K3KL3L30QM-JGCT vs K3KL3L30CM-BGCU 比較
詳細な並列比較: K3KL3L30QM-JGCT メーカー: Samsung Electronics および K3KL3L30CM-BGCU メーカー: Samsung Electronics。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | K3KL3L30QM-JGCT | K3KL3L30CM-BGCU |
|---|---|---|
| ブランド | Samsung Electronics | Samsung Electronics |
| カテゴリ | Memory ICs | Memory ICs |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $0.00 | $0.00 |
| メモリタイプ | Volatile - DRAM | LPDDR5X SDRAM (Volatile DRAM) |
| Technology | LPDDR5X | LPDDR5X (JEDEC LPDDR5X-class low-power DRAM) |
| メモリサイズ | 64 Gb | 64 Gb (8 GB) |
| Memory Organization | x64 | x64 |
| Maximum Data Rate | 7500 Mbps/pin | — |
| インターフェースタイプ | Parallel LPDDR5X | — |
| Clock Rate | [DATA_NEEDED: clock rate] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD voltage] | — |
| Supply Voltage VDDQ | [DATA_NEEDED: VDDQ voltage] | — |
| Access Time / Latency | [DATA_NEEDED: CAS latency] | — |
| パッケージ | [DATA_NEEDED: package code and dimensions] | FBGA-496 (BGCU) |
| Ball Count | [DATA_NEEDED: ball count] | — |
| 実装タイプ | Surface Mount | Surface Mount |
| 動作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Product Status | Sampling (per distributor data) | — |
| Packaging | Plateau (tray style, per distributor data) | — |
| RoHS ステータス | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| データレート | — | 8533 Mbps |
| Die Configuration | — | Stacked multi-die DRAM |
| インターフェース | — | LPDDR5X (standard LPDDR ball interface) |
| Application Segment | — | AI devices and automotive |
| Power Efficiency | — | Approx. 25% better than previous LPDDR5 generation (per Samsung) |
| Speed Improvement | — | Up to 1.25x faster than previous generation (per Samsung) |
| Supply Voltage Class | — | [DATA_NEEDED: VDD/VDDQ voltage] |
| MSLレベル | — | [DATA_NEEDED: moisture sensitivity level] |
| Place of Origin (per distributor listing) | — | Johor, Malaysia |