10CL016YF484I7G - Cyclone 10 LP FPGA 15K LE FBGA-484 | Intel
MPN: 10CL016YF484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34.5 | $34.50 |
| 10 | $31.05 | $310.50 |
| 100 | $27.6 | $2,760.00 |
| 500 | $24.15 | $12,075.00 |
| 1,000 | $21.5 | $21,500.00 |
Drop-in alternatives for 10CL016YF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL016YF484C8G
✅ Drop-In✓ In Stock
$20.75 / Unit
View Datasheet →10CL016YF484C6G
✅ Drop-In✓ In Stock
$40.15 / Unit
View Datasheet →10CL016YF484I7G
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →10CL016YF484C7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10CL016YF484I7G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits |
| User I/O Pins | 340 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Node | TSMC 60 nm low-power |
| Core Voltage | 1.0 V (typical) |
| I/O Voltage Range | 1.2 V to 3.3 V (per bank) |
| Package | 484-ball FBGA, 1.0 mm pitch |
| Configuration | JTAG or serial flash (AES encryption supported) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I7 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
10CL016YF484I7G 484-ball fbga, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10CL016YF484I7G (484-ball fbga, 1.0 mm pitch package) with 340 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016YF484I7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 340 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YF484I7G is suitable for 6 applications: Industrial Machine Vision, Video Format Conversion and Bridging, Motor Drive Peripherals, Factory Automation I/O Expansion, Software-Defined Radio Front-End, Low-Cost Embedded Computing Platform.
Industrial Machine Vision
The 10CL016YF484I7G fits industrial machine vision pipelines because it offers 56 hardware 18x18 multipliers for real-time image preprocessing and 4 PLLs for pixel-clock generation. Its 340 user I/O pins support multi-camera sensor aggregation through parallel LVDS or sub-LVDS lanes, while the -40C to +100C industrial temperature grade allows deployment near motors and lighting fixtures without thermal screening. The 1.0 V core and 1.2-3.3 V I/O banks interface directly to CMOS image sensors without level translators. Quartus Prime Lite support keeps development tooling costs low for factory OEMs. Compared to DSP + ASSP solutions, this FPGA provides upgradeable image processing algorithms in the field.
Recommended
Video Format Conversion and Bridging
The 10CL016YF484I7G is well suited for video format conversion between HDMI, MIPI, parallel CMOS, and LVDS interfaces because of its 340 I/O pins and high-speed LVDS capability on every bank. The 516 Kbits of embedded memory buffer active video lines without external SDRAM in single-stream designs, and the 56 DSP blocks perform real-time scaling and color-space conversion. Designers can implement multiple video pipelines concurrently using the 15,408 logic elements, with 4 PLLs providing independent pixel clocks for input and output. The FBGA-484 footprint suits mid-size video processing boards.
Recommended
Motor Drive Peripherals
The 10CL016YF484I7G serves motor drive peripheral roles such as encoder decoding, commutation logic, and isolated communication bridges. Its 56 hardware multipliers accelerate field-oriented control (FOC) observers and current-loop calculations, while the 4 PLLs generate the high-resolution PWM clocks required by modern IGBT gate drivers. Industrial temperature rating and 1.0 V core power support embedded mounting inside inverter cabinets. The 20 global clock networks distribute multi-axis timing precisely, and the FBGA-484 footprint fits standard 4-layer motor control PCBs.
Recommended
Factory Automation I/O Expansion
The 10CL016YF484I7G expands PLC and industrial PC systems by providing hundreds of customizable digital I/O lines, real-time fieldbus protocol handling (EtherCAT, Profinet, Modbus), and machine-safety logic. The 340 user I/O pins aggregate multiple fieldbus segments and discrete sensors, while the 56 multipliers accelerate CRC and protocol-stack computations. Industrial temperature grade and AES-encrypted bitstreams support factory-floor reliability and IP protection. Quartus Prime Lite enables PLC OEMs to deliver custom I/O configurations without per-seat toolchain costs.
Recommended
Software-Defined Radio Front-End
The 10CL016YF484I7G can implement SDR front-end stages such as digital up/down-conversion, channelization, and baseband preprocessing. Its 56 DSP blocks provide sufficient throughput for narrow-band signals below 50 MHz, and 4 PLLs synthesize the required sampling clocks with low jitter. The 340 I/O pins accept parallel ADC data from high-speed converters while the 1.0 V core keeps dynamic power below 1.5 W for portable SDR enclosures. AES bitstream encryption protects proprietary waveform IP.
Recommended
Low-Cost Embedded Computing Platform
The 10CL016YF484I7G functions as a soft-processor host (NIOS II or RISC-V cores) for low-cost embedded computing. Its 15,408 logic elements fit a 32-bit RISC-V core plus peripheral IP, while 516 Kbits of on-chip memory serves as tightly-coupled scratchpad storage. 340 I/O pins expose the soft processor to external memories, sensors, and communication peripherals. Industrial temperature grade and AES bitstream security suit edge-computing nodes deployed in harsh environments. Quartus Prime Lite and free RISC-V toolchains keep total BOM and tooling costs minimal.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YF484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YF484C8G | 10CL016YF484C6G | 10CL016YF484C7G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 15,408 | 15,408 - same | 15,408 - same | 15,408 - same |
| Embedded Memory (bits) | 516,096 | 516,096 - same | 516,096 - same | 516,096 - same |
| 18x18 Multipliers | 56 | 56 - same | 56 - same | 56 - same |
| PLLs | 4 | 4 - same | 4 - same | 4 - same |
| User I/O | 340 | 340 - same | 340 - same | 340 - same |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I7 | C8 (slower) | C6 (slowest) | C7 |
Key Differentiators
- Industrial temperature grade with fastest speed bin (vs 10CL016YF484C8G)
- Maximum Fmax within 10CL016 family (vs 10CL016YF484C6G)
- Same die across commercial and industrial SKUs (vs 10CL016YF484C8G)
Design Notes
The 484-ball FBGA package uses 1.0 mm ball pitch. PCB design requires microvia (laser-drilled) stack-ups with at least a 4-2-4 or 6-layer HDI construction to fan out the BGA signals. Use a 0.5 mm via pad with 0.2 mm drill for inner-layer escape. Per Intel Cyclone 10 LP hardware design guidelines, decouple each VCC and VCCIO pin with a 0.1 uF X7R ceramic placed within 100 mils of the ball to minimize PDN inductance for the 1.0 V core.
Estimated: at 100% logic utilization with default toggle rate, the 10CL016YF484I7G dissipates approximately 1.2 W from the 1.0 V core. The FBGA-484 theta_JA is roughly 15 C/W on a 4-layer JEDEC test board with adequate thermal vias under the central ball grid. For enclosed industrial cabinets, derate ambient to +85C max and add a center thermal pad with 25 thermal vias tied to internal ground planes to keep junction temperature below +100C.
Do not mix 3.3 V and 1.2 V I/O standards on the same I/O bank of the 10CL016YF484I7G - each bank shares one VCCIO rail. Plan bank assignments in Quartus Pin Planner before PCB layout. Also, JTAG and serial flash configuration modes use different dedicated pins; populating both interfaces requires careful shared-pin management. Finally, enable AES-encrypted bitstream mode if your design IP is sensitive, since unencrypted SRAM FPGAs expose netlist data on every power-up.
Per Intel hardware guidelines, place the 50 MHz configuration clock oscillator within 1 inch of the nCONFIG/nSTATUS pins and use a 33 ohm series termination if the trace exceeds 2 inches. Separate PLL analog supply pins (VCC_PLL) require their own ferrite-bead-isolated 1.0 V LDO output with 1 uF + 0.1 uF decoupling. Route all four PLL feedback paths as short, guard-banded differential traces to minimize jitter.
Compliance Information
RoHS and REACH compliance per Altera/Intel product declaration. Not AEC-Q100 qualified - this is a commercial/industrial part. For automotive safety applications, contact Intel about AEC-Q100 Cyclone 10 LP variants.
