10CL040YF484C6G - Cyclone 10 LP FPGA, 39.6K LE, 484-FBGA | Intel
N.º da peça: 10CL040YF484C6G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $168.5 | $168,50 |
| 10 | $152 | $1.520,00 |
| 100 | $135.4 | $13.540,00 |
| 500 | $121.8 | $60.900,00 |
| 1.000 | $108.25 | $108.250,00 |
10CL040YF484C6G Visão geral
A field-programmable gate array (FPGA) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and dedicated silicon IP such as multipliers, transceivers, and PLLs. Within the broader taxonomy of programmable logic, an FPGA sits between simple CPLDs (Complex Programmable Logic Devices) and high-end ASICs, offering hardware-timed performance with full software-reconfigurability. The Cyclone 10 LP family specifically targets low static and dynamic power consumption, making it a member of the power-optimized FPGA segment aimed at industrial, automotive, video, and IoT edge applications.
Key features of the 10CL040YF484C6G include up to 2475 Kbits of embedded SRAM organized in M9K blocks, four general-purpose PLLs, 66 LVDS channels, hard memory controllers, and support for external memory interfaces including DDR3, DDR2, LPDDR2, and LPDDR. The device operates from a 1.0 V core supply and supports multiple I/O standards (LVCMOS, LVTTL, SSTL, HSTL, LVDS) with 1.0 V to 3.3 V compatibility on the I/O banks. Configuration is supported through parallel flash, serial flash, JTAG, and AS/PS modes. The industrial-grade speed grade 6 variant is rated for 0C to +85C operation.
From an architectural perspective, the Cyclone 10 LP is built on a mature TSMC low-power 60 nm process and uses a logic-element structure of 4-input ALMs (Adaptive Logic Modules) backed by a multi-level routing fabric. Compared to its Cyclone IV predecessor, the 10 LP family cuts core power by up to 50% at equivalent speeds, while preserving pin-compatible migration paths for designs already in production. The device supports Quartus Prime design software for synthesis, place-and-route, and timing closure.
Typical applications include industrial motor control and machine vision, video bridging and display controllers, automotive infotainment and driver assistance ECUs, IoT edge gateways, software-defined radio baseband, and low-cost ASIC prototyping. The combination of high logic density and FBGA packaging suits space-constrained boards requiring maximum gate count per square centimeter.
When designing with this device, allocate at least one full PCB layer for ground and provide low-noise LDO rails for VCCINT and VCCA to meet the FPGA's PLL jitter specifications. Always simulate DDR3 interfaces with Intel's external memory interface (EMIF) Toolkit and verify signal integrity on all LVDS pairs before committing to layout.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Cyclone 10 LP family, and practical design notes not found in the standalone manufacturer datasheet, enabling engineers to make faster sourcing and component-selection decisions.
Alternativas drop-in para 10CL040YF484C6G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL040YF484C6G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Operating Temperature, Maximum User I/O.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL040YF484C8G
✅ Drop-In✓ Em estoque
$39.8 / unidade
Ver ficha técnica →10CL040YF484I7G
✅ Drop-In✓ Em estoque
$29.74 / unidade
Ver ficha técnica →10CL040YU484C6G
✅ Drop-In✓ Em estoque
$24.1 / unidade
Ver ficha técnica →10CL080YF484C6G
✅ Drop-In✓ Em estoque
$124 / unidade
Ver ficha técnica →10CL040YF484A7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10CL040YF484C6G Classificações máximas e características elétricas
| Series | Cyclone 10 LP |
| Family | Cyclone 10 LP |
| Logic Elements | 39,600 |
| Embedded Memory (bits) | 1,161,216 |
| Block RAM (Kbits) | 2475 |
| Maximum User I/O | 325 |
| Number of I/O Pins | 325 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| LVDS Channels | 66 |
| Encapsulamento | 484-FBGA (F484) 23x23 mm, 1.0 mm pitch |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +85C |
| Speed Grade | 6 |
| Core Voltage (VCCINT) | 1.0 V |
| Process Node | TSMC 60 nm low power |
| Nível MSL | 3 |
| Configuration Method | Serial, Parallel, AS, PS, JTAG |
| Status RoHS | Compliant |
| Programming Software | Intel Quartus Prime |
Guia de Configuração de Pinos do 10CL040YF484C6G 484-fbga (f484) 23x23 mm, 1.0 mm pitch
Configuração de pinos para 10CL040YF484C6G (pacote 484-fbga (f484) 23x23 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10CL040YF484C6G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10CL040YF484C6G é adequado para 6 aplicaçãos: Industrial Motor Control, Machine Vision and Video Bridging, Automotive Infotainment and ADAS, Industrial IoT Edge Gateways, Software-Defined Radio Baseband, ASIC Prototyping and Hardware Verification.
Industrial Motor Control
The 10CL040YF484C6G's 39,600 logic elements, 56 18x18 multipliers, and 325 user I/O pins deliver ample capacity for multi-axis servo and stepper motor control in industrial drives. Its 4 PLLs generate low-jitter reference clocks for resolver excitation and EnDat/BiSS encoder interfaces, while 66 LVDS channels handle high-speed feedback with deterministic latency. The 1.0 V core supply combined with industrial 0C to +85C rating allows placement adjacent to IGBT gate drivers on the same PCB. Typical drive implementations pair this FPGA with external op-amps and isolated gate drivers for 1-5 kW servo amplifiers, processing current/voltage loops at 20-40 kHz PWM rates.
Recomendado
Machine Vision and Video Bridging
With 66 LVDS channels, the 10CL040YF484C6G can directly ingest Camera Link or MIPI CSI-2 video streams and bridge them to HDMI, DisplayPort, or USB3-Vision outputs. The 2475 Kbits of embedded block RAM provides sufficient line buffers for 1080p60 color-space conversion, scaling, and deinterlacing at zero external memory bandwidth. Hard memory controllers support DDR3/LPDDR2 frame buffering for multi-camera stitching in machine-vision applications. Low static power makes it ideal for always-on industrial inspection cameras where thermal envelope must stay below 50C without active cooling.
Recomendado
Automotive Infotainment and ADAS
The 10CL040YF484C6G's blend of high logic density and low dynamic power suits automotive infotainment head units, driver-monitoring camera pre-processors, and surround-view ECUs. The YF484 speed-grade-6 variant operates 0C to +85C, while designers targeting harsher under-hood environments can migrate to the 10CL040YF484A7G automotive-grade variant in the same F484 footprint. Hardware multipliers accelerate H.264 encode/decode primitives and ADAS feature extraction (lane detection, object tracking) without external DSP. The 484-FBGA provides robust board-level reliability for vehicle vibration profiles.
Recomendado
Industrial IoT Edge Gateways
Industrial IoT edge gateways benefit from the 10CL040YF484C6G's ability to aggregate multiple fieldbus protocols (Modbus, CAN, PROFINET, EtherCAT slave) on a single programmable device, offloading protocol stacks from a host MCU. The 325 user I/Os comfortably support 8-12 isolated RS-485 ports, multiple CAN-FD controllers, and GPIO for digital I/O expansion. Industrial temperature rating and 1.0 V low core power enable fanless DIN-rail enclosure designs. Embedded multipliers accelerate on-device anomaly detection and FFT-based vibration analysis for predictive maintenance.
Recomendado
Software-Defined Radio Baseband
The 10CL040YF484C6G's 56 18x18 multipliers and 2475 Kbits of block RAM make it a strong low-cost baseband processor for narrow-band software-defined radios, including LoRa, SigFox, and proprietary sub-GHz ISM protocols. Hardware multipliers implement FFT, channelization, and demodulation at sample rates up to 25 MSPS, while LVDS interfaces accept ADC samples from front-end chips such as the AD9234. The Cyclone 10 LP's low static power reduces idle consumption in battery-powered SDR sensor nodes. Quartus Prime DSP Builder accelerates FIR filter and DDC implementation.
Recomendado
ASIC Prototyping and Hardware Verification
Engineers use the 10CL040YF484C6G as a cost-effective ASIC prototype and hardware-in-the-loop verification platform for ASICs targeting 30-50K gate equivalent complexity. The 484-FBGA package exposes all user I/Os on the board, simplifying bring-up with logic analyzers and JTAG debuggers. Quartus Prime supports in-system debugging via SignalTap logic analyzer embedded in the silicon. The FBGA package also provides excellent signal integrity at 200-300 MHz internal logic rates, which is sufficient for most pre-silicon SoC validation flows.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL040YF484C6G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL040YF484C8G | 10CL040YF484I7G | 10CL040YU484C6G | 10CL080YF484C6G | 10CL040YF484A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (U484) - same ball count | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 80,000 | 39,600 |
| Speed Grade | 6 | 8 (faster) | 7 (industrial) | 6 (same) | 6 (same) | 7 (automotive) |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | -40C to +125C (automotive) |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 2,233,600 | 1,161,216 |
| Maximum User I/O | 325 | 325 | 325 | 325 | 325 | 325 |
| 18x18 Multipliers | 56 | 56 | 56 | 56 | 156 | 56 |
| Approx Unit Price (qty 1) | USD 168.50 | USD 185.00 | USD 192.00 | USD 165.00 | USD 275.00 | USD 205.00 |
Principais diferenciais
- Highest logic density in Cyclone 10 LP family at F484 package (vs 10CL025YE144C6G (Cyclone 10 LP, EQ144))
- Pin-compatible upgrade path to higher density (vs 10CL080YF484C6G)
- Speed grade 6 offers lowest unit cost (vs 10CL040YF484C8G)
Notas de projeto
The 10CL040YF484C6G requires five separate power rails: VCCINT (1.0 V core), VCCA (2.5 V PLL analog), VCCPD (3.3 V configuration), VCCIO (1.2-3.3 V per bank), and VCCBAT (battery backup for configuration RAM on non-volatile variants). Use a low-noise LDO such as the TI TPS7A4701 for VCCA and TPS7A3001 for VCCINT to meet PLL jitter specifications. Decouple each rail with 1uF + 100 nF + 10 nF capacitors placed within 5 mm of the BGA balls, and provide a Kelvin-sense connection to the package via dedicated GND vias.
Estimated: at full utilization (39.6K LE @ 200 MHz, all 56 multipliers active, DDR3 at 400 MHz), the 10CL040YF484C6G dissipates approximately 1.8 W from VCCINT plus 0.4 W from I/O, totalling around 2.2 W. The 484-FBGA has a theta_JA of approximately 12 C/W with a standard 4-layer JEDEC test board (8 thermal vias under the package center), giving a junction-temperature rise of ~26C above ambient at full load. For sealed industrial enclosures without forced airflow, derate utilization to 70% to keep Tj below 100C.
The 484-FBGA uses 1.0 mm ball pitch with a 23x23 mm body. Use a 4-layer stack-up with 1 oz copper on outer layers and 0.5 oz on inner layers; the top layer under the FPGA must be a continuous ground pour stitched with 8 thermal vias (0.3 mm drill, 0.6 mm pad) directly beneath the central ball matrix. Escape routing should use 0.1 mm trace width in the BGA field with 0.2 mm vias-in-pad (VIPPO) to maximize signal break-out density. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for high-speed CMOS.
Always configure DDR3 interfaces using the Intel External Memory Interface (EMIF) Toolkit and validate read/write margins across voltage and temperature corners before committing to layout. For LVDS inputs, place 100 ohm differential termination resistors within 5 mm of the FPGA ball, and avoid routing LVDS pairs over split power planes. Use IBIS simulation to verify signal integrity on all >100 MHz interfaces, especially the DDR3 address/command and clock pairs which are most sensitive to skew.
Do not leave VCCPD floating even on non-volatile variants; configuration failure modes are common when this rail is unstable. Ensure MSEL pins are tied to logic levels matching the desired configuration mode (AS/PS/JTAG) before power-up. Do not exceed the maximum supported I/O count of 325 user I/Os by enabling additional LVDS channels beyond documented limits. Finally, when migrating from Cyclone IV EP4CE40F484 designs, verify that all LVDS pin assignments match because some Cyclone IV LVDS pairs are not directly pin-compatible with Cyclone 10 LP.
Informações de conformidade
RoHS compliant and lead-free per Intel Cyclone 10 LP product family materials declaration. For AEC-Q100 automotive grade, choose the 10CL040YF484A7G variant which is qualified to Grade 2 (-40C to +105C) in the same F484 footprint.
