A3P600L-FGG144 - ProASIC3L Flash FPGA 600K, 97 I/O | Microchip
部品番号: A3P600L-FGG144 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3P600L-FGG144 概要
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash cells rather than SRAM. Within the programmable logic hierarchy - FPGA -> flash FPGA -> single-chip programmable SoC building block - flash devices such as the ProASIC3L family are live at power-up (LAPU), require no external configuration ROM, and are inherently more secure than SRAM FPGAs because the bitstream is not intercepted at boot.
Key features include nonvolatile FlashFreeze-style low static power, reprogrammability with abundant advanced features, a single-chip solution with no boot PROM, small-footprint 144-ball packaging, and low total cost of ownership. The 1.2 V to 1.5 V core voltage option lets designers trade performance against dynamic power, making the L-grade suited to battery-powered and thermally constrained systems.
Architecturally, the ProASIC3L fabric is built from VersaTiles - fine-grained logic modules implemented in flash switches - delivering performance beyond the ProASICPLUS generation while retaining the security and instant-on behavior of Actel flash technology. The fabric supports embedded RAM blocks totaling 110592 bits and clocking resources suitable for moderate-speed glue logic, control, and interface bridging at 0C to +85C junction operation.
Typical applications include industrial control and automation, portable and battery-operated instrumentation, secure single-chip boot logic, communications line-card bridging, and aerospace/defense designs where configuration volatility is unacceptable.
Design consideration: verify I/O bank voltage compatibility against your level-shifting plan before layout, since the 97 available user I/Os are grouped into banks that constrain mixed-voltage designs.
This page synthesizes verified distributor data, drop-in same-footprint alternatives, and practical design guidance not found in the manufacturer datasheet.
ドロップイン代替品: A3P600L-FGG144 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P600L-FGG144 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Family, Configuration, Technology.
クイック比較ツール — 並列比較する代替部品を選択:
A3P600L-FGG144I
✅ ドロップイン✓ 在庫あり
$33.95 / 個
データシートを見る →A3P600L-1FGG144
✅ ドロップイン✓ 在庫あり
$29.4 / 個
データシートを見る →A3P600L-FG144
✅ ドロップイン✓ 在庫あり
$48.34 / 個
データシートを見る →A3P600L-1FG144
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$25.73 / 個
データシートを見る →A3P600-2FGG144
✅ ドロップイン✓ 在庫あり
$30.4 / 個
データシートを見る →A3P600L-FGG144 最大定格＆電気的特性
| Family | ProASIC3L |
| System Gates | 600000 gates |
| Number of I/O | 97 |
| Embedded Memory | 110592 bits |
| 電源電圧 | 1.14 V to 1.575 V |
| Core Voltage Range | 1.2 V to 1.5 V |
| Technology | Flash-based (nonvolatile) |
| Live at Power-Up | Yes (LAPU) |
| 動作温度 | 0C to +85C (TJ) |
| パッケージ | 144-LBGA (FGG144) |
| 実装タイプ | Surface Mount |
| Speed Grade | Standard |
| Packaging | Tray |
| Programmability | In-system reprogrammable |
A3P600L-FGG144 144-lbga (fgg144) ピン配置ガイド
A3P600L-FGG144 (144-lbga (fgg144) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3P600L-FGG144.
詳細は データシート をご参照ください。
主な用途
A3P600L-FGG144 の用途: 6 件s: Industrial Control and Automation, Portable and Battery-Powered Instrumentation, Secure Single-Chip Boot and Control Logic, Communications Line-Card Bridging, Aerospace and Defense Secure Logic, Test and Measurement Equipment.
Industrial Control and Automation
The A3P600L-FGG144 fits industrial control and automation because its 600k-gate flash fabric provides deterministic, live-at-power-up logic that starts working the instant 1.14 V to 1.575 V power is applied - no configuration delay or external boot PROM that could stall a production line. With 97 user I/Os it can bridge sensor banks, motor-driver PWM inputs, and fieldbus transceivers simultaneously, while 110592 bits of embedded flash memory buffer lookup tables and configuration constants. Operating at the 1.2 V core setting reduces dynamic power in sealed cabinets with limited airflow, and the 0C to +85C junction range covers typical factory-floor enclosures.
おすすめ
Portable and Battery-Powered Instrumentation
For battery-powered handheld and portable instruments, the A3P600L-FGG144's defining advantage is the L-grade programmable 1.2 V core, which measurably lowers dynamic power compared with fixed 1.5 V ProASIC3 devices - directly extending battery runtime. The nonvolatile flash configuration removes the repeated boot energy and standby leakage of SRAM FPGA configuration circuits, giving a genuine single-chip solution. Its 144-ball LBGA keeps board area small in handheld enclosures, and 97 I/Os suffice for display interfaces, keypads, and sensor front ends. Designers should verify timing closure in Libero SoC at 1.2 V, since maximum fabric frequency drops at reduced core voltage.
おすすめ
Secure Single-Chip Boot and Control Logic
The A3P600L-FGG144 is well suited to secure single-chip boot and control logic because flash-based configuration cannot be intercepted during power-up the way SRAM bitstreams can. Live-at-power-up operation means security-critical sequencing, board-management, and access-control logic is active within microseconds of applying the 1.14 V to 1.575 V rail, before a host processor even completes reset. The 600k gates implement state machines, watchdog logic, and cryptographic glue functions, while the 110592-bit flash memory stores keys and policy tables on-chip. This makes the device a strong fit for secure gateways and tamper-aware system controllers.
おすすめ
Communications Line-Card Bridging
In networking and communications line cards, the A3P600L-FGG144 serves as glue logic and protocol bridging between PHYs, framers, and backplane connectors. Its 97 user I/Os are organized in banks that support mixed-voltage signaling required to interface legacy 3.3 V, 2.5 V, and 1.8 V subsystems on a single card. The flash fabric starts operating immediately at power application, enabling in-band management and health monitoring before host software loads. With 600k gates it can implement parallel-to-serial adaptation, status aggregation, and hot-swap control, while the 144-ball LBGA fits dense card layouts with 0C to +85C telecom ambient requirements.
おすすめ
Aerospace and Defense Secure Logic
Aerospace and defense systems favor flash FPGAs because configuration data is never exposed on an external bus, removing a class of bitstream-interception risk inherent to SRAM devices. The A3P600L-FGG144's live-at-power-up fabric delivers instant-on control for power sequencing, telemetry formatting, and interface adaptation in avionics black boxes and secure communications equipment. Its single-chip solution reduces board complexity and component count - a reliability advantage in vibration-prone environments. Note that this specific MPN is the commercial 0C to +85C grade; military-temperature programs should qualify the corresponding extended-temperature Microchip variants rather than using this part outside its rated junction range.
おすすめ
Test and Measurement Equipment
Bench and modular instruments use the A3P600L-FGG144 for channel sequencing, trigger logic, and front-end calibration control. The 600k-gate flash fabric holds its configuration permanently, so an instrument powers up with its housekeeping logic intact - important for calibration retention across power cycles. Embedded flash (110592 bits) stores calibration coefficients on-chip, and 97 I/Os handle relay drivers, ADC control buses, and front-panel indicators. Running the core at 1.2 V keeps self-heating low in enclosed benches, and the tray-packaged 144-LBGA supports standard reflow assembly for instrument main boards operating from 0C to +85C.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P600L-FGG144 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P600L-FGG144I | A3P600L-1FGG144 | A3P600L-FG144 | A3P600-2FGG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FGG144) | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FG144) - same ball map | 144-LBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.2 V to 1.5 V (programmable, L-grade) | 1.2 V to 1.5 V (L-grade) | 1.2 V to 1.5 V (L-grade) | 1.2 V to 1.5 V (L-grade) | 1.5 V fixed (standard ProASIC3) |
| Speed Grade | Standard | Standard | -1 (slower) | Standard | -2 (faster) |
| Configuration Technology | Flash, nonvolatile (LAPU) | Flash, nonvolatile (LAPU) | Flash, nonvolatile (LAPU) | Flash, nonvolatile (LAPU) | Flash, nonvolatile (LAPU) |
主な差別化要因
- Programmable 1.2 V to 1.5 V core for active power savings （vs A3P600-2FGG144)
- Industrial temperature option without redesign （vs A3P600L-FGG144I)
- Faster timing closure available in same package （vs A3P600L-1FGG144)
設計ノート
Power the 1.14 V to 1.575 V core rail from a low-noise LDO or point-of-load buck with at least 10 uF of bulk and 0.1 uF per power ball of high-frequency decoupling. If exploiting the L-grade 1.2 V core setting for lower dynamic power, confirm in Libero SoC that all timing paths still close at 1.2 V across 0C to +85C - reduced core voltage directly reduces maximum fabric frequency. Estimated: at 1.2 V versus 1.5 V, dynamic power falls roughly by the (V^2) ratio, about 36% for identical switching activity.
The FGG144 LBGA requires an exact 144-ball land pattern per the Microchip package drawing; do not substitute an FG144 land pattern drawing without confirming ball finish and dimensional tolerances. Route the 97 user I/Os respecting I/O bank voltage domains - mixed-voltage signaling is only valid within each bank's supported range. Place decoupling capacitors on the underside of the board directly beneath the ball array where possible to minimize loop inductance.
A frequent error is substituting speed grades (A3P600L-1FGG144 for the standard A3P600L-FGG144) without re-running timing analysis - pin-compatible does not mean timing-compatible. Also verify the temperature suffix: the commercial-grade part is rated 0C to +85C junction; deploying it in an extended-temperature industrial enclosure without switching to the -I variant risks field failures. Finally, flash FPGAs are single-chip solutions - do not add an external configuration PROM, which wastes board space and BOM cost.
コンプライアンス情報
Compliance status not stated in the verified web data. The FGG package suffix conventionally denotes Pb-free finish per Microchip naming, but RoHS/REACH declarations should be confirmed against the official Microchip product page or certificate before procurement.
