EP2SGX90EF1152I3 vs EP2SGX90EF1152C4N Comparaison
Comparaison détaillée côte à côte de EP2SGX90EF1152I3 par Intel et EP2SGX90EF1152C4N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP2SGX90EF1152I3 | EP2SGX90EF1152C4N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 480,00 | $695,00 |
| Series | Stratix II GX | — |
| Logic Elements | 90,960 | — |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 bits |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | Compliant | — |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90,960 |
| LABs/CLBs | — | 4,548 |
| User I/O Count | — | 558 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage | — | 1.2 V |
| Process Node | — | 90 nm |
| Transceivers | — | Up to 20 channels, 6.375 Gbps per channel |
| Speed Grade | — | C4 |
| Température de fonctionnement | — | Commercial (0C to +85C) |
| Boîtier | — | 1152-BBGA / FC-FBGA-1152 |
| Niveau MSL | — | MSL-3 / MS-034AAR-1 (per package outline) |
| Lead-Free / RoHS | — | Lead free; RoHS compliance per JEDEC |