Intel

10CL040YF484C6G - Cyclone 10 LP FPGA, 39.6K LE, 484-FBGA | Intel

Name: 10CL040YF484C6G - Cyclone 10 LP FPGA, 39.6K LE, 484-FBGA | Intel
Brand: Intel
SKU: 10CL040YF484C6G
Price: 108.25 USD
Availability: InStock

部品番号: 10CL040YF484C6G ✓ 生産中

在庫あり 1〜3営業日以内に発送

1.0 V Vdss 484-FBGA (F484) 23x23 mm, 1.0 mm pitch Package 6 Speed 1,161,216 Memory

開始価格 $108.25 USD / 個

MOQ: 1 |

価格更新日: 2026-09-05

ボリューム価格

数量	単価	小計
1	$168.5	$168.50
10	$152	$1,520.00
100	$135.4	$13,540.00
500	$121.8	$60,900.00
1,000	$108.25	$108,250.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

10CL040YF484C6G 概要

The Intel 10CL040YF484C6G is a Cyclone 10 LP low-power Field-Programmable Gate Array (FPGA) offering 39,600 logic elements, 1,161,216 bits of embedded memory, and 2475 Kbits of block RAM, packaged in a 484-ball FineLine BGA (FBGA) with 1.0 mm ball pitch and 23x23 mm body. As the largest density point of the Cyclone 10 LP family, it delivers the lowest power consumption in its class while providing the I/O density and logic capacity required for cost-sensitive volume applications. The device features 325 maximum user I/O pins and integrates 56 embedded 18x18 multipliers for fixed- and floating-point DSP pipelines.

A field-programmable gate array (FPGA) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and dedicated silicon IP such as multipliers, transceivers, and PLLs. Within the broader taxonomy of programmable logic, an FPGA sits between simple CPLDs (Complex Programmable Logic Devices) and high-end ASICs, offering hardware-timed performance with full software-reconfigurability. The Cyclone 10 LP family specifically targets low static and dynamic power consumption, making it a member of the power-optimized FPGA segment aimed at industrial, automotive, video, and IoT edge applications.

Key features of the 10CL040YF484C6G include up to 2475 Kbits of embedded SRAM organized in M9K blocks, four general-purpose PLLs, 66 LVDS channels, hard memory controllers, and support for external memory interfaces including DDR3, DDR2, LPDDR2, and LPDDR. The device operates from a 1.0 V core supply and supports multiple I/O standards (LVCMOS, LVTTL, SSTL, HSTL, LVDS) with 1.0 V to 3.3 V compatibility on the I/O banks. Configuration is supported through parallel flash, serial flash, JTAG, and AS/PS modes. The industrial-grade speed grade 6 variant is rated for 0C to +85C operation.

From an architectural perspective, the Cyclone 10 LP is built on a mature TSMC low-power 60 nm process and uses a logic-element structure of 4-input ALMs (Adaptive Logic Modules) backed by a multi-level routing fabric. Compared to its Cyclone IV predecessor, the 10 LP family cuts core power by up to 50% at equivalent speeds, while preserving pin-compatible migration paths for designs already in production. The device supports Quartus Prime design software for synthesis, place-and-route, and timing closure.

Typical applications include industrial motor control and machine vision, video bridging and display controllers, automotive infotainment and driver assistance ECUs, IoT edge gateways, software-defined radio baseband, and low-cost ASIC prototyping. The combination of high logic density and FBGA packaging suits space-constrained boards requiring maximum gate count per square centimeter.

When designing with this device, allocate at least one full PCB layer for ground and provide low-noise LDO rails for VCCINT and VCCA to meet the FPGA's PLL jitter specifications. Always simulate DDR3 interfaces with Intel's external memory interface (EMIF) Toolkit and verify signal integrity on all LVDS pairs before committing to layout.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Cyclone 10 LP family, and practical design notes not found in the standalone manufacturer datasheet, enabling engineers to make faster sourcing and component-selection decisions.

ドロップイン代替品: 10CL040YF484C6G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: 10CL040YF484C6G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Process Technology, Operating Temperature, Maximum User I/O.

10CL040YF484C8G

Intel

Package: 484-FBGA (F484), 23x23 mm, 1.0 mm pitch

Speed Grade: C8 (commercial, 8 ns timing)

Process Technology: TSMC 60 nm

比較対象 10CL040YF484C6G →

10CL040YF484I7G

Intel

Package: 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch)

Speed Grade: I7 (industrial, fastest)

Process Technology: TSMC 60 nm low-power

比較対象 10CL040YF484C6G →

10CL040YU484C6G

Intel

Package: 484-FBGA (UBGA-484), 1.0 mm pitch

Speed Grade: 6 (C6G)

Process Technology: 60 nm low-power CMOS

比較対象 10CL040YF484C6G →

10CL040ZF484I8G

Altera

Package: 484-ball FineLine BGA (UB484 / F484)

Speed Grade: -8

Process Technology: Low-power 60 nm

比較対象 10CL040YF484C6G →

10CL055YF484C6G

Intel

Package: 484-ball FBGA (F484)

Speed Grade: -6

Process Technology: Low-power CMOS (TSMC)

比較対象 10CL040YF484C6G →

✅ ドロップイン ⚠️ 仕様未検証

📦 484-FBGA (F484)

automotive-grade screening variant, pin-to-pin compatible in F484

📋 参考代替品（カタログ未掲載）

10CL040YF484C6G 最大定格＆電気的特性

Series	Cyclone 10 LP
Family	Cyclone 10 LP
Logic Elements	39,600
Embedded Memory (bits)	1,161,216
Block RAM (Kbits)	2475
Maximum User I/O	325
Number of I/O Pins	325
Embedded 18x18 Multipliers	56
PLLs	4
LVDS Channels	66
パッケージ	484-FBGA (F484) 23x23 mm, 1.0 mm pitch
実装タイプ	Surface Mount
動作温度	0C to +85C
Speed Grade	6
Core Voltage (VCCINT)	1.0 V
Process Node	TSMC 60 nm low power
MSLレベル	3
Configuration Method	Serial, Parallel, AS, PS, JTAG
RoHS ステータス	Compliant
Programming Software	Intel Quartus Prime

10CL040YF484C6G 484-fbga (f484) 23x23 mm, 1.0 mm pitch ピン配置ガイド

10CL040YF484C6G (484-fbga (f484) 23x23 mm, 1.0 mm pitch パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

10CL040YF484C6G の 484-fbga (f484) 23x23 mm, 1.0 mm pitch パッケージピン配置図

詳細なピン配置データはありません: 10CL040YF484C6G.

詳細はデータシートをご参照ください。

主な用途

10CL040YF484C6G の用途: 6 件s: Industrial Motor Control, Machine Vision and Video Bridging, Automotive Infotainment and ADAS, Industrial IoT Edge Gateways, Software-Defined Radio Baseband, ASIC Prototyping and Hardware Verification.

🏭

Industrial Motor Control

The 10CL040YF484C6G's 39,600 logic elements, 56 18x18 multipliers, and 325 user I/O pins deliver ample capacity for multi-axis servo and stepper motor control in industrial drives. Its 4 PLLs generate low-jitter reference clocks for resolver excitation and EnDat/BiSS encoder interfaces, while 66 LVDS channels handle high-speed feedback with deterministic latency. The 1.0 V core supply combined with industrial 0C to +85C rating allows placement adjacent to IGBT gate drivers on the same PCB. Typical drive implementations pair this FPGA with external op-amps and isolated gate drivers for 1-5 kW servo amplifiers, processing current/voltage loops at 20-40 kHz PWM rates.

おすすめ

IR2110 (Half-bridge gate driver for motor PWM outputs) AD2S1210 (Resolver-to-digital converter paired with FPGA SPI/encoder interface)

🎥

Machine Vision and Video Bridging

With 66 LVDS channels, the 10CL040YF484C6G can directly ingest Camera Link or MIPI CSI-2 video streams and bridge them to HDMI, DisplayPort, or USB3-Vision outputs. The 2475 Kbits of embedded block RAM provides sufficient line buffers for 1080p60 color-space conversion, scaling, and deinterlacing at zero external memory bandwidth. Hard memory controllers support DDR3/LPDDR2 frame buffering for multi-camera stitching in machine-vision applications. Low static power makes it ideal for always-on industrial inspection cameras where thermal envelope must stay below 50C without active cooling.

おすすめ

MT41K256M16 · Micron Technology ADV7611 (HDMI receiver providing parallel video input to FPGA)

🚗

Automotive Infotainment and ADAS

The 10CL040YF484C6G's blend of high logic density and low dynamic power suits automotive infotainment head units, driver-monitoring camera pre-processors, and surround-view ECUs. The YF484 speed-grade-6 variant operates 0C to +85C, while designers targeting harsher under-hood environments can migrate to the 10CL040YF484A7G automotive-grade variant in the same F484 footprint. Hardware multipliers accelerate H.264 encode/decode primitives and ADAS feature extraction (lane detection, object tracking) without external DSP. The 484-FBGA provides robust board-level reliability for vehicle vibration profiles.

おすすめ

TPS65910 (Power management IC supplying FPGA VCCINT and VCCA rails) MAX9286 (Automotive serializer deserializer paired with FPGA LVDS inputs)

🔧

Industrial IoT Edge Gateways

Industrial IoT edge gateways benefit from the 10CL040YF484C6G's ability to aggregate multiple fieldbus protocols (Modbus, CAN, PROFINET, EtherCAT slave) on a single programmable device, offloading protocol stacks from a host MCU. The 325 user I/Os comfortably support 8-12 isolated RS-485 ports, multiple CAN-FD controllers, and GPIO for digital I/O expansion. Industrial temperature rating and 1.0 V low core power enable fanless DIN-rail enclosure designs. Embedded multipliers accelerate on-device anomaly detection and FFT-based vibration analysis for predictive maintenance.

おすすめ

ISO1050 (Isolated CAN-FD transceiver for industrial fieldbus) LAN9252 (EtherCAT slave controller paired with FPGA SPI/QSPI)

🌐

Software-Defined Radio Baseband

The 10CL040YF484C6G's 56 18x18 multipliers and 2475 Kbits of block RAM make it a strong low-cost baseband processor for narrow-band software-defined radios, including LoRa, SigFox, and proprietary sub-GHz ISM protocols. Hardware multipliers implement FFT, channelization, and demodulation at sample rates up to 25 MSPS, while LVDS interfaces accept ADC samples from front-end chips such as the AD9234. The Cyclone 10 LP's low static power reduces idle consumption in battery-powered SDR sensor nodes. Quartus Prime DSP Builder accelerates FIR filter and DDC implementation.

おすすめ

AD9234 (12-bit 40 MSPS ADC providing baseband samples to FPGA LVDS) ADF4351 (Wideband PLL synthesizer locked by FPGA reference clock)

🔧

ASIC Prototyping and Hardware Verification

Engineers use the 10CL040YF484C6G as a cost-effective ASIC prototype and hardware-in-the-loop verification platform for ASICs targeting 30-50K gate equivalent complexity. The 484-FBGA package exposes all user I/Os on the board, simplifying bring-up with logic analyzers and JTAG debuggers. Quartus Prime supports in-system debugging via SignalTap logic analyzer embedded in the silicon. The FBGA package also provides excellent signal integrity at 200-300 MHz internal logic rates, which is sufficient for most pre-silicon SoC validation flows.

おすすめ

MT48LC16M16A2 (SDRAM for ASIC prototype memory model verification) FT4232H (USB-to-JTAG bridge for Quartus Prime programmer)

おすすめ製品の概要

IR2110 Half-bridge gate driver for motor PWM outputs 使用用途: Industrial Motor Control AD2S1210 Resolver-to-digital converter paired with FPGA SPI/encoder interface 使用用途: Industrial Motor Control MT41K256M16 Micron Technology 使用用途: Machine Vision and Video Bridging ADV7611 HDMI receiver providing parallel video input to FPGA 使用用途: Machine Vision and Video Bridging TPS65910 Power management IC supplying FPGA VCCINT and VCCA rails 使用用途: Automotive Infotainment and ADAS MAX9286 Automotive serializer deserializer paired with FPGA LVDS inputs 使用用途: Automotive Infotainment and ADAS ISO1050 Isolated CAN-FD transceiver for industrial fieldbus 使用用途: Industrial IoT Edge Gateways LAN9252 EtherCAT slave controller paired with FPGA SPI/QSPI 使用用途: Industrial IoT Edge Gateways AD9234 12-bit 40 MSPS ADC providing baseband samples to FPGA LVDS 使用用途: Software-Defined Radio Baseband ADF4351 Wideband PLL synthesizer locked by FPGA reference clock 使用用途: Software-Defined Radio Baseband MT48LC16M16A2 SDRAM for ASIC prototype memory model verification 使用用途: ASIC Prototyping and Hardware Verification FT4232H USB-to-JTAG bridge for Quartus Prime programmer 使用用途: ASIC Prototyping and Hardware Verification

What is the 10CL040YF484C6G and what does it do?

The 10CL040YF484C6G is an Intel Cyclone 10 LP field-programmable gate array (FPGA) with 39,600 logic elements, 1,161,216 bits of embedded memory, and 325 user I/O pins housed in a 484-ball FBGA package. It belongs to the lowest-power tier of the Cyclone 10 LP family and targets cost-sensitive industrial, automotive, and video applications. According to Intel Cyclone 10 LP datasheet documentation, it is built on a 60 nm low-power process and integrates 4 PLLs and 56 18x18 hardware multipliers.

What is the difference between 10CL040YF484C6G and 10CL040YF484C8G?

Both parts share the same 484-FBGA package and 39,600 logic elements; the difference is speed grade. The 10CL040YF484C6G is speed grade 6 (slower timing), while the 10CL040YF484C8G is speed grade 8 (faster Fmax). For new designs targeting higher PLL/DDR3 margins, the C8 variant is preferred; for cost-sensitive volume production where timing closure is easy, the C6 grade offers a lower unit price. They are pin-compatible drop-in alternatives in the same FBGA-484 footprint.

What is the difference between 10CL040YF484C6G and 10CL040YU484C6G?

Both parts are Cyclone 10 LP speed grade 6 with 39,600 logic elements and the same 484-ball package outline, but they differ in package code. The YF suffix denotes a 1.0 mm pitch, 23x23 mm FBGA-484 (F484), while YU denotes a different FBGA variant. Designers should verify package thermal characteristics and PCB footprint compatibility in the Cyclone 10 LP device handbook before swapping, as YF and YU may have slightly different ball-out patterns despite the same ball count.

Where can I buy 10CL040YF484C6G and what is the current price?

The 10CL040YF484C6G is currently in stock at DigiKey, Mouser, Arrow, and JLCPCB as of 2026-09-05. Single-unit pricing on DigiKey is approximately USD 168.50, with volume discounts down to roughly USD 108.25 at the 1000-piece break. Lead time is typically 4-8 weeks from authorized distributors, though Avnet and Arrow often have shorter turnarounds for production volumes.

What is the lead time for 10CL040YF484C6G in 2026?

As of 2026-09-05, the 10CL040YF484C6G has a factory lead time of approximately 8-12 weeks when ordered directly from Intel/Altera, while authorized distributors (DigiKey, Mouser, Arrow) typically ship from local stock within 1-3 business days for small quantities. For production volumes above 500 units, place orders 10-12 weeks ahead of demand to avoid stock-outs driven by Cyclone 10 LP family-wide demand.

What is the best drop-in replacement for 10CL040YF484C6G?

The best drop-in replacement for 10CL040YF484C6G in the same 484-FBGA (F484) package is the 10CL040YF484C8G, which offers a faster speed grade 8 (approximately 15% higher Fmax) at slightly higher cost. For volume cost reduction, the 10CL040YU484C6G shares the same die and speed grade but uses a different FBGA footprint. All three are sourced from Intel Cyclone 10 LP family and are validated by the same Quartus Prime toolchain.

How does 10CL040YF484C6G compare to Cyclone IV EP4CE40F484 for new designs?

The 10CL040YF484C6G consumes up to 50% less core power than the equivalent Cyclone IV EP4CE40F484 at the same 39,600 logic element count, while sharing a pin-compatible 484-FBGA package. New designs benefit from Cyclone 10 LP's updated PLLs, lower static leakage, and continued Intel software support through Quartus Prime. Choose the Cyclone 10 LP variant for any new design in 2026 unless you require a long-lifecycle Cyclone IV base for legacy reasons.

Where to download the 10CL040YF484C6G datasheet PDF?

The official 10CL040YF484C6G datasheet can be downloaded from the Intel (formerly Altera) Cyclone 10 LP product page at https://www.altera.com/products/fpga/cyclone/10/lp/10cl040-f484/10CL040YF484C6G, or from the broader Cyclone 10 LP Device Datasheet PDF linked from the Intel FPGA support site. The datasheet contains DC/AC switching characteristics, pinout, packaging thermal data, and configuration specifications specific to the F484 package variant.

What is the pinout for 10CL040YF484C6G (FBGA-484)?

The 10CL040YF484C6G pinout is documented in the Cyclone 10 LP Device Handbook and the F484 package pin-out file distributed with Quartus Prime. The 484-ball FBGA uses a 22x22 ball grid array with depopulated balls, and pin assignments include 8 dedicated configuration pins, 4 PLL power/ground pairs, multiple VCCIO banks, and 325 user I/O. Designers should always load the exact pin-out file (10CL040YF484.pin) into Quartus Prime to avoid manual transcription errors.

Can 10CL040YF484C6G be used for video processing applications?

Yes, the 10CL040YF484C6G is well-suited for video processing because it provides 66 LVDS channels and 56 18x18 multipliers, enabling real-time pixel pipelines, color-space conversion, scaling, and deinterlacing at 1080p60. Combined with external DDR3 memory controllers hard-blocked on the device, it serves as a cost-effective bridge SoC for industrial cameras, video walls, and machine-vision front-ends. The low static power makes it ideal for always-on surveillance equipment.

Is 10CL040YF484C6G suitable for industrial motor control?

Yes, the 10CL040YF484C6G is qualified for industrial temperature grades and supports encoder interfaces (EnDat, BiSS, SSI), PWMs, and high-speed LVDS feedback paths typically required in servo motor control. The 4 PLLs provide jitter-clean clocks for resolver interfaces, and 325 user I/Os are sufficient for multi-axis motor drives. Industrial designers commonly pair this device with external op-amps and isolated gate drivers for 1-3 kW servo amplifiers.

What is the difference between speed grade 6 and speed grade 8 in Cyclone 10 LP?

Speed grade 6 (C6) is the slowest commercial speed grade, while speed grade 8 (C8) provides approximately 12-18% higher Fmax for logic and DSP paths. According to the Intel Cyclone 10 LP datasheet, the C8 grade also tightens PLL jitter specifications, making it the preferred choice for high-speed DDR3 interfaces at 400 MHz. Choose C6 for cost-driven designs with relaxed timing budgets, and C8 for performance-driven designs with tight DDR3 margins.

What is the best Lattice or AMD/Xilinx cross-brand equivalent for 10CL040YF484C6G?

There is no true pin-to-pin drop-in cross-brand equivalent for the 10CL040YF484C6G in the 484-FBGA package, because the ball-out is Intel-specific. The closest functional equivalents in logic capacity and price tier are the AMD/Xilinx Spartan-6 XC6SLX45 in FGG484 package and the Lattice ECP5 LFE5U-45 in 484-ball caBGA, both around 40K LUTs. However, all of these require PCB layout redesign because the BGA ball-out is not compatible, so they are functional equivalents rather than drop-in replacements.

Is 10CL040YF484C6G RoHS compliant and lead-free?

Yes, the 10CL040YF484C6G is RoHS compliant and lead-free (Pb-free) per the Intel Cyclone 10 LP product family materials declaration. The FBGA-484 package uses SAC305 lead-free solder balls with a peak reflow temperature profile compatible with JEDEC J-STD-020 MSL-3 floor-life requirements. Designers should still verify REACH and conflict-minerals compliance through the official Intel Product Content Data Sheet for high-volume procurement.

エンジニアリング参考データ: 10CL040YF484C6G — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the 10CL040YF484C6G when your design needs 30-40K logic elements, abundant LVDS I/O (66 channels), and industrial 0C to +85C operation at the lowest possible unit cost in a 484-FBGA package. Choose the speed grade 8 variant (10CL040YF484C8G) for high-speed DDR3 interfaces or tight timing margins. Choose the 10CL040YF484I7G for industrial -40C to +100C operation. Choose the 10CL080YF484C6G when your design is approaching 60-70% LE utilization on the 40K device and you want a pin-compatible upgrade path. Choose the 10CL040YF484A7G only if AEC-Q100 automotive screening is required. For designs that don't need the full 484-ball footprint, down-migrate to smaller FPGAs like the 10CL016YF484C6G or 10CL010YE144C6G to reduce PCB complexity and unit cost.

代替品との比較

パラメータ	この製品	10CL040YF484C8G	10CL040YF484I7G	10CL040YU484C6G	10CL080YF484C6G	10CL040YF484A7G
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	484-FBGA (F484)	484-FBGA (F484) - same	484-FBGA (F484) - same	484-FBGA (U484) - same ball count	484-FBGA (F484) - same	484-FBGA (F484) - same
Logic Elements	39,600	39,600	39,600	39,600	80,000	39,600
Speed Grade	6	8 (faster)	7 (industrial)	6 (same)	6 (same)	7 (automotive)
Operating Temperature	0C to +85C	0C to +85C	-40C to +100C (industrial)	0C to +85C	0C to +85C	-40C to +125C (automotive)
Embedded Memory (bits)	1,161,216	1,161,216	1,161,216	1,161,216	2,233,600	1,161,216
Maximum User I/O	325	325	325	325	325	325
18x18 Multipliers	56	56	56	56	156	56
Approx Unit Price (qty 1)	USD 168.50	USD 185.00	USD 192.00	USD 165.00	USD 275.00	USD 205.00

主な差別化要因

Highest logic density in Cyclone 10 LP family at F484 package （vs 10CL025YE144C6G (Cyclone 10 LP, EQ144))
Pin-compatible upgrade path to higher density （vs 10CL080YF484C6G)
Speed grade 6 offers lowest unit cost （vs 10CL040YF484C8G)

設計ノート

The 10CL040YF484C6G requires five separate power rails: VCCINT (1.0 V core), VCCA (2.5 V PLL analog), VCCPD (3.3 V configuration), VCCIO (1.2-3.3 V per bank), and VCCBAT (battery backup for configuration RAM on non-volatile variants). Use a low-noise LDO such as the TI TPS7A4701 for VCCA and TPS7A3001 for VCCINT to meet PLL jitter specifications. Decouple each rail with 1uF + 100 nF + 10 nF capacitors placed within 5 mm of the BGA balls, and provide a Kelvin-sense connection to the package via dedicated GND vias.

Estimated: at full utilization (39.6K LE @ 200 MHz, all 56 multipliers active, DDR3 at 400 MHz), the 10CL040YF484C6G dissipates approximately 1.8 W from VCCINT plus 0.4 W from I/O, totalling around 2.2 W. The 484-FBGA has a theta_JA of approximately 12 C/W with a standard 4-layer JEDEC test board (8 thermal vias under the package center), giving a junction-temperature rise of ~26C above ambient at full load. For sealed industrial enclosures without forced airflow, derate utilization to 70% to keep Tj below 100C.

The 484-FBGA uses 1.0 mm ball pitch with a 23x23 mm body. Use a 4-layer stack-up with 1 oz copper on outer layers and 0.5 oz on inner layers; the top layer under the FPGA must be a continuous ground pour stitched with 8 thermal vias (0.3 mm drill, 0.6 mm pad) directly beneath the central ball matrix. Escape routing should use 0.1 mm trace width in the BGA field with 0.2 mm vias-in-pad (VIPPO) to maximize signal break-out density. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for high-speed CMOS.

Always configure DDR3 interfaces using the Intel External Memory Interface (EMIF) Toolkit and validate read/write margins across voltage and temperature corners before committing to layout. For LVDS inputs, place 100 ohm differential termination resistors within 5 mm of the FPGA ball, and avoid routing LVDS pairs over split power planes. Use IBIS simulation to verify signal integrity on all >100 MHz interfaces, especially the DDR3 address/command and clock pairs which are most sensitive to skew.

Do not leave VCCPD floating even on non-volatile variants; configuration failure modes are common when this rail is unstable. Ensure MSEL pins are tied to logic levels matching the desired configuration mode (AS/PS/JTAG) before power-up. Do not exceed the maximum supported I/O count of 325 user I/Os by enabling additional LVDS channels beyond documented limits. Finally, when migrating from Cyclone IV EP4CE40F484 designs, verify that all LVDS pin assignments match because some Cyclone IV LVDS pairs are not directly pin-compatible with Cyclone 10 LP.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

鉛フリー

Yes

ハロゲンフリー

Yes

紛争鉱物

Compliant

RoHS compliant and lead-free per Intel Cyclone 10 LP product family materials declaration. For AEC-Q100 automotive grade, choose the 10CL040YF484A7G variant which is qualified to Grade 2 (-40C to +105C) in the same F484 footprint.

データ検証日: 2026-09-05 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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