10AX090N2F40I2LG - Arria 10 GX FPGA 900K LE | Intel | 1517-FCBGA
MPN: 10AX090N2F40I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8418.64 | $8,418.64 |
| 10 | $8081.89 | $80,818.90 |
| 100 | $7576.77 | $757,677.00 |
| 500 | $7240.03 | $3,620,015.00 |
| 1,000 | $6903.28 | $6,903,280.00 |
Drop-in alternatives for 10AX090N2F40I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090N2F40I1SG
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View Datasheet →10AX066N2F40E1SG
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View Datasheet →10AX066K2F40I1SG
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View Datasheet →10AX066K1F40I1SG
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View Datasheet →10AX090N2F40I2LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| User I/O Pins | 600 |
| Transceivers | 24 channels up to 17.4 Gbps |
| DSP Blocks | Hardened IEEE 754 floating-point |
| Process Technology | 20 nm TSMC |
| Core Supply Voltage | 0.9 V |
| Package | 1517-ball FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Temperature Grade | Industrial |
| LVDS I/O Speed | Up to 2.4 Gbps |
| PCIe Hard IP | PCIe Gen3 x8 |
| Ethernet Hard IP | 100G Ethernet MAC |
| Configuration Memory | External (active serial) |
| RoHS Status | Compliant |
10AX090N2F40I2LG 1517-ball fcbga (flip-chip bga) Pin Configuration Guide
Complete pinout information for 10AX090N2F40I2LG (1517-ball fcbga (flip-chip bga) package) with 600 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N2F40I2LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 600 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N2F40I2LG is suitable for 6 applications: 100G Ethernet Line Card / Switch Fabric, Wireless Baseband Processing (LTE / 5G Fronthaul), Radar and Electronic Warfare Front-End, ASIC and Protocol Bridge Prototyping, Medical Imaging Backplane Aggregator, Video Broadcast and Professional AV Routing.
100G Ethernet Line Card / Switch Fabric
The 10AX090N2F40I2LG fits 100G Ethernet line cards because its 24 transceivers at 17.4 Gbps provide 4 channels of 25G or 1 channel of 100G using four 25.78G CAUI-4 lanes, with a hardened 100G Ethernet MAC block eliminating soft-logic implementation. The 900K logic elements handle table lookup (L2/L3 forwarding), packet parsing, and QoS queueing while 59 Mbits of M20K block memory buffer line-rate traffic. Designers typically pair this FPGA with external OTN framer or retimer PHYs; the FPGA's hard PCIe Gen3 x8 IP also serves as the host CPU control plane interface for the switch fabric card.
Recommended
Wireless Baseband Processing (LTE / 5G Fronthaul)
The 10AX090N2F40I2LG supports 5G fronthaul because the hardened IEEE 754 floating-point DSP blocks deliver up to 1.5 TFLOPs, enabling CPRI and eCPRI physical-layer processing, FFT/iFFT of 100 MHz 5G NR waveforms, and PRACH detection without consuming soft multipliers. Industrial temperature rating (-40C to +100C) lets the design be deployed in outdoor base-station enclosures. The 24 transceivers interface directly to CPRI Option 7-2 radio units over fiber, while the FPGA fabric runs the PHY and lower MAC. Designers use Quartus Prime DSP Builder to compile Simulink models into optimized DSP blocks on this part.
Recommended
Radar and Electronic Warfare Front-End
The 10AX090N2F40I2LG fits radar and EW signal processing because its high transceiver count and 17.4 Gbps serial rate let it capture wide-bandwidth ADC data from multiple RF channels and stream directly into on-chip DSP for pulse compression, MTI, and STAP processing. The hardened floating-point DSP blocks accelerate beamforming matrix multiplies at deterministic latency, critical for phased-array systems. 59 Mbits of block memory stores range-Doppler maps between radar pulses, and the industrial temperature rating supports airborne and shipboard installations where -40C to +100C thermal stress is routine.
Recommended
ASIC and Protocol Bridge Prototyping
The 10AX090N2F40I2LG is widely used for ASIC prototyping and protocol bridging because 900K logic elements can map multi-million-gate ASICs, while 24 transceivers support PCIe Gen3, 100G Ethernet, Interlaken, and serial RapidIO in a single chip. Designers use this FPGA as a software-development platform before ASIC tape-out, validating firmware against real I/O traffic. Protocol-bridge applications include MLAG switches, custom NVMe-over-Fabric adapters, and proprietary sensor aggregation backplanes. The 1517-ball FCBGA footprint provides enough I/O density for hundreds of GPIO plus multiple high-speed serial links in one BGA breakout.
Recommended
Medical Imaging Backplane Aggregator
The 10AX090N2F40I2LG fits medical imaging systems because the 24 transceivers aggregate data from multiple MRI, CT, or ultrasound detector heads and stream combined pixel data to a host workstation over 100G Ethernet. The 900K logic elements and floating-point DSP blocks perform real-time image preprocessing (filtering, beamforming in ultrasound) with deterministic latency, and the 59 Mbits of block memory act as a multi-line frame buffer between sensor front-ends and host interface. Industrial temperature rating and long-term supply availability through Intel's FPGA product longevity program make it suitable for medical OEM platforms with multi-decade service commitments.
Recommended
Video Broadcast and Professional AV Routing
The 10AX090N2F40I2LG is ideal for video broadcast routers because 24 transceivers at 17.4 Gbps can drive multiple 12G-SDI or UHD-SDI links plus a 100G Ethernet trunk back to a central switching fabric. 900K logic elements implement SDI timing recovery, ancillary data extraction, and audio embedding without external ASSPs, reducing BOM cost. The 59 Mbits of block memory acts as a frame buffer for audio/video re-alignment during matrix switches. Industrial temperature rating lets the router chassis be deployed in uncontrolled broadcast booth environments where ambient temperatures exceed 70C during outdoor sports or studio LED lighting loads.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N2F40I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N2F40I1SG | 10AX066N2F40E1SG | 10AX066K2F40I1SG | 10AX066K1F40I1SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 660,000 (-27%) | 660,000 (-27%) | 660,000 (-27%) |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Transceivers | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | Reduced count (Arria 10 660K variant) | Reduced count (Arria 10 660K variant) | Reduced count (Arria 10 660K variant) |
| Speed Grade | 2 | 1 (slower ~10%) | 1 (E suffix = enhanced) | 2 | 1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (E suffix) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest LE density in the Arria 10 GX family (vs 10AX066N2F40E1SG)
- 24 transceivers at 17.4 Gbps per channel (vs 10AX090N2F40I1SG)
- Hardened IEEE 754 floating-point DSP blocks (vs Cyclone 10 GX)
Design Notes
The 1517-ball FCBGA package dissipates up to 35W under typical 100G Ethernet workload. Estimated: with all 24 transceivers active and fabric utilization around 70%, thermal resistance theta_JA of approximately 0.4 C/W with a properly attached cold plate or high-performance heatsink is required to keep junction temperature below the 100C industrial limit. Mount a thermal interface material (TIM) with conductivity >=3 W/mK between the FCBGA lid and heatsink, and populate a thermal via array on the PCB thermal pad with 0.5 mm pitch filled vias to inner copper planes.
Place all 0.9V core and 1.8V/3.3V auxiliary decoupling capacitors within 100 mils of their respective power pins, using a mix of 1uF, 0.1uF, and 0.01uF values to cover broadband switching noise. Use stripline layers for all 24 high-speed serial channels with 100-ohm differential impedance and continuous reference planes on both sides of the trace. Avoid routing any signal layer directly under the BGA escape region; keep the top two layers dedicated to BGA break-out and decoupling, and route out from layer 3 onward.
Do not assume that all 10AX devices in the same F40 package share the same pinout: the 'N' prefix denotes a non-volatile configuration option that can change transceiver lane assignments. Verify the exact pinout against the Arria 10 device pinout file (.pin) for your specific ordering code before PCB layout. Also, ensure power-on-reset (POR) sequencing follows Intel's reference design - the 0.9V core must reach 90% of nominal before the 1.8V rail reaches 0.7V, otherwise the device can latch up and require a full power cycle to recover.
For 17.4 Gbps backplane operation, use Intel's Transceiver Toolkit in Quartus Prime to perform pre-emphasis and equalization tuning. Each channel's CTLE and DFE settings must be calibrated per channel using a PRBS31 pattern and a reference BERT. Maintain at least 3dB margin in the eye opening at the receiver to compensate for temperature drift across the industrial operating range. If the design uses an external retimer PHY, ensure the trace length between FPGA TX and retimer RX is less than 8 inches to avoid reflections.
Compliance Information
RoHS and REACH compliance per Intel Arria 10 product page. AEC-Q100 is not applicable (FPGA, not automotive-grade IC). Industrial temperature grade (-40C to +100C) is indicated by 'I' suffix in MPN.
