K3KL3L30QM-JGCT vs K3KL3L30CM-BGCU 对比
详细并排对比 K3KL3L30QM-JGCT 出自 Samsung Electronics 和 K3KL3L30CM-BGCU 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K3KL3L30QM-JGCT | K3KL3L30CM-BGCU |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| 存储器类型 | Volatile - DRAM | LPDDR5X SDRAM (Volatile DRAM) |
| Technology | LPDDR5X | LPDDR5X (JEDEC LPDDR5X-class low-power DRAM) |
| 存储容量 | 64 Gb | 64 Gb (8 GB) |
| Memory Organization | x64 | x64 |
| Maximum Data Rate | 7500 Mbps/pin | — |
| 接口类型 | Parallel LPDDR5X | — |
| Clock Rate | [DATA_NEEDED: clock rate] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD voltage] | — |
| Supply Voltage VDDQ | [DATA_NEEDED: VDDQ voltage] | — |
| Access Time / Latency | [DATA_NEEDED: CAS latency] | — |
| 封装 | [DATA_NEEDED: package code and dimensions] | FBGA-496 (BGCU) |
| Ball Count | [DATA_NEEDED: ball count] | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Product Status | Sampling (per distributor data) | — |
| Packaging | Plateau (tray style, per distributor data) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| 数据速率 | — | 8533 Mbps |
| Die Configuration | — | Stacked multi-die DRAM |
| 接口 | — | LPDDR5X (standard LPDDR ball interface) |
| Application Segment | — | AI devices and automotive |
| Power Efficiency | — | Approx. 25% better than previous LPDDR5 generation (per Samsung) |
| Speed Improvement | — | Up to 1.25x faster than previous generation (per Samsung) |
| Supply Voltage Class | — | [DATA_NEEDED: VDD/VDDQ voltage] |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |
| Place of Origin (per distributor listing) | — | Johor, Malaysia |