EP2SGX90EF1152I3 vs EP2SGX90EF1152C4N 比較
詳細な並列比較: EP2SGX90EF1152I3 メーカー: Intel および EP2SGX90EF1152C4N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ ラストタイムバイ仕様比較
| パラメータ | EP2SGX90EF1152I3 | EP2SGX90EF1152C4N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | ラストバイ | ラストバイ |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $1,480.00 | $695.00 |
| Series | Stratix II GX | — |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 bits |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| 実装タイプ | Surface Mount | Surface Mount (BGA) |
| RoHS ステータス | Compliant | — |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90,960 |
| LABs/CLBs | — | 4,548 |
| User I/O Count | — | 558 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage | — | 1.2 V |
| Process Node | — | 90 nm |
| Transceivers | — | Up to 20 channels, 6.375 Gbps per channel |
| Speed Grade | — | C4 |
| 動作温度 | — | Commercial (0C to +85C) |
| パッケージ | — | 1152-BBGA / FC-FBGA-1152 |
| MSLレベル | — | MSL-3 / MS-034AAR-1 (per package outline) |
| Lead-Free / RoHS | — | Lead free; RoHS compliance per JEDEC |