10AX115N4F45I3SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
MPN: 10AX115N4F45I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6168.47 | $6,168.47 |
| 10 | $5800 | $58,000.00 |
| 25 | $5400 | $135,000.00 |
| 50 | $5050 | $252,500.00 |
| 100 | $4725 | $472,500.00 |
Drop-in alternatives for 10AX115N4F45I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115N4F45I3LG
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View Datasheet →10AX115N4F45E3LG
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View Datasheet →10AX115N4F40I3SG
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View Datasheet →10AX115N4F40I3LG
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View Datasheet →10AX115N3F45I2SG
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View Datasheet →10AX115N4F45I3SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| DSP Blocks | 1,518 (variable precision) |
| User I/O Pins | 768 |
| Transceivers | 24 (up to 17.4 Gbps) |
| Process Technology | 20 nm TSMC + 28 nm hard IP |
| Core Voltage | 0.85 V to 0.95 V (SmartVID) |
| Hard Memory Controllers | DDR4/3 and LPDDR3 |
| Hard PCIe Gen3 | x8 Gen3 (Gen2 x8 compatible) |
| Package | 1932-ball FC-FBGA |
| Temperature Grade | Industrial (-40C to +100C) |
| Configuration Device | Internal, supports serial/parallel flash |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Supply Voltage Range | 0.85 V to 0.95 V core |
10AX115N4F45I3SG 1932-ball fc-fbga Pin Configuration Guide
Complete pinout information for 10AX115N4F45I3SG (1932-ball fc-fbga package) with 768 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N4F45I3SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 768 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N4F45I3SG is suitable for 6 applications: 4K/8K Video Broadcast and Professional A/V, 100G/400G Networking Line Cards, Military Radar and Electronic Warfare, ASIC Prototyping and Emulation, Medical Imaging and Diagnostics, Industrial Automation and Robotics.
4K/8K Video Broadcast and Professional A/V
The 10AX115N4F45I3SG is well-suited to 4K/8K broadcast processing because its 1,150,000 logic elements and 1,518 DSP blocks handle multi-channel HEVC/H.264 codec, color-space conversion, and up/down/cross-conversion at 60 fps. Its 24 transceivers at up to 17.4 Gbps support SDI (SMPTE ST-2082/2081) over coaxial and 12G-SDI at scale, while the hard PCIe Gen3 x8 IP accelerates ingestion into host server PCs for playout. The device's 768 user I/Os accommodate multi-port SDI front ends, DDR4 frame buffers, and HDMI 2.0 outputs, with industrial-grade -40C to +100C operating range ensuring compliance with broadcast rack environments.
Recommended
100G/400G Networking Line Cards
In 100G and 400G line cards, the 10AX115N4F45I3SG serves as a programmable traffic manager and MAC aggregation device. Its 24 transceivers at 17.4 Gbps support 12.5G KR/KR4 backplanes and 10GbE uplinks, while 100G is built up via four 25G channels per port using external retimers. The hard PCIe Gen3 x8 IP connects the FPGA to a host CPU for SDN forwarding tables, and 68.86 Mbit embedded memory (about 8.4 MB) provides packet buffering at 10 GbE line rates. The device's industrial-grade operation ensures reliable line-card performance in climate-controlled data-center environments.
Recommended
Military Radar and Electronic Warfare
The 10AX115N4F45I3SG is well-suited to military radar and EW signal processing because its 1,518 DSP blocks deliver up to 1.5 TFLOPS of variable-precision arithmetic for pulse-Doppler, SAR, and digital-RF beamforming workloads. Transceivers at 17.4 Gbps accept wideband ADC samples for direct RF digitization, while 768 user I/Os interface with ADCs, DACs, and synchronous optical network links. The -40C to +100C industrial temperature range covers most defense platforms; for aerospace-grade requirements, MIL-PRF-38534 and MIL-STD-810 conformance must be verified at the board level, and Xilinx or Microsemi alternatives may also be considered.
Recommended
ASIC Prototyping and Emulation
For ASIC and SoC prototyping, the 10AX115N4F45I3SG offers 1,150,000 logic elements, which is sufficient for multi-million-gate ASICs partitioned across multiple FPGAs. The 24 transceivers enable chip-to-chip links at 17.4 Gbps, supporting gigabit-transceiver-class SoC interfaces such as DDR physical layers, SerDes, and high-speed serial I/O. Designers commonly use the same F45 package and pinout across prototypes for fast design iteration; companion products in the Arria 10 family provide lower-density drop-in options when prototypes must split logic across multiple devices for power or capacity reasons.
Recommended
Medical Imaging and Diagnostics
The 10AX115N4F45I3SG serves medical imaging accelerator boards such as CT, MRI, and ultrasound scanners because its 1.5 TFLOPS DSP throughput performs real-time image reconstruction (filtered back-projection, parallel MRI, beamforming) at patient-scan frame rates. The 24 transceivers accept raw data from high-channel-count ADCs and link to host PCs over PCIe Gen3 x8, while 768 user I/Os route video pipelines to display outputs. Industrial-grade operation ensures reliable performance in climate-controlled hospital and imaging-equipment environments; full IEC 60601-1 and ISO 13485 compliance must be addressed at the system level, not the FPGA alone.
Recommended
Industrial Automation and Robotics
The 10AX115N4F45I3SG is well-suited to industrial machine-vision and motion-control systems because its 1,150,000 logic elements and 1,518 DSP blocks perform real-time image classification, FFT-based vibration analysis, and multi-axis motion control in a single device. The 24 transceivers connect to camera-link, CoaXPress, and gigabit-Ethernet vision standards, while PCIe Gen3 x8 links to industrial PCs. Industrial-grade -40C to +100C operation ensures reliability in factory-floor enclosures, and the high pin count (768 user I/Os) supports multi-camera parallel processing without external I/O expanders.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N4F45I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N4F45I3LG | 10AX115N4F45E3LG | 10AX115N4F40I3SG | 10AX115N3F45I2SG | 10AX115N2F45I2SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FC-FBGA | 1932-ball FC-FBGA (same) | 1932-ball FC-FBGA (same) | 1932-ball FC-FBGA (same) | 1932-ball FC-FBGA (same) | 1932-ball FC-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O Pins | 768 | 768 | 768 | 768 | 768 | 768 |
| Transceivers | 24 up to 17.4 Gbps (N4) | 24 up to 17.4 Gbps (N4) | 24 up to 17.4 Gbps (N4) | 24 up to 17.4 Gbps (N4) | N3 configuration (reduced) | N2 configuration (lower) |
| Speed Grade | F45 | F45 | F45 | F40 | F45 | F45 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended | Industrial | Industrial | Industrial |
Key Differentiators
- Highest-density Arria 10 GX F45 package option (vs 10AX090N4F45I3LG (Arria 10 GX 090))
- Industrial temperature range -40C to +100C (vs 10AX115N4F45C3SG (commercial grade))
- Same-family pin compatibility with N3 and N2 transceiver variants (vs 10AX115N3F45I2SG)
Design Notes
The Arria 10 GX 115 uses a SmartVID multi-rail power supply scheme that typically delivers 0.85 V to 0.95 V core voltage with separate 0.9 V/1.8 V/2.5 V/3.3 V auxiliary rails. Estimated: typical board power is approximately 25 to 40 W at full transceiver utilization, peaking above 60 W in compute-heavy workloads. A 6-layer or 8-layer PCB with a dedicated power plane is recommended. Reference design AN-799 (Intel/Altera) provides recommended decoupling and bulk-capacitor values.
At 25 to 40 W typical dissipation, the 1932-ball FC-FBGA requires a heat sink with a thermal interface material such as Shin-Etsu X-23-7762 or equivalent. Theta-JA estimates for the FC-FBGA package are around 0.6 to 0.9 C/W with a heat sink; without one, junction temperatures exceed the 100C industrial limit. Forced airflow of 200 LFM is recommended in closed enclosures. Refer to the Arria 10 GX Thermal Management User Guide.
The 1932-ball FC-FBGA uses a 1.0 mm ball pitch with a staggered grid; a high-density interconnect PCB is mandatory. Estimated: PCB stack-up should be at least 12 layers with stacked-via / any-layer-via construction for the breakout region. Trace impedance targets: 50 ohm single-ended for GPIO, 85/100 ohm differential for transceivers and DDR4. Reference the device's pin-out file and Altera's PCB design guidelines.
Common pitfalls when designing with this device include: (1) omitting the SmartVID controller or feeding it incorrect VID values, causing the core voltage to be out of spec; (2) under-sizing the configuration flash - select a QSPI or parallel flash sized for at least 1.6x the bitstream size; (3) overlooking transceiver reference-clock jitter - use a low-jitter clock synthesizer such as a Si5345 or equivalent; (4) forgetting to enable signal-integrity-aware pin assignment in Quartus, leading to crosstalk.
For 17.4 Gbps transceivers, signal-integrity simulation is required. Use IBIS-AMI models from Intel to simulate channel loss; recommended PCB material is low-loss (Df ~ 0.008 at 5 GHz), e.g. Isola FR408HR or Megtron 6. Pre-emphasis and equalization settings must be tuned per channel; AC-coupled coupling capacitors (100 nF) are required on all high-speed serial links.
Compliance Information
RoHS and REACH compliance per Intel/Altera product declaration; AEC-Q100 is not applicable to FPGAs; conflict-minerals declaration compliant per Intel's CMRT filing. Halogen-free status not specified in available data.
