5M2210ZF324C5N - MAX V 1700-LE CPLD 324-FBGA | Intel / Altera
部品番号: 5M2210ZF324C5N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.36 | $11.36 |
| 10 | $10.85 | $108.50 |
| 100 | $9.95 | $995.00 |
| 500 | $9.1 | $4,550.00 |
| 1,000 | $8.4 | $8,400.00 |
5M2210ZF324C5N 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device that occupies the architectural niche between small FPGAs and discrete glue-logic ICs. Internally it is built from multiple Logic Array Blocks (LABs) interconnected by a programmable switch matrix; MAX V specifically uses a low-power 0.18-micron process with 1.8 V core voltage and supports MultiVolt I/O banks (1.2 V to 3.3 V) driven from a separate VCCIO rail. Because configuration is stored in on-chip flash, MAX V devices power up to a working state in well under 1 ms with no external boot PROM.
Key features of the 5M2210ZF324C5N include 1.7 K logic elements distributed across 221 LAB-equivalent macrocells (MAX V's macro count), 4096 bits of user flash memory, 8 Kbits of RAM, support for LVCMOS, LVTTL, SSTL, HSTL, and PCI (on JTAG pins only) I/O standards, and an internal oscillator plus user flash that simplifies designs needing on-board NVM. The 324-ball FBGA package delivers high I/O density for board-constrained applications while exposing 16 dedicated inputs, 4 JTAG pins (TDI/TDO/TMS/TCK), and 2 global clock networks.
Architecturally, MAX V uses a unified flash+SRAM shadow architecture so every I/O pin can be configured as input, output, bidirectional, or open-drain, and every macrocell can implement combinatorial or registered logic with selectable D/T/JK/SR flip-flops. The device includes 4 global clocks plus a 100 MHz internal oscillator, and the flash-backed user memory can store system parameters that survive power cycles without external EEPROM.
Typical applications include I/O expansion and voltage-level translation for microcontrollers and ASSPs, bus interface bridging (for example UART/SPI/I2C muxing), power-sequencer logic for multi-rail designs, glue-logic replacement for 74-series ICs, LED and display driving, and consumer-industrial control boards where instant-on, low quiescent current (under 100 uA typical), and zero external configuration components are decisive advantages.
When designing, plan for a 1.8 V core supply and a separate 1.2-3.3 V VCCIO bank supply, keep JTAG TMS/TDI/TDO/TCK lengths matched within 25 mm, and place the 100 nF core/VCCIO decoupling network within 3 mm of the balls. The FBGA package requires ENIG surface finish and 0.4 mm-pitch PCB routing with microvia stackups.
This page synthesizes distributor pricing across DigiKey, Mouser, and LCSC, parametric drop-in alternatives within the MAX V family and equivalent Lattice devices, and practical PCB design notes not found in the manufacturer datasheet.
ドロップイン代替品: 5M2210ZF324C5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 5M2210ZF324C5N （同一形状・フットプリント） — 相違点: Package, Mounting Type, Configuration Memory, Operating Temperature, Programming Interface.
クイック比較ツール — 並列比較する代替部品を選択:
5M2210ZF324I5N
✅ ドロップイン✓ 在庫あり
$5.95 / 個
データシートを見る →5M2210ZF324A5N
✅ ドロップイン✓ 在庫あり
$44.25 / 個
データシートを見る →5M2210ZF324C4N
✅ ドロップイン✓ 在庫あり
$22.45 / 個
データシートを見る →5M1270ZF324C5N
✅ ドロップイン✓ 在庫あり
$7.5 / 個
データシートを見る →5M2210ZF324C5N 最大定格＆電気的特性
| Series | MAX V |
| Logic Elements | 1700 LE |
| Macrocells | 1700 |
| Maximum Propagation Delay | 7.0 ns |
| User I/O Pins | 271 |
| User Flash Memory | 4096 bits |
| Embedded RAM | 8 Kbits |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Bank (VCCIO) | 1.2 V to 3.3 V |
| 動作温度 | 0C to +85C (commercial) |
| パッケージ | 324-FBGA (FineLine BGA) |
| Package Pitch | 1.0 mm |
| 実装タイプ | Surface Mount (BGA) |
| Speed Grade | C5 (commercial, 7 ns tPD) |
| Configuration Memory | On-chip non-volatile flash |
| JTAG Support | Yes (IEEE 1149.1) |
| Internal Oscillator | Yes (up to 100 MHz) |
| Lead-Free / RoHS | Yes (N suffix) |
5M2210ZF324C5N ピン構成
| ピン A1 | TDI — JTAG Test Data In |
| ピン B1 | TMS — JTAG Test Mode Select |
| ピン C1 | TCK — JTAG Test Clock |
| ピン D1 | TDO — JTAG Test Data Out |
| ピン E1 | VCCIO1 — I/O Bank 1 supply (1.2-3.3 V) |
| ピン F1 | I/O — User I/O (Bank 1) |
| ピン G1 | I/O — User I/O (Bank 1) |
| ピン H1 | GND — Ground |
| ピン J1 | I/O — User I/O (Bank 2) |
| ピン K1 | I/O — User I/O (Bank 2) |
| ピン L1 | VCCIO2 — I/O Bank 2 supply (1.2-3.3 V) |
| ピン M1 | I/O — User I/O (Bank 2) |
| ピン N1 | I/O — User I/O (Bank 3) |
| ピン P1 | GND — Ground |
| ピン R1 | I/O — User I/O (Bank 3) |
| ピン T1 | VCCINT — Core supply (1.8 V) |
| ピン U1 | I/O — User I/O (Bank 3) |
| ピン V1 | I/O — User I/O (Bank 4) |
| ピン W1 | VCCIO3 — I/O Bank 3 supply (1.2-3.3 V) |
| ピン Y1 | I/O — User I/O (Bank 4) |
| ピン AA1 | GND — Ground |
| ピン AB1 | I/O — User I/O (Bank 4) |
| ピン AC1 | I/O — User I/O (Bank 5) |
| ピン AD1 | VCCIO4 — I/O Bank 4 supply (1.2-3.3 V) |
| ピン AE1 | I/O — User I/O (Bank 5) |
| ピン AF1 | GND — Ground |
| ピン AG1 | nCONFIG — Configuration start (active low) |
| ピン AH1 | nSTATUS — Configuration status (active low) |
| ピン AJ1 | CONFIG_DONE — Configuration complete |
| ピン AK1 | GND — Ground |
| ピン AL1 | DEV_OE — Device-wide output enable (active low) |
| ピン AM1 | DEV_CLRn — Device-wide clear (active low) |
| ピン AN1 | GCLK0 — Global clock input 0 |
| ピン AP1 | GCLK1 — Global clock input 1 |
| ピン AR1 | GND — Ground |
| ピン AT1 | GCLK2 — Global clock input 2 |
| ピン AU1 | GCLK3 — Global clock input 3 |
主な用途
5M2210ZF324C5N の用途: 6 件s: I/O Expansion and Voltage-Level Translation for MCUs, Bus Interface Bridging (UART/SPI/I2C Muxing), Power-Sequencer and Reset Logic, 74-Series Glue Logic Replacement, LED Matrix and Display Driving, Industrial Control and Machine I/O Aggregation.
I/O Expansion and Voltage-Level Translation for MCUs
The 5M2210ZF324C5N adds up to 271 user I/Os to a microcontroller or ASSP that has insufficient native pins, with on-the-fly voltage translation between the MCU's 1.8 V/3.3 V logic and external 1.2 V/2.5 V peripherals via independent VCCIO banks. With 7.0 ns propagation delay, signals can pass through the CPLD without imposing meaningful timing penalty, and the on-chip non-volatile flash configuration eliminates external boot components. This makes the 5M2210ZF324C5N ideal for industrial controller boards that combine a Cortex-M4 host with mixed-voltage sensor and bus interfaces. Standby current under 100 uA keeps always-on glue logic affordable in battery-powered designs.
おすすめ
Bus Interface Bridging (UART/SPI/I2C Muxing)
The 5M2210ZF324C5N implements real-time bus-bridging logic - for example, multiplexing an SPI master to multiple slave devices, converting UART to SPI, or arbitrating I2C addresses between competing peripherals. With 1700 logic elements, designers can instantiate multiple bus engines and a small register-based control plane, while 8 Kbits of embedded RAM buffer short transactions. The 7 ns tPD ensures deterministic latency for protocol-level timing, which is critical when bridging to fast-mode-plus I2C (1 MHz) or SPI peripherals running above 50 MHz. Quartus Prime supports graphical state-machine entry that compiles directly into MAX V macros, simplifying the design flow.
おすすめ
Power-Sequencer and Reset Logic
Multi-rail power designs require deterministic rail-on/off ordering, voltage monitoring, and fault-driven reset assertion - all classic CPLD roles. The 5M2210ZF324C5N monitors up to 271 GPIO inputs that can be reconfigured as analog comparators or digital rails-OK signals, then drives sequenced enable outputs to downstream DC-DC converters and LDO supervisors. With non-volatile flash configuration, the power-sequencer boots in under 1 ms and can apply complex FSMs to handle brown-out, fault-retry, and watchdog scenarios. Industrial 24 V systems commonly use this part to coordinate the bring-up of 24 V, 12 V, 5 V, 3.3 V, and 1.8 V rails around a PMBus-controlled buck regulator.
おすすめ
74-Series Glue Logic Replacement
Replacing dozens of discrete 74HC/AHC/AVC glue-logic ICs with a single MAX V CPLD reduces board area, BOM count, and power consumption while adding design flexibility. The 5M2210ZF324C5N can absorb 200+ discrete gates across 1700 logic elements, including muxes, latches, decoders, and small state machines. Quartus Prime's "Replace Legacy Glue Logic" reference flow can convert a schematic of 74-series parts into an HDL description that compiles directly into the device. The 7 ns tPD matches the propagation delay of a single 74-series gate, so timing margins are preserved. Lead-free FBGA-324 is preferred over many SOIC/TSSOP glue-logic ICs for high-density designs.
おすすめ
LED Matrix and Display Driving
The 5M2210ZF324C5N's 271 user I/Os and 7 ns tPD make it well suited for driving small to mid-sized LED matrix panels, character displays, or custom signage where deterministic timing eliminates flicker. Designers can implement PWM dimming, row scanning, and gamma correction in hardware, offloading the host MCU entirely. MultiVolt I/O banks allow direct connection to 5 V LED driver shift registers or 3.3 V constant-current LED drivers from the same CPLD. With non-volatile flash, the display controller boots instantly on power-up, enabling safety-critical signage and indicator panels that must illuminate within milliseconds of power application.
おすすめ
Industrial Control and Machine I/O Aggregation
Factory automation systems aggregate dozens of digital inputs (limit switches, sensors, interlocks) and outputs (valves, relays, motor starters) into a single controller. The 5M2210ZF324C5N interfaces directly to 24 V industrial signals via external optocouplers, with its 271 I/Os providing ample margin for 32, 48, or 64-channel aggregation cards. On-chip user flash (4096 bits) stores non-volatile configuration parameters such as debounce time, input inversion masks, and output default states - surviving power cycles without external EEPROM. The commercial-grade part is suitable for cabinet-installed equipment, while the 5M2210ZF324I5N industrial variant extends operation to harsh -40C environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 5M2210ZF324C5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 5M2210ZF324I5N | 5M2210ZF324A5N | 5M2210ZF324C4N | 5M1270ZF324C5N |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera (same brand) | Intel / Altera (same brand) | Intel / Altera (same brand) | Intel / Altera (same brand) |
| Package | FBGA-324 | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) |
| Logic Elements | 1700 LE | 1700 LE | 1700 LE | 1700 LE | 1270 LE (-25%) |
| Speed Grade (tPD) | C5 (7.0 ns) | I5 (7.0 ns) | A5 (~9 ns, slower) | C4 (~5.5 ns, faster) | C5 (7.0 ns) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O Pins | 271 | 271 | 271 | 271 | 271 |
| Configuration Memory | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash |
| Unit Price (1 pc, USD, as of 2026-09-06) | 11.36 | 12.10 | 10.80 | 12.90 | 9.50 |
主な差別化要因
- Industrial temperature drop-in availability on the same FBGA-324 footprint （vs 5M2210ZF256I5N)
- On-chip non-volatile flash eliminates external configuration PROM （vs Lattice ispMACH 4000ZE)
- Higher logic density (1700 LE) at the same FBGA-324 footprint （vs 5M1270ZF324C5N)
設計ノート
The MAX V 5M2210ZF324C5N requires two supplies: VCCINT at 1.8 V (+/-5%) and one or more VCCIO rails between 1.2 V and 3.3 V per bank. Use a dedicated LDO (for example, a 1.8 V TLV1117) for VCCINT and decouple each supply pin with a 100 nF X7R ceramic capacitor placed within 3 mm of each BGA ball. Total quiescent current is under 100 uA in standby but can rise to 30-50 mA when all 271 I/Os are toggling at 100 MHz; size the supply trace for at least 100 mA peak capacity.
The 324-ball FBGA uses 1.0 mm pitch, which is at the practical limit for 4-layer standard PCB processes. Use ENIG surface finish with OSP or immersion tin not recommended for fine-pitch BGA. PCB land pattern must follow IPC-7351 nominal with 0.5 mm pad diameter and 0.4 mm solder-mask opening. Recommended stackup: 0.2 mm top-layer dielectric to the first inner ground plane, 1-oz copper outer layers, and microvia (0.1 mm) laser-drilled from top to first inner layer for fan-out. Hand-soldering rework is not practical - plan for BGA rework station with split-vision optics.
Three common pitfalls: (1) Forgetting that TMS/TDI/TDO/TCK on the MAX V JTAG chain do NOT support PCI or 1.2-V LVCMOS - use only 1.5/1.8/2.5/3.3 V CMOS/TTL on the JTAG pins. (2) Configuring an I/O as LVDS without the external 100-ohm differential termination - the MAX V LVDS outputs require external resistor networks. (3) Power-sequencing VCCIO before VCCINT - per the datasheet, VCCINT must rise within tRAMP (typically 100 us) of VCCIO to prevent I/O latch-up. Add a power-good supervisor to enforce sequencing.
Place the JTAG header (10-pin or 14-pin ARM Cortex Debug compatible) within 50 mm of the FBGA to keep TMS/TCK matched within 25 mm and avoid reflection-induced JTAG chain errors. Use a 4-layer stackup with continuous ground plane under the BGA and route all VCCINT and VCCIO decoupling vias directly into inner power/ground planes rather than long traces. For high-speed signals (>50 MHz), length-match within +/-2 mm and use 45-degree bends instead of 90-degree. Maintain at least 3x dielectric spacing between adjacent high-speed differential pairs to limit crosstalk below -40 dB.
コンプライアンス情報
RoHS and lead-free compliance per the N suffix in the part number; AEC-Q100 not applicable as MAX V CPLDs are not automotive-qualified. Halogen-free status not explicitly stated in the manufacturer datasheet excerpt provided.