A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip
部品番号: A3PE1500-1FGG484 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.9 | $5,790.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $48.1 | $48,100.00 |
A3PE1500-1FGG484 概要
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than volatile SRAM. This places the ProASIC3E family in the broader hierarchy of programmable logic devices: FPGA -> programmable logic -> digital IC -> semiconductor. Unlike SRAM FPGAs, flash-based devices are live-at-power-up, single-chip solutions that require no external configuration PROM, reducing bill-of-materials cost and board area while improving configuration security and power-up immunity.
Key features include reprogrammable flash fabric, up to 504 kbits of true dual-port SRAM block memory, low total cost of ownership (TOC), and single-chip operation without boot devices. The fabric supports system-level performance suitable for glue logic consolidation, bus bridging, and control-plane functions.
Technically, the device uses Microchip's Versatile routing fabric with flash switches that retain configuration through power cycles. The Sea-of-Versatile-Element architecture provides fine-grained logic granularity, and embedded block SRAM supports FIFOs and dual-port buffering for data-path designs.
Typical applications include industrial automation control, communications and networking line-card support logic, medical instrumentation, and aerospace/defense systems where configuration volatility is undesirable. The 280 available I/Os in this package support wide parallel bus interfaces.
Design consideration: the commercial temperature grade (0C to +70C) of the non-I suffix means industrial designs should select the A3PE1500-1FGG484I variant instead; also plan I/O bank voltages carefully since ProASIC3E supports mixed-voltage I/O.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE1500-1FGG484 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE1500-1FGG484 （同一形状・フットプリント） — 相違点: Package, System Gates, Family, Process Technology, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE1500-1FGG484I
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →M1A3PE1500-1FGG484
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE1500-FGG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
A3PE3000-1FGG484I
✅ ドロップイン✓ 在庫あり
$1336.6 / 個
データシートを見る →A3PE3000-2FGG484
✅ ドロップイン✓ 在庫あり
$28.9 / 個
データシートを見る →A3PE1500-1FGG484 最大定格＆電気的特性
| Family | ProASIC3E |
| System Gates | 1,500,000 (1.5M) |
| Fabric Cells / Logic Capacity | 276,480 |
| Logic Cells | 38,400 |
| User I/Os (this package) | 280 |
| Max User I/Os (family) | 616 |
| Embedded SRAM | Up to 504 kbits true dual-port |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | On-chip flash (live-at-power-up, single-chip) |
| Speed Grade | -1 (standard) |
| 動作温度 | 0C to +70C (commercial) |
| パッケージ | 484-ball FBGA (FGG484), 1.00 mm pitch |
| 実装タイプ | Surface Mount |
| Packaging | Tray |
A3PE1500-1FGG484 484-ball fbga (fgg484), 1.00 mm pitch ピン配置ガイド
A3PE1500-1FGG484 (484-ball fbga (fgg484), 1.00 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE1500-1FGG484.
詳細は データシート をご参照ください。
主な用途
A3PE1500-1FGG484 の用途: 6 件s: Industrial Automation Control, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Support Logic, Test and Measurement Equipment, Battery-Powered and Power-Sensitive Systems.
Industrial Automation Control
The A3PE1500-1FGG484 fits industrial automation controllers where instant-on behavior and single-chip integration reduce system complexity. Its flash-based fabric is live-at-power-up, so I/O states are valid within microseconds of power application - valuable for safety interlocks and motor-control sequencing that cannot wait for an SRAM FPGA to load configuration. The 280 user I/Os in the FGG484 package support wide parallel buses to PLC backplanes, encoder interfaces, and fieldbus PHYs, while up to 504 kbits of true dual-port SRAM buffer data between clock domains. Designers trade the commercial 0C to +70C rating against the lower cost of the non-I suffix; for uncontrolled factory-floor temperatures, the drop-in A3PE1500-1FGG484I variant should be specified instead.
おすすめ
Communications and Networking Line Cards
In networking equipment, the A3PE1500-1FGG484 serves as support logic bridging control processors, PHYs, and switch fabric. The 1.5M-gate fabric consolidates glue logic, bus arbitration, and status aggregation that would otherwise occupy multiple discrete devices, cutting BOM cost and board area. True dual-port SRAM (up to 504 kbits) implements FIFOs between asynchronous domains such as a management Ethernet MAC and a backplane interface. Because the configuration is flash-based, a line card reboots instantly without a configuration PROM, improving carrier-grade availability metrics. The 280 I/Os accommodate wide parallel PHY interfaces at moderate data rates; for line-rate packet processing, pair the FPGA with a dedicated switch IC and use the fabric for the control plane.
おすすめ
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE1500-1FGG484's deterministic, instant-on power-up and single-chip configuration, which simplify design documentation for regulatory review. The flash fabric retains its bitstream through power cycles and offers inherent resistance to configuration tampering compared to SRAM-based devices, supporting device-security requirements. With 280 user I/Os, the FGG484 part interfaces sensor front-ends, ADCs, and display controllers in patient monitors and laboratory analyzers. Designs must respect the commercial 0C to +70C temperature rating; clinical environments typically comply, but transport/storage conditions may justify the industrial A3PE1500-1FGG484I variant, which is footprint-identical and requires no PCB change to adopt.
おすすめ
Aerospace and Defense Support Logic
ProASIC3E devices are widely used in defense and aerospace programs where configuration volatility is a system risk: the flash-based A3PE1500-1FGG484 powers up functional without any external bitstream, eliminating an attack and failure mode present in SRAM FPGAs. The 1.5M gates absorb bus interfaces (MIL-STD-1553 companion logic, ARINC companions), telemetry framing, and housekeeping functions, while dual-port SRAM implements ping-pong buffers between processing chains. Designers should note the commercial temperature grade and select the I-suffix variant for extended environments, and should verify radiation requirements against the dedicated RT ProASIC3 family for true spaceflight missions. The FGG484 footprint allows migration to A3PE3000 variants as logic grows without PCB rework.
おすすめ
Test and Measurement Equipment
Bench instruments and automated test equipment use the A3PE1500-1FGG484 for timing generation, trigger logic, and instrument bus interfacing. The 276,480-cell fabric with 38,400 logic cells implements precise digital delay lines, pattern generators, and protocol engines, while the flash configuration guarantees the instrument is operational the moment power is applied - important for instruments with fast-boot requirements. The 280 I/Os connect front-panel indicators, relay drivers, and multiple measurement channels simultaneously. Embedded true dual-port SRAM supports deep capture buffers for logic-analysis functions. Because the fabric is reprogrammable in-system via FlashPro, instrument firmware features can be updated in the field without recalling hardware, protecting both manufacturer and end-user investment.
おすすめ
Battery-Powered and Power-Sensitive Systems
The ProASIC3E family includes Low Static (Idle) mode support via the ULSICC macro documented in the ProASIC3E FPGA Fabric User's Guide, letting designs park the fabric in a low-leakage state between events. Combined with the absence of a configuration device - no PROM read on every power cycle - the A3PE1500-1FGG484 suits battery-backed data loggers, portable field equipment, and energy-harvesting nodes that wake intermittently. Flash storage means state and bitstream survive complete power removal, so the system resumes instantly on wake. Engineers should budget core current during active operation and use clock-gating and the ULSICC macro aggressively; the commercial 0C to +70C range should be verified against the product's environmental specification.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE1500-1FGG484 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE1500-1FGG484I | M1A3PE1500-1FGG484 | A3PE3000-1FGG484I | A3PE3000-2FGG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484), 1.00 mm pitch | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | Microchip Technology (Actel heritage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5M | 1.5M | 1.5M | 3M (2x) | 3M (2x) |
| Embedded ARM Core | None | None | ARM Cortex-M1 | None | None |
| Speed Grade | -1 (standard) | -1 | -1 | -1 | -2 (faster) |
| Configuration | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up | On-chip flash, live-at-power-up |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
主な差別化要因
- Instant-on single-chip operation （vs SRAM FPGAs (e.g., Xilinx/Intel equivalents))
- Extended-temperature drop-in within same footprint （vs A3PE1500-1FGG484I)
- Embedded processing upgrade without re-spin （vs M1A3PE1500-1FGG484)
- Trade-off: lower density ceiling vs A3PE3000 （vs A3PE3000-1FGG484I)
設計ノート
The A3PE1500-1FGG484 uses a 1.5V core supply with separate I/O bank supplies. Decouple the core rail with at least 22 uF bulk capacitance plus 0.1 uF ceramics per power pin, placed within 3 mm of each VCC ball via. Because the flash fabric draws negligible configuration current at power-up (unlike SRAM FPGAs with inrush during bitstream loading), supply sequencing requirements are relaxed - but still follow the Microchip power-up ramp-rate guidance in the ProASIC3E user's guide to avoid I/O latch-up on mixed-voltage banks.
The FGG484 package uses a 1.00 mm ball pitch, which is routable on standard 0.8 mm-design-rule PCBs with via-in-pad or dog-bone fanout on the outer two rows. Plan at least 4 layers: signal-top, GND, power, signal-bottom. Connect all GND balls to a solid ground plane, and do not leave unused VCC/VCIO balls floating - tie each I/O bank's VCIO to its actual I/O voltage per the Libero voltage-mapping report. Estimated: a typical design uses the exposed thermal path minimally since the FBGA dissipates under 1 W in most glue-logic roles.
Do not confuse the FGG484 and FG484 package suffixes - they differ in ball pitch/finish details and are NOT interchangeable on the same PCB land pattern. Also verify the temperature grade: the non-I suffix (-1FGG484) is commercial 0C to +70C only. Finally, programming requires the Libero SoC toolchain and Microchip FlashPro hardware; SRAM-FPGA programming flows (JTAG bitstreams to external PROM) do not apply, and bitstream updates happen in-system via the on-chip flash.
コンプライアンス情報
Compliance status not stated in the retrieved distributor data; consult the Microchip product page or request a certificate of conformance. AEC-Q100 qualification is not claimed for ProASIC3E commercial/industrial parts.
