10AX115S3F45I2SG - Arria 10 GX FPGA 1150K LE, 1932-FCBGA | Intel
部品番号: 10AX115S3F45I2SG ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2470 | $247,000.00 |
| 500 | $2245 | $1,122,500.00 |
| 1,000 | $2020 | $2,020,000.00 |
10AX115S3F45I2SG 概要
An FPGA is a reprogrammable integrated circuit whose logic fabric, interconnect, block RAM, DSP blocks, and I/O can be configured by the user after manufacture. FPGAs sit above general-purpose microcontrollers in performance and below ASICs in unit cost, making them the standard choice for prototyping, low-volume production, and designs requiring hardware-level parallelism. The Arria 10 GX family specifically targets applications that combine high-speed serial transceivers, moderate logic density, and hard floating-point DSP blocks.
Key features include 1,150,000 logic elements, 24 high-speed transceivers with data rates up to 14.1 Gbps (suitable for PCIe Gen3 x4, 10 GbE, and CPRI), dual-core ARM Cortex-A9 hard processor subsystem options in the SoC variants, 8-input adaptive logic modules (ALMs), 1,728 18x19 multipliers, and 24 fractional PLLs. The device is rated for industrial temperature operation (-40C to +100C) and supports both 0.85 V core and 0.9 V core voltage options. Hard memory controllers support DDR3, DDR4, QDR IV, and RLDRAM III external memories.
The Arria 10 architecture uses a heterogeneous fabric combining ALMs, M20K block RAM blocks, DSP blocks with hard IEEE 754 floating-point support, and a routing interconnect optimized for timing closure. The transceiver tiles are physically distributed for signal integrity at multi-gigabit speeds, and the device includes hardened PCIe Gen3 IP blocks plus 100 GbE MAC and Reed-Solomon FEC cores in the higher-tier Arria 10 variants.
Typical applications include 4K video broadcast equipment, 100G OTN line cards, radar and electronic warfare signal processing, 5G baseband processing, medical imaging accelerators, high-performance computing (HPC) inference engines, test and measurement instrumentation, and ASIC prototyping. The 14.1 Gbps transceivers also support CPRI for 4G/5G fronthaul and 10 GbE backhaul aggregation.
When designing with the 10AX115S3F45I2SG, plan the PCB stack-up for the FC-BGA1932 package - typically a high-layer-count board (12+ layers) with microvia construction is required to escape the dense 1 mm pitch BGA. Power sequencing must follow the Intel / Altera Arria 10 power management guidelines; use a dedicated sequencer IC such as the LTC2974 or equivalent to ramp the 0.85 V core, 1.8 V I/O, and auxiliary rails in the correct order. Always refer to the official Intel Arria 10 datasheet and pin connection guidelines.
This page synthesizes distributor pricing, same-package (1932-FCBGA) same-family alternatives within the Intel FPGA portfolio, and practical design notes not found in a single distributor listing.
ドロップイン代替品: 10AX115S3F45I2SG — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10AX115S3F45I2SG （同一形状・フットプリント） — 相違点: Package, DSP Blocks, Speed Grade, Transceivers, Temperature Grade.
クイック比較ツール — 並列比較する代替部品を選択:
10AX115S3F45E2SG
✅ ドロップイン✓ 在庫あり
$6200 / 個
データシートを見る →10AX115S2F45I2SG
✅ ドロップイン✓ 在庫あり
$7100 / 個
データシートを見る →10AX115S3F45I2LG
✅ ドロップイン✓ 在庫あり
$13200 / 個
データシートを見る →10AX115N3F45I2SG
✅ ドロップイン✓ 在庫あり
$5200 / 個
データシートを見る →10AX115N4F45I3SG
✅ ドロップイン✓ 在庫あり
$4725 / 個
データシートを見る →10AX115S3F45I2SG 最大定格＆電気的特性
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (8,557 Kbit x 8) |
| Maximum User I/O | 624 |
| Transceivers | Up to 24 |
| Maximum Transceiver Data Rate | 14.1 Gbps |
| DSP Blocks | Hard IEEE 754 floating-point capable |
| Process Technology | 20 nm |
| パッケージ | 1932-ball FC-BGA, 45 x 45 mm, 1 mm pitch |
| Core Voltage | 0.85 V or 0.9 V (selectable) |
| Temperature Grade | Industrial (-40C to +100C) |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
| ピン数 | 1932 |
10AX115S3F45I2SG 1932-ball fc-bga, 45 x 45 mm, 1 mm pitch ピン配置ガイド
10AX115S3F45I2SG (1932-ball fc-bga, 45 x 45 mm, 1 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10AX115S3F45I2SG.
詳細は データシート をご参照ください。
主な用途
10AX115S3F45I2SG の用途: 6 件s: 4K Video Broadcast Equipment, 100G OTN / OTU Line Card, 5G Baseband / Fronthaul Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator, ASIC Prototyping Platform.
4K Video Broadcast Equipment
The 10AX115S3F45I2SG fits 4K broadcast pipeline designs because its 1.15M logic elements and 24 transceivers running at up to 14.1 Gbps provide both the parallel DSP headroom needed for multi-stream HEVC / AVC processing and the serial bandwidth for SMPTE ST 2022 / ST 2110 (10 GbE) transport. The hard memory controllers support the high-throughput external DDR4 buffers required between encode and decode stages. Industrial temperature grading makes it suitable for outdoor broadcast racks and air-conditioned control rooms alike. Unlike a discrete DSP + ASSP approach, the FPGA consolidates scaling, frame-rate conversion, and overlay compositing into a single reprogrammable device, while PCIe Gen3 hard IP enables direct attachment to host workstation capture cards.
おすすめ
100G OTN / OTU Line Card
The 10AX115S3F45I2SG fits 100G optical transport network line cards because its transceiver tiles deliver up to 14.1 Gbps per lane, allowing four lanes to carry an OTU4 payload with Reed-Solomon FEC implemented in hard logic. The 1.15M logic elements and 8,557 Kbits of block RAM provide the buffer and forwarding table capacity required for OTN cross-connect designs, while the hard PCIe Gen3 IP enables direct attachment to a switch fabric ASIC. Industrial temperature grading supports central-office environments. The Arria 10 architecture integrates 100 GbE MAC and FEC cores that engineers typically instantiate alongside OTN framing, reducing soft-logic area. Compared to a pure ASIC implementation, the FPGA allows late-stage feature additions such as new FEC algorithms without respin.
おすすめ
5G Baseband / Fronthaul Processing
The 10AX115S3F45I2SG fits 5G baseband and fronthaul processing because its 24 transceivers at up to 14.1 Gbps cover CPRI option 7 (9.8 Gbps) and option 8 (10.1 Gbps) for connecting to remote radio heads, plus 10 GbE for backhaul aggregation. The hard IEEE 754 floating-point DSP blocks and 1,728 18x19 multipliers accelerate FFT, channel estimation, and LDPC decoding workloads. Hardened DDR4 controllers support the massive tile buffers in massive-MIMO beamforming pipelines. Industrial temperature grading fits outdoor small-cell and rooftop macro deployments. The FPGA offers a reprogrammable upgrade path for evolving 3GPP releases, unlike fixed-function DSP ASSPs.
おすすめ
Radar and Electronic Warfare Signal Processing
The 10AX115S3F45I2SG fits radar and EW signal processing because its 1.15M logic elements combined with thousands of hard floating-point DSP blocks deliver the compute density required for pulse compression, MTI filtering, and direction-finding across wide instantaneous bandwidths. Transceivers at up to 14.1 Gbps accept digitized antenna signals from modern RF ADC/DAC ASICs such as the AD9234 or AD9164. Hard DDR4 controllers support large range-Doppler map buffers. Industrial temperature grading supports ground-mobile and shipboard platforms. The reprogrammable fabric allows algorithm updates as new emitter threats emerge, a key advantage over fixed-function radar ASICs.
おすすめ
Medical Imaging Accelerator
The 10AX115S3F45I2SG fits CT, MRI, and ultrasound imaging accelerators because its hard IEEE 754 floating-point DSP blocks and rich block RAM enable real-time back-projection, filtered back-projection, and beamforming pipelines. The 24 transceivers at up to 14.1 Gbps accept high-channel-count data from modern ultrasound transducers and digitizer ASICs, while hard DDR4 controllers handle the large intermediate frame buffers. Industrial temperature grading fits mobile C-arm and portable ultrasound carts. Engineers can re-tune reconstruction kernels for new imaging protocols without board respin, a key advantage over medical-imaging ASICs.
おすすめ
ASIC Prototyping Platform
The 10AX115S3F45I2SG fits multi-FPGA ASIC and SoC prototyping because its 1.15M logic elements can host large logic blocks of the design under test, while 24 transceivers at up to 14.1 Gbps form the chip-to-chip links that bridge partitioned dies across the prototyping board. Hard DDR3 / DDR4 controllers allow real-world memory verification before tape-out. Industrial temperature grading supports both lab and bring-up environments. The Arria 10 family is supported by Synopsys HAPS, Cadence Protium, and Mentor Veloce prototyping flows. Compared to custom ASIC verification, this FPGA-based approach cuts bring-up time from months to weeks and supports software development before silicon exists.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10AX115S3F45I2SG — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10AX115S3F45E2SG | 10AX115S2F45I2SG | 10AX115S3F45I2LG | 10AX115N3F45I2SG | 10AX115N4F45I3SG |
|---|---|---|---|---|---|---|
| Package | 1932-FCBGA (F45) 45 x 45 mm | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Maximum Transceiver Data Rate | 14.1 Gbps | 14.1 Gbps | 12.5 Gbps | 14.1 Gbps | 12.5 Gbps | 14.1 Gbps |
| Number of Transceivers | 24 | 24 | 24 | 24 | 24 | 24 |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial | Industrial | Industrial | Industrial |
| Speed Grade | 3 (14.1 Gbps transceiver) | 3 | 2 | 3 | 3 | 4 |
| Pin Count | 1932 | 1932 | 1932 | 1932 | 1932 | 1932 |
主な差別化要因
- Maximum 14.1 Gbps transceiver data rate in Arria 10 GX tier （vs 10AX115S2F45I2SG)
- Industrial temperature grade with full Arria 10 feature set （vs 10AX115S3F45E2SG)
- 1.15M logic elements in the same FC-BGA1932 package as smaller Arria 10 variants （vs 10AX115N3F45I2SG)
設計ノート
The 1932-ball FC-BGA package at 45 x 45 mm with 1 mm ball pitch requires a high-layer-count PCB (typically 12+ layers) with microvia / laser-drilled via construction to escape the dense BGA. Plan stack-up early and verify with the Intel / Altera Arria 10 package symbol and PCB design guidelines. Use buried capacitance layers under the FPGA core power region to improve PDN performance.
The Arria 10 GX FPGA requires sequenced power-up of the 0.85 V or 0.9 V core rail, 1.8 V I/O rail, PLL analog supplies, and transceiver supplies. Use a dedicated sequencer such as the LTC2974 or the Intel / Altera recommended sequencer topology. Decouple each supply pin with the capacitor values specified in the Arria 10 device family pin connection guidelines. Use a simulation tool (e.g., PDN analysis) to verify the impedance profile at the FPGA core rail frequency.
Route the 14.1 Gbps transceiver channels with controlled differential impedance (typically 100 ohm differential, 85 ohm common-mode) and length matching within the tolerance specified for the protocol (PCIe, 10 GbE, CPRI). Keep transceiver reference clock traces isolated, and provide a clean analog ground island. Follow Intel / Altera Arria 10 transceiver layout guidelines for via count, AC-coupling capacitor placement, and shielding.
Estimated: at industrial temperature, plan for the Arria 10 thermal envelope using the Intel / Altera PowerPlay early power estimator. With 24 transceivers active, a heat-spreader and forced-air cooling are typically required. For dense multi-FPGA ASIC prototyping boards, a heatsink with thermal interface material and chassis-level airflow is recommended.
Common pitfalls when designing with the 10AX115S3F45I2SG include: omitting the required PCIe reference clock termination, using wrong configuration mode (MSEL pin settings) which prevents Quartus Prime from detecting the device, and underrating the bulk decoupling on the core rail leading to PDN resonance. Always cross-check the Quartus Prime pinout assignments against the F45 package symbol and the pin connection guidelines document.
コンプライアンス情報
RoHS compliance indicated by 'G' suffix in the ordering code. REACH compliance per Intel / Altera declarations. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
