and BOM cost low while providing enough compute for lightweight Linux tasks, MQTT clients, and on-device scripting. The 128 MB DDR2 RAM is double what the smaller Omega2 (OM-O2) ships with, allowing larger application workloads. Typical applications include home automation gateways, WiFi-connected sensor nodes, IP-camera prototypes, smart agriculture controllers, and educational Linux-on-SoC platforms. Designers frequently dock the OM-O2P onto the Onion Expansion Dock (OP-EA) or the Arduino-compatible Power Dock (OP-PA) to access Arduino-shield expansion. When designing with this module, verify that your 3.3 V regulator can supply at least 500 mA peak for WiFi TX bursts, and place a local 10 uF decoupling capacitor near the VIN pin. The through-hole header footprint makes the module hand-solderable and breadboard-friendly without requiring reflow equipment. This page synthesizes distributor pricing, real drop-in alternatives within the Omega2 family, and practical docking-station design notes not found in the manufacturer datasheet alone.
PCF7936AS - HITAG 2 Security Transponder | NXP Semiconductors
The NXP Semiconductors PCF7936AS is a HITAG 2 programmable security transponder employing mutual authentication, designed for contactless authentication and memory access between a basestation and the transponder. Operating at 125 kHz carrier frequency with a 32x8 = 256-bit user memory architecture and a 39 ms typical transaction time, the part is housed in an encapsulated SOT-385-1 transponder package (glass-encapsulated pill form factor) optimized for embedding into a key head. What is a security transponder? A security transponder (also called an RFID tag or contactless transponder) is a passive semiconductor device that harvests its operating energy from the magnetic field emitted by a basestation reader, then modulates that field to transmit a unique identification code back to the reader. Within the broader product taxonomy, a security transponder belongs to: RFID transponder -> contactless IC -> NFC/RFID tag -> semiconductor. The HITAG 2 family specifically targets automotive immobilizer and access-control markets where mutual authentication prevents relay attacks and code duplication. Key features of the PCF7936AS include HITAG 2 protocol support with mutual authentication, a 32x8 user-programmable memory array providing 256 bits of storage, and an extended read/write transaction time of 39 ms that supports robust cryptographic handshakes. The transponder derives its supply voltage entirely from the LF magnetic field established by the basestation coil, eliminating any on-board battery. The encapsulated SOT-385-1 glass package withstands the mechanical and thermal stresses of injection-molded key-head assembly. The PCF7936AS implements the HITAG 2 cryptographic protocol using a hardware finite-state machine rather than a software stack, which minimizes gate count and dynamic power consumption. Because the device is fully passive, all energy for both computation and LF backscatter modulation comes from the reader's H-field; this drives both the read range and the maximum allowed transaction latency of 39 ms. The mutual-authentication sequence uses a rolling-code challenge-response mechanism that defeats static-code replay attacks common to earlier fixed-code immobilizer systems. Typical applications include automotive remote keyless entry (RKE) and immobilizer systems, vehicle ignition keys, building access control, fleet management transponders, and asset tracking tags. The 39 ms transaction time makes it compatible with legacy HITAG 2 basestations deployed across major European OEM vehicle platforms from the late 1990s onward. When designing the antenna coil, ensure the LC tank Q is high enough to deliver adequate H-field at the desired read distance (typically 2-5 cm). The 39 ms transaction time imposes a minimum field-on duration in the basestation firmware; do not poll faster than the protocol allows or the authentication handshake will time out. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping sourcing engineers and immobilizer system integrators evaluate the PCF7936AS against current alternatives.
PCF7936AS/3851/C,1 - HITAG2 256-Bit Security Transponder | NXP
The NXP Semiconductors PCF7936AS/3851/C,1 is a HITAG2 programmable security transponder IC designed for contactless authentication and secure memory access between a base station and a transponder. Operating at 125 kHz carrier frequency, the device integrates a 256-bit (32 byte × 8-bit) user-programmable EEPROM memory organized for cryptographic key storage and access control, with mutual authentication protocol support. The IC is supplied in a SOT-385-1 transponder package that is hermetically sealed and tuned for embedding into key fobs, immobilizer housings, and other credential carriers. A security transponder is a passive contactless memory device that powers itself from the inductive coupling of an external reader's 125 kHz magnetic field. The HITAG2 family from NXP is widely used in automotive immobilizer systems, building access control, and industrial asset tracking, where robust mutual-authentication and replay-attack resistance are required. The transponder category sits hierarchically inside NFC/RFID tags → RFID transponders → security/authentication ICs → wired/wireless identification semiconductors. Key features include HITAG2 protocol operation, a 39 ms typical read/write transaction time, 32-byte user EEPROM with bit-level access granularity, and an operating temperature range of -40 °C to +85 °C suitable for automotive under-hood and outdoor industrial deployments. The device is supplied in tape-and-reel packaging to support high-volume injection molding of transponder keys. Internally, the IC uses a tuned LC resonant front-end, a low-power analog front-end for demodulation/load modulation, a deterministic HITAG2 cryptographic state machine, and a serial EEPROM array. The protocol includes rolling-code mutual authentication, making it suitable for systems where a static UID alone would be insufficient to defeat unauthorized cloning. Typical applications include automotive vehicle immobilizers, RFID key fobs, building access control tokens, and industrial equipment authentication modules. The 256-bit memory and HITAG2 cipher make it appropriate where cloned-readers and replay attacks are realistic threat models. Compared with 1-Wire or 13.56 MHz ISO14443 credentials, 125 kHz HITAG2 offers longer read range in metal-rich environments and lower reader BOM cost. When designing with this device, ensure the transponder coil inductance and matching capacitor are tuned for 125 kHz resonance (typical Q > 10) to achieve the rated 39 ms transaction time at the target read distance. Pair the transponder with an HITAG2-compatible reader IC such as the NXP HTRC110 or derivative, and verify EMC compliance of the complete reader system to EN 300 330 or local equivalents. This page synthesizes distributor pricing, same-family NXP alternatives, and practical HITAG2 integration notes not found in the manufacturer datasheet. Cross-reference data is sourced from Mouser, NXP datasheet portals, and authorized NXP distributor listings as of 2026-10-05.
PN7642 - NFC Reader IC with Cortex-M33 MCU & Security | NXP
The NXP Semiconductors PN7642 is a highly integrated NFC open controller that combines a high-performance NFC reader, a low-power Arm Cortex-M33 microcontroller with 180 kB of programmable flash memory, and a Common Criteria EAL6+ certified secure element, supplied in a BGA form factor (PN7642EV orderable variants). An NFC reader controller is a single-chip integration of an RF analog front end (for 13.56 MHz contactless communication), protocol firmware, and a host-processing MCU. Within the system hierarchy, it belongs to the RF & Wireless > NFC/RFID reader family: antenna driver -> NFC frontend -> NFC controller with MCU (PN7462, PN7642). By merging reader, MCU, and secure element, the PN7642 replaces the need for an extra discrete MCU and a dedicated Secure Element in the bill of materials, reducing board area and BOM cost in payment and access-control designs. Key features include the integrated Common Criteria EAL6+ certified secure element, EMVCo certification for contactless payments, support for ISO 14443 (Type A and Type B) and NFC Forum protocols, and the Arm Cortex-M33 core with 180 kB of user-programmable flash. GPIO resources include multi-function pins such as GPIO2 (PWM2 capability) and GPIO3 (PWM3 capability); when ULPCD (Ultra-Low-Power Card Detection) is used, GPIO3 must be dedicated to aborting the ULPCD function and cannot be allocated to other roles. Technically, the PN7642 pairs a high-performance NFC frontend with a customizable MCU subsystem, enabling customer firmware to implement application logic, key management, and cryptographic operations on-chip. The security toolbox addresses secure key storage, a primary requirement for payment terminals and secure access readers, and the part is supplied in a compact BGA package suitable for space-constrained embedded designs. Typical applications include EMVCo contactless payment terminals, secure access-control and identity readers, and NFC-enabled IoT devices that require both contactless connectivity and embedded security without external components. Design consideration: firmware architecture must account for pin multiplexing constraints such as GPIO3 contention with ULPCD, and designers should consult NXP design-in documents beyond the product data sheet, since detailed design-in information is distributed separately by NXP. This page synthesizes verified distributor pricing, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.
PN7642EV/C100K - NFC Controller with Cortex-M33 MCU | NXP
The NXP Semiconductors PN7642EV/C100K is a high-performance NFC open controller that integrates an Arm Cortex-M33 microcontroller, a full NFC reader front end for 13.56 MHz contactless communication, and a hardware security subsystem in a single 64-ball VFBGA package. It operates from a 1.8 V to 3.5 V supply and supports ISO 14443-A, ISO 14443-3/4-B, ISO 15693, ISO 18092 (NFCIP-1), ISO 18000-3, MIFARE and FeliCa protocols, with host interfaces including I2C, SPI, UART and USB. An NFC controller is a specialized mixed-signal integrated circuit that modulates and demodulates 13.56 MHz RF signals and executes contactless protocol stacks. Within the system hierarchy, the PN7642 sits above discrete NFC front ends: by combining the analog NFC front end, a general-purpose MCU and a secure element on one die, it functions as a complete NFC reader system-on-chip within the connectivity layer of a terminal design. Key differentiating features include 180 kB of programmable flash memory (256 kB total memory per distributor listings), an integrated security toolbox optimized for secure key storage and cryptography, and low-power operation suited to battery-powered readers. The single-chip architecture removes the need for a separate host MCU and a discrete secure element, reducing bill-of-materials count and board area. Technically, the PN7642 combines NXP's proven NFC RF front end with an Arm Cortex-M33 CPU core, providing developer-customizable firmware on the C100 firmware version (01.00). GPIO pins with PWM capability (for example GPIO2/GPIO3 on balls E7 and D7) allow direct control of LEDs, buzzers and power switches. The datasheet also documents firmware variants C101 (02.00, pinless-download mode) and C102 (03.00) for field-upgradeable deployments. Typical applications include point-of-sale payment terminals, access-control readers, battery-powered smart locks, and industrial handheld readers. The security subsystem makes it particularly suited to payment and authentication use cases requiring cryptographic key protection. A key design consideration is the 64-ball VFBGA package: ball-grid mounting requires controlled reflow profiles and is not hand-solderable, so panel design and rework capability should be confirmed before layout. Antenna matching network design should follow the NXP PN7642 antenna design guidance for 13.56 MHz EMC performance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
QPM1002 - 8.5-10.5GHz GaN X-Band T/R FEM 3W | Qorvo
The Qorvo QPM1002 is a Gallium Nitride (GaN) MMIC front-end module (FEM) for X-Band radar applications covering 8.5 GHz to 10.5 GHz, integrating a T/R switch, a low-noise amplifier, and a power amplifier in a 5 x 5 mm QFN surface-mount package with over-mold encapsulant. A front-end module (FEM) is a highly integrated RF building block that sits between the antenna and the transceiver in a radar system. In an X-Band phased array radar, the FEM performs three critical functions: amplifying weak received echoes (LNA path), amplifying transmitted pulses (PA path), and switching between the two (T/R switch). Integrating all three on a single GaN-on-SiC die reduces board area, assembly variation, and lattice-spacing constraints compared to discrete multi-chip solutions. According to the Qorvo datasheet, the receive path delivers 25 dB of small-signal gain with a low noise figure of 2.2 dB, maximizing radar detection range against small targets. The transmit path provides 33 dB of small-signal gain and can deliver 3 W of saturated output power with a power-added efficiency (PAE) of 32%. The ANT port tolerates up to 2 W of input power, eliminating the need for an external limiter diode and its associated insertion loss. The module is fabricated on Qorvo's QGaN25 0.25 um GaN-on-SiC process. The high thermal conductivity die-attach, combined with the over-molded QFN package, allows reliable operation in high-temperature environments typical of airborne and ground-based phased array antennas. Typical applications include X-Band phased array radar transmit/receive (T/R) channels, marine and weather radar, and airborne surveillance systems where compact size and high power density are mandatory. Design consideration: the high power density of GaN requires a well-designed thermal path; the exposed package paddle must be soldered to a low-thermal-resistance via array in the PCB. This page synthesizes distributor sourcing data, drop-in alternative guidance, and practical design notes not found in the manufacturer datasheet.
QPM1002SR - X-Band 3W GaN T/R FEM 8.5-10.5GHz | Qorvo
The Qorvo QPM1002SR is an 8.5-10.5 GHz GaN MMIC front-end module (FEM) integrating a T/R switch, low-noise amplifier, and power amplifier in a 5 x 5 mm over-molded QFN surface-mount package. The receive path provides 25 dB of gain with a 2.2 dB noise figure, while the transmit path delivers 33 dB small-signal gain, 3 W of saturated output power, and 32% power-added efficiency (PAE). A transmit/receive module is a bidirectional RF front end that shares a single antenna between a transmitter and a receiver using a T/R switch. In the system hierarchy, it sits above individual MMIC amplifiers, combining switching, LNA, and PA functions into one module, and is a core building block of power management for radar front ends. Modules like the QPM1002 reduce component count, footprint, and assembly tolerance compared to discrete chains. Key differentiating features include the integration of three functions (switch, LNA, PA) on a single die-level module, which minimizes interconnect losses and lattice pitch. According to Qorvo, the part is fabricated on the QGaN25 0.25 um GaN-on-SiC process, whose wide bandgap supports high power density and ruggedness. The over-mold encapsulant combined with a proprietary high-thermal-conductivity die-attach allows operation in elevated-temperature environments, and the compact 5 x 5 mm footprint supports the tight lattice spacing required by X-Band phased array radar. Technically, the GaN-on-SiC construction offers superior thermal conductivity relative to GaAs, enabling higher channel temperatures to be tolerated and higher power density per millimeter of gate periphery. The 0.25 um gate length of the QGaN25 process supports X-Band frequencies with good efficiency, and the integrated T/R switch eliminates the insertion loss of an off-module circulator or switch in compact arrays. Typical applications include X-Band phased array radar transmit/receive channels, military and commercial radar front ends, and airborne or ground-based surveillance radar systems. In phased arrays, the module's small size directly determines achievable element pitch at 8.5-10.5 GHz. When designing with this module, thermal management is the primary consideration: the GaN die dissipates substantial heat at 3 W RF output, so the PCB ground vias and heat-spreading copper must be designed for the high-thermal-conductivity die-attach to work as intended. Bias sequencing and switch control timing should follow the manufacturer datasheet. This page synthesizes distributor availability, verified datasheet parameters, and practical design guidance for the QPM1002SR not consolidated in the manufacturer datasheet.
RAK2247 - SX1301 LoRa Concentrator mPCIe Module | RAKwireless
The RAKwireless RAK2247 is a mini-PCIe LoRa gateway concentrator module based on the Semtech SX1301 baseband processor, delivering up to 10 programmable parallel demodulation paths across 2 SX125x Tx/Rx front-end stages. Housed in a 50.95 mm × 30 mm PCI Express Mini Card form factor, the module supports US915 (and other regional ISM bands via SKU variants) and targets smart-metering fixed networks plus IoT deployments up to 500 nodes per km² in moderately interfered environments. A LoRa concentrator is a gateway-side baseband processor that turns a host embedded platform (any board exposing a free mPCIe slot) into a multi-channel LoRaWAN gateway. Within the broader wireless taxonomy the part sits at: LoRa concentrator -> LPWAN gateway module -> RF module -> IoT gateway hardware. By exploiting Semtech's chirp-spread-spectrum demodulation in parallel on 8 (or 10) channels, it allows simultaneous reception of many LoRa packets on different spreading factors and frequencies, which is the fundamental capability that distinguishes an 8-channel gateway from a single-channel peer device. Key features include: SPI or USB host interface (SKU dependent), integrated GPS receiver input for packet timestamping, +27 dBm maximum TX power through the on-board power amplifier, and a Listen-Before-Talk preamble scanner. Operating from a 3.3 V supply drawn through the mPCIe edge connector, the RAK2247 simplifies gateway prototyping because the host only needs to load the Semtech HAL / sx1301_hal library and forward IP packets to a LoRaWAN network server such as ChirpStack or TTN. Technically the SX1301 sits between two SX1257 (or SX1255) transceivers feeding an IF chain into the digital demodulation block; the chip contains 8 LoRa demodulation paths plus one FSK/GFSK path and one narrow-band channel. The host CPU offloads packet CRC, de-whitening and address filtering to the SX1301 firmware, dramatically reducing the gateway CPU load compared to a soft-modem approach. RAK2247 is a complete subsystem: the SX1301 plus front-ends, TCXO, LNA, PA, balun, GPS connector and IPEX antenna connectors are all integrated on the single mPCIe board. Typical applications include LoRaWAN indoor gateway prototypes, smart-metering aggregation gateways, industrial IoT bridges, and Helium light-hotspot builds. The 10-path parallel demodulation is the dominant selection criterion when a deployment expects concurrent traffic from many SF7–SF12 nodes. When designing with RAK2247, ensure the host carrier board routes USB D+/D- or SPI pins (CS, CLK, MOSI, MISO, IRQ, RESET) to a free mPCIe socket, supplies a clean 3.3 V at 500 mA, and provisions an IPEX antenna pigtail for the LoRa port and a separate IPEX for GPS. This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
RAK3172-8-SM-NI - LoRaWAN 868MHz Stamp Module, STM32WLE5, SMD | RAKwireless
The RAKwireless RAK3172-8-SM-NI is a compact, surface-mount LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CCU6 SoC, operating in the 864 MHz / 865 MHz / 868 MHz ISM bands with 2 V to 3.6 V supply, and supplied without an I-PEX antenna connector. It integrates an Arm Cortex-M4 MCU at 48 MHz with 256-Kbyte Flash and 64-Kbyte SRAM alongside a Semtech SX126x-compatible LoRa transceiver, delivering up to 15 km line-of-sight range at 5.22 mA receive current and 87 mA transmit current in a 15.5 x 15 mm SMD footprint. A LoRa module is a self-contained radio block that bundles an MCU, RF transceiver, matching network and crystal into a single reflow-solderable unit. LoRaWAN, the wider-area networking protocol layered on LoRa modulation, occupies the sub-GHz ISM spectrum and is the dominant low-power wide-area network (LPWAN) standard for battery-operated IoT deployments - a category that includes LoRa modules, LPWAN SoCs, RF transceivers, and wireless connectivity ICs. The RAK3172 sits at the lower end of this taxonomy, giving designers a pre-certified path to LoRaWAN Class A/B/C without exposing the SX126x register set or the STM32WLE5 radio peripherals. Key features include support for LoRa, (G)FSK and BPSK modulations, multiple regional bands (EU868 / IN865 / RU864), AT-command and RUI3 (RAKwireless Unified Interface v3) firmware modes, and a hardware sleep current measured in microamperes for coin-cell and Li-SOCl2 battery use. The integrated RF matching network and 32.768 kHz RTC crystal simplify host-board design, while exposed UART, SPI, I2C, ADC and GPIO lines let the module double as the application's main controller. Architecturally, the STM32WLE5 silicon mates an LPWAN radio block to a Cortex-M4 with FPU, providing hardware AES-256 for LoRaWAN payload encryption, an integrated DC-DC converter for the radio PA, and a sub-GHz front end that removes the need for an external SAW filter in most band plans. This depth of integration explains why the RAK3172 can match the range of earlier discrete-MCU + discrete-transceiver designs in a fraction of the PCB area. Typical deployments include battery-powered IoT sensors, smart agriculture probes, asset tracking, smart metering, environmental monitors, and LoRaWAN-to-Cellular gateways' downlink/uplink test fixtures. The wide -40 C to +85 C operating range covers industrial outdoor enclosures. A design tip: route the antenna trace on the host board only when the host owns the RF keep-out, since this -NI variant ships without an I-PEX connector and relies on a trace antenna or U.FL pigtail. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
RAK3172-9-SM-I - 9xx MHz LoRaWAN Module with IPEX | RAKwireless
The RAKwireless RAK3172-9-SM-I is a compact, low-power LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CC SoC, integrating an Arm Cortex-M4 32-bit core with 256 KB Flash and 64 KB SRAM alongside an embedded LoRa radio. The -9-SM-I suffix denotes the 902-928 MHz sub-band (915 MHz nominal center) variant with a surface-mount form factor and an IPEX/U.FL antenna connector footprint. The module measures 15.5 mm x 15.5 mm and operates over a 2.0 V to 3.6 V supply range. A LoRaWAN module is a long-range, low-power wireless data transceiver that uses Semtech's LoRa modulation to deliver multi-kilometer connectivity in sub-GHz ISM bands while consuming only microamps in sleep mode. LoRaWAN (Long Range Wide Area Network) is an open LPWAN protocol standardized by the LoRa Alliance that sits above LoRa modulation and defines the MAC layer, device classes, and join procedures used for massive IoT deployments. Key specifications include +20 dBm maximum RF output power, link budget supporting up to 15 km line-of-sight range, 5.22 mA typical receive current, 87 mA peak transmit current, and 1.69 uA sleep current. The module exposes SPI, UART, and I2C peripherals through a stamp-hole land pattern, enabling drop-in integration into host PCBs without RF design effort. System architecture is built around the STM32WLE5 single-chip solution, which fuses the application MCU and sub-GHz radio on a common silicon die, reducing BOM cost and bill of materials while retaining full LoRaWAN 1.0.3 Class A/B/C stack compatibility. Developers can use the RAK3172 Arduino library, AT command firmware, or the Zephyr RTOS BSP for embedded development. Typical applications include battery-powered wireless sensor networks, smart agriculture soil/irrigation telemetry, asset tracking and cold-chain logistics, smart metering for water/gas utilities, and LPWAN building automation. The IPEX connector enables external high-gain antenna mounting for chassis-mounted or outdoor enclosures. When designing with this module, place the IPEX connector trace away from switching nodes and ensure the host PCB provides adequate ground flooding under the antenna feed. For external SMA antenna routing, choose the -NI (no IPEX) variant and route the RF pad directly to the SMA connector - the -I variant is intended for IPEX-attached flex antennas. This page consolidates verified distributor pricing, parametric alternatives, and practical LoRaWAN design notes not duplicated in the RAK3172 datasheet.
RAK3172-9-SM-NI - LoRaWAN 915MHz Module, STM32WLE5, 15.5x15mm | RAKwireless
The RAKwireless RAK3172-9-SM-NI is a compact, low-power LoRaWAN transceiver module built around the STMicroelectronics STM32WLE5CCU6 SoC and supporting 915MHz, 920MHz, and 923MHz regional bands. The module is supplied in a 15.5x15 mm SMD package, operates from 2 V to 3.6 V, and is shipped without an integrated I-PEX antenna connector so designers can route the RF output to an external antenna or SMA pigtail. Per the RAKwireless datasheet, the module supports LoRaWAN 1.0.3 Classes A/B/C and exposes UART, SPI, and I2C host interfaces. A LoRaWAN module is a pre-certified radio transceiver that combines a long-range sub-GHz physical layer (typically based on Semtech SX126x or integrated equivalents inside the host SoC) with LoRaWAN MAC protocol firmware. These modules sit one level above a raw RF transceiver in the connectivity hierarchy and below the application MCU; they remove the burden of RF matching, antenna design, and regional regulatory certification, allowing engineers to add multi-kilometer wireless links to battery-powered IoT nodes. The RAK3172 integrates the LoRa modem directly inside the STM32WLE5CC application MCU, eliminating the external transceiver IC and shrinking BOM cost and PCB footprint. Key feature highlights include an LoRaWAN 1.0.3 Class A/B/C stack, a stated link range of up to 15 km in line-of-sight conditions, three low-power operating modes (transmit, receive, and sleep), and access to GPIO, ADC, and timers of the underlying Cortex-M4 host. The host runs an integrated LoRaWAN stack via AT commands or STM32Cube firmware, allowing rapid prototyping without external MCU glue logic. UART serves as the primary host interface for AT-command control, while SPI and I2C are exposed for direct MCU integration. The wide 2 V to 3.6 V supply range is well suited to single-cell Li-SoCl2, Li-ion, and 2x AA battery chemistries common in field-deployed sensors. The module is rated for an industrial operating temperature range of -40 C to +85 C. Its small 15.5x15 mm SMD footprint, combined with the absence of an I-PEX connector, makes it suitable for designs where the antenna is integrated on the host PCB (chip antenna or PCB trace) or routed via a pigtail to a chassis-mount SMA. Designers can leverage the Zephyr OS board support, RAK's AT-command firmware, or STM32Cube-based SDKs. Typical applications include battery-powered LoRaWAN end nodes, agricultural soil/moisture sensors, smart-city metering, asset tracking, and wireless alarm panels. Designers should evaluate antenna gain and ground clearance around the RF pad when migrating from the I-PEX-equipped RAK3172-9-SM-I to this no-I-PEX variant. A key design consideration is antenna selection: because the I-PEX connector is omitted, RF performance depends entirely on the external antenna implementation. A poorly matched antenna can reduce range by 10 dB or more. This page synthesizes distributor pricing, drop-in module alternatives, and field design notes that go beyond the manufacturer datasheet alone.
RAK3172-T - LoRaWAN Module, 20dBm, TCXO | RAKwireless | IoT
The RAKwireless RAK3172-T is a low-power, long-range LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CC RF System-on-Chip, delivering up to 20 dBm output power from a 2 V to 3.6 V supply in a compact 15.5 x 15 mm castellated SMD stamp package. The -T variant integrates a 32 MHz temperature-compensated crystal oscillator (TCXO) for superior RF frequency accuracy over the industrial -40C to +85C operating range. A LoRaWAN module is a complete wireless subsystem that implements the LoRaWAN 1.0.3 MAC protocol on top of LoRa spread-spectrum physical-layer modulation, sitting within the LPWAN (low-power wide-area network) family of radio technologies used across the industrial IoT stack. Unlike a bare LoRa transceiver IC, the RAK3172-T embeds the MCU, radio, and RF matching network, so a host board only needs a UART/SPI link and an antenna. Key features include compliance with LoRaWAN Class A, B, and C, support for both LoRaWAN networks and pure LoRa point-to-point communication, up to 15 km line-of-sight range, and low active current of approximately 5.22 mA RX / 87 mA TX. Interfaces include UART, SPI, and I2C, enabling AT-command operation via RAKwireless RUI3 firmware or custom STM32WL development with STM32CubeIDE. The STM32WLE5CC SoC integrates an Arm Cortex-M4 core with the sub-GHz LoRa radio on a single die, reducing BOM count and board area versus discrete transceiver-plus-MCU designs. Compatibility with The Things Network (TTN), ChirpStack, and Actility server platforms simplifies end-device provisioning. The TCXO reference delivers tighter frequency tolerance than the standard RAK3172 crystal version, improving duty-cycle compliance and link reliability at band edges (863-870 MHz EU868 / 902-928 MHz US915, depending on variant). Typical applications include battery-powered IoT sensors, smart metering, asset trackers, and agricultural or smart-city nodes where multi-kilometer range and multi-year battery life are essential. Design consideration: place the module near the board edge with a keep-out area beneath the antenna feed, and always verify your regional frequency variant (-8 for 868 MHz, -9 for 915 MHz) before ordering. This page synthesizes distributor pricing, drop-in module variants, and practical design notes not found in the manufacturer datasheet.
RAK3172-T-8-SM-I - LoRaWAN 868MHz STM32WLE5 WisDuo Module
The RAKwireless RAK3172-T-8-SM-I is a low-power, long-range LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CC SoC, integrating an Arm Cortex-M4 MCU core and Semtech SX126x LoRa radio in a single die. The -T-8-SM-I variant is the tape-and-reel packaged, 868 MHz EU868 band, SMD castellation module with IPEX antenna connector, operating from a 2V to 3.6V supply and delivering up to +20 dBm transmit power. A LoRaWAN module is a pre-certified, surface-mount wireless subsystem that combines a microcontroller, a sub-GHz radio transceiver, an RF matching network, and an antenna interface into a single reflow-solderable PCB module. Within the broader wireless hierarchy, a LoRaWAN module sits above a bare transceiver IC and below a complete LoRaWAN end-device; the module approach lets product designers skip RF layout certification and reuse already-approved LoRaWAN 1.0.3 stacks. The RAK3172 belongs to the LPWAN family of modules using Chirp Spread Spectrum (CSS) modulation for long range, low data rate, and robust urban penetration. Key specifications of the RAK3172-T-8-SM-I include a +20 dBm maximum TX output power, approximately 5.22 mA average receive current, and up to 87 mA peak current at full +20 dBm transmit output. The module is housed in a 15.5 mm × 15 mm SMD castellation package with an operating temperature range of -40°C to +85°C and an RF range of approximately 15 km line-of-sight. Communication interfaces supporting serial SPI, UART, and I2C peripherals are exposed through the castellated edge pads. The STM32WLE5CC SoC at the heart of the module embeds a Cortex-M4 core running up to 48 MHz with 256 Kbytes of Flash and 64 Kbytes of SRAM, alongside the Semtech SX1262-compatible radio IP. This single-die integration removes the SPI bus between MCU and radio that earlier discrete designs required and reduces BOM cost. The module is pre-certified for the EU868 LoRaWAN band and supports Class A, B, and C end-device classes per LoRaWAN 1.0.3 specification. Typical applications for the RAK3172-T-8-SM-I include battery-powered IoT sensors for smart agriculture soil moisture monitoring, livestock asset tracking, smart metering for gas and water utilities, environmental monitoring stations, and industrial equipment predictive maintenance nodes. The IPEX antenna connector allows external antenna selection per deployment scenario, and the small 15.5 × 15 mm footprint fits inside compact enclosures. When designing with this module, ensure the host PCB exposes the IPEX connector footprint if an external antenna is planned, and add at least 10 µF of bulk decoupling near the module supply pin. The castellation pads are the only electrical connection - hand soldering requires a hot plate or precise iron tip. Confirm regional LoRaWAN band selection before purchasing: the -8- variant is for EU868, while other variants cover US915, AU915, AS923, IN865, and KR920 regions. This page synthesizes distributor pricing, drop-in same-band variants, and practical design considerations beyond the manufacturer datasheet, providing an engineering-grade resource for module selection and PCB integration.
RAK3172-T-9-SM-I - LoRaWAN 9 LoRa Module | RAK3172 WisDuo LPWAN
The RAK3172-T-9-SM-I is a compact, low-power LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CCU6 SoC, housed in a 15.5 x 15 mm surface-mount package with an integrated IPEX antenna connector. It supports LoRa and FSK modulation across the 9-band (902-928 MHz, US915/AU915/AS923 sub-bands) and operates from a 2 V to 3.6 V supply at 87 mA continuous transmit current and 5.22 mA receive current, with a stated link range of up to 15 km line-of-sight. A LoRa module (LoRaWAN transceiver) is a radio-frequency sub-system that implements the physical layer of the LoRaWAN low-power wide-area networking protocol defined by the LoRa Alliance. Within a wireless IoT node hierarchy, a LoRa module sits below the sensor/MCU logic, above the antenna matching network, and is governed by class-A/B/C MAC behavior for uplink/downlink scheduling on sub-GHz ISM frequencies in unlicensed bands. Key features of the RAK3172-T-9-SM-I include ultra-low-power sleep current suitable for battery-operated nodes, integrated ARM Cortex-M4 application core inside the STM32WLE5, native LoRaWAN 1.0.3 Class A/B/C firmware compatibility, and an SPI/UART/I2C host interface for external sensor integration. The IPEX MHF4 antenna connector simplifies field-replacement antenna selection and supports external high-gain antennas. The architecture combines STMicroelectronics' STM32WLE5 SoC with an on-board TCXO and RF matching network; this delivers improved frequency stability across temperature and reduced phase noise compared with XTAL-only designs. Internal DC-DC and LDO regulation allow the module to operate directly from 2 V to 3.6 V sources including single-cell Li-SoCl2 primary batteries. Typical applications include long-range battery-powered IoT sensors, agricultural and environmental telemetry nodes, smart-metering AMR/AMI endpoints, asset tracking, and industrial SCADA wireless extensions. Engineers choose the RAK3172 family for design-reuse compatibility across global LoRaWAN regional bands (8/EU868, 9/US915, AS923) via the trailing band code in the ordering scheme. When designing with this module, ensure the host PCB reserves a clearance keep-out beneath the IPEX connector, and verify host-MCU UART logic levels are 3.3 V tolerant. Sleep-mode firmware configuration (STM32WL STOP2/STANDBY) is required to meet the uA-class standby current claims needed for multi-year battery life. This page synthesizes distributor stock, regional band ordering variants, and practical design notes that the manufacturer datasheet alone does not compile in a single view.
RF-BM-ND02 - BLE 4.2 nRF51822 Module | RF-Star | IoT
The RF-Star RF-BM-ND02 is a Bluetooth 4.2 Low Energy (BLE) RF module built on the Nordic Semiconductor nRF51822QFAA SoC, which integrates an ARM Cortex-M0 32-bit processor, 256 KB flash memory, 16 KB RAM, and AES hardware encryption, with an integrated 16.0 MHz crystal, LC filter, antenna matching network, and meander line inverted-F PCB antenna in a compact surface-mount castellated package. A Bluetooth Low Energy module is a complete short-range wireless subsystem combining a 2.4 GHz radio transceiver, a microcontroller, clock sources, and an antenna into a single pre-certified unit. Within the wireless connectivity hierarchy, BLE modules sit under RF modules, which belong to the broader family of short-range wireless communication devices. Using a module instead of a bare SoC removes RF layout, antenna tuning, and regulatory certification work from the OEM, drastically shortening time to market for connected products. Key features of the RF-BM-ND02 include support for Bluetooth v4.2 Low Energy as well as 2.4 GHz proprietary protocols, low power consumption suited to coin-cell battery operation, a compact footprint, robust connection distance from the inverted-F PCB antenna, and rigid reliability per the manufacturer hardware datasheet. The underlying nRF51822QFAA provides SPI master/slave, I2C master, and UART programming interfaces plus AES hardware encryption, enabling flexible sensor and peripheral designs. The nRF51822 architecture pairs the ARM Cortex-M0 core with a 2.4 GHz transceiver supporting GFSK modulation, programmable output power, and Nordic's SoftDevice BLE stack architecture, which separates protocol firmware from application code. The integrated LC filter and matched antenna network ensure consistent RF performance across production units without external RF components. Typical applications include battery-powered IoT sensors, smart home devices, beacons, medical wearables, and industrial wireless monitoring nodes where a pre-certified BLE link and secondary development capability reduce certification cost and design risk. When designing with this module, keep a clear keep-out area around the PCB antenna, feed it with a clean 2.4 GHz-rated power supply, and verify antenna detuning effects from nearby metal or ground planes. Because the module is BQB and FCC approved, careful layout preserves the certification grant. This page synthesizes verified datasheet parameters, drop-in alternatives, application guidance, and pricing context not found in the manufacturer datasheet alone.
RF-LORA-868-SO - 868MHz LoRa Transceiver Module, 16km | RF Solutions
The RF Solutions RF-LORA-868-SO is an 868 MHz LoRa spread-spectrum transceiver module delivering up to 16 km line-of-sight range, -130 dBm receive sensitivity, and +20 dBm (100 mW) transmit power in a surface-mount, castellated-edge SMT package. It integrates the Semtech SX1272 LoRa long-range transceiver and communicates with a host controller over SPI. A LoRa module is a sub-GHz radio transceiver sub-system that implements LoRa (Long Range) chirp spread spectrum modulation, a technology within the LPWAN (low-power wide-area network) family of radio standards. Unlike short-range protocols such as Bluetooth or Wi-Fi, LoRa trades data rate for link budget, enabling kilometer-scale links at milliamp-level currents - the reason it dominates battery-powered IoT telemetry. Key features of the RF-LORA-868-SO include the Semtech SX1272 chipset with ultra-long-range spread-spectrum communication and high interference immunity at minimal current consumption, receive-mode current of approximately 10 mA, a wide 2.2 V to 3.7 V supply range suitable for single lithium cell operation, and a 16 km maximum range. The module is a plug-and-play design intended to minimize RF design effort for OEM boards. Technically, the SX1272-based architecture supports multiple modulation schemes including LoRa, FSK, GFSK, GMSK, MSK and OOK, giving designers flexibility between raw packet radios and long-range LoRa links. The castellated SMT footprint permits reflow soldering directly onto the host PCB, with the antenna connected via an external feed point (antenna not included). Typical applications include smart metering, agricultural and environmental sensor networks, asset tracking, and general ISM-band (< 1 GHz) telemetry across Europe where the 868 MHz band is licensed-exempt. Design consideration: keep the transmit duty cycle within the 868 MHz band regulations, and provide a proper 50-ohm ground-referenced antenna feed - poor antenna matching is the most common cause of underperforming LoRa links. This page adds value beyond the datasheet by synthesizing distributor pricing (as of 2026-10-19), drop-in alternatives from the same family, and practical RF layout guidance in one reference.
RF1127 - 0.45-3.5GHz GaAs SPDT RF Switch | RFMD/Qorvo
The RF Micro Devices (now Qorvo) RF1127 is a broadband low-power single-pole double throw (SPDT) RF switch manufactured in GaAs (gallium arsenide) process technology, covering 450 MHz to 3500 MHz with a maximum insertion loss of 0.65 dB, housed in a leadless 6-pin QFN package measuring 2 x 1.30 mm with 0.385 mm height. An RF SPDT switch is a type of radio-frequency signal-routing device that alternately connects a single RF common port to one of two switched ports. Within the semiconductor hierarchy it belongs to the family of RF control components (RF switch ICs -> RF front-end components -> RF semiconductors), sitting alongside RF amplifiers, LNAs, and PA modules in the transmitter/receiver chain of wireless systems. GaAs switch ICs are favored over PIN-diode solutions because they switch faster, consume near-zero DC power, and integrate control logic on die. Key features of the RF1127 include very low insertion loss (0.65 dB maximum), good port-to-port isolation, excellent linearity, and exceptionally low DC power consumption. According to Qorvo, these characteristics make the device ideally suited for battery-operated applications that require high-performance switching with very little DC current draw, which is exactly the trade profile demanded by portable wireless products. Technically, the RF1127 uses GaAs FET switch cores with integrated negative-voltage generation or control logic (per the manufacturer datasheet), allowing direct drive from standard CMOS control lines in many designs. The small 2 x 1.30 mm leadless QFN footprint minimizes parasitic inductance, preserving broadband return loss up to 3.5 GHz. Its low power handling rating must be respected; this is a small-signal switch, not a high-power transmit switch. Typical applications include antenna switching between transmit and receive paths in portable wireless devices, band or filter bank selection in multi-band radios, and general-purpose RF signal routing in battery-powered test and telemetry equipment. Design consideration: because the RF1127 is a low-power switch, verify RF input power against the datasheet absolute maximum ratings and provide RF grounding vias close to the QFN ground pads to realize the published insertion loss and isolation. This page synthesizes verified distributor and manufacturer data, EOL replacement guidance, and practical design notes not consolidated in the manufacturer datasheet.
RFM95W-915S2 - 915MHz LoRa Transceiver Module, 20dBm | HOPERF
The HOPERF RFM95W-915S2 is a sub-GHz, low-power, long-range LoRa transceiver module operating in the 915MHz ISM band, providing ultra-long-range spread-spectrum communication with high interference immunity. The module integrates a Semtech SX1276-class LoRa modem, supports FSK/GFSK/GMSK/MSK/OOK modulation, delivers up to +20dBm (100mW) of transmit output power, and offers a maximum air-data rate of 300kbps. Sensitivity extends down to -148dBm in LoRa mode, enabling multi-kilometer line-of-sight links. The module is housed in a compact SMD package and is supplied from a 1.8V to 3.7V rail, making it directly compatible with battery-powered IoT nodes. A LoRa (Long Range) transceiver is a wireless modem that uses Chirp Spread Spectrum (CSS) modulation to achieve very high receiver sensitivity and robust link margins at low data rates. LoRa sits in the sub-GHz ISM radio category, above narrowband FSK radios in range/budget and below cellular LTE in cost/complexity, and it is widely deployed in LPWAN (Low-Power Wide-Area Network) applications under standards such as LoRaWAN. The RFM95W-915S2 brings this LoRa modem together with the matching network and a 915MHz SAW filter inside a single module, eliminating most of the RF design complexity for the host. Key features include +20dBm output power, -148dBm sensitivity (LoRa BW=125kHz, SF=12), 300kbps maximum bit rate, an SPI host interface, and a programmable bit rate on the air interface. Compared with the non-W (RFM95) variant, the W version adds an on-board PA (power amplifier) and LNA chain to support the higher +20dBm output and improved receive performance. The wide 1.8V–3.7V supply range permits direct Li-ion/Li-poly battery operation, while the SPI control port allows simple connection to microcontrollers such as STM32, ESP32, and Arduino-class boards. The module shares the same SPI register set as the Semtech SX1276 transceiver IC, allowing engineers to port existing LoRaWAN and RadioHead drivers without firmware changes. The LoRa modem provides spreading factors from SF6 to SF12, bandwidth settings from 7.8kHz to 500kHz, and an integrated CRC/packet handler. The high receiver sensitivity and high selectivity (typically >60dB adjacent channel rejection) make the part well-suited to dense urban LPWAN deployments as well as long-range agricultural and industrial telemetry. Typical applications include LoRaWAN end nodes, automatic meter reading, agricultural and environmental sensors, home and building automation, wireless alarm/security systems, industrial monitoring and SCADA telemetry, asset tracking, and remote control. The 915MHz variant is approved for use in regions including the US (FCC Part 15), Canada, Australia, and parts of Asia that allocate the 902–928MHz ISM band. When designing with this module, observe PCB layout guidelines for the antenna feed - keep the antenna trace impedance at 50 ohms and place a pi-matching network close to the module's RF pad - and respect the maximum duty cycle limits imposed by regional regulators. The 'W' suffix is required whenever +20dBm output is needed; for shorter links the lower-power RFM95 variant reduces current consumption significantly. This page synthesizes current distributor pricing, drop-in alternatives, and practical RF design notes not found in the manufacturer datasheet alone, helping engineers select and source the correct LoRa transceiver module for 915MHz IoT deployments.
RM520N-EU - 5G Sub-6 M.2 Module EMEA/APAC/Brazil | Quectel
The Quectel RM520N-EU is an industrial-grade 5G NR Sub-6 GHz M.2 module targeted at EMEA, APAC, and Brazil markets, optimized for IoT and eMBB applications. Based on the 3GPP Release 16 specification, the module supports both 5G NSA (Non-Standalone) and SA (Standalone) modes, delivering peak downlink speeds up to 3.2 Gbps in NSA Sub-6 and 2.4 Gbps in SA Sub-6, with uplink rates of 600 Mbps and 900 Mbps respectively. Housed in a standard M.2 form factor (Key B), it provides drop-in compatibility with Quectel's RM50xQ series and LTE-A modules including EM06, EM12/EM12xR/EM120K, and EM160R-GL. A 5G module is a wireless modem subsystem that integrates RF transceiver, baseband processor, power management, and host interface into a single surface-mount module. Within the broader cellular hierarchy, 5G NR modules sit above LTE Cat-12/16 modules and below integrated application processors with embedded modems. They serve as the wireless backbone for fixed wireless access, industrial routers, mobile gateways, and edge-compute terminals where standalone cellular connectivity is required. Key features of the RM520N-EU include Qualcomm's Snapdragon X62 platform, multi-mode 5G NR / LTE-A / WCDMA fallback for forward and backward network compatibility, integrated multi-constellation GNSS (optional), and a Linux/Windows/Android driver stack accessible through AT commands. The module also provides embedded operating system support and voice capability, enabling it to serve gateways that require CSFB or VoLTE. The architecture leverages Release 16 enhancements including improved EN-DC, dynamic spectrum sharing, and 5G LAN features. Compared with the earlier X55-based RM50xQ, the X62 chipset improves power efficiency under Sub-6 carrier aggregation and reduces idle-mode current draw for always-connected industrial deployments. Typical applications include Fixed Wireless Access (FWA) customer-premises equipment, industrial IoT gateways, mobile hotspots and MiFi routers, smart retail terminals, and edge AI gateways requiring low-latency uplink. The EMEA/APAC/Brazil band set specifically covers the n1/n3/n5/n7/n8/n20/n28/n38/n40/n41/n77/n78/n79 Sub-6 bands used by European, Asian, and South American operators. When designing with the RM520N-EU, engineers should evaluate regional band compatibility against target operators - Quectel offers the RM520N-GL variant for global deployments requiring broader band coverage. PCB layout must observe M.2 Key-B mechanical constraints and provide adequate antenna isolation between the four Sub-6 antenna ports. This page synthesizes Quectel product documentation, regional band mapping, drop-in pin-compatible alternatives within the RM520N series, and practical integration guidance not consolidated in a single datasheet.
RM550V-GL - 5G Sub-6GHz M.2 Module 3.2Gbps | Quectel
The Quectel RM550V-GL is a 5G Sub-6 GHz NR cellular module in the standard M.2 (Key B) form factor measuring 30.0 x 52.0 x 2.3 mm, delivering peak downlink speeds of 3.2 Gbps (5G NSA) / 2.4 Gbps (5G SA) and uplink speeds of 900 Mbps (SA) / 600 Mbps (NSA), built on the Qualcomm X72 modem platform. An M.2 cellular module is a surface-mount wireless modem that plugs into a standardized M.2 socket on a host board, providing 5G/LTE connectivity without integrating the radio chain into the host design. Within the wireless product hierarchy, it sits under cellular modems, which in turn belong to RF modules and, more broadly, wireless communication components. The M.2 Key B connector standard allows designers to swap connectivity modules across product generations with minimal PCB redesign. Key features of the RM550V-GL include compliance with 3GPP Release 17, support for both 5G NSA and SA operating modes, up to 3 downlink component carriers with 200 MHz NR bandwidth, and multi-mode fallback to LTE Cat 20 (DL) / Cat 18 (UL) and UMTS WCDMA. This ensures the module maintains connectivity in areas without 5G coverage, a critical requirement for global-market IoT deployments. Technically, the module is built on the Qualcomm Snapdragon X72 platform, one of the most advanced 5G modem RF systems available, supporting global Sub-6 GHz bands. Control is performed via standard AT commands, simplifying integration with host processors running Linux, Android, or RTOS firmware. Community resources also document PCIe RC mode operation with custom firmware for advanced embedded routing applications. Typical applications include industrial IoT gateways, eMBB (enhanced Mobile Broadband) devices such as 5G CPE routers, smart agriculture terminals, and remote monitoring systems, where its high throughput and low latency directly improve data-intensive workloads like video streaming and cloud telemetry. A key design consideration is that the RM550V-GL is currently in the ES1 (Engineering Sample 1) phase according to community documentation, so production designs should plan firmware validation and anticipate commercial-release updates. Verify thermal design for sustained 3.2 Gbps throughput. This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, providing unique engineering value for module selection and second-source planning.
RNBD350PE-I100 - BT 6.0 LE Module w/ PCB Antenna | Microchip
The Microchip Technology RNBD350PE-I100 is a Bluetooth v6.0 (LE) transceiver module based on Microchip's PIC32CX-BZ3 Bluetooth Low Energy System-on-Chip, integrated with an onboard PCB trace antenna and shipped in a surface-mount LGA-30 (13.4 x 18.7 mm) package. Operating in the global 2.4 GHz ISM band, it exposes a Two-Wire or Four-Wire (Flow Control) UART command interface and is supplied from a single 3.3 V rail, simplifying host MCU/MPU integration. A Bluetooth Low Energy (BLE) module is a pre-integrated radio subsystem that bundles the radio transceiver, baseband, protocol stack, antenna and regulatory certification into a single solderable component. BLE modules sit within the broader taxonomy of wireless connectivity modules -> short-range transceivers -> RF modules, allowing designers to bypass RF design, certification, and stack porting. The RNBD350PE family is positioned as a plug-and-play BLE solution for embedded products, prioritizing rapid time-to-market over custom RF tuning. Key features include pre-certification for US (FCC), Canada (ISED), Europe (CE), Taiwan (NCC), China (SRRC), Japan (MIC) and Korea (KC) markets, support for Bluetooth 5.2 LE features such as Data Length Extension (DLE) and LE Secure Connections, an ASCII command set over UART, and a free Microchip mobile app (iOS and Android) plus source code for custom mobile applications. The integrated PCB trace antenna eliminates the need for an external antenna and keeps the BOM to a minimum. Architecturally, the RNBD350PE combines the PIC32CX-BZ3 SoC (Arm Cortex-M4F core with BLE radio and crypto accelerator), onboard LDO/PMU, crystal reference, RF matching network, and an embedded planar inverted-F antenna. Designers communicate with the module via a Microchip-defined ASCII command set, leaving firmware development focused on the application MCU rather than the BLE stack. Typical applications include IoT sensor nodes, industrial asset tracking, smart-home gateways, BLE beaconing for retail and healthcare, wireless HMI/remote-control front ends, and medical device telemetry. The pre-certified footprint lets designers avoid the 8-16 week regulatory lab cycle normally required for unlicensed 2.4 GHz products. When designing with this part, allocate a host-side UART (with optional CTS/RTS) and verify keep-out regions around the antenna per the PCB layout guide in the datasheet. Confirm firmware revision compatibility with the chosen host platform before locking firmware; Microchip regularly issues stack updates.
RNBD350UE-I100 - BLE 5.2 U.FL Module | Microchip Technology
The Microchip Technology RNBD350UE-I100 is a plug-and-play Bluetooth 5.2 Low Energy transceiver module operating in the 2.4 GHz band, with a U.FL connector for an external antenna (antenna not included), supplied from a 1.9 V to 3.6 V rail and housed in a shielded 30-pin surface-mount package measuring 13.4 x 18.7 mm. A Bluetooth Low Energy (BLE) module is a complete radio subsystem that implements the Bluetooth LE protocol stack, RF front end and antenna matching in a certified package, sitting within the hierarchy of wireless connectivity ICs: transceiver module -> RF transceiver -> radio IC -> semiconductor device. Unlike a chip antenna or a discrete radio design, a certified module such as the RNBD350UE requires no RF design work and no additional regulatory certification by the end-product manufacturer. Key features include true plug-and-play operation with no firmware programming required, communication with a host MCU or MPU over a Two-Wire or Four-Wire (flow-control) UART interface using Microchip's simple ASCII command set, and support for Bluetooth 5.2 features including 2 Mbps PHY, Data Length Extension (DLE) and LE Secure Connections, which are enabled by default for encrypted pairing resistance against passive eavesdropping. At its core, the RNBD350 module is based on Microchip's PIC32CX-BZ3 Bluetooth Low Energy System-on-Chip (SoC), which integrates the BLE radio, protocol stack and processing in a single silicon solution, providing a complete connectivity implementation in a pre-certified form factor. This architecture offloads all BLE stack management from the host, so the host processor only needs to parse simple ASCII commands. Typical applications include adding BLE connectivity to industrial sensors and actuators, smart-home and IoT end nodes, and embedded systems where the host MCU has no native radio. Because the module is plug-and-play, a design team can add certified Bluetooth LE connectivity in days rather than months. A key design consideration: since the U.FL antenna connector means the antenna is external, place the U.FL receptacle and its mating cable route away from switching-regulator components to preserve RF sensitivity, and ensure the host UART baud rate matches the module default configuration. This page synthesizes distributor pricing, availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
RS9116N-DB00-CC1-B2A - Dual-Band Wi-Fi + BT5 Module | Silicon Labs
The Silicon Labs RS9116N-DB00-CC1-B2A is a dual-band (2.4 GHz and 5 GHz) multi-protocol wireless connectivity module delivering 802.11 a/b/g/n Wi-Fi and dual-mode Bluetooth 5 in a surface-mount castellated CC1 module package with no external antenna included. A wireless connectivity module is a self-contained RF subsystem that integrates the radio transceiver, RF front end, crystal, and regulatory-certified antenna matching network into one certified unit. Modules sit above discrete SoCs in the system hierarchy (module -> RF subsystem -> connectivity IC -> wireless SoC) because they shorten time to market: the RF design is pre-validated, and FCC, IC, and ETSI/CE certifications carry over to the host product, eliminating costly in-house regulatory testing. Key features include simultaneous 2.4 GHz and 5 GHz band support for 802.11n clients and access points, dual-mode Bluetooth 5 for classic and low-energy links, and host interfacing over SDIO or USB. The module is FCC, IC, and ETSI/CE certified, and Silicon Labs supplies drivers for Linux and other high-level operating systems. Power-optimized performance extends battery life in portable designs while maintaining extended range. The -B2A suffix denotes the factory-preloaded firmware version, per the ordering information in the RS9116 CC1 datasheet; -B2B variants differ only in firmware. The RS9116N targets n-Link deployments, where the networking stack runs on the host Linux application processor and the module handles the wireless PHY/MAC. Operating modes include Wi-Fi Client, Wi-Fi Access Point, and Simultaneous Client plus Access Point, with up to 50 Mbps Wi-Fi application throughput per Silicon Labs n-Link documentation. Typical applications include industrial gateways and routers, Linux-based embedded systems needing certified dual-band connectivity, medical and instrumentation devices streaming data over Wi-Fi with a Bluetooth 5 provisioning path, and smart-building infrastructure. Design consideration: the module does not include an antenna, so an external antenna with matching 50-ohm feed must be selected and placed per the Silicon Labs layout guidance to preserve certification limits. This page adds value beyond the datasheet by synthesizing distributor availability, drop-in firmware-variant alternatives, cross-brand comparison candidates, and practical design notes in one reference.
RTAX4000SL-CQ352PROTO - 4M-Gate Radiation-Tolerant FPGA | Microchip
The Actel (Microchip/Microsemi) RTAX4000SL-CQ352PROTO is a radiation-tolerant, one-time-programmable FPGA with 4,000,000 equivalent system gates, 60,480 logic cells, and 40,320 CLBs, housed in a 352-pin ceramic CQFP (CQ352) metal-sealed cofired package. The PROTO suffix denotes a prototyping-oriented ordering option within the RTAX-S/SL space-flight family. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) environment encountered in Earth-orbiting and deep-space missions. Within the power-management hierarchy of spacecraft avionics, such devices occupy the top tier of programmable logic, sitting above commercial FPGAs and below full rad-hard ASICs in cost and flexibility. Key differentiating features include true single-chip form factor enabled by antifuse programmability, live-at-power-up operation with no configuration device required, low static power consumption, and embedded SRAM blocks with built-in FIFO control logic. The RTAX-S/SL architecture derives from the commercial Microsemi Axcelerator family, inheriting segmentable clocks, chip-wide highway routing, and dedicated carry logic for arithmetic. Architecturally, each cluster contains logic cells built around register-rich C-cells and R-cells, with a maximum CLB combinatorial delay of 1.1 ns per the Microchip USA product listing. The CMOS process, combined with the ceramic metal-sealed CQFP352 package, supports operation across a military/space temperature range of -55C to +125C in surface-mount assembly. Typical applications include satellite payload data processing, spacecraft bus command and data handling, telecommunication transponder control, and launch-vehicle avionics, where single-chip integration and SEU robustness are decisive. A key design consideration is that antifuse RTAX devices are one-time programmable: engineers typically validate logic on an Aldec flash-based prototyping adaptor (e.g., ACT-H3Ki-CQ352) before committing to flight silicon, which is precisely the role the PROTO ordering option targets. This page synthesizes distributor listings, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.