10CL025YU256A7G - Cyclone 10 LP FPGA 25K LE | Intel | 256-UBGA
部品番号: 10CL025YU256A7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.75 | $347.50 |
| 100 | $30.2 | $3,020.00 |
| 500 | $26.85 | $13,425.00 |
| 1,000 | $24.1 | $24,100.00 |
10CL025YU256A7G 概要
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic, signal processing, and interface functions by configuring an array of configurable logic blocks (CLBs), memory, multipliers, and I/O after manufacturing. FPGAs sit within the broader semiconductor hierarchy of digital ICs -> programmable logic -> programmable logic devices (PLDs). Cyclone 10 LP belongs to the low-cost, low-power FPGA segment positioned between CPLDs and mid-range FPGAs from Xilinx and Lattice.
Key features include a logic element count of 24,624, total embedded RAM of 608,256 bits, support for DDR3/DDR2/LPDDR2 external memory interfaces via soft IP, configurable high-speed LVDS transceivers in user I/O, and on-chip clock management with 4 PLLs. The device supports single-supply operation and a wide industrial temperature grade. The UBGA-256 package offers compact 17 mm x 17 mm body area with 1 mm ball pitch, enabling high board density for space-constrained applications.
The Cyclone 10 LP architecture uses a 4-input look-up table (LUT) based logic element with embedded memory bits and dedicated 18x18 multiplier blocks for DSP. Logic is routed via a multi-tier routing fabric; configuration is loaded from external flash via the standard active serial (AS) mode, JTAG, or passive serial (PS) modes. The device is designed for low static and dynamic power, with optional power management features such as clock gating per region and hot-socketing support.
Typical applications include industrial motor control and factory automation, video surveillance and image processing, portable medical devices, IoT edge nodes with custom sensor aggregation, low-cost software-defined radio front ends, and bridge/protocol converter boards. The combination of 25K logic elements, 150 user I/Os, and embedded multipliers makes it well-suited for parallel processing pipelines and medium-complexity glue logic between processors and peripherals.
When designing with this device, ensure your configuration flash memory matches the required AS configuration mode (typically EPCQ16 or larger), and follow the Intel Cyclone 10 LP pin connection guidelines for unused pins (typically tied to GND through a defined resistor configuration or left NC per device guidance). Power sequencing requires VCCINT and VCCA to ramp together within specification; consult the device handbook for tolerance.
This page synthesizes distributor pricing across at least three sources, drop-in same-package alternatives from the Cyclone 10 LP family, and practical design notes derived from the official Intel Cyclone 10 LP device handbook, providing information not aggregated on a single manufacturer or distributor page.
ドロップイン代替品: 10CL025YU256A7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10CL025YU256A7G （同一形状・フットプリント） — 相違点: Package, Family, Operating Temperature, Speed Grade, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
10CL025YU256C8G
✅ ドロップイン✓ 在庫あり
$32.54 / 個
データシートを見る →10CL025YU256I7G
✅ ドロップイン✓ 在庫あり
$44.5 / 個
データシートを見る →10CL025YU256C6G
✅ ドロップイン✓ 在庫あり
$25.6 / 個
データシートを見る →10CL025YU256A7G-Q
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
10CL025YU256A7G 最大定格＆電気的特性
| Family | Cyclone 10 LP |
| Logic Elements | 24,624 |
| Embedded Memory (bits) | 608,256 |
| Embedded 18x18 Multipliers | 66 |
| PLLs | 4 |
| User I/O Count | 150 |
| パッケージ | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm |
| Process Node | 60 nm |
| Operating Temperature Grade | Automotive / Industrial |
| Configuration Modes | AS, PS, JTAG |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
10CL025YU256A7G 17 mm x 17 mm ピン配置ガイド
10CL025YU256A7G (17 mm x 17 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10CL025YU256A7G.
詳細は データシート をご参照ください。
主な用途
10CL025YU256A7G の用途: 6 件s: Industrial Motor Control, Video Surveillance and Image Processing, IoT Edge Sensor Aggregation, Protocol Bridge and Converter Boards, Software-Defined Radio Front End, Portable Medical Device Control.
Industrial Motor Control
The 10CL025YU256A7G fits industrial motor control because its 66 embedded 18x18 multipliers can execute field-oriented control (FOC) math at PWM rates up to 50 kHz with single-cycle throughput. The 4 PLLs deliver precise phase-shifted clocks for multi-axis PWM generation, while 150 user I/Os accept quadrature encoder, Hall sensor, and resolver feedback channels simultaneously. According to the Cyclone 10 LP datasheet, the industrial temperature grade (-40C to +100C junction) ensures operation near motor drive stages. Placed between a microcontroller host and the power inverter, the FPGA handles current-loop math offloading while remaining deterministic - unlike a software MCU implementation that may stall under interrupt load.
おすすめ
Video Surveillance and Image Processing
The 10CL025YU256A7G serves video processing pipelines because its 24,624 logic elements and 66 multipliers can implement Sobel edge detection, motion estimation, or H.264 preprocessing at 720p/30fps. The 608 Kbit embedded RAM acts as line buffers without external memory, reducing BOM cost per the Cyclone 10 LP datasheet. The 150 I/Os accept parallel CMOS sensor interfaces and drive HDMI/DDR encoder chips via LVDS pairs. Used in a camera main board, the FPGA converts raw Bayer data to YUV while the host CPU handles networking - partitioning work by throughput capability rather than flexibility.
おすすめ
IoT Edge Sensor Aggregation
The 10CL025YU256A7G works in IoT edge nodes because its low static power (~25 mW at 100K LEs typical per the Cyclone 10 LP datasheet) is appropriate for battery or PoE-powered sensor hubs. The 150 I/Os aggregate multiple I2C/SPI/UART sensor buses into a single high-speed uplink (SPI or parallel) to a host processor. The 4 PLLs generate independent sensor-clock domains without external clock generators. Deployed in a smart-building controller, the FPGA samples 20+ sensor inputs while consuming less power than a software-only MCU running equivalent protocol stacks.
おすすめ
Protocol Bridge and Converter Boards
The 10CL025YU256A7G is ideal for protocol bridging because its logic density supports multiple concurrent protocol cores (UART, SPI, I2C, CAN, custom) in a single device. The 608 Kbit embedded memory provides FIFO buffering between mismatched data-rate interfaces without external SRAM. The 150 user I/Os accommodate multiple physical-layer transceivers simultaneously. According to the Cyclone 10 LP datasheet, hot-socketing support allows live insertion into backplanes. Used as an industrial bus bridge (e.g., CAN-to-Ethernet), the FPGA handles deterministic real-time protocol conversion while the host CPU focuses on application logic.
おすすめ
Software-Defined Radio Front End
The 10CL025YU256A7G supports SDR front ends because its 66 embedded 18x18 multipliers implement digital down-conversion (DDC) and channelization filters at baseband sample rates. The 4 PLLs derive ADC and DAC clocks with sub-ns jitter per the Cyclone 10 LP datasheet, while the 150 I/Os accept LVDS ADC data and drive LVDS DAC outputs directly. Embedded RAM serves as sample buffers between ADC capture and DSP blocks. Paired with a 12-14 bit ADC, the FPGA handles all baseband processing, leaving only protocol/MAC layers to a host processor.
おすすめ
Portable Medical Device Control
The 10CL025YU256A7G fits portable medical controllers because its low dynamic power (per the Cyclone 10 LP datasheet, typically 1.5-2x less than prior Cyclone generations) extends battery life in handheld patient monitors. The 66 multipliers execute real-time DSP for ECG/EEG signal conditioning and feature extraction. The 150 I/Os interface with color TFT displays, touch controllers, and multiple sensor front ends simultaneously. Used in a bedside monitor, the FPGA handles display refresh, button debouncing, and signal preprocessing while the application processor runs UI and network stacks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10CL025YU256A7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10CL025YU256C8G | 10CL025YU256I7G | 10CL025YU256C6G | 10CL025YU256A7G-Q |
|---|---|---|---|---|---|
| Package | 256-UBGA | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 24,624 | 24,624 (same die) | 24,624 (same die) | 24,624 (same die) | 24,624 (same die) |
| Embedded Memory (bits) | 608,256 | 608,256 | 608,256 | 608,256 | 608,256 |
| 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 |
| User I/O Count | 150 | 150 | 150 | 150 | 150 |
| Speed Grade | A7 (fastest automotive) | C8 (commercial, slower) | I7 (industrial) | C6 (slowest commercial) | A7 (same) |
| Temperature Grade | Automotive / Industrial | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Automotive |
主な差別化要因
- UBGA-256 package compatibility across the entire speed-grade matrix （vs 10CL025YU256C8G / C6G / I7G)
- 150 user I/Os in a compact 17x17 mm package （vs 10CL016YM164A7G)
- Cyclone 10 LP low-power architecture with 25 mW typical static power （vs Cyclone IV E 10CL025 variants)
設計ノート
The Cyclone 10 LP device requires multiple supply rails: VCCINT (core), VCCA (PLL analog), VCCD_PLL (PLL digital), and VCCIO (I/O banks). Per the device handbook, VCCINT and VCCA must ramp within a defined window or the device may latch. Use a power sequencer or tie enable lines to enforce correct sequencing. Decoupling: place 0.1uF X7R ceramic capacitors adjacent to every supply pin, plus bulk 47-100uF tantalum or polymer capacitors near the device.
The 256-UBGA package has a 1.0 mm ball pitch requiring 4-6 layer PCB with microvia or via-in-pad construction for reliable assembly. Per Intel layout guidelines, route signals on inner layers with matched impedance for high-speed LVDS pairs. Provide a solid ground plane on layer 2 directly beneath the device to control return paths for the high-speed I/O and minimize EMI. Thermal vias under the package center (12-16 vias, 0.3 mm drill) improve heat dissipation for high-utilization designs.
Common pitfalls with Cyclone 10 LP BGA designs: (1) Unused pin configuration - per Intel guidelines, leave unused user I/Os as tri-stated inputs with weak pull-up enabled; do not tie to ground or power unless explicitly required. (2) Configuration mode selection - confirm MSEL[2:0] strap pins match the desired AS/PS/JTAG mode before PCB layout, as rework is expensive on BGA. (3) JTAG chain - include a 10K pull-up on TCK per the device handbook to avoid spurious configuration during reset.
コンプライアンス情報
RoHS compliance per Intel product page. AEC-Q100 grade not explicitly confirmed in verified web data. Lead-free (Pb-free) assembly confirmed by UBGA package compatibility with lead-free reflow profiles.
