EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
部品番号: EP3C5U256C6N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $39.86 | $39.86 |
| 10 | $36.5 | $365.00 |
| 100 | $32.1 | $3,210.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $25.4 | $25,400.00 |
EP3C5U256C6N 概要
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic.
Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes.
The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources.
Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment.
When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.
ドロップイン代替品: EP3C5U256C6N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3C5U256C6N （同一形状・フットプリント） — 相違点: Process Technology, Speed Grade, Package, Configuration Modes, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP3C5U256C6
✅ ドロップイン✓ 在庫あり
$10.85 / 個
データシートを見る →EP3C5U256A7N
✅ ドロップイン✓ 在庫あり
$16.2 / 個
データシートを見る →EP3C10U256C6N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP3C16U256C8N
✅ ドロップイン✓ 在庫あり
$48.4 / 個
データシートを見る →EP3C25U256I7N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP3C5U256C6N 最大定格＆電気的特性
| Series | Cyclone III |
| Device Family | Cyclone III FPGA |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Embedded Memory | 423,936 bits |
| Maximum User I/Os | 182 |
| パッケージ | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 14 x 14 mm |
| Ball Pitch | 0.80 mm |
| Package Height | 2.20 mm |
| Speed Grade | C6 |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 60 nm low-power CMOS |
| 実装タイプ | Surface Mount (BGA) |
| Lead Free / RoHS | Yes / Compliant |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel |
EP3C5U256C6N ピン構成
| ピン A1 | I/O — User I/O (bank 1) |
| ピン A2 | I/O — User I/O (bank 1) |
| ピン A3 | I/O — User I/O (bank 1) |
| ピン A4 | VCCIO1 — I/O bank 1 supply voltage |
| ピン A5 | I/O — User I/O (bank 1) |
| ピン A6 | I/O — User I/O (bank 1) |
| ピン A7 | I/O — User I/O (bank 1) |
| ピン A8 | VCCIO1 — I/O bank 1 supply voltage |
| ピン B1 | I/O — User I/O (bank 1) |
| ピン B2 | GND — Ground |
| ピン B3 | I/O — User I/O (bank 1) |
| ピン B4 | I/O — User I/O (bank 1) |
| ピン B5 | GND — Ground |
| ピン B6 | I/O — User I/O (bank 1) |
| ピン B7 | I/O — User I/O (bank 1) |
| ピン B8 | GND — Ground |
| ピン C1 | VCCINT — Core logic supply voltage (1.2V) |
| ピン C2 | I/O — User I/O (bank 2) |
| ピン C3 | VCCIO2 — I/O bank 2 supply voltage |
| ピン C4 | I/O — User I/O (bank 2) |
| ピン C5 | I/O — User I/O (bank 2) |
| ピン C6 | VCCIO2 — I/O bank 2 supply voltage |
| ピン C7 | I/O — User I/O (bank 2) |
| ピン C8 | VCCINT — Core logic supply voltage (1.2V) |
| ピン D1 | I/O — User I/O (bank 2) |
| ピン D2 | GND — Ground |
| ピン D3 | I/O — User I/O (bank 2) |
| ピン D4 | TCK — JTAG Test Clock |
| ピン D5 | TDO — JTAG Test Data Out |
| ピン D6 | I/O — User I/O (bank 2) |
| ピン D7 | GND — Ground |
| ピン D8 | I/O — User I/O (bank 2) |
| ピン E1 | VCCIO3 — I/O bank 3 supply voltage |
| ピン E2 | I/O — User I/O (bank 3) |
| ピン E3 | I/O — User I/O (bank 3) |
| ピン E4 | TMS — JTAG Test Mode Select |
| ピン E5 | TDI — JTAG Test Data In |
| ピン E6 | I/O — User I/O (bank 3) |
| ピン E7 | I/O — User I/O (bank 3) |
| ピン E8 | VCCIO3 — I/O bank 3 supply voltage |
| ピン F1 | I/O — User I/O (bank 3) |
| ピン F2 | GND — Ground |
| ピン F3 | I/O — User I/O (bank 3) |
| ピン F4 | I/O — User I/O (bank 3) |
| ピン F5 | nCONFIG — Configuration control (active low) |
| ピン F6 | GND — Ground |
| ピン F7 | I/O — User I/O (bank 3) |
| ピン F8 | I/O — User I/O (bank 3) |
| ピン G1 | VCCINT — Core logic supply voltage (1.2V) |
| ピン G2 | I/O — User I/O (bank 4) |
| ピン G3 | VCCIO4 — I/O bank 4 supply voltage |
| ピン G4 | CONF_DONE — Configuration done status (open-drain) |
| ピン G5 | nSTATUS — Configuration status (open-drain) |
| ピン G6 | VCCIO4 — I/O bank 4 supply voltage |
| ピン G7 | I/O — User I/O (bank 4) |
| ピン G8 | VCCINT — Core logic supply voltage (1.2V) |
| ピン H1 | I/O — User I/O (bank 4) |
| ピン H2 | GND — Ground |
| ピン H3 | I/O — User I/O (bank 4) |
| ピン H4 | I/O — User I/O (bank 4) |
| ピン H5 | GND — Ground |
| ピン H6 | I/O — User I/O (bank 4) |
| ピン H7 | I/O — User I/O (bank 4) |
| ピン H8 | GND — Ground |
| ピン J1 | VCCIO5 — I/O bank 5 supply voltage |
| ピン J2 | I/O — User I/O (bank 5) |
| ピン J3 | I/O — User I/O (bank 5) |
| ピン J4 | CLK0 — Clock input 0 (dedicated) |
| ピン J5 | CLK1 — Clock input 1 (dedicated) |
| ピン J6 | I/O — User I/O (bank 5) |
| ピン J7 | I/O — User I/O (bank 5) |
| ピン J8 | VCCIO5 — I/O bank 5 supply voltage |
| ピン K1 | I/O — User I/O (bank 5) |
| ピン K2 | GND — Ground |
| ピン K3 | I/O — User I/O (bank 5) |
| ピン K4 | I/O — User I/O (bank 5) |
| ピン K5 | GND — Ground |
| ピン K6 | I/O — User I/O (bank 5) |
| ピン K7 | GND — Ground |
| ピン K8 | I/O — User I/O (bank 5) |
| ピン L1 | VCCINT — Core logic supply voltage (1.2V) |
| ピン L2 | I/O — User I/O (bank 6) |
| ピン L3 | VCCIO6 — I/O bank 6 supply voltage |
| ピン L4 | I/O — User I/O (bank 6) |
| ピン L5 | I/O — User I/O (bank 6) |
| ピン L6 | VCCIO6 — I/O bank 6 supply voltage |
| ピン L7 | I/O — User I/O (bank 6) |
| ピン L8 | VCCINT — Core logic supply voltage (1.2V) |
| ピン M1 | I/O — User I/O (bank 6) |
| ピン M2 | GND — Ground |
| ピン M3 | I/O — User I/O (bank 6) |
| ピン M4 | I/O — User I/O (bank 6) |
| ピン M5 | GND — Ground |
| ピン M6 | I/O — User I/O (bank 6) |
| ピン M7 | I/O — User I/O (bank 6) |
| ピン M8 | GND — Ground |
| ピン N1 | VCCIO7 — I/O bank 7 supply voltage |
| ピン N2 | I/O — User I/O (bank 7) |
| ピン N3 | I/O — User I/O (bank 7) |
| ピン N4 | I/O — User I/O (bank 7) |
| ピン N5 | I/O — User I/O (bank 7) |
| ピン N6 | I/O — User I/O (bank 7) |
| ピン N7 | I/O — User I/O (bank 7) |
| ピン N8 | VCCIO7 — I/O bank 7 supply voltage |
| ピン P1 | I/O — User I/O (bank 7) |
| ピン P2 | GND — Ground |
| ピン P3 | I/O — User I/O (bank 7) |
| ピン P4 | I/O — User I/O (bank 8) |
| ピン P5 | GND — Ground |
| ピン P6 | I/O — User I/O (bank 8) |
| ピン P7 | I/O — User I/O (bank 8) |
| ピン P8 | GND — Ground |
| ピン R1 | VCCINT — Core logic supply voltage (1.2V) |
| ピン R2 | I/O — User I/O (bank 8) |
| ピン R3 | VCCIO8 — I/O bank 8 supply voltage |
| ピン R4 | I/O — User I/O (bank 8) |
| ピン R5 | I/O — User I/O (bank 8) |
| ピン R6 | VCCIO8 — I/O bank 8 supply voltage |
| ピン R7 | I/O — User I/O (bank 8) |
| ピン R8 | VCCINT — Core logic supply voltage (1.2V) |
| ピン T1 | I/O — User I/O (bank 8) |
| ピン T2 | GND — Ground |
| ピン T3 | I/O — User I/O (bank 8) |
| ピン T4 | I/O — User I/O (bank 8) |
| ピン T5 | GND — Ground |
| ピン T6 | I/O — User I/O (bank 8) |
| ピン T7 | I/O — User I/O (bank 8) |
| ピン T8 | GND — Ground |
| ピン U1 | DATA0 — Configuration data (AS/PS mode) |
| ピン U2 | I/O — User I/O (bank 8) |
| ピン U3 | I/O — User I/O (bank 8) |
| ピン U4 | MSEL0 — Configuration mode select 0 |
| ピン U5 | MSEL1 — Configuration mode select 1 |
| ピン U6 | I/O — User I/O (bank 8) |
| ピン U7 | I/O — User I/O (bank 8) |
| ピン U8 | DCLK — Configuration clock input |
| ピン V1 | I/O — User I/O (bank 8) |
| ピン V2 | GND — Ground |
| ピン V3 | I/O — User I/O (bank 8) |
| ピン V4 | I/O — User I/O (bank 8) |
| ピン V5 | GND — Ground |
| ピン V6 | I/O — User I/O (bank 8) |
| ピン V7 | GND — Ground |
| ピン V8 | I/O — User I/O (bank 8) |
| ピン W1 | VCCA_PLL1 — PLL1 analog supply (2.5V) |
| ピン W2 | I/O — User I/O (bank 8) |
| ピン W3 | VCCIO8 — I/O bank 8 supply voltage |
| ピン W4 | I/O — User I/O (bank 8) |
| ピン W5 | nCE — Chip enable (active low) |
| ピン W6 | VCCIO8 — I/O bank 8 supply voltage |
| ピン W7 | I/O — User I/O (bank 8) |
| ピン W8 | GNDA_PLL1 — PLL1 analog ground |
| ピン Y1 | I/O — User I/O (bank 8) |
| ピン Y2 | GND — Ground |
| ピン Y3 | I/O — User I/O (bank 8) |
| ピン Y4 | I/O — User I/O (bank 8) |
| ピン Y5 | GND — Ground |
| ピン Y6 | I/O — User I/O (bank 8) |
| ピン Y7 | I/O — User I/O (bank 8) |
| ピン Y8 | GND — Ground |
主な用途
EP3C5U256C6N の用途: 6 件s: Industrial Motor Control, Video Surveillance / Display Bridging, Telecommunications Line Card Glue Logic, Low-Cost ASIC Replacement, USB and Connectivity Bridging, Embedded Control Logic in Factory Automation.
Industrial Motor Control
The EP3C5U256C6N is well-suited for industrial motor control applications where precise timing and flexible I/O configuration are essential. Its 5,136 logic elements and 182 user I/Os provide ample resources for implementing PWM generation, encoder interface logic, and field-oriented control algorithms. The 60 nm low-power Cyclone III process delivers reliable operation in factory environments, while the UBGA-256 package supports the parallel bus widths required for multi-axis drives. Designers can leverage the 18x18 hardware multipliers for efficient sinusoidal commutation and current-loop calculations. Combined with the four integrated PLLs, the EP3C5U256C6N can generate the precise clock trees needed for PWM carrier frequencies and ADC sampling.
おすすめ
Video Surveillance / Display Bridging
The EP3C5U256C6N excels in video bridging applications where camera sensors, displays, and processors must be interconnected with format conversion and timing adjustment. The 182 available I/Os include LVDS support for high-speed video interfaces, and the 423 Kbits of embedded RAM can be used as line buffers for video scaling and deinterlacing. Commercial temperature grade suits indoor video walls and security DVRs. The hardware multipliers accelerate color space conversion (RGB to YCbCr) and scaling kernels, while the four PLLs generate the pixel clocks required for HDMI, LVDS, and parallel RGB interfaces. Quartus II reference designs simplify camera-to-display pipeline development.
おすすめ
Telecommunications Line Card Glue Logic
Telecommunications line cards require programmable glue logic to interface between SERDES, network processors, and backplane connectors, and the EP3C5U256C6N fits this role with its 182 LVCMOS/LVDS/SSTL I/Os. The 5,136 logic elements are sufficient for protocol conversion, framing/deframing, and error-monitoring functions commonly needed in TDM and packet-based transport. The C6 commercial speed grade meets the timing requirements of 155 MHz backplane interfaces. Multiple I/O banks support mixed voltage standards (1.5V, 1.8V, 2.5V, 3.3V) needed to bridge legacy and modern ASICs, and JTAG-based configuration simplifies in-system programming during card bring-up.
おすすめ
Low-Cost ASIC Replacement
The EP3C5U256C6N is widely used as a low-cost ASIC replacement for medium-complexity glue logic, state machines, and protocol bridges where ASIC NRE is unjustified. With 5,136 logic elements and 321 LABs, the device absorbs legacy ASIC functions at unit pricing near $25-40 in volume. Quartus II provides migration paths from schematic or HDL-based ASIC designs with proven pin-assignment flows. Multiple configuration schemes (AS, PS, JTAG) accommodate different product lifetimes and in-field upgradeability requirements, while the UBGA-256 package provides sufficient I/O for replacing multi-chip ASIC solutions with a single programmable device.
おすすめ
USB and Connectivity Bridging
Embedded systems often require bridging between USB, UART, SPI, I2C, and parallel buses, and the EP3C5U256C6N provides sufficient logic and I/O to act as a flexible connectivity bridge. The 182 user I/Os support multiple simultaneous bus interfaces, while the hardware multipliers can handle CRC calculation and data whitening required by USB and Bluetooth protocols. Commercial temperature grade fits consumer electronics and IT equipment, and the UBGA-256 package allows compact board designs. Designers can leverage Quartus reference designs for USB 2.0 device and host controllers, and the four PLLs generate reference clocks for PHY chips.
おすすめ
Embedded Control Logic in Factory Automation
Factory automation equipment requires deterministic control logic for sensor aggregation, actuator control, and safety interlocks, and the EP3C5U256C6N delivers these functions in a single chip. Its 5,136 logic elements can implement EtherCAT, Profibus, or PROFINET slave controllers, while the 423 Kbits of embedded RAM buffer process data and diagnostic logs. Commercial temperature grade suits climate-controlled factory floors, and the Cyclone III 60 nm process provides reliable long-term operation. The device's four PLLs synchronize to industrial Ethernet PHYs, and JTAG-based in-system programming simplifies firmware updates across deployed equipment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3C5U256C6N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3C5U256C6 | EP3C5U256A7N | EP3C10U256C6N | EP3C16U256C8N | EP3C25U256I7N |
|---|---|---|---|---|---|---|
| Package | 256-UBGA (14x14 mm, 0.80 mm pitch) | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Speed Grade | C6 | C6 | A7 (faster) | C6 | C8 (slower) | I7 (industrial) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits | 608,256 bits |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes (Pb-free) | No (Pb-containing) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
主な差別化要因
- Lowest-density Cyclone III in UBGA-256 footprint with C6 speed grade （vs EP3C10U256C6N)
- C6 commercial speed grade optimized for cost-sensitive designs （vs EP3C5U256A7N)
- Commercial temperature grade with RoHS-compliant Pb-free ball finish （vs EP3C25U256I7N)
設計ノート
The EP3C5U256C6N requires three supply rails: VCCINT (1.2V core), VCCIOx (per-bank I/O supply, 1.5V-3.3V depending on standards), and VCCA_PLLx (2.5V analog supply for each PLL). Place 0.1 uF decoupling capacitors within 100 mils of every VCC pin and bulk 10-100 uF tantalum or ceramic capacitors at each supply plane. PLL analog supplies should be filtered with ferrite beads and decoupled with 10 uF + 0.1 uF to minimize jitter. Estimated core current at 100 MHz toggle activity is ~150 mA, rising with logic utilization and clock frequency.
The 256-ball UBGA package uses 0.80 mm ball pitch requiring microvia or via-in-pad PCB technology for reliable assembly. Escape routing on inner layers should use 0.4-0.5 mm trace/space and 8-12 mil laser-drilled microvias. Stencil aperture of 1:1 with 4-5 mil reduction produces consistent solder joints. Per IPC-7093, BGA packages require X-ray inspection after reflow and BGA rework capability is recommended for prototype builds.
Differential pairs (LVDS) require 100 ohm differential impedance with matched trace lengths within 20 mil. CLK0/CLK1 dedicated clock inputs should be routed with controlled impedance and isolated from switching signals. Use full ground planes on all layers adjacent to BGA breakout traces; avoid power plane splits beneath the device. JTAG chain (TCK, TMS, TDI, TDO) should be kept short and protected with series termination if chain length exceeds 4 inches.
Configuration mode pins (MSEL0, MSEL1, MSEL2) must match the desired configuration scheme - incorrect MSEL settings cause configuration failure. nCONFIG must see a clean rising edge with appropriate RC time constant (typically 1k resistor + 0.1 uF cap). CONF_DONE and nSTATUS are open-drain and require external 10k pull-ups to VCCIO. Do not leave JTAG pins floating during normal operation if JTAG is unused - tie TCK low and TMS high per IEEE 1149.1.
コンプライアンス情報
RoHS and REACH compliant per Cyclone III product family documentation. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for commercial-grade FPGAs. Conflict-minerals compliance per Intel program-level disclosures.
