A3P600-1FG256I - ProASIC3 FPGA 600K Gates 1.5V | Microchip
部品番号: A3P600-1FG256I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $58.9 | $58.90 |
| 10 | $54.2 | $542.00 |
| 100 | $49.6 | $4,960.00 |
| 500 | $45.1 | $22,550.00 |
| 1,000 | $41.8 | $41,800.00 |
A3P600-1FG256I 概要
A field programmable gate array (FPGA) is a semiconductor device containing a matrix of programmable logic blocks and interconnects that designers configure in the field, sitting within the programmable logic hierarchy: FPGA -> programmable logic IC -> digital IC. Unlike SRAM-based FPGAs, the ProASIC3 family stores its configuration in on-chip flash, making it a single-chip, non-volatile, instantly-on solution that requires no external boot configuration device.
Key features include flash-based reprogrammability with low total cost of ownership (TOC), single-chip operation that eliminates the external configuration PROM, abundant advanced features for its density class, and industrial temperature grading (-40C to +100C junction) for harsh environments. The VersaTile architecture allows each logic tile to act as a three-input LUT, a D-flip-flop/latch with enable, or memory, maximizing fabric efficiency.
The 130nm flash cell technology provides secure, non-volatile configuration immune to radiation-induced configuration upset compared to SRAM fabrics, and supports live design updates. Four I/O banks with independently supplied VCCIB rails allow mixed-voltage I/O standards on one device; only I/Os with compatible voltage standards should be assigned to the same bank per Microchip's migration application notes.
Typical applications include industrial automation and control, communications and networking line cards, aerospace and defense payloads requiring instant-on logic, medical equipment, and test instrumentation glue-logic consolidation.
Design consideration: budget the 1.5V core and per-bank VCCIB supplies separately and verify bank voltage compatibility early in pin assignment to avoid board respins.
This page synthesizes distributor pricing tiers, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3P600-1FG256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P600-1FG256I （同一形状・フットプリント） — 相違点: Package, Process Technology, Operating Temperature, Family, Configuration Memory.
クイック比較ツール — 並列比較する代替部品を選択:
A3P600-1FGG256I
✅ ドロップイン✓ 在庫あり
$16.19 / 個
データシートを見る →A3P600-1FG256
✅ ドロップイン✓ 在庫あり
$51.28 / 個
データシートを見る →A3P600-FG256I
✅ ドロップイン✓ 在庫あり
$23.1 / 個
データシートを見る →A3P600-2FG256I
✅ ドロップイン✓ 在庫あり
$44.4 / 個
データシートを見る →A3P600-2FGG256
✅ ドロップイン✓ 在庫あり
$50.51 / 個
データシートを見る →A3P600-1FGG256
✅ ドロップイン✓ 在庫あり
$18.75 / 個
データシートを見る →A3P600-FG256
✅ ドロップイン✓ 在庫あり
$48.9 / 個
データシートを見る →A3P600-1FG256I 最大定格＆電気的特性
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements | 7K LEs |
| Number of I/O | 177 |
| RAM Bits | 110592 |
| Maximum Frequency | 272 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Technology | Flash-based (non-volatile) |
| I/O Banks | 4 |
| パッケージ | 256-LBGA (FBGA) |
| 動作温度 | -40C to +100C (Industrial) |
| 実装タイプ | Surface Mount |
| Terminal Form | Ball |
| Terminal Count | 256 |
| Programmability | In-system reprogrammable, single-chip |
A3P600-1FG256I 256-lbga (fbga) ピン配置ガイド
A3P600-1FG256I (256-lbga (fbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3P600-1FG256I.
詳細は データシート をご参照ください。
主な用途
A3P600-1FG256I の用途: 6 件s: Industrial Automation and Control, Aerospace and Defense Payloads, Communications and Networking Line Cards, Medical Equipment Control Logic, Test and Measurement Instrumentation, Secure Embedded Systems and Firmware Protection.
Industrial Automation and Control
The A3P600-1FG256I fits industrial control well because its industrial temperature grade (-40C to +100C) covers unconditioned factory-floor cabinets, and its flash fabric is instantly-on, letting PLC I/O and safety interlock logic be live within microseconds of power application. With 177 user I/Os and four independently supplied I/O banks, it can bridge mixed-voltage sensor buses (3.3V, 2.5V, 1.8V standards) to a common controller. In a typical topology, the FPGA sits between field-side transceivers and an MCU, implementing glue logic, PWM generation, and quadrature decoding. The non-volatile single-chip configuration also removes the configuration-PROM failure point common in SRAM FPGA industrial designs.
おすすめ
Aerospace and Defense Payloads
Flash-based ProASIC3 devices are widely used in aerospace and defense because configuration is immune to the configuration upset mechanisms that affect SRAM FPGAs, and the A3P600-1FG256I's 256-ball FBGA offers a proven, reworkable footprint. The 600K-gate fabric implements sensor-interface bridges, bus controllers, and reconfigurable payload functions, while 110592 RAM bits support small buffering and telemetry FIFOs. Instant-on operation matters in munitions and satellite subsystems where power-up sequencing is not available. For flight programs requiring higher radiation tolerance, Microchip's related RTAX-series radiation-touched FPGAs on this site extend the same design methodology. Verify program-specific qualification and screening requirements before substitution.
おすすめ
Communications and Networking Line Cards
In networking equipment, the A3P600-1FG256I consolidates backplane glue logic, bus bridging, and status aggregation that previously consumed multiple CPLDs and discrete logic, reducing total cost of ownership as Microchip advertises for ProASIC3. The 272 MHz system performance ceiling supports moderate clock domains, while 177 I/Os address wide parallel buses on line cards. Four I/O banks with independent VCCIB rails allow the same device to interface 3.3V management planes and 1.8V high-speed sections. Because configuration is on-chip flash, cards boot operational immediately at shelf power-on - important in telecom systems with tight bring-up timing budgets. Reprogrammability supports in-field feature updates via JTAG.
おすすめ
Medical Equipment Control Logic
Medical diagnostic and monitoring equipment benefits from the A3P600-1FG256I's deterministic instant-on behavior and single-chip non-volatile configuration, simplifying IEC-style design reviews around unexpected boot states. The 600K-gate fabric handles front-end timing, filter control, and interface consolidation between analog front ends and host processors, with 177 I/Os providing generous connectivity. Low static power of the flash fabric suits battery-backup and portable instrumentation scenarios. The 256-FBGA ball grid array gives reliable solder-joint mechanical performance for equipment subject to vibration during transport. Design teams typically implement redundant power-good monitoring externally and use the FPGA for sequencing and fault latching.
おすすめ
Test and Measurement Instrumentation
Bench and automated test instruments use the A3P600-1FG256I as a reconfigurable timing, trigger, and interface engine. The 272 MHz performance ceiling and VersaTile fabric support custom counters, trigger state machines, and protocol generators, while 110592 RAM bits implement capture buffers for transient events. Reprogrammability is a core value in instrumentation: one board can be firmware-updated for new measurement profiles without hardware changes. The industrial temperature grade suits rack-mounted and field instruments alike. Instant-on flash configuration means instruments are measurement-ready as soon as power is stable, avoiding the several-hundred-millisecond boot delay of SRAM FPGA platforms and their external configuration flashes.
おすすめ
Secure Embedded Systems and Firmware Protection
The flash cell architecture of ProASIC3 provides inherent design-security advantages: configuration is stored non-volatilely on-chip and cannot be read back or sniffed from an external boot device during power-up, unlike SRAM FPGAs whose bitstreams are exposed on a config flash. The A3P600-1FG256I therefore suits secure industrial controllers, license-protection logic, and anti-cloning functions. Single-chip operation eliminates the external configuration memory that is a common attack surface, reducing bill-of-materials and attack area simultaneously. With 600K gates, designers can co-locate authentication engines (hashing, challenge-response) alongside functional logic in one device, and JTAG-level security features supported by the family further harden deployed systems.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P600-1FG256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P600-1FGG256I | A3P600-1FG256 | A3P600-2FG256I | A3P600-FG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 177 | 177 | 177 | 177 | 177 |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | Standard |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +70C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Technology | On-chip flash (non-volatile) | On-chip flash (non-volatile) | On-chip flash (non-volatile) | On-chip flash (non-volatile) | On-chip flash (non-volatile) |
主な差別化要因
- Industrial temperature grade with -1 speed in the same footprint （vs A3P600-1FG256)
- Best cost/performance balance within the same package （vs A3P600-2FG256I)
- Single-chip non-volatile configuration （vs Cross-brand SRAM FPGAs)
設計ノート
Supply the A3P600-1FG256I with a dedicated 1.5V core rail (VCC) plus independent VCCIB rails per I/O bank. Per Microchip's ProASIC3 migration application note, VCCIBx pins are routed through their corresponding banks, so only I/Os with compatible voltage standards may share a bank. Estimate per-rail current with Microchip's power calculator using your design's utilization and toggle rates; do not size regulators from other designs' figures. Estimated: budget decoupling of at least 100uF bulk plus 0.1uF/0.01uF ceramics per supply pin group as a baseline.
The 256-ball FBGA (typically 1.0 mm ball pitch on this family) requires via-in-pad or dog-bone fanout on outer rows and at least a 4-layer stack with dedicated ground plane for signal return. Follow the land pattern per Microchip's package mechanical drawing. Place core-VCC decoupling capacitors on the underside of the BGA directly at via exits to minimize loop inductance. Verify reflow profile compatibility with the ball composition (standard vs lead-free GG balls) when qualifying the assembly process.
Do not mix incompatible I/O voltage standards within one bank - bank assignment must be locked before PCB routing, since the ballout ties bank supplies to fixed balls. Also confirm speed grade and temperature suffix when sourcing: the -1I part in this listing is frequently confused with commercial-grade A3P600-1FG256 or the faster A3P600-2FG256; the suffixes are functional, not packaging, differences. Finally, use Libero SoC for programming - third-party SVF/JTAG flows must match the flash programming algorithm.
コンプライアンス情報
The standard FG suffix variant is typically tin-lead balls; the FGG suffix denotes lead-free balls. Verify current RoHS status on the Microchip product page or choose the FGG variant for RoHS builds.
