EPF10K200SBC356-1X vs EPF10K200SBC356-3 对比
详细并排对比 EPF10K200SBC356-1X 出自 Intel 和 EPF10K200SBC356-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ 最后一次采购
规格对比
| 参数 | EPF10K200SBC356-1X | EPF10K200SBC356-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $138.00 | $87.50 |
| Family | FLEX 10KE | FLEX 10K |
| Series | FLEX-10KS | — |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1,248 |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 39,616 | — |
| User I/Os | 274 | 470 (package exposes 274 bonded-out) |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS, 4 metal layers |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) | — |
| 封装 | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | -1 (fastest commercial bin) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP | — |
| Lead Free / RoHS | Yes (per -1X suffix) | — |
| Configuration Mode | SRAM-based, ISP via JTAG | Passive Serial / Passive Parallel / JTAG |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Typical Gates | — | 200,000 |
| Logic Elements (Cells) | — | 9,984 |
| Total EAB RAM | — | 98,304 bits |
| Flip-Flops | — | 4,992 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| Propagation Delay | — | 0.4 ns |
| Internal Performance (fmax) | — | 250 MHz |
| 工作温度 | — | 0 C to 70 C (Commercial) |
| MultiVolt I/O | — | 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |
| RoHS 状态 | — | [DATA_NEEDED: rohs status] |