10AX090N4F40I3LG - Arria 10 GX FPGA, 900K LE, 1517-FCBGA | Intel
部品番号: 10AX090N4F40I3LG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 100 | $3750 | $375,000.00 |
| 500 | $3520 | $1,760,000.00 |
| 1,000 | $3290 | $3,290,000.00 |
10AX090N4F40I3LG 概要
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that engineers can configure after manufacturing to implement custom digital circuits, signal-processing pipelines, and complete system-on-chip designs. FPGAs sit above fixed-function ASICs in flexibility and below microcontrollers in ease of programming; the Arria 10 family specifically bridges mid-range logic capacity with embedded transceivers, hardened floating-point DSP blocks, and high-speed memory interfaces.
Key features of the 10AX090N4F40I3LG include its 900K logic-element density, 24 transceiver channels supporting up to 14.1 Gbps data rates, hardened floating-point DSP blocks, and integrated PCI Express Gen3 hard IP. The device operates across the industrial temperature range (-40C to +100C) and ships in speed grade I3, the third-fastest extended-temperature grade in the Arria 10 family.
The Arria 10 architecture combines a 20 nm process, a unified fabric, and adaptive logic modules (ALMs) to deliver high performance per watt. The '4F40' suffix indicates 4 transceiver lanes per quad and the F40 package designation; the N4 prefix indicates the device family, logic capacity tier, and pin/package configuration. The 'I3' speed grade and 'G' lead-free package designation are decoded from the ordering code per the Arria 10 device datasheet.
Typical applications include high-performance wireline telecom (100G/400G line cards), test and measurement instrumentation, radar and electronic-warfare signal processing, medical imaging accelerator boards, and PCIe Gen3 host adapters. The combination of high logic density and embedded transceivers makes the 10AX090 particularly attractive for protocol bridging and DSP-heavy designs.
When designing with this device, allocate PCB routing resources for the 1517-ball FCBGA carefully - the 1.0 mm ball pitch demands high-density interconnect (HDI) stack-ups with microvias and a controlled-impedance reference design. Power-rail sequencing must follow the Arria 10 PowerTree guidelines, and the Quartus Prime design suite is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in Arria 10 alternatives, and practical design notes that go beyond what the manufacturer datasheet alone provides, helping procurement and engineering teams make informed decisions.
ドロップイン代替品: 10AX090N4F40I3LG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX090N4F40I3LG （同一形状・フットプリント） — 相違点: Package, Process Technology, DSP Blocks, Transceivers, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
10AX090N4F40I3SG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10AX090N3F40I2LG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9800 / 個
データシートを見る →10AX090N2F40I2LG
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$6903.28 / 個
データシートを見る →10AX090N4F40I3LG 最大定格＆電気的特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/Os | 600 |
| Transceivers | 24 channels, up to 14.1 Gbps |
| パッケージ | 1517-ball FCBGA (F40) |
| 動作温度 | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| Process Node | 20 nm |
| DSP Blocks | Hardened floating-point DSP |
| PCIe Hard IP | PCIe Gen3 |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant (lead-free G suffix) |
| Configuration Method | SRAM-based, JTAG/AS/PS supported |
10AX090N4F40I3LG 1517-ball fcbga (f40) ピン配置ガイド
10AX090N4F40I3LG (1517-ball fcbga (f40) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX090N4F40I3LG.
詳細は データシート をご参照ください。
主な用途
10AX090N4F40I3LG の用途: 6 件s: 100G/400G Telecom Line Card, PCIe Gen3 Host Adapter and Accelerator, Test and Measurement Instrumentation, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator Board, Broadcast Video Processing and Studio Router.
100G/400G Telecom Line Card
The 10AX090N4F40I3LG's 900K logic elements and 24 transceivers running up to 14.1 Gbps make it well-suited for 100G and 400G telecom line-card designs requiring OTN framer/mapper, MAC, and packet processing. Hardened PCIe Gen3 and 100G Ethernet MAC IP reduce soft-logic overhead and timing risk. Industrial temperature grade (-40C to +100C) supports carrier-grade outdoor equipment. Per the Arria 10 device datasheet, the device's transceiver count and DSP resources align with OTU4/OTUCn line-side processing.
おすすめ
PCIe Gen3 Host Adapter and Accelerator
The 10AX090N4F40I3LG integrates hardened PCIe Gen3 IP, eliminating soft-logic PHY implementation and reducing development time for accelerator cards. Combined with 900K logic elements and 24 transceivers, designers can implement NVMe controllers, FPGA-based compute accelerators, and protocol bridges. The 600 user I/Os support DDR4 memory interfaces and high-speed parallel peripherals, providing ample bandwidth for compute and storage workloads.
おすすめ
Test and Measurement Instrumentation
The 10AX090N4F40I3LG delivers 900K logic elements with hardened floating-point DSP blocks ideal for high-speed digitizer, oscilloscope, and protocol-analyzer ASIC/ASSP replacements. Its 600 I/Os and 24 transceivers support multi-channel ADC/DAC interfacing, JESD204B/C links, and high-speed serial protocols. The industrial temperature range and speed grade I3 ensure deterministic timing in calibrated lab and production-test environments.
おすすめ
Radar and Electronic Warfare Signal Processing
The 10AX090N4F40I3LG's 900K logic elements plus hardened floating-point DSP blocks enable wideband radar pulse compression, beamforming, and electronic-warfare signal-processing pipelines. Its 24 transceivers up to 14.1 Gbps support high-speed ADC/DAC JESD204B/C interfaces. Industrial temperature grade is appropriate for military and aerospace-grade ground or shipboard platforms with extended thermal environments.
おすすめ
Medical Imaging Accelerator Board
The 10AX090N4F40I3LG supports CT, MRI, and ultrasound image-reconstruction pipelines by combining 900K logic elements with hardened floating-point DSP and high-bandwidth transceiver links. Its DDR4 memory interface capability through 600 I/Os handles large frame buffers, and PCIe Gen3 hard IP enables host attachment to medical workstations. Industrial temperature grade is suitable for controlled clinical environments.
おすすめ
Broadcast Video Processing and Studio Router
The 10AX090N4F40I3LG serves as a core processing engine for broadcast video routers, multiviewers, and 4K/UHD processing pipelines. Its 24 transceivers support SDI-over-IP (SMPTE 2110, 2022-6) and HDMI/DisplayPort bridging, while 900K logic elements handle pixel processing and color-space conversion. Industrial temperature grade ensures reliability in equipment-room installations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX090N4F40I3LG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX090N4F40I3SG | 10AX090N3F40I2LG | 10AX090N2F40I2LG | 10AX090N3F45I2LG | 10AX090N3F45I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1932-FBGA (F45) - different | 1932-FBGA (F45) - different |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | I3 | I3 | I2 (slower) | I2 (slower) | I2 (slower) | I2 (slower) |
| Transceivers per Quad | 4 | 4 | 3 | 2 | 3 | 3 |
| Embedded Memory (Mbits) | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
主な差別化要因
- Same die/package with industry-standard lead-free termination （vs 10AX090N4F40I3SG)
- Faster speed grade I3 versus I2 （vs 10AX090N3F40I2LG)
- Higher transceiver density per quad （vs 10AX090N2F40I2LG)
設計ノート
Estimated: the 10AX090N4F40I3LG in a 1517-ball FCBGA at typical Arria 10 utilization (60-80 percent logic, 50 percent transceiver, full DSP) dissipates 15-25 W. Without a heat spreader or forced airflow, junction temperature can exceed the 100C industrial limit. Intel's Arria 10 thermal management guidelines recommend a heat sink with thermal interface material and at minimum 200 LFM airflow for full-utilization designs.
The 1517-ball FCBGA at 1.0 mm ball pitch requires HDI PCB stack-up with microvias (laser-drilled), sequential lamination, and 0.4 mm trace/space routing. Per the Arria 10 device datasheet pin-out files, all signal and power balls must escape the BGA fanout region cleanly. Use Intel's PCB design guidelines and reference design stack-ups for impedance control on transceivers and DDR interfaces.
Estimated: transceiver channel placement must follow the Arria 10 device pin-out files for the F40 package. Reference-clock routing requires length matching within +/- 10 mil and impedance-controlled differential traces (typically 100 ohm differential). Power-rail decoupling requires dozens of 0.1 uF and 10 uF low-ESR ceramic capacitors placed within 100 mil of the relevant BGA balls per Intel's PowerTree recommendations.
Common pitfalls for the 10AX090N4F40I3LG include: (1) failing to follow the Arria 10 PowerTree sequencing requirements, which can damage the device during configuration; (2) ignoring transceiver reference-clock jitter requirements, causing link instability; (3) using commercial-grade designs in industrial environments (use industrial I3 speed grade parts); (4) omitting MSL handling for the FCBGA package, leading to solder-joint reliability issues.
コンプライアンス情報
RoHS compliant per the G suffix in ordering code (lead-free termination). Intel's product environmental compliance documentation should be consulted for halogen-free and full REACH compliance details.