10CL080YF484I7G - Cyclone 10 LP FPGA 80K LE 484-FBGA | Intel
部品番号: 10CL080YF484I7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $102.13 | $102.13 |
| 10 | $96.5 | $965.00 |
| 100 | $88.2 | $8,820.00 |
| 500 | $79.4 | $39,700.00 |
| 1,000 | $71.95 | $71,950.00 |
10CL080YF484I7G 概要
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as multipliers, memory blocks, and PLL/clock networks. FPGAs belong to the broader category of programmable logic, sitting between fixed-function ASICs and software-driven microcontrollers in terms of flexibility, parallelism, and power. Cyclone 10 LP is Intel's low-power FPGA family positioned for cost-sensitive, high-volume applications.
Key features of the 10CL080YF484I7G include up to 244 embedded 18x18 multipliers for DSP workloads, integrated PLL clock networks, dedicated DDR3 memory controller hard IP, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and RSDS. The device family integrates a Nios II soft processor ecosystem, allowing designers to instantiate CPU cores alongside custom logic for embedded applications. The -I7 speed grade indicates an industrial -40C to +100C operating range with mid-tier timing closure performance.
Cyclone 10 LP architecture uses an LUT-based fabric with M9K memory blocks and MLAB (logic-array) blocks for distributed RAM. The 60 nm process optimizes static and dynamic power simultaneously, with optional power reduction features such as fine-grained clock gating and I/O bank supply shutoff. Compared to Cyclone IV, Cyclone 10 LP delivers up to 70% lower static power with similar logic density, making it suitable for thermally constrained industrial systems.
Typical applications include industrial motor and motion control, video surveillance and image processing bridges, low-cost ASIC prototyping, factory automation I/O expansion, and portable medical instrument signal conditioning. Designers also use Cyclone 10 LP devices for protocol bridging (PCIe Gen2, GbE, USB 3.0 soft controllers), LED video wall scan-and-refresh logic, and multi-axis sensor fusion front-ends.
When designing with this device, allocate at least 4 high-performance clock lanes for PLL-driven domain crossing, and follow Intel's pin connection guidelines (PDF: pin connection guidelines) for unused I/O bank power pins. Use the Quartus Prime Lite or Quartus Prime Standard edition toolchain for synthesis, place-and-route, and power analysis. The 484-ball FBGA requires a minimum of 6 PCB layers with controlled-impedance routing for LVDS pairs.
ドロップイン代替品: 10CL080YF484I7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10CL080YF484I7G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Process Technology, Core Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
10CL080YF484C8G
✅ ドロップイン✓ 在庫あり
$12.65 / 個
データシートを見る →10CL080YF484C6G
✅ ドロップイン✓ 在庫あり
$124 / 個
データシートを見る →10CL080YF484I7G
✅ ドロップイン✓ 在庫あり
$71.95 / 個
データシートを見る →10CL055YF484I7G
✅ ドロップイン✓ 在庫あり
$46.09 / 個
データシートを見る →10CL040YF484I7G
✅ ドロップイン✓ 在庫あり
$29.74 / 個
データシートを見る →10CL016YF484I7G
✅ ドロップイン✓ 在庫あり
$21.5 / 個
データシートを見る →10CL080YF484I7G 最大定格＆電気的特性
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 81,264 |
| Embedded Memory (Bits) | 2,810,880 |
| Maximum User I/Os | 289 |
| Embedded 18x18 Multipliers | 244 |
| パッケージ | 484-ball FBGA (F484) |
| Core Voltage | 1.0 V / 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| 動作温度 | -40C to +100C (industrial, -I7 grade) |
| Speed Grade | -I7 (industrial, mid-tier) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, RSDS, HSTL, PCI |
| Memory Controller Hard IP | DDR3, DDR2, LPDDR2 |
| 実装タイプ | Surface Mount (FBGA) |
| RoHS ステータス | Compliant |
10CL080YF484I7G 484-ball fbga (f484) ピン配置ガイド
10CL080YF484I7G (484-ball fbga (f484) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10CL080YF484I7G.
詳細は データシート をご参照ください。
主な用途
10CL080YF484I7G の用途: 6 件s: Industrial Motor Control, Video Surveillance and Image Processing, ASIC Prototyping and Emulation, Factory Automation I/O Expansion, Portable Medical Instrument Signal Conditioning, LED Video Wall Scan and Refresh Logic.
Industrial Motor Control
The 10CL080YF484I7G is well suited for multi-axis industrial motor and motion control applications. Its 81,264 logic elements handle field-oriented control (FOC), space-vector PWM generation, and encoder interface logic simultaneously. The 244 embedded 18x18 multipliers execute the Park, Clarke, and inverse transforms plus PID loops in real time at sub-microsecond latency. The 2,810,880 bits of embedded memory buffer position trajectories and current-loop state without external SRAM. The 289 user I/Os in the F484 package route multi-axis quadrature encoder feedback, Hall sensors, and gate-driver PWM signals. Industrial -I7 grade operation (-40C to +100C junction) handles factory floor ambient conditions.
おすすめ
Video Surveillance and Image Processing
The 10CL080YF484I7G implements video pipeline bridging, sensor aggregation, and on-the-fly image processing at HD and 4K resolutions. Its 244 18x18 multipliers run Sobel, Laplacian, and motion-detection kernels in real time on 1080p60 streams. The M9K memory blocks implement line buffers and frame FIFOs without external DDR. The hard DDR3 controller in the F484 package variant interfaces external SDRAM for larger frame stores. LVDS I/O support allows direct MIPI-CSI or LVDS camera deserialization. Low static power (~0.5 W typical at 81K LE) keeps fanless camera enclosures cool during 24/7 operation.
おすすめ
ASIC Prototyping and Emulation
Engineers use the 10CL080YF484I7G as an ASIC prototyping target for mid-complexity SoC designs. Its 81,264 logic elements accommodate mid-sized CPU subsystems, custom peripherals, and memory-mapped bus fabrics. The 289 I/Os in the 484-ball BGA expose ample signal probing to logic analyzers during bring-up. Quartus Prime Standard integrates with industry RTL simulation flows (Synopsys VCS, Mentor Questa) for partition-based prototyping. Multiple 10CL080YF484I7G boards can be stacked via LVDS interconnect for designs larger than 81K LE. Industrial -I7 grade is suitable for in-vehicle and aerospace bench validation environments.
おすすめ
Factory Automation I/O Expansion
The 10CL080YF484I7G serves as a flexible I/O aggregator and protocol bridge on the factory floor. Its 289 user I/Os convert between Ethernet/IP, PROFINET, EtherCAT, RS-485, and discrete 24V signals at deterministic latency. The hard DSP blocks implement industrial protocol stacks (EtherCAT distributed clocks, PROFINET IRT) at 100 Mbps line rate. The -I7 industrial temperature grade handles -40C to +100C junction operation in cabinets without forced cooling. The F484 BGA footprint fits standard industrial SOM form factors for modular PLC backplane integration.
おすすめ
Portable Medical Instrument Signal Conditioning
The 10CL080YF484I7G conditions biosignal inputs (ECG, EMG, SpO2) in portable patient monitors and diagnostic instruments. Its 244 multipliers implement FIR/IIR filters, FFT spectral analysis, and adaptive noise cancellation on multi-channel arrays. Low static power (~0.5 W at 81K LE) extends battery runtime in ambulatory monitors. The 2.8 Mbit embedded memory buffers waveform captures before display transfer. Industrial -I7 grade accommodates clinical environment thermal conditions. The F484 BGA's small footprint supports compact handheld form factors required by wearable diagnostic devices.
おすすめ
LED Video Wall Scan and Refresh Logic
The 10CL080YF484I7G drives scan-and-refresh logic for medium-resolution LED video walls and digital signage. Its 81K logic elements and 244 multipliers generate gamma correction, brightness calibration, and pixel remap tables at 60 Hz refresh rates. The 289 I/Os in the F484 BGA drive multi-port HUB75E chains across 1/16, 1/32, and 1/64 scan panels simultaneously. Embedded M9K memory buffers line data without external SDRAM. Low static power eliminates fan cooling in ceiling-mounted signage cabinets. Industrial -I7 grade handles 24/7 operational duty in unconditioned retail environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10CL080YF484I7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10CL080YF484C8G | 10CL080YF484C6G | 10CL055YF484I7G | 10CL040YF484I7G | 10CL016YF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements (LE) | 81,264 | 81,264 | 81,264 | 55,856 | 39,600 | 15,408 |
| Embedded Memory (Bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,142,720 | 1,161,216 | 504,576 |
| Speed Grade | I7 (industrial -40C to +100C) | C8 (commercial 0C to +85C) | C6 (commercial 0C to +85C, faster) | I7 | I7 | I7 |
| Operating Temperature | -40C to +100C (junction) | 0C to +85C (junction) | 0C to +85C (junction) | -40C to +100C (junction) | -40C to +100C (junction) | -40C to +100C (junction) |
| Embedded 18x18 Multipliers | 244 | 244 | 244 | 156 | 81 | 56 |
主な差別化要因
- Industrial temperature grade at standard F484 density （vs 10CL080YF484C8G)
- High logic density in 484-ball FBGA （vs 10CL040YF484I7G)
- Better timing margin than faster speed grade drop-ins （vs 10CL080YF484C6G)
設計ノート
The 484-ball FBGA package at 0.8 mm ball pitch requires a 6-layer PCB minimum with via-in-pad or microvia technology for fan-out. Use Intel's F484 land pattern with non-solder-mask-defined (NSMD) pads to ensure reliable BGA solder joint formation. Maintain 50-ohm controlled impedance for LVDS pairs, 100-ohm differential for LVDS, and matched trace lengths within 50 mils for DDR3 DQS groups. Reference Intel's Cyclone 10 LP handbook (PDF) pin connection guidelines for unused I/O bank power supply connections.
Estimated: at maximum toggle rate on 81K LE (~80% utilization) and 1.0 V core, total power dissipation is approximately 1.5 W (static 0.5 W + dynamic 1.0 W). With F484 theta_JA approximately 18 C/W (still-air, 4-layer JEDEC test board), junction temperature rise is ~27C above ambient, well within the +100C industrial limit. For sealed enclosures with no air flow, add thermal vias under the central BGA thermal balls and consider a heat spreader for continuous 100% utilization workloads.
Do not connect JTAG configuration pins (TCK, TMS, TDI, TDO) without Intel-recommended 10 kohm pull-ups on TDI and TMS; missing pull-ups can cause configuration failure. The Cyclone 10 LP configuration scheme supports AS (active serial), PS (passive serial), JTAG, and FPP (fast passive parallel). When using EPCQ flash for AS mode, ensure the MSEL pins are correctly set to the configuration scheme voltage. Verify CRC error checking is enabled in the Quartus device options to detect configuration bitstream corruption.
コンプライアンス情報
RoHS and REACH compliance per Altera/Intel product page; AEC-Q100 not applicable for general-purpose FPGAs (use Cyclone 10 GX automotive variants if required); halogen-free status not explicitly stated in verified data.