10CL025YU256A7G - Cyclone 10 LP FPGA 25K LE | Intel | 256-UBGA
MPN: 10CL025YU256A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.75 | $347.50 |
| 100 | $30.2 | $3,020.00 |
| 500 | $26.85 | $13,425.00 |
| 1,000 | $24.1 | $24,100.00 |
Drop-in alternatives for 10CL025YU256A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL025YU256C8G
✅ Drop-In✓ In Stock
$32.54 / Unit
View Datasheet →10CL025YU256I7G
✅ Drop-In✓ In Stock
$44.5 / Unit
View Datasheet →10CL025YU256C6G
✅ Drop-In✓ In Stock
$25.6 / Unit
View Datasheet →10CL025YU256A7G-Q
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10CL025YU256A7G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements | 24,624 |
| Embedded Memory (bits) | 608,256 |
| Embedded 18x18 Multipliers | 66 |
| PLLs | 4 |
| User I/O Count | 150 |
| Package | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | 17 mm x 17 mm |
| Ball Pitch | 1.0 mm |
| Process Node | 60 nm |
| Operating Temperature Grade | Automotive / Industrial |
| Configuration Modes | AS, PS, JTAG |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
10CL025YU256A7G 17 mm x 17 mm Pin Configuration Guide
Complete pinout information for 10CL025YU256A7G (17 mm x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL025YU256A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL025YU256A7G is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, IoT Edge Sensor Aggregation, Protocol Bridge and Converter Boards, Software-Defined Radio Front End, Portable Medical Device Control.
Industrial Motor Control
The 10CL025YU256A7G fits industrial motor control because its 66 embedded 18x18 multipliers can execute field-oriented control (FOC) math at PWM rates up to 50 kHz with single-cycle throughput. The 4 PLLs deliver precise phase-shifted clocks for multi-axis PWM generation, while 150 user I/Os accept quadrature encoder, Hall sensor, and resolver feedback channels simultaneously. According to the Cyclone 10 LP datasheet, the industrial temperature grade (-40C to +100C junction) ensures operation near motor drive stages. Placed between a microcontroller host and the power inverter, the FPGA handles current-loop math offloading while remaining deterministic - unlike a software MCU implementation that may stall under interrupt load.
Recommended
Video Surveillance and Image Processing
The 10CL025YU256A7G serves video processing pipelines because its 24,624 logic elements and 66 multipliers can implement Sobel edge detection, motion estimation, or H.264 preprocessing at 720p/30fps. The 608 Kbit embedded RAM acts as line buffers without external memory, reducing BOM cost per the Cyclone 10 LP datasheet. The 150 I/Os accept parallel CMOS sensor interfaces and drive HDMI/DDR encoder chips via LVDS pairs. Used in a camera main board, the FPGA converts raw Bayer data to YUV while the host CPU handles networking - partitioning work by throughput capability rather than flexibility.
Recommended
IoT Edge Sensor Aggregation
The 10CL025YU256A7G works in IoT edge nodes because its low static power (~25 mW at 100K LEs typical per the Cyclone 10 LP datasheet) is appropriate for battery or PoE-powered sensor hubs. The 150 I/Os aggregate multiple I2C/SPI/UART sensor buses into a single high-speed uplink (SPI or parallel) to a host processor. The 4 PLLs generate independent sensor-clock domains without external clock generators. Deployed in a smart-building controller, the FPGA samples 20+ sensor inputs while consuming less power than a software-only MCU running equivalent protocol stacks.
Recommended
Protocol Bridge and Converter Boards
The 10CL025YU256A7G is ideal for protocol bridging because its logic density supports multiple concurrent protocol cores (UART, SPI, I2C, CAN, custom) in a single device. The 608 Kbit embedded memory provides FIFO buffering between mismatched data-rate interfaces without external SRAM. The 150 user I/Os accommodate multiple physical-layer transceivers simultaneously. According to the Cyclone 10 LP datasheet, hot-socketing support allows live insertion into backplanes. Used as an industrial bus bridge (e.g., CAN-to-Ethernet), the FPGA handles deterministic real-time protocol conversion while the host CPU focuses on application logic.
Recommended
Software-Defined Radio Front End
The 10CL025YU256A7G supports SDR front ends because its 66 embedded 18x18 multipliers implement digital down-conversion (DDC) and channelization filters at baseband sample rates. The 4 PLLs derive ADC and DAC clocks with sub-ns jitter per the Cyclone 10 LP datasheet, while the 150 I/Os accept LVDS ADC data and drive LVDS DAC outputs directly. Embedded RAM serves as sample buffers between ADC capture and DSP blocks. Paired with a 12-14 bit ADC, the FPGA handles all baseband processing, leaving only protocol/MAC layers to a host processor.
Recommended
Portable Medical Device Control
The 10CL025YU256A7G fits portable medical controllers because its low dynamic power (per the Cyclone 10 LP datasheet, typically 1.5-2x less than prior Cyclone generations) extends battery life in handheld patient monitors. The 66 multipliers execute real-time DSP for ECG/EEG signal conditioning and feature extraction. The 150 I/Os interface with color TFT displays, touch controllers, and multiple sensor front ends simultaneously. Used in a bedside monitor, the FPGA handles display refresh, button debouncing, and signal preprocessing while the application processor runs UI and network stacks.
Recommended
Recommended Products Summary
Engineering reference data for 10CL025YU256A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL025YU256C8G | 10CL025YU256I7G | 10CL025YU256C6G | 10CL025YU256A7G-Q |
|---|---|---|---|---|---|
| Package | 256-UBGA | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 24,624 | 24,624 (same die) | 24,624 (same die) | 24,624 (same die) | 24,624 (same die) |
| Embedded Memory (bits) | 608,256 | 608,256 | 608,256 | 608,256 | 608,256 |
| 18x18 Multipliers | 66 | 66 | 66 | 66 | 66 |
| User I/O Count | 150 | 150 | 150 | 150 | 150 |
| Speed Grade | A7 (fastest automotive) | C8 (commercial, slower) | I7 (industrial) | C6 (slowest commercial) | A7 (same) |
| Temperature Grade | Automotive / Industrial | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Automotive |
| Unit Price (qty 1) | $38.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- UBGA-256 package compatibility across the entire speed-grade matrix (vs 10CL025YU256C8G / C6G / I7G)
- 150 user I/Os in a compact 17x17 mm package (vs 10CL016YM164A7G)
- Cyclone 10 LP low-power architecture with 25 mW typical static power (vs Cyclone IV E 10CL025 variants)
Design Notes
The Cyclone 10 LP device requires multiple supply rails: VCCINT (core), VCCA (PLL analog), VCCD_PLL (PLL digital), and VCCIO (I/O banks). Per the device handbook, VCCINT and VCCA must ramp within a defined window or the device may latch. Use a power sequencer or tie enable lines to enforce correct sequencing. Decoupling: place 0.1uF X7R ceramic capacitors adjacent to every supply pin, plus bulk 47-100uF tantalum or polymer capacitors near the device.
The 256-UBGA package has a 1.0 mm ball pitch requiring 4-6 layer PCB with microvia or via-in-pad construction for reliable assembly. Per Intel layout guidelines, route signals on inner layers with matched impedance for high-speed LVDS pairs. Provide a solid ground plane on layer 2 directly beneath the device to control return paths for the high-speed I/O and minimize EMI. Thermal vias under the package center (12-16 vias, 0.3 mm drill) improve heat dissipation for high-utilization designs.
Common pitfalls with Cyclone 10 LP BGA designs: (1) Unused pin configuration - per Intel guidelines, leave unused user I/Os as tri-stated inputs with weak pull-up enabled; do not tie to ground or power unless explicitly required. (2) Configuration mode selection - confirm MSEL[2:0] strap pins match the desired AS/PS/JTAG mode before PCB layout, as rework is expensive on BGA. (3) JTAG chain - include a 10K pull-up on TCK per the device handbook to avoid spurious configuration during reset.
Compliance Information
RoHS compliance per Intel product page. AEC-Q100 grade not explicitly confirmed in verified web data. Lead-free (Pb-free) assembly confirmed by UBGA package compatibility with lead-free reflow profiles.
