10M25DAF256C8G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel
部品番号: 10M25DAF256C8G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $69.01 | $69.01 |
| 10 | $62.5 | $625.00 |
| 100 | $55.2 | $5,520.00 |
| 500 | $49.8 | $24,900.00 |
| 1,000 | $45.3 | $45,300.00 |
10M25DAF256C8G 概要
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic architecture, routing, and I/O behaviour can be defined by the user after manufacture through a hardware-description-language (HDL) bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, and combine lookup-table (LUT) based fabric, dedicated memory, multipliers, transceivers, and clock management to implement parallel digital signal processing, glue logic, and bus-bridging functions that would otherwise require multiple discrete ICs.
Key feature highlights for the 10M25DAF256C8G include 25,000 logic elements, 1,728 Kbits (Kb) embedded SRAM, 4 PLLs, 2 hard 12-bit ADCs, and integrated configuration flash that eliminates an external boot PROM. The device supports LVDS, LVCMOS, SSTL, and DDR3 external memory interfaces, with 8 GPIO banks and a low-power core that typically draws under 1 W at moderate toggle rates. Compared with discrete MCU+ASIC solutions, the integrated flash and ADC blocks reduce BOM count and PCB footprint for industrial control designs.
From an architectural standpoint, the MAX 10 family uses an SRAM-based logic fabric backed by non-volatile flash, allowing single-chip instant-on in under 10 ms. Each logic element is a 4-input LUT plus dedicated register, and DSP blocks support 18x18 multiplication with optional accumulation. The dual 12-bit ADCs can sample up to 1 MSPS with up to 17 analog inputs, providing sensor interface capability without an external ADC.
Typical applications include industrial motor control (where the integrated ADC and PWM-friendly I/O simplify drive firmware), factory automation I/O expansion modules, low-cost video bridging and image preprocessing, and consumer display controllers. The 256-FBGA package offers ample I/O for parallel RGB or LVDS panel interfaces in human-machine-interface (HMI) systems.
When designing with the 10M25DAF256C8G, observe the I/O bank supply grouping in the pinout table because mixed-voltage rails (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) require separate VCCIO pins per bank. Use Intel Quartus Prime (Lite or Standard edition) for synthesis, place-and-route, and programming-file generation, and follow the MAX 10 Power and Thermal Management User Guide for power estimation.
This page synthesizes distributor pricing, package-level drop-in alternatives within the MAX 10 family, and PCB layout notes that are not consolidated in the manufacturer datasheet itself, giving component engineers a single reference for sourcing, replacement, and design validation.
ドロップイン代替品: 10M25DAF256C8G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M25DAF256C8G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Process Technology, Operating Temperature, Logic Elements (LE).
クイック比較ツール — 並列比較する代替部品を選択:
10M25DAF256C7G
✅ ドロップイン✓ 在庫あり
$38.75 / 個
データシートを見る →10M25DAF256I8G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M50DAF256C8G
✅ ドロップイン✓ 在庫あり
$47.85 / 個
データシートを見る →10M16DAF256C8G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M08DAF256C8G
✅ ドロップイン✓ 在庫あり
$15.4 / 個
データシートを見る →10M04DAF256C7G
✅ ドロップイン✓ 在庫あり
$9.45 / 個
データシートを見る →10M25DAF256C8G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 1,728 Kbits |
| Embedded 18x18 Multipliers | 55 |
| User I/O Count | 178 |
| PLLs | 4 |
| Hard ADC Blocks | 2 (12-bit) |
| Configuration Flash | Internal, non-volatile |
| Process Node | 55 nm TSMC |
| パッケージ | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Speed Grade | C8 |
| Temperature Grade | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
10M25DAF256C8G 256-ball fbga (17 mm x 17 mm, 1.0 mm pitch) ピン配置ガイド
10M25DAF256C8G (256-ball fbga (17 mm x 17 mm, 1.0 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M25DAF256C8G.
詳細は データシート をご参照ください。
主な用途
10M25DAF256C8G の用途: 6 件s: Industrial Motor Control and Drive, Factory Automation I/O Expansion Module, Human-Machine Interface (HMI) Display Controller, Low-Cost Video Bridge and Image Preprocessor, Portable / Battery-Powered IoT Gateway, Test and Measurement Instrumentation Front-End.
Industrial Motor Control and Drive
The 10M25DAF256C8G suits 3-axis field-oriented-control (FOC) motor drives because the dual 12-bit 1 MSPS ADCs sample phase currents directly while the 25,000 logic elements hold the FOC state machine and PWM generators. The internal flash eliminates external boot PROM and enables sub-10 ms power-on to torque production, critical for safety stops. Recommended products: 10M25DAF256C8G paired with IRFS7530 MOSFETs and AMC1301 isolated current shunts.
おすすめ
Factory Automation I/O Expansion Module
In a programmable logic controller (PLC) remote I/O slice the 10M25DAF256C8G provides 178 user I/Os that can be configured per bank for 24 V industrial signal levels, replacing multiple 74-series transceivers. Its small 17 mm x 17 mm FBGA footprint and 1 W typical power ease integration into DIN-rail modules. Recommended products: 10M25DAF256C8G with TLP281 optocouplers and MAX14840E RS-485 transceiver.
おすすめ
Human-Machine Interface (HMI) Display Controller
The 10M25DAF256C8G drives TFT panels up to 1280x800 with parallel RGB or LVDS thanks to its 178 I/Os and built-in PLL-based pixel clock generation. The integrated configuration flash reduces BOM and boot latency, while 1,728 Kbits of embedded memory support double-buffered frame storage for touch gestures. Recommended products: 10M25DAF256C8G with FT5406 touch controller and SN65LVDS93A LVDS serializer.
おすすめ
Low-Cost Video Bridge and Image Preprocessor
Camera designs use the 10M25DAF256C8G as a CSI-2 to parallel-RGB or MIPI to Ethernet bridge, exploiting the DSP multipliers for Bayer demosaic and gamma correction. The 55 dedicated 18x18 multipliers handle 720p streams at 30 fps with low latency. Recommended products: 10M25DAF256C8G with MT9V031 image sensor and DP83848 Ethernet PHY.
おすすめ
Portable / Battery-Powered IoT Gateway
The MAX 10 family consumes under 1 W at moderate toggle rates, and the 10M25DAF256C8G fits battery-powered edge nodes that perform local sensor aggregation before forwarding to BLE or LoRa. Its instant-on from internal flash avoids the long boot times of SRAM FPGAs, extending battery life. Recommended products: 10M25DAF256C8G paired with STM32WB55 host MCU and SX1276 LoRa transceiver.
おすすめ
Test and Measurement Instrumentation Front-End
Bench instruments use the 10M25DAF256C8G to implement trigger logic, time-interpolators, and display refresh for entry-level oscilloscopes and logic analysers. The 2 hard 12-bit ADCs at 1 MSPS provide cost-effective signal acquisition for low-bandwidth channels. Recommended products: 10M25DAF256C8G with AD8065 front-end amplifier and ADG708 analog mux.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M25DAF256C8G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M25DAF256C7G | 10M25DAF256I8G | 10M50DAF256C8G | 10M16DAF256C8G | 10M08DAF256C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 50,000 | 16,000 | 8,000 |
| Embedded Memory | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 2,736 Kbits | 504 Kbits | 378 Kbits |
| Speed Grade | C8 | C7 | I8 | C8 | C8 | C8 |
| Temperature Grade | Commercial (0 to 85 C) | Commercial | Industrial (-40 to 100 C) | Commercial | Commercial | Commercial |
| Hard ADC | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit | 2 x 12-bit |
| Internal Flash | Dual-image | Dual-image | Dual-image | Dual-image | Dual-image | Dual-image |
| Unit Price (qty 1) | USD 69.01 | Lower (slower speed grade) | Higher (industrial grade) | Higher (larger fabric) | Lower (smaller fabric) | Lowest |
主な差別化要因
- Same-package density scaling without PCB rework （vs 10M16DAF256C8G)
- Industrial temperature grade available in identical package （vs 10M25DAF256I8G)
- Integrated 12-bit ADC eliminates external ADC BOM （vs Lattice ECP5 LFE5U-25F-8BG256C)
設計ノート
Estimated: With 25K LE at 100 MHz toggle and 60% utilization, the MAX 10 core current is approximately 200-400 mA from a 1.2 V supply. Decouple every VCC and VCCIO pin with 100 nF X7R 0402 placed within 2 mm of the ball, plus one 10 uF bulk capacitor per power rail. Use Intel's Early Power Estimator (EPE) before layout to size the DC-DC converters correctly.
The 256-FBGA package has a theta_JA in the range of 15-20 C/W on a 4-layer JEDEC test board. Estimated: at 1.0 W total dissipation, junction temperature rise is approximately 18 C above ambient, so adequate airflow is needed only in enclosed industrial housings. Avoid placing the device directly above heat-generating components and follow the MAX 10 thermal management user guide for thermal via patterns under the BGA.
Use a 4-layer or 6-layer stack-up with continuous GND plane beneath the BGA for return-path integrity. Escape the inner rows of the 1.0 mm pitch BGA with 0.10 mm (4 mil) traces via micro-vias (0.20 mm pad / 0.10 mm drill). JTAG pins TCK, TMS, TDI, TDO must be pulled or terminated per the MAX 10 Configuration User Guide to prevent spurious configuration during power-up.
Do not confuse the 10M25DAF256C8G (dual-image flash) with the 10M25DCF256C8G (single-image flash) or the 10M25SAF256C8G (single-supply analog). Mismatches cause non-functional boards because user flash sectors and remote-update capability differ. Always verify the full OPN against Intel's ordering guide before tape-out. Also confirm that JTAG is not multiplexed with GPIO0 in the pinout file you are using.
For DDR3 or LVDS interfaces above 300 MHz, follow Intel's MAX 10 board design guidelines: 100 ohm differential impedance on LVDS pairs, matched length within 5 mils, and series 2.2 nF AC-coupling capacitors on the receive side. The integrated PLL has a limited VCO range, so select PLL input pin assignments before PCB layout to keep clock routing short.
コンプライアンス情報
RoHS and lead-free status per Intel MAX 10 product family material declaration. Not AEC-Q100 qualified; AEC-Q100 is not applicable for this FPGA family. For automotive designs use the Cyclone IV or Cyclone V families with automotive OPNs.
