10AX090N4F40I3LG - Arria 10 GX FPGA, 900K LE, 1517-FCBGA | Intel
부품 번호: 10AX090N4F40I3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 100 | $3750 | $375,000.00 |
| 500 | $3520 | $1,760,000.00 |
| 1,000 | $3290 | $3,290,000.00 |
10AX090N4F40I3LG 개요
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that engineers can configure after manufacturing to implement custom digital circuits, signal-processing pipelines, and complete system-on-chip designs. FPGAs sit above fixed-function ASICs in flexibility and below microcontrollers in ease of programming; the Arria 10 family specifically bridges mid-range logic capacity with embedded transceivers, hardened floating-point DSP blocks, and high-speed memory interfaces.
Key features of the 10AX090N4F40I3LG include its 900K logic-element density, 24 transceiver channels supporting up to 14.1 Gbps data rates, hardened floating-point DSP blocks, and integrated PCI Express Gen3 hard IP. The device operates across the industrial temperature range (-40C to +100C) and ships in speed grade I3, the third-fastest extended-temperature grade in the Arria 10 family.
The Arria 10 architecture combines a 20 nm process, a unified fabric, and adaptive logic modules (ALMs) to deliver high performance per watt. The '4F40' suffix indicates 4 transceiver lanes per quad and the F40 package designation; the N4 prefix indicates the device family, logic capacity tier, and pin/package configuration. The 'I3' speed grade and 'G' lead-free package designation are decoded from the ordering code per the Arria 10 device datasheet.
Typical applications include high-performance wireline telecom (100G/400G line cards), test and measurement instrumentation, radar and electronic-warfare signal processing, medical imaging accelerator boards, and PCIe Gen3 host adapters. The combination of high logic density and embedded transceivers makes the 10AX090 particularly attractive for protocol bridging and DSP-heavy designs.
When designing with this device, allocate PCB routing resources for the 1517-ball FCBGA carefully - the 1.0 mm ball pitch demands high-density interconnect (HDI) stack-ups with microvias and a controlled-impedance reference design. Power-rail sequencing must follow the Arria 10 PowerTree guidelines, and the Quartus Prime design suite is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in Arria 10 alternatives, and practical design notes that go beyond what the manufacturer datasheet alone provides, helping procurement and engineering teams make informed decisions.
드롭인 대체품: 10AX090N4F40I3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090N4F40I3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, DSP Blocks, Transceivers, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090N4F40I3SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX090N3F40I2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9800 / 개
데이터시트 보기 →10AX090N2F40I2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6903.28 / 개
데이터시트 보기 →10AX090N4F40I3LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/Os | 600 |
| Transceivers | 24 channels, up to 14.1 Gbps |
| 패키지 | 1517-ball FCBGA (F40) |
| 동작 온도 | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| Process Node | 20 nm |
| DSP Blocks | Hardened floating-point DSP |
| PCIe Hard IP | PCIe Gen3 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (lead-free G suffix) |
| Configuration Method | SRAM-based, JTAG/AS/PS supported |
10AX090N4F40I3LG 1517-ball fcbga (f40) 핀 구성 가이드
10AX090N4F40I3LG(1517-ball fcbga (f40) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090N4F40I3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090N4F40I3LG 적합 용도: 6 애플리케이션s: 100G/400G Telecom Line Card, PCIe Gen3 Host Adapter and Accelerator, Test and Measurement Instrumentation, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator Board, Broadcast Video Processing and Studio Router.
100G/400G Telecom Line Card
The 10AX090N4F40I3LG's 900K logic elements and 24 transceivers running up to 14.1 Gbps make it well-suited for 100G and 400G telecom line-card designs requiring OTN framer/mapper, MAC, and packet processing. Hardened PCIe Gen3 and 100G Ethernet MAC IP reduce soft-logic overhead and timing risk. Industrial temperature grade (-40C to +100C) supports carrier-grade outdoor equipment. Per the Arria 10 device datasheet, the device's transceiver count and DSP resources align with OTU4/OTUCn line-side processing.
추천
PCIe Gen3 Host Adapter and Accelerator
The 10AX090N4F40I3LG integrates hardened PCIe Gen3 IP, eliminating soft-logic PHY implementation and reducing development time for accelerator cards. Combined with 900K logic elements and 24 transceivers, designers can implement NVMe controllers, FPGA-based compute accelerators, and protocol bridges. The 600 user I/Os support DDR4 memory interfaces and high-speed parallel peripherals, providing ample bandwidth for compute and storage workloads.
추천
Test and Measurement Instrumentation
The 10AX090N4F40I3LG delivers 900K logic elements with hardened floating-point DSP blocks ideal for high-speed digitizer, oscilloscope, and protocol-analyzer ASIC/ASSP replacements. Its 600 I/Os and 24 transceivers support multi-channel ADC/DAC interfacing, JESD204B/C links, and high-speed serial protocols. The industrial temperature range and speed grade I3 ensure deterministic timing in calibrated lab and production-test environments.
추천
Radar and Electronic Warfare Signal Processing
The 10AX090N4F40I3LG's 900K logic elements plus hardened floating-point DSP blocks enable wideband radar pulse compression, beamforming, and electronic-warfare signal-processing pipelines. Its 24 transceivers up to 14.1 Gbps support high-speed ADC/DAC JESD204B/C interfaces. Industrial temperature grade is appropriate for military and aerospace-grade ground or shipboard platforms with extended thermal environments.
추천
Medical Imaging Accelerator Board
The 10AX090N4F40I3LG supports CT, MRI, and ultrasound image-reconstruction pipelines by combining 900K logic elements with hardened floating-point DSP and high-bandwidth transceiver links. Its DDR4 memory interface capability through 600 I/Os handles large frame buffers, and PCIe Gen3 hard IP enables host attachment to medical workstations. Industrial temperature grade is suitable for controlled clinical environments.
추천
Broadcast Video Processing and Studio Router
The 10AX090N4F40I3LG serves as a core processing engine for broadcast video routers, multiviewers, and 4K/UHD processing pipelines. Its 24 transceivers support SDI-over-IP (SMPTE 2110, 2022-6) and HDMI/DisplayPort bridging, while 900K logic elements handle pixel processing and color-space conversion. Industrial temperature grade ensures reliability in equipment-room installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090N4F40I3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090N4F40I3SG | 10AX090N3F40I2LG | 10AX090N2F40I2LG | 10AX090N3F45I2LG | 10AX090N3F45I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1932-FBGA (F45) - different | 1932-FBGA (F45) - different |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | I3 | I3 | I2 (slower) | I2 (slower) | I2 (slower) | I2 (slower) |
| Transceivers per Quad | 4 | 4 | 3 | 2 | 3 | 3 |
| Embedded Memory (Mbits) | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
주요 차별점
- Same die/package with industry-standard lead-free termination (vs 10AX090N4F40I3SG)
- Faster speed grade I3 versus I2 (vs 10AX090N3F40I2LG)
- Higher transceiver density per quad (vs 10AX090N2F40I2LG)
설계 노트
Estimated: the 10AX090N4F40I3LG in a 1517-ball FCBGA at typical Arria 10 utilization (60-80 percent logic, 50 percent transceiver, full DSP) dissipates 15-25 W. Without a heat spreader or forced airflow, junction temperature can exceed the 100C industrial limit. Intel's Arria 10 thermal management guidelines recommend a heat sink with thermal interface material and at minimum 200 LFM airflow for full-utilization designs.
The 1517-ball FCBGA at 1.0 mm ball pitch requires HDI PCB stack-up with microvias (laser-drilled), sequential lamination, and 0.4 mm trace/space routing. Per the Arria 10 device datasheet pin-out files, all signal and power balls must escape the BGA fanout region cleanly. Use Intel's PCB design guidelines and reference design stack-ups for impedance control on transceivers and DDR interfaces.
Estimated: transceiver channel placement must follow the Arria 10 device pin-out files for the F40 package. Reference-clock routing requires length matching within +/- 10 mil and impedance-controlled differential traces (typically 100 ohm differential). Power-rail decoupling requires dozens of 0.1 uF and 10 uF low-ESR ceramic capacitors placed within 100 mil of the relevant BGA balls per Intel's PowerTree recommendations.
Common pitfalls for the 10AX090N4F40I3LG include: (1) failing to follow the Arria 10 PowerTree sequencing requirements, which can damage the device during configuration; (2) ignoring transceiver reference-clock jitter requirements, causing link instability; (3) using commercial-grade designs in industrial environments (use industrial I3 speed grade parts); (4) omitting MSL handling for the FCBGA package, leading to solder-joint reliability issues.
규정 준수 정보
RoHS compliant per the G suffix in ordering code (lead-free termination). Intel's product environmental compliance documentation should be consulted for halogen-free and full REACH compliance details.