EPF10K200SBC356-1X vs EPF10K200SBC356-3 비교
다음의 상세 나란히 비교: EPF10K200SBC356-1X 제조: Intel 및 EPF10K200SBC356-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPF10K200SBC356-1X | EPF10K200SBC356-3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 최종 구매 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $138.00 | $87.50 |
| Family | FLEX 10KE | FLEX 10K |
| Series | FLEX-10KS | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 39,616 | — |
| User I/Os | 274 | 470 (package exposes 274 bonded-out) |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS, 4 metal layers |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) | — |
| 패키지 | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | -1 (fastest commercial bin) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP | — |
| Lead Free / RoHS | Yes (per -1X suffix) | — |
| Configuration Mode | SRAM-based, ISP via JTAG | Passive Serial / Passive Parallel / JTAG |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Typical Gates | — | 200,000 |
| Logic Elements (Cells) | — | 9,984 |
| Total EAB RAM | — | 98,304 bits |
| Flip-Flops | — | 4,992 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| Propagation Delay | — | 0.4 ns |
| Internal Performance (fmax) | — | 250 MHz |
| 동작 온도 | — | 0 C to 70 C (Commercial) |
| MultiVolt I/O | — | 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |
| RoHS 상태 | — | [DATA_NEEDED: rohs status] |