A3P600L-FGG144I - ProASIC3L Flash FPGA 97 I/O | Microchip
部品番号: A3P600L-FGG144I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $44.2 | $442.00 |
| 100 | $40.1 | $4,010.00 |
| 500 | $36.8 | $18,400.00 |
| 1,000 | $33.95 | $33,950.00 |
A3P600L-FGG144I 概要
An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and programmable interconnects that designers configure after manufacturing. FPGAs sit within the broader programmable logic hierarchy alongside CPLDs and ASICs, and the ProASIC3L is a one-time-programmable, flash-based FPGA - meaning configuration data is stored on-chip in non-volatile flash cells, so no external configuration PROM or boot sequence is required.
Key features include a core supply range of 1.14 V to 1.575 V supporting both 1.2 V and 1.5 V core operation, non-volatile flash programming for single-chip, instant-on operation, and industrial-grade temperature qualification. The 'L' suffix denotes the low-power ProASIC3L variant, which targets reduced static power consumption compared with the standard ProASIC3 family.
Architecturally, ProASIC3L devices use Microchip (formerly Actel/Microsemi) flash switch technology with VersTiles logic elements, embedded SRAM blocks totaling 110,592 bits, and support for common I/O standards at 3.3 V and lower. The fabric is reprogrammable in-system despite the flash storage, enabling iterative development.
Typical applications include industrial control and automation, communications and networking interface bridging, medical instrumentation glue logic, and portable or power-sensitive systems that benefit from the low-power L variant and instant-on flash configuration.
When designing with this device, budget I/O carefully - the FGG144 package exposes only 97 user I/Os, significantly fewer than larger FGG484/FG484 packages for the same 600 k-gate fabric.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3P600L-FGG144I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P600L-FGG144I （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Technology, RoHS Status, Configuration.
クイック比較ツール — 並列比較する代替部品を選択:
A3P600L-FGG144
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →A3P600L-1FGG144
✅ ドロップイン✓ 在庫あり
$29.4 / 個
データシートを見る →A3P600-2FGG144I
✅ ドロップイン✓ 在庫あり
$44.6 / 個
データシートを見る →A3P1000-2FGG144I
✅ ドロップイン✓ 在庫あり
$27.2 / 個
データシートを見る →A3P250-2FGG144I
✅ ドロップイン✓ 在庫あり
$24.8 / 個
データシートを見る →A3P600L-FGG144I 最大定格＆電気的特性
| Family | ProASIC3L |
| Logic Technology | Flash-based (non-volatile) |
| System Gates | 600000 |
| Total RAM Bits | 110592 |
| Number of I/O | 97 |
| 電源電圧 | 1.14 V to 1.575 V |
| Core Voltage Options | 1.2 V / 1.5 V |
| 動作温度 | -40C to +100C (TJ) |
| パッケージ | 144-LBGA (FGG144, 13x13 mm) |
| 実装タイプ | Surface Mount |
| Configuration | Single-chip, on-chip flash, instant-on |
| Programmability | Reprogrammable flash fabric |
| RoHS ステータス | Compliant |
| Operating Temperature Grade | Industrial (I suffix) |
A3P600L-FGG144I 144-lbga (fgg144, 13x13 mm) ピン配置ガイド
A3P600L-FGG144I (144-lbga (fgg144, 13x13 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3P600L-FGG144I.
詳細は データシート をご参照ください。
主な用途
A3P600L-FGG144I の用途: 6 件s: Industrial Control and Automation, Communications and Networking Interface Bridging, Medical Instrumentation, Portable and Battery-Powered Systems, Aerospace and Defense Legacy Systems, Test and Measurement Equipment.
Industrial Control and Automation
The A3P600L-FGG144I fits factory automation and industrial control nodes where the industrial -40C to +100C junction rating and instant-on flash configuration are essential. Its 600 k gates absorb glue logic, state machines, and parallel I/O expansion around a host MCU or PLC processor, while the 97 user I/Os handle sensor lines, encoder interfaces, and fieldbus PHY handshakes in the compact 13 x 13 mm FGG144 footprint. Because ProASIC3L stores configuration in on-chip flash, the controller is live within microseconds of power-up - no bitstream loading delay. The 1.14 V to 1.575 V core supply integrates with standard industrial point-of-load rails, and the L variant's reduced static power simplifies thermal design in sealed, fanless cabinets.
おすすめ
Communications and Networking Interface Bridging
In networking and communications equipment, the A3P600L-FGG144I serves as an interface bridge between backplane protocols, line cards, and processors. The 110,592-bit embedded RAM buffers packet payloads or implements small FIFOs between clock domains, while 97 user I/Os support common single-ended and low-voltage I/O standards at the FGG144 package's pin budget. The flash-based fabric starts forwarding logic instantly at power-up, important for systems with tight link-bring-up windows. Designers benefit from the ProASIC3L architecture's deterministic routing when meeting timing on serial interface glue paths. For designs requiring more than 97 I/O pins or higher-speed transceivers, the FGG484 packaging of the same fabric (A3P600L-FGG484) provides the upgrade path on the same Libero toolchain.
おすすめ
Medical Instrumentation
Medical diagnostic and monitoring instruments use the A3P600L-FGG144I for sensor-interface logic, timing generation, and data-path formatting ahead of an ADC or processor. The single-chip flash FPGA eliminates configuration PROMs, reducing board area and removing one reliability concern in devices that must power up predictably at the press of a button. Its low static power (ProASIC3L 'L' variant) suits battery-backed and portable instruments, and the 1.2 V core option minimizes dynamic power in always-on monitoring paths. The industrial temperature rating comfortably covers the controlled interiors of clinical equipment. The 600 k-gate capacity accommodates filter accelerators, trigger logic, and calibration state machines alongside the 110,592-bit RAM for sample buffering in the compact FGG144 footprint.
おすすめ
Portable and Battery-Powered Systems
Portable instrumentation, handheld test tools, and battery-powered data loggers choose the A3P600L-FGG144I for its defining characteristic: the ProASIC3L low-power fabric. Compared with the standard ProASIC3 (A3P600), the L variant cuts static current significantly, extending battery runtime in systems where the FPGA is always partially active. Instant-on flash configuration means the device performs useful work immediately - there is no external configuration memory to power or wait for. The 13 x 13 mm 144-ball package suits dense handheld PCBs, and the 97 I/Os typically suffice for display, keypad, sensor, and communication interfaces. Designers should budget power across the 1.14 V to 1.575 V window, choosing the 1.2 V core rail to minimize dynamic dissipation.
おすすめ
Aerospace and Defense Legacy Systems
Flash-based ProASIC3L devices have a long history in defense electronics for configuration-store protection and instant-on behavior, and the A3P600L-FGG144I continues that role in upgrades of legacy avionics and ground-system boards. The non-volatile flash fabric contains no SRAM configuration bitstream exposed at power-up, an attribute valued in secure designs, and the industrial -40C to +100C junction rating supports harsh enclosures. The 600 k-gate fabric retrofits bus interface logic, arinc-style glue paths, and voter circuits onto existing 144-ball footprints. Because Microchip maintains the mature ProASIC3 product line, long-lifecycle programs benefit from continued availability. All design work remains in Microchip Libero, preserving proven toolchain qualification across program refreshes.
おすすめ
Test and Measurement Equipment
Bench and modular test instruments deploy the A3P600L-FGG144I as timing sequencers, trigger engines, and bus-interface logic between measurement front ends and processing boards. The 110,592 bits of embedded RAM implement capture buffers, while 600 k gates of fabric encode trigger state machines that react deterministically - flash fabric imposes no configuration-load delay when the instrument powers up, matching user expectations of instant readiness. The 97 user I/Os of the FGG144 package interface front-panel indicators, digitizer handshakes, and control buses. When stimulus rates exceed ProASIC3L timing, the pin-compatible A3P600-2FGG144I offers a faster speed grade on the identical footprint, letting one PCB layout cover both economy and performance SKUs of the instrument line.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P600L-FGG144I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P600L-FGG144 | A3P600L-1FGG144 | A3P600-2FGG144I | A3P1000-2FGG144I | A3P250-2FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-LBGA (FGG144) | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 1000000 | 250000 |
| Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Temperature Grade | Industrial (-40C to +100C TJ) | Commercial | Commercial | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) |
| Family / Speed | ProASIC3L (low power) | ProASIC3L (low power) | ProASIC3L, speed grade -1 (faster) | ProASIC3, speed grade -2 (faster, higher power) | ProASIC3, speed grade -2 | ProASIC3, speed grade -2 |
主な差別化要因
- Low-power ProASIC3L fabric （vs A3P600-2FGG144I)
- Industrial temperature rating （vs A3P600L-FGG144)
- Instant-on flash configuration （vs SRAM-based FPGAs (e.g., AMD Xilinx Spartan class))
- Upgrade capacity on same footprint （vs A3P1000-2FGG144I)
設計ノート
The ProASIC3L core accepts 1.14 V to 1.575 V, supporting both 1.2 V and 1.5 V rails. Estimated: operating at the 1.2 V option instead of 1.5 V reduces dynamic core power roughly proportionally to V^2 - about 36% lower at identical activity - making 1.2 V preferable for battery or thermally constrained designs. The 'L' variant's key advantage over the standard A3P600 is reduced static current; quantify this in Libero power analysis with your actual utilization before finalizing the supply budget. Provide adequate decoupling at each VCC/VCCI pin pair per Microchip's ProASIC3L power application guidance.
The FGG144 package is a 13 x 13 mm, 0.5 mm-pitch ball grid array. Plan a minimum of two signal layers plus dedicated ground and power planes; escape the 0.5 mm pitch with via-in-pad or dog-bone fanout as in Microchip's ProASIC3 PCB layout guidelines. Assign I/O banks so that VCCI supplies match the I/O standard voltage per bank, and follow datasheet recommendations for series termination on fast single-ended outputs to limit overshoot. Keep configuration/programming (FlashPro) header access on the board for in-system updates.
Do not confuse package order codes: FGG144 (lead-free ball) versus FG144 differ in ball material and RoHS profile - the non-FGG variants on some supplier sites are separate SKUs. Also verify the speed-grade suffix: A3P600L without a digit and A3P600L-1 differ in timing, and timing constraints closed on a -1 device may fail on a base-speed part. Finally, the industrial 'I' suffix must be preserved in defense/industrial BOMs; substituting the commercial A3P600L-FGG144 voids the -40C rating.
コンプライアンス情報
RoHS compliance and lead-free (FGG lead-free ball) per distributor listings for the FGG144 package. REACH, halogen-free, and conflict-minerals status not stated in provided data.
