ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip
部品番号: ATSAME70Q19A-CN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.42 | $11.42 |
| 10 | $10.05 | $100.50 |
| 100 | $8.62 | $862.00 |
| 500 | $7.45 | $3,725.00 |
| 1,000 | $6.68 | $6,680.00 |
ATSAME70Q19A-CN 概要
An ARM Cortex-M7 microcontroller is a 32-bit RISC processor core designed for embedded systems that demand high computational throughput, deterministic interrupt latency, and DSP extensions. The Cortex-M7 sits at the top of the Cortex-M family hierarchy (Cortex-M7 -> Cortex-M -> ARMv7-M architecture -> 32-bit embedded processor), and supersedes Cortex-M4/M3 by adding a superscalar pipeline, branch prediction, and an integrated single/double-precision FPU. Microcontrollers based on the Cortex-M7 are commonly chosen over Cortex-M4 alternatives when applications require complex FFTs, audio codecs, motor-control loops, or high-speed graphics.
Key features include 300 MHz maximum CPU clock, 512 KB embedded Flash with prefetch cache, 256 KB SRAM, an external bus interface (EBI) supporting SDRAM, and a rich peripheral set: HS USB Host/Device with on-chip PHY, two CAN-FD controllers, three FLEXCOMs (USART/SPI/TWI), EMAC with 1588 PTP, a 12-bit 2 Msps ADC, a 12-bit DAC, and hardware crypto accelerators (AES, SHA, TRNG). The integrated FPU and DSP instructions allow DSP-grade signal processing without an external DSP chip.
The ATSAME70Q19A-CN architecture pairs the Cortex-M7 core with a multi-layer AHB/APB bus matrix, dedicated DMA (XDMAC) with 24 channels, and tightly-coupled memory ports that eliminate Flash wait states for time-critical routines. This combination of bandwidth, deterministic latency, and rich analog/digital peripherals enables single-chip implementation of motor-control, audio-processing, and industrial-automation designs.
Typical applications include industrial motor drives, audio processing and effects units, PLC communication modules, building automation controllers, smart energy gateways, and IoT edge nodes requiring TLS hardware acceleration. The hardware AES/SHA blocks make the device attractive for secured IoT endpoints.
A key design consideration: the LFBGA-144 footprint requires at least a 4-layer PCB with microvia fan-outs to reliably escape the 0.8 mm pitch ball array; a 2-layer board is not recommended for production designs.
ドロップイン代替品: ATSAME70Q19A-CN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAME70Q19A-CN （同一形状・フットプリント） — 相違点: ADC, Package, USB, Operating Temperature, SRAM.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAME70Q20A-CN
✅ ドロップイン✓ 在庫あり
$8.93 / 個
データシートを見る →ATSAMS70Q19A-CN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAME70N21B-CN
✅ ドロップイン✓ 在庫あり
$12.1 / 個
データシートを見る →ATSAME70Q19A-AN
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$10.55 / 個
データシートを見る →ATSAME70Q19A-CFNT
✅ ドロップイン✓ 在庫あり
$9.78 / 個
データシートを見る →ATSAME70Q19A-CN 最大定格＆電気的特性
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 512 KB |
| SRAM | 256 KB |
| Operating Voltage (VDDCORE) | 1.2 V (typical) |
| I/O Voltage (VDDIO) | 3.3 V (typical) |
| パッケージ | 144-LFBGA (10x10 mm, 0.8 mm pitch) |
| 動作温度 | -40C to +105C (industrial) |
| ADC | 12-bit, up to 2 Msps |
| DAC | 12-bit |
| USB | USB 2.0 High-Speed Host + Device with on-chip PHY |
| Ethernet | 10/100 Mbps MAC (GMAC) with 1588 PTP |
| CAN | 2x CAN-FD controllers |
| Serial Interfaces | 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed |
| DMA Channels | 24 (XDMAC) |
| Crypto Accelerator | AES, SHA, TRNG hardware blocks |
| External Bus Interface (EBI) | Yes (SDRAM, SRAM, NAND support) |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
ATSAME70Q19A-CN 144-lfbga (10x10 mm, 0.8 mm pitch) ピン配置ガイド
ATSAME70Q19A-CN (144-lfbga (10x10 mm, 0.8 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAME70Q19A-CN.
詳細は データシート をご参照ください。
主な用途
ATSAME70Q19A-CN の用途: 6 件s: Industrial Motor Control, Audio Processing and Effects, Industrial Ethernet Gateway, Building Automation Controller, Secured IoT Edge Node, Human-Machine Interface (HMI).
Industrial Motor Control
The ATSAME70Q19A-CN's 300 MHz Cortex-M7 with FPU and DSP extensions, plus 12-bit 2 Msps ADC and dedicated PWM timers, fits field-oriented control (FOC) loops for 3-phase PMSM and BLDC motors. Per the SAM E70 datasheet, the PWM peripheral supports complementary outputs with 8 ns resolution, while the XDMAC offloads current-sample transfers. Combined with 256 KB SRAM and AES hardware crypto, the chip can run a 10 kHz control loop, encrypt CAN-FD telemetry, and still leave headroom for Ethernet-based industrial networking.
おすすめ
Audio Processing and Effects
Dual I2S ports, a 12-bit DAC, and the 300 MHz Cortex-M7 with DSP extensions make ATSAME70Q19A-CN suitable for digital audio effects units, headphone amplifiers, and stage-effect processors. The 256 KB SRAM holds audio buffers without off-chip memory, while the hardware FPU accelerates FFT and biquad cascade calculations at low latency. Compared to a discrete DSP + MCU design, the integrated architecture eliminates one chip and one clock domain, reducing BOM and EMI.
おすすめ
Industrial Ethernet Gateway
The ATSAME70Q19A-CN's integrated 10/100 Ethernet MAC with IEEE 1588 PTP, plus dual CAN-FD controllers, positions the part as a gateway between industrial fieldbus and IT networks. The 300 MHz core can run a TCP/IP stack (lwIP or equivalent), a TLS 1.3 client using the hardware AES/SHA accelerators, and a CANopen or Modbus handler concurrently. The 512 KB Flash accommodates a real-time OS such as FreeRTOS plus the networking stack.
おすすめ
Building Automation Controller
The HS USB Host port, SD/MMC host, dual CAN-FD, and 114 GPIO of ATSAME70Q19A-CN fit BACnet, KNX, or Modbus building-automation controllers that aggregate HVAC, lighting, and security data. The 512 KB Flash holds the protocol stack and the 256 KB SRAM handles concurrent sensor buffers. Industrial -40C to +105C temperature rating allows deployment in unconditioned electrical rooms without additional cooling.
おすすめ
Secured IoT Edge Node
The hardware AES, SHA, and TRNG blocks in ATSAME70Q19A-CN allow TLS 1.3 / Matter / secure-boot implementations without software crypto overhead, freeing the 300 MHz core for application logic. The HS USB and Ethernet peripherals support both wired and tethering connectivity, while 256 KB SRAM handles MQTT/CoAP message buffers. Hardware secure boot uses the embedded Flash's secure boot signature verification, mitigating firmware-cloning risks for connected-product deployments.
おすすめ
Human-Machine Interface (HMI)
With a 300 MHz core, hardware FPU, and EBI to external SDRAM, ATSAME70Q19A-CN drives TFT-LCD panels up to WVGA resolution via the integrated LCD controller, while the Cortex-M7's DSP accelerates PNG decompression and touch-gesture math. The 114 GPIO and three FLEXCOM ports parallelize SPI display, I2C touch, and UART debug links. Power consumption at 300 MHz is around 200 mA, manageable with a 5 V to 1.2 V buck regulator plus a small heatsink copper pour.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAME70Q19A-CN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAME70Q20A-CN | ATSAMS70Q19A-CN | ATSAME70N21B-CN | ATSAME70Q19A-AN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LFBGA (10x10 mm) | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same | 144-LQFP (20x20 mm) |
| Core / Clock | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz |
| Flash | 512 KB | 1024 KB | 512 KB | 2048 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 384 KB | 256 KB |
| HS USB + EMAC | Yes / Yes | Yes / Yes | No / No (safety variant) | Yes / Yes | Yes / Yes |
| CAN-FD | 2x | 2x | 2x | 2x | 2x |
| Industrial Temp | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Crypto (AES/SHA/TRNG) | Yes | Yes | Yes | Yes | Yes |
主な差別化要因
- Integrated HS USB PHY eliminates external ULPI chip （vs ATSAMS70Q19A-CN)
- On-chip 10/100 EMAC with 1588 PTP （vs ATSAMS70Q19A-CN)
- Higher Flash density than older SAM S70Q19B-CN （vs ATSAME70Q20A-CN)
- Smaller footprint than LQFP equivalent （vs ATSAME70Q19A-AN)
設計ノート
Estimated: The 144-LFBGA package uses a 0.8 mm ball pitch on a 10x10 mm body. Escape routing requires at minimum a 4-layer PCB (1 oz copper) with 0.4 mm laser-drilled micro-vias to fan out from the inner rows. Using a 2-layer PCB is not recommended for production designs because outer-row escape channels cannot accommodate GND/VDD planes without violating DRC spacing rules. Maintain a continuous GND plane directly under the BGA to reduce simultaneous-switching noise on the high-speed parallel bus.
Apply the SAM E70 datasheet's recommended decoupling scheme: a 4.7 uF bulk capacitor plus a 100 nF ceramic capacitor on every VDDIO pin pair, and a 4.7 uF + 100 nF combination on VDDCORE. The internal 1.2 V regulator is fed from VDDIO; if you disable the internal regulator to use an external 1.2 V LDO (recommended for EMI-sensitive designs), tie VREGCTRL to GND and provide a clean 1.2 V rail with at least 200 mA capacity. Hold NRST low until VDDIO and VDDCORE are both stable to prevent code corruption on startup.
A common ATSAME70Q19A-CN design mistake is assuming the HS USB PHY shares its 48 MHz clock with the EMAC; in fact, the USB PHY requires a dedicated 12 MHz crystal with tight tolerance (50 ppm or better) for USB compliance. Another pitfall is failing to enable the Cortex-M7's I-cache and D-cache properly through the memory-map registers (SCB) - leaving them off can drop benchmark performance by 30% or more. Always program the wait-state register on the EBI when interfacing SDRAM, otherwise bus contention will corrupt data on burst reads.
Estimated: At 300 MHz with all peripherals active, the ATSAME70Q19A-CN consumes roughly 200 mA from VDDCORE (1.2 V) plus 40 mA from VDDIO, totaling about 290 mW dissipation. The LFBGA-144 package thermal resistance is approximately 30 C/W to a 4-layer JEDEC EIA/JESD51 test board. Mount the BGA to a continuous 10x10 mm copper land pad (or a thermal via array) to keep junction rise below 10 C at room ambient. Forced airflow is recommended above 70 C ambient.
コンプライアンス情報
RoHS and lead-free per Microchip product page. AEC-Q100 not applicable - this is an industrial-grade MCU, not automotive-qualified; for automotive-grade SAM E70 variants check ATSAME70Q19B-CFN automotive part numbers.
