10AX115S3F45I2SG - Arria 10 GX FPGA 1150K LE, 1932-FCBGA | Intel
MPN: 10AX115S3F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2470 | $247,000.00 |
| 500 | $2245 | $1,122,500.00 |
| 1,000 | $2020 | $2,020,000.00 |
Drop-in alternatives for 10AX115S3F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115S3F45E2SG
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View Datasheet →10AX115S2F45I2SG
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View Datasheet →10AX115S3F45I2LG
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View Datasheet →10AX115N3F45I2SG
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View Datasheet →10AX115N4F45I3SG
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View Datasheet →10AX115S3F45I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (8,557 Kbit x 8) |
| Maximum User I/O | 624 |
| Transceivers | Up to 24 |
| Maximum Transceiver Data Rate | 14.1 Gbps |
| DSP Blocks | Hard IEEE 754 floating-point capable |
| Process Technology | 20 nm |
| Package | 1932-ball FC-BGA, 45 x 45 mm, 1 mm pitch |
| Core Voltage | 0.85 V or 0.9 V (selectable) |
| Temperature Grade | Industrial (-40C to +100C) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Number of Pins | 1932 |
10AX115S3F45I2SG 1932-ball fc-bga, 45 x 45 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for 10AX115S3F45I2SG (1932-ball fc-bga, 45 x 45 mm, 1 mm pitch package) with 1932 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115S3F45I2SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1932 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115S3F45I2SG is suitable for 6 applications: 4K Video Broadcast Equipment, 100G OTN / OTU Line Card, 5G Baseband / Fronthaul Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator, ASIC Prototyping Platform.
4K Video Broadcast Equipment
The 10AX115S3F45I2SG fits 4K broadcast pipeline designs because its 1.15M logic elements and 24 transceivers running at up to 14.1 Gbps provide both the parallel DSP headroom needed for multi-stream HEVC / AVC processing and the serial bandwidth for SMPTE ST 2022 / ST 2110 (10 GbE) transport. The hard memory controllers support the high-throughput external DDR4 buffers required between encode and decode stages. Industrial temperature grading makes it suitable for outdoor broadcast racks and air-conditioned control rooms alike. Unlike a discrete DSP + ASSP approach, the FPGA consolidates scaling, frame-rate conversion, and overlay compositing into a single reprogrammable device, while PCIe Gen3 hard IP enables direct attachment to host workstation capture cards.
Recommended
100G OTN / OTU Line Card
The 10AX115S3F45I2SG fits 100G optical transport network line cards because its transceiver tiles deliver up to 14.1 Gbps per lane, allowing four lanes to carry an OTU4 payload with Reed-Solomon FEC implemented in hard logic. The 1.15M logic elements and 8,557 Kbits of block RAM provide the buffer and forwarding table capacity required for OTN cross-connect designs, while the hard PCIe Gen3 IP enables direct attachment to a switch fabric ASIC. Industrial temperature grading supports central-office environments. The Arria 10 architecture integrates 100 GbE MAC and FEC cores that engineers typically instantiate alongside OTN framing, reducing soft-logic area. Compared to a pure ASIC implementation, the FPGA allows late-stage feature additions such as new FEC algorithms without respin.
Recommended
5G Baseband / Fronthaul Processing
The 10AX115S3F45I2SG fits 5G baseband and fronthaul processing because its 24 transceivers at up to 14.1 Gbps cover CPRI option 7 (9.8 Gbps) and option 8 (10.1 Gbps) for connecting to remote radio heads, plus 10 GbE for backhaul aggregation. The hard IEEE 754 floating-point DSP blocks and 1,728 18x19 multipliers accelerate FFT, channel estimation, and LDPC decoding workloads. Hardened DDR4 controllers support the massive tile buffers in massive-MIMO beamforming pipelines. Industrial temperature grading fits outdoor small-cell and rooftop macro deployments. The FPGA offers a reprogrammable upgrade path for evolving 3GPP releases, unlike fixed-function DSP ASSPs.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AX115S3F45I2SG fits radar and EW signal processing because its 1.15M logic elements combined with thousands of hard floating-point DSP blocks deliver the compute density required for pulse compression, MTI filtering, and direction-finding across wide instantaneous bandwidths. Transceivers at up to 14.1 Gbps accept digitized antenna signals from modern RF ADC/DAC ASICs such as the AD9234 or AD9164. Hard DDR4 controllers support large range-Doppler map buffers. Industrial temperature grading supports ground-mobile and shipboard platforms. The reprogrammable fabric allows algorithm updates as new emitter threats emerge, a key advantage over fixed-function radar ASICs.
Recommended
Medical Imaging Accelerator
The 10AX115S3F45I2SG fits CT, MRI, and ultrasound imaging accelerators because its hard IEEE 754 floating-point DSP blocks and rich block RAM enable real-time back-projection, filtered back-projection, and beamforming pipelines. The 24 transceivers at up to 14.1 Gbps accept high-channel-count data from modern ultrasound transducers and digitizer ASICs, while hard DDR4 controllers handle the large intermediate frame buffers. Industrial temperature grading fits mobile C-arm and portable ultrasound carts. Engineers can re-tune reconstruction kernels for new imaging protocols without board respin, a key advantage over medical-imaging ASICs.
Recommended
ASIC Prototyping Platform
The 10AX115S3F45I2SG fits multi-FPGA ASIC and SoC prototyping because its 1.15M logic elements can host large logic blocks of the design under test, while 24 transceivers at up to 14.1 Gbps form the chip-to-chip links that bridge partitioned dies across the prototyping board. Hard DDR3 / DDR4 controllers allow real-world memory verification before tape-out. Industrial temperature grading supports both lab and bring-up environments. The Arria 10 family is supported by Synopsys HAPS, Cadence Protium, and Mentor Veloce prototyping flows. Compared to custom ASIC verification, this FPGA-based approach cuts bring-up time from months to weeks and supports software development before silicon exists.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115S3F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115S3F45E2SG | 10AX115S2F45I2SG | 10AX115S3F45I2LG | 10AX115N3F45I2SG | 10AX115N4F45I3SG |
|---|---|---|---|---|---|---|
| Package | 1932-FCBGA (F45) 45 x 45 mm | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Maximum Transceiver Data Rate | 14.1 Gbps | 14.1 Gbps | 12.5 Gbps | 14.1 Gbps | 12.5 Gbps | 14.1 Gbps |
| Number of Transceivers | 24 | 24 | 24 | 24 | 24 | 24 |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial | Industrial | Industrial | Industrial |
| Speed Grade | 3 (14.1 Gbps transceiver) | 3 | 2 | 3 | 3 | 4 |
| Pin Count | 1932 | 1932 | 1932 | 1932 | 1932 | 1932 |
Key Differentiators
- Maximum 14.1 Gbps transceiver data rate in Arria 10 GX tier (vs 10AX115S2F45I2SG)
- Industrial temperature grade with full Arria 10 feature set (vs 10AX115S3F45E2SG)
- 1.15M logic elements in the same FC-BGA1932 package as smaller Arria 10 variants (vs 10AX115N3F45I2SG)
Design Notes
The 1932-ball FC-BGA package at 45 x 45 mm with 1 mm ball pitch requires a high-layer-count PCB (typically 12+ layers) with microvia / laser-drilled via construction to escape the dense BGA. Plan stack-up early and verify with the Intel / Altera Arria 10 package symbol and PCB design guidelines. Use buried capacitance layers under the FPGA core power region to improve PDN performance.
The Arria 10 GX FPGA requires sequenced power-up of the 0.85 V or 0.9 V core rail, 1.8 V I/O rail, PLL analog supplies, and transceiver supplies. Use a dedicated sequencer such as the LTC2974 or the Intel / Altera recommended sequencer topology. Decouple each supply pin with the capacitor values specified in the Arria 10 device family pin connection guidelines. Use a simulation tool (e.g., PDN analysis) to verify the impedance profile at the FPGA core rail frequency.
Route the 14.1 Gbps transceiver channels with controlled differential impedance (typically 100 ohm differential, 85 ohm common-mode) and length matching within the tolerance specified for the protocol (PCIe, 10 GbE, CPRI). Keep transceiver reference clock traces isolated, and provide a clean analog ground island. Follow Intel / Altera Arria 10 transceiver layout guidelines for via count, AC-coupling capacitor placement, and shielding.
Estimated: at industrial temperature, plan for the Arria 10 thermal envelope using the Intel / Altera PowerPlay early power estimator. With 24 transceivers active, a heat-spreader and forced-air cooling are typically required. For dense multi-FPGA ASIC prototyping boards, a heatsink with thermal interface material and chassis-level airflow is recommended.
Common pitfalls when designing with the 10AX115S3F45I2SG include: omitting the required PCIe reference clock termination, using wrong configuration mode (MSEL pin settings) which prevents Quartus Prime from detecting the device, and underrating the bulk decoupling on the core rail leading to PDN resonance. Always cross-check the Quartus Prime pinout assignments against the F45 package symbol and the pin connection guidelines document.
Compliance Information
RoHS compliance indicated by 'G' suffix in the ordering code. REACH compliance per Intel / Altera declarations. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
