MRFE6P9220HR3 vs MRFE6S9160HR3 比較
詳細な並列比較: MRFE6P9220HR3 メーカー: NXP Semiconductors および MRFE6S9160HR3 メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | MRFE6P9220HR3 | MRFE6S9160HR3 |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | MOSFETs | MOSFETs |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $232.20 | $25.20 |
| トランジスタタイプ | LDMOS, N-Channel Enhancement-Mode, Lateral | N-Channel Enhancement-Mode Lateral MOSFET |
| Technology | RF Power MOSFET | HV6E lateral MOSFET (LDMOS-like) |
| Frequency Range | 865 MHz to 1000 MHz | — |
| Test Frequency | 880 MHz | 880 MHz |
| Drain-Source Voltage (Vdss) Max | 66 V | — |
| Test Supply Voltage | 28 V | — |
| Test Drain Current | 1.6 A | — |
| Output Power (Avg, N-CDMA) | 47 W | — |
| Peak Output Power | 200 W | — |
| Power Gain (Typ) | 20 dB at 880 MHz | — |
| Drain Efficiency | [DATA_NEEDED: typical drain efficiency % at 47 W avg] | 32.4% (typical, N-CDMA, 880 MHz) |
| パッケージ | NI-860C3 (NI860ML), ceramic-metal sealed cofired, surface mount | — |
| Configuration | Common source, 2 elements | — |
| 実装タイプ | Surface Mount with copper heatsink pad | Chassis / Flange mount (through-hole RF leads) |
| 動作温度範囲 | [DATA_NEEDED: Tj max / operating range] | -40C to +150C (junction) |
| Lead Free Status | Lead Free | — |
| RoHS ステータス | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors |
| Drain-Source Voltage (V DSS) | — | 70 V (max) |
| Drain Current (continuous) | — | [DATA_NEEDED: typical drain current at TC=25C] |
| Operating Frequency Range | — | 865 MHz to 960 MHz |
| Drain Supply Voltage (V DD) | — | 28 V (typical) |
| Output Power (Average) | — | 35 W (single-carrier N-CDMA, 880 MHz) |
| Output Power (PEP) | — | [DATA_NEEDED: PEP at specified conditions] |
| Power Gain (G ps / G p) | — | 21 dB (typical at 880 MHz) |
| パッケージ / ケース | — | NI-780H-2L (ceramic/metal air-cavity flange-mount) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature] |
| Thermal Resistance (R thJC) | — | [DATA_NEEDED: thermal resistance junction-to-case] |
| Input Match | — | Internally matched input (broadband) |
| Lead-Free | — | Yes |
| MSLレベル | — | Not applicable (non-SMD air-cavity package) |