EPF10K200SBC356-1X vs EPF10K200SBC356-3 比較
詳細な並列比較: EPF10K200SBC356-1X メーカー: Intel および EPF10K200SBC356-3 メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ ラストタイムバイ
仕様比較
| パラメータ | EPF10K200SBC356-1X | EPF10K200SBC356-3 |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | ラストバイ | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $138.00 | $87.50 |
| Family | FLEX 10KE | FLEX 10K |
| Series | FLEX-10KS | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 39,616 | — |
| User I/Os | 274 | 470 (package exposes 274 bonded-out) |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS, 4 metal layers |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) | — |
| パッケージ | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | -1 (fastest commercial bin) | — |
| 実装タイプ | Surface Mount (BGA) | Surface Mount |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP | — |
| Lead Free / RoHS | Yes (per -1X suffix) | — |
| Configuration Mode | SRAM-based, ISP via JTAG | Passive Serial / Passive Parallel / JTAG |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Typical Gates | — | 200,000 |
| Logic Elements (Cells) | — | 9,984 |
| Total EAB RAM | — | 98,304 bits |
| Flip-Flops | — | 4,992 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| Propagation Delay | — | 0.4 ns |
| Internal Performance (fmax) | — | 250 MHz |
| 動作温度 | — | 0 C to 70 C (Commercial) |
| MultiVolt I/O | — | 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |
| RoHS ステータス | — | [DATA_NEEDED: rohs status] |