ATSAME70Q21B-CN vs ATSAME70Q19A-CN 비교
다음의 상세 나란히 비교: ATSAME70Q21B-CN 제조: Microchip Technology 및 ATSAME70Q19A-CN 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
ATSAME70Q21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
ATSAME70Q21B-CN ✓ 활성Microchip Technology
ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip
ATSAME70Q19A-CN ✓ 활성사양 비교
| 파라미터 | ATSAME70Q21B-CN | ATSAME70Q19A-CN |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $16.75 | $6.68 |
| Core | ARM Cortex-M7 with FPU (single + double precision) | — |
| Maximum CPU Clock | 300 MHz | 300 MHz |
| CoreMark Score | 1284 | — |
| DMIPS | 600 | — |
| Program Flash | 2048 KB (2 MB) with ECC | — |
| Multi-Port SRAM | 384 KB | — |
| TCM (tightly-coupled memory) | Configurable portion of SRAM, zero-wait-state | — |
| Instruction / Data Cache | 16 KB ICache + 16 KB DCache | — |
| Supply Voltage (VDDIO) | 3.0 V to 3.6 V (3.3 V typical) | — |
| 동작 온도 | -40 C to +105 C | -40C to +105C (industrial) |
| 패키지 | 144-ball LFBGA, 10x10 mm, 0.8 mm pitch | 144-LFBGA (10x10 mm, 0.8 mm pitch) |
| ADC | 12-bit, up to 2 MSPS, up to 24 channels | 12-bit, up to 2 Msps |
| USB | USB 2.0 High-Speed / Full-Speed with on-chip PHY | USB 2.0 High-Speed Host + Device with on-chip PHY |
| CAN | 2x CAN-FD controllers | 2x CAN-FD controllers |
| Ethernet | 10/100 MAC with 1588 PTP support (GMII/RMII/MII) | 10/100 Mbps MAC (GMAC) with 1588 PTP |
| Other Peripherals | I2S, SSC, SPI, TWI (I2C), USART, QSPI, SDMMC, EBI, AFEC | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 상태 | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-M7 with FPU (single + double precision) |
| Flash Memory | — | 512 KB |
| SRAM | — | 256 KB |
| Operating Voltage (VDDCORE) | — | 1.2 V (typical) |
| I/O Voltage (VDDIO) | — | 3.3 V (typical) |
| DAC | — | 12-bit |
| Serial Interfaces | — | 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed |
| DMA Channels | — | 24 (XDMAC) |
| Crypto Accelerator | — | AES, SHA, TRNG hardware blocks |
| External Bus Interface (EBI) | — | Yes (SDRAM, SRAM, NAND support) |
| MSL 레벨 | — | 3 |