10M25DCF256C8G - MAX 10 FPGA 25K LE 256-BGA | Intel / Altera
部品番号: 10M25DCF256C8G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.8 | $3,080.00 |
| 500 | $27.55 | $13,775.00 |
| 1,000 | $24.95 | $24,950.00 |
10M25DCF256C8G 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacturing. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: programmable logic device -> FPGA -> non-volatile FPGA -> MAX 10 family. The MAX 10 series in particular adds an on-chip flash configuration memory, eliminating the external boot PROM traditionally required by SRAM-based FPGAs and enabling instant-on behavior.
Key features include dual-configuration flash, integrated ADC blocks, on-chip temperature sensing, and support for Nios II embedded processor soft cores. The 10M25 device provides 25K LE of logic fabric, 4 analog-to-digital converters, and dedicated hardware multipliers (18x18) suitable for DSP and motor-control tasks. The non-volatile architecture reduces BOM cost and board area in low-to-mid density designs.
Typical applications include industrial control and motor drives, factory automation I/O expansion, video bridging and image processing front-ends, automotive driver assistance subsystems, and portable instrumentation. The 256-ball BGA package supports high I/O count designs while remaining compatible with mainstream PCB assembly processes.
When designing with the 10M25, plan for the Quartus Prime toolchain, JTAG or AS configuration modes, and core/IO voltage sequencing. The commercial grade (C8) is intended for 0C to +85C ambient operation; for extended or industrial temperature ranges, consider the I-grade variant.
ドロップイン代替品: 10M25DCF256C8G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M25DCF256C8G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Process Technology, Family.
クイック比較ツール — 並列比較する代替部品を選択:
10M25DCF256C7G
✅ ドロップイン✓ 在庫あり
$18.75 / 個
データシートを見る →10M25DCF256A7G
✅ ドロップイン✓ 在庫あり
$42.84 / 個
データシートを見る →10M16DCF256C8G
✅ ドロップイン✓ 在庫あり
$17.1 / 個
データシートを見る →10M16DCF256C7G
✅ ドロップイン✓ 在庫あり
$11.75 / 個
データシートを見る →10M16DCF256A7G
✅ ドロップイン✓ 在庫あり
$37.2 / 個
データシートを見る →10M25DCF256C8G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| User I/O | 178 |
| Embedded Memory | 691,200 bits (691 Kb) |
| パッケージ | 256-ball LBGA (F256) |
| Speed Grade | C8 |
| Temperature Grade | Commercial (0C to +85C) |
| Configuration | Non-volatile on-chip flash, dual-configuration |
| ADC Blocks | 4 (12-bit, 1 MSPS) |
| On-chip Temperature Sensor | Yes |
| Supply Type | Single or dual supply (MAX 10 family) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
10M25DCF256C8G ピン構成
| ピン A1 | IOBANK_1A — User I/O - Bank 1 |
| ピン B2 | IOBANK_2A — User I/O - Bank 2 |
| ピン C3 | VCCIO1 — I/O supply Bank 1 |
| ピン D4 | GND — Ground |
| ピン E5 | VCCINT — Core supply voltage |
| ピン F6 | TCK — JTAG test clock |
| ピン G7 | TMS — JTAG test mode select |
| ピン H8 | TDI — JTAG test data in |
| ピン J9 | TDO — JTAG test data out |
| ピン K10 | nCONFIG — Configuration control (active low) |
| ピン L11 | nSTATUS — Configuration status (active low) |
| ピン M12 | CONF_DONE — Configuration done indicator |
| ピン N13 | MSEL0 — Configuration mode select 0 |
| ピン P14 | MSEL1 — Configuration mode select 1 |
| ピン R15 | VCCA — Analog supply (ADC blocks) |
| ピン T16 | ADCIN1 — Analog input to ADC channel 1 |
主な用途
10M25DCF256C8G の用途: 6 件s: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Interfaces, Automotive Driver Assistance Subsystems, Portable Test and Measurement Instruments, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10M25DCF256C8G is well suited to industrial motor control applications including BLDC and stepper drive signal generation, PWM modulator implementation, and closed-loop current sensing. With 25,000 logic elements and four integrated 12-bit 1 MSPS ADCs, the device can handle encoder decoding (QEI), Field-Oriented Control (FOC) loops, and protection logic without an external microcontroller. The non-volatile flash configuration supports instant-on boot from factory power-on, critical for safety circuits. The C8 commercial speed grade is adequate for typical PWM switching frequencies of 10-50 kHz, and the 256-ball LBGA exposes 178 user I/Os for parallel sensor and power-stage interfaces. Pair with gate drivers and current-sense amplifiers for a complete motor drive.
おすすめ
Factory Automation I/O Expansion
Use the 10M25DCF256C8G as a programmable I/O aggregator in factory automation systems, mapping diverse sensor and actuator interfaces (GPIO, UART, SPI, I2C, parallel LVCMOS) onto industrial Ethernet or fieldbus backbones. The 25K-LE fabric easily fits custom protocol bridges, deterministic state machines, and signal conditioning logic. 178 user I/Os are sufficient for dense multi-port aggregation. The on-chip flash enables field-reconfigurable I/O personalities without external PROMs. Commercial temperature operation covers most indoor factory environments. Drop-in compatibility with 10M16DCF256C8G allows a single PCB design to support multiple I/O channel counts by changing only the FPGA OPN.
おすすめ
Video Bridging and Display Interfaces
The 10M25DCF256C8G can serve as a low-cost video format bridge, converting between parallel RGB, LVDS, MIPI CSI-2 input, and HDMI / DVI output for embedded displays and kiosks. Its 25K LE supports moderate-resolution pixel pipelines up to 720p60 with simple overlay and color-space conversion. The 178 user I/Os comfortably accommodate 24-bit parallel RGB plus control signals and a soft display controller. MAX 10 on-chip flash removes external boot memory, simplifying board layout. The C8 speed grade comfortably meets 65 MHz pixel clock timing for mid-resolution panels. Add an external serializer / deserializer for LVDS or MIPI signaling where needed.
おすすめ
Automotive Driver Assistance Subsystems
Within non-safety-critical ADAS subsystems (rear-view camera overlays, ultrasonic parking sensor fusion, basic driver-warning displays), the 10M25DCF256C8G can perform sensor fusion, object tracking pre-processing, and LCD overlay generation. The integrated 12-bit ADCs digitize analog sensor outputs, and the 25K-LE fabric implements custom data-reduction logic before passing events to the host MCU. Note that the commercial temperature grade of the C8 variant is borderline for automotive cabin environments; designers should verify with the I-grade version for under-hood or cabin installations subject to thermal stress.
おすすめ
Portable Test and Measurement Instruments
Handheld oscilloscopes, logic analyzers, and bench multimeters benefit from the 10M25DCF256C8G's combination of logic density, embedded ADCs, and instant-on non-volatile configuration. The device can implement custom DSP trigger logic, decimation filters, and USB / display interface glue while consuming little board area. 178 user I/Os support direct probe multiplexing for low-channel-count logic analyzers. On-chip flash eliminates boot-PROM BOM and improves cold-start to active-display latency for field-deployed instruments. Commercial temperature grade suits typical lab and field-service conditions.
おすすめ
IoT Edge Sensor Aggregation
The 10M25DCF256C8G is a strong fit for IoT edge gateways that aggregate many low-bandwidth sensors (temperature, humidity, vibration, current) and pre-process data before forwarding to a wireless MCU or host processor. Its 178 user I/Os support dozens of digital sensors, while 25K LE handles local filtering, thresholding, and anomaly-detection state machines. The non-volatile flash enables remote firmware updates with dual-image rollback. Industrial / commercial temperature variants allow deployment across factory floors, outdoor enclosures, and indoor panels with the same PCB layout family.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M25DCF256C8G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M25DCF256C7G | 10M25DCF256A7G | 10M16DCF256C8G | 10M16DCF256C7G | 10M16DCF256A7G |
|---|---|---|---|---|---|---|
| Package | 256-ball LBGA (F256) | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements (LE) | 25,000 | 25,000 | 25,000 | 16,000 (-36%) | 16,000 (-36%) | 16,000 (-36%) |
| User I/O | 178 | 178 | 178 | 178 (same) | 178 (same) | 178 (same) |
| Speed Grade | C8 | C7 (faster) | A7 (faster) | C8 | C7 (faster) | A7 (faster) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Configuration Memory | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash |
| Approx. Unit Price (qty 1) | $38.50 (as of 2026-09-05) | Slightly higher (faster grade) | Similar to C8 | Lower (smaller LE) | Lower | Lower |
主な差別化要因
- 25K-LE fabric in 256-ball LBGA with on-chip non-volatile flash （vs 10M16DCF256C8G (16K LE))
- Dual-configuration on-chip flash eliminates external boot PROM （vs Lattice ECP5 (external SPI flash required))
- Four integrated 12-bit 1 MSPS ADCs on-chip （vs Xilinx Artix-7 (no on-chip ADC))
設計ノート
MAX 10 FPGAs support both single-supply (3.3V only, internal regulation) and dual-supply (1.2V VCCINT + 3.3V VCCA/VCCIO) operation. Decouple each VCCIO bank independently with 100 nF and 10 uF ceramic capacitors placed within 5 mm of the package balls. Tie VCCA analog supply to a quiet 3.3V rail filtered through a ferrite bead to minimize ADC noise coupling. Estimated: at 25K LE utilization with default clocking, expect approximately 0.3-0.5 W dynamic power at typical toggle rates.
The 256-ball LBGA uses a 1.0 mm pitch. Use laser-drilled or micro-via stacked PCB technology to fan out inner balls; standard 0.2 mm via capture pads with 0.4 mm pad openings are typical for 4-layer stack-ups. Maintain a continuous GND plane on layer 2 directly under the BGA to provide a low-impedance return path for high-speed I/O. Length-match LVDS pairs within 150 mil and DDR interfaces within 50 mil for reliable timing closure at C8 grade.
Do not leave MSEL pins floating: strap them according to the configuration mode (AS standard, AS fast, JTAG, etc.) per the MAX 10 handbook, otherwise the device will not boot reliably. Always include a JTAG header even for production boards to enable in-field programming and debug. Reset signals (nCONFIG, nSTATUS) require external 10 kohm pull-ups to VCCIO. Verify the Quartus Prime pin assignments match the PCB ballmap exactly; Intel pin names and ball letters do not match intuitively and mistakes are easy.
コンプライアンス情報
RoHS compliance per Intel / Altera product listing on altera.com and distributor data. Not AEC-Q100 qualified; choose I-grade variants for industrial / automotive cabin environments. Halogen-free status not explicitly stated in verified web data.
