ATSAME70Q21B-CN vs ATSAME70Q19A-CN 比較
詳細な並列比較: ATSAME70Q21B-CN メーカー: Microchip Technology および ATSAME70Q19A-CN メーカー: Microchip Technology。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
Microchip Technology
ATSAME70Q21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
ATSAME70Q21B-CN ✓ 生産中Microchip Technology
ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip
ATSAME70Q19A-CN ✓ 生産中仕様比較
| パラメータ | ATSAME70Q21B-CN | ATSAME70Q19A-CN |
|---|---|---|
| ブランド | Microchip Technology | Microchip Technology |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $16.75 | $6.68 |
| Core | ARM Cortex-M7 with FPU (single + double precision) | — |
| Maximum CPU Clock | 300 MHz | 300 MHz |
| CoreMark Score | 1284 | — |
| DMIPS | 600 | — |
| Program Flash | 2048 KB (2 MB) with ECC | — |
| Multi-Port SRAM | 384 KB | — |
| TCM (tightly-coupled memory) | Configurable portion of SRAM, zero-wait-state | — |
| Instruction / Data Cache | 16 KB ICache + 16 KB DCache | — |
| Supply Voltage (VDDIO) | 3.0 V to 3.6 V (3.3 V typical) | — |
| 動作温度 | -40 C to +105 C | -40C to +105C (industrial) |
| パッケージ | 144-ball LFBGA, 10x10 mm, 0.8 mm pitch | 144-LFBGA (10x10 mm, 0.8 mm pitch) |
| ADC | 12-bit, up to 2 MSPS, up to 24 channels | 12-bit, up to 2 Msps |
| USB | USB 2.0 High-Speed / Full-Speed with on-chip PHY | USB 2.0 High-Speed Host + Device with on-chip PHY |
| CAN | 2x CAN-FD controllers | 2x CAN-FD controllers |
| Ethernet | 10/100 MAC with 1588 PTP support (GMII/RMII/MII) | 10/100 Mbps MAC (GMAC) with 1588 PTP |
| Other Peripherals | I2S, SSC, SPI, TWI (I2C), USART, QSPI, SDMMC, EBI, AFEC | — |
| 実装タイプ | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS ステータス | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-M7 with FPU (single + double precision) |
| Flash Memory | — | 512 KB |
| SRAM | — | 256 KB |
| Operating Voltage (VDDCORE) | — | 1.2 V (typical) |
| I/O Voltage (VDDIO) | — | 3.3 V (typical) |
| DAC | — | 12-bit |
| Serial Interfaces | — | 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed |
| DMA Channels | — | 24 (XDMAC) |
| Crypto Accelerator | — | AES, SHA, TRNG hardware blocks |
| External Bus Interface (EBI) | — | Yes (SDRAM, SRAM, NAND support) |
| MSLレベル | — | 3 |