MC9S08AW60CFUE vs MC9S08AW60CPUE 比較
詳細な並列比較: MC9S08AW60CFUE メーカー: NXP Semiconductors および MC9S08AW60CPUE メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | MC9S08AW60CFUE | MC9S08AW60CPUE |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | NRND | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $8.10 | $0.00 |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Frequency | 40 MHz | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | — |
| Core | Enhanced HCS08 8-bit core | — |
| 電源電圧 | 2.7 V to 5.5 V | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| I/O Ports | 38 ports | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| パッケージ | 64-QFP, 14 x 14 mm | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Package Height | 1 mm | — |
| Package Pitch | 0.50 mm | — |
| 実装スタイル | Surface mount | — |
| Instruction Cycle | 50 ns minimum at 2.7 V and 20 MHz bus | — |
| Instruction Set | HC08 instruction set with added BGND instruction | HC08 (CISC) with added BGND instruction |
| Debug Interface | Single-wire background debug mode interface | Single-wire background debug mode (BDM) |
| Application Support | Industrial and automotive | — |
| ライフサイクル状態 | NRND | — |
| Supplier Reference | NXP USA Inc. | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Speed (CPU Clock) | — | 40 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 4 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| ADC | — | 10-bit |
| 実装タイプ | — | Surface Mount |
| 動作温度 | — | [DATA_NEEDED: Operating Temperature Range] |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |
| Family | — | HCS08 (S08AW) |