A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
部品番号: A3PE3000-1FG324I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.5 | $2,625.00 |
| 100 | $238 | $23,800.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $196 | $196,000.00 |
A3PE3000-1FG324I 概要
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than volatile SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that boot instantly at power-up, require no external configuration PROM, and offer inherently lower total cost of ownership (TOC). Within the programmable logic hierarchy, the A3PE3000 belongs to the ProASIC3E generation of the ProASIC3 flash FPGA family, fabricated on a 130nm process and positioned for high-density system-on-chip integration.
Key features include low total cost of ownership, single-chip operation with on-chip flash programming, reprogrammability, small-footprint packaging, and an abundance of advanced features such as support for high-performance 32-bit soft processors in related M1 ProASIC3 variants. The FBGA-324 package provides 221 user I/Os (516096 total usable in larger packages) supporting a broad range of single-ended and differential I/O standards, with certain I/O standards limited on A3PE3000 devices per the manufacturer datasheet.
The architecture uses the ProASIC3 VersaTile logic fabric, in which each tile can be configured as a three-input lookup table, a D flip-flop, or latched logic, enabling fine-grained logic, memory, and register implementation without wasting resources. The flash switching technology gives low static power (quiescent supply current in the 25 mA class) and secure, non-volatile configuration.
Typical applications include industrial automation and motor control, military and aerospace embedded processing, communications line cards, and test and measurement instruments that require instant-on operation, single-chip integration, and industrial temperature qualification.
A key design consideration is power delivery: the 1.5V core rail must be tightly regulated, and designers should budget for the maximum frequency corner (272 MHz) when calculating dynamic power using Microchip Libero SoC power analysis tools.
This page synthesizes distributor pricing, verified drop-in alternatives, application guidance, and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: A3PE3000-1FG324I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE3000-1FG324I （同一形状・フットプリント） — 相違点: Family, Package, Process Technology, Operating Temperature, System Gates.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE3000-1FGG324I
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データシートを見る →A3PE3000-FG324I
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$1 / 個
データシートを見る →A3PE3000-2FG324I
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データシートを見る →A3PE3000-2FGG324I
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$1 / 個
データシートを見る →A3PE3000L-1FG324I
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$135 / 個
データシートを見る →A3PE3000L-FGG324I
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$62.65 / 個
データシートを見る →A3PE3000L-1FGG324I
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データシートを見る →A3PE3000-1FG324I 最大定格＆電気的特性
| Logic Cells | 75264 |
| System Gates | 3000000 |
| Family | ProASIC3E |
| Series | A3PE3000 |
| Number of I/Os | 221 |
| Maximum Operating Frequency | 272 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| パッケージ / ケース | 324-FBGA |
| 実装スタイル | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Quiescent Supply Current | 25 mA |
| Configuration Memory | Flash (non-volatile, single-chip) |
| Programming Type | In-system reprogrammable |
| Packaging | Tray |
A3PE3000-1FG324I 324-fbga ピン配置ガイド
A3PE3000-1FG324I (324-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE3000-1FG324I.
詳細は データシート をご参照ください。
主な用途
A3PE3000-1FG324I の用途: 6 件s: Industrial Automation and Motor Control, Military and Aerospace Embedded Processing, Communications Line Cards and Networking, Test and Measurement Instrumentation, Medical Diagnostic Equipment, Secure Embedded Control Systems.
Industrial Automation and Motor Control
The A3PE3000-1FG324I suits industrial automation because its -40C to +85C industrial rating, instant-on flash configuration, and 221 user I/Os support multi-axis PWM generation, quadrature encoder decoding, and fieldbus interfaces (CAN, RS-485, Ethernet MAC soft cores) in a single 1.5V-core chip. In a typical design the FPGA implements deterministic motion-control loops between a host processor and power stages, with 3M gates providing headroom for a 32-bit soft processor plus control logic. Because the configuration is stored in on-chip flash, the logic is live within microseconds of power-up, eliminating configuration-boot latency critical to safety interlocks, and avoiding configuration-image corruption from noisy industrial power transients.
おすすめ
Military and Aerospace Embedded Processing
Flash-based ProASIC3E FPGAs are widely deployed in defense and space-adjacent systems because the on-chip flash configuration provides inherent resistance to configuration upsets and cannot be read out as easily as SRAM bitstreams, supporting design security requirements. The A3PE3000-1FG324I offers 3M gates for embedding soft processors, crypto wrappers, and interface bridging between legacy MIL-STD buses and modern interfaces. The 324-FBGA with 221 I/Os supports differential standards for high-integrity signaling. The -1 speed grade at 272 MHz balances throughput with lower dynamic power for convection- or conduction-cooled enclosures where thermal budget is constrained.
おすすめ
Communications Line Cards and Networking
In telecom and data communications equipment, the A3PE3000-1FG324I acts as a glueless bridge between backplane interfaces, line-card PHYs, and control processors. Its 221 user I/Os in the 324-FBGA handle parallel bus aggregation, and the ProASIC3E fabric supports multiple differential I/O standards for clock-forwarded and source-synchronous links, noting per datasheet DS0098 that each used differential pair reduces single-ended I/O count by two. The 272 MHz maximum system frequency supports 8b/10b-style framer and per-channel processing in soft logic, while flash boot gives sub-millisecond link bring-up, reducing card-provisioning time in redundant systems.
おすすめ
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A3PE3000-1FG324I's instant-on operation and reprogrammability: stimulus/response engines, timing generators, and protocol exercisers can be reconfigured per test profile over JTAG or via on-board flash update without changing hardware. The 3M-gate density hosts acquisition state machines, memory controllers, and a soft processor for local analysis; 221 I/Os connect to front-end ADCs, level shifters, and backplane connectors. Because configuration is non-volatile, instruments power up ready to acquire, matching user expectations for turnkey bench equipment and eliminating boot delays in high-throughput production test.
おすすめ
Medical Diagnostic Equipment
Medical imaging and diagnostic front ends use the A3PE3000-1FG324I for sensor-interface logic where deterministic, low-latency control matters: ultrasound beamforming sequencers, detector readout for lab analyzers, and patient-safety interlock logic. The 272 MHz fabric timing supports real-time channel processing, and the flash fabric's low static power (~25 mA quiescent at 1.5V core) aids compliance with line-powered equipment energy budgets. Single-chip non-volatile configuration avoids the boot-time window where an SRAM FPGA is unconfigured - important for power-fail-safe behavior in patient-connected systems. The industrial -40C to +85C range comfortably covers clinical ambient requirements.
おすすめ
Secure Embedded Control Systems
The A3PE3000-1FG324I's on-chip flash provides design security advantages for industrial IoT gateways, access-control controllers, and anti-counterfeiting logic: unlike SRAM FPGAs whose bitstreams are intercepted during load, ProASIC3E configuration resides on-chip and supports FlashLock-protected JTAG programming. The 3M gates host a 32-bit soft processor, cryptographic wrappers, and multiple UART/SPI/I2C masters for sensor and actuator control within one 1.5V-core chip. Instant-on behavior means security logic is active before external processors boot, closing power-up attack windows. The 221 I/Os support comprehensive tamper-signal fan-in across the 324-FBGA footprint.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE3000-1FG324I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE3000-1FGG324I | A3PE3000-FG324I | A3PE3000-2FG324I | A3PE3000L-1FG324I |
|---|---|---|---|---|---|
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Maximum Frequency | 272 MHz (-1 speed grade) | 272 MHz | ~231 MHz (standard) | ~310 MHz (-2) | 272 MHz class (-1) |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V to 1.5 V |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Ball Metallurgy / RoHS | Standard FG balls | Lead-free FGG balls | Standard FG balls | Standard FG balls | Standard FG balls |
| Quiescent Current | ~25 mA | ~25 mA | ~25 mA | ~25 mA | Lower (L low-power core) |
主な差別化要因
- Higher performance speed grade （vs A3PE3000-FG324I)
- Standard ball metallurgy for legacy assembly lines （vs A3PE3000-1FGG324I)
- Higher static-power budget vs low-power variant （vs A3PE3000L-1FG324I)
- Cost-optimal speed for control applications （vs A3PE3000-2FG324I)
設計ノート
Power the 1.5V core from a dedicated low-noise regulator with at least 500 mA headroom; the device draws roughly 25 mA static, but dynamic core current scales with the 272 MHz maximum fabric frequency and design activity. Sequence the core rail before or simultaneously with I/O bank rails and use the Microchip Libero SoC SmartPower analyzer to model worst-case current before selecting regulators - dynamic current can exceed static current by an order of magnitude in I/O-heavy designs.
The 324-FBGA (typically 1.0 mm ball pitch, ~15 x 15 mm body) requires a minimum of 4 layers: dedicated core and I/O ground planes via stitching vias at every GND ball, and short escape routing on the outer layers. For FG (standard ball) assembly, follow the datasheet reflow profile for the ball metallurgy; if moving to FGG (lead-free) variants, re-qualify the reflow profile. Place 0.1uF ceramic decoupling within 3 mm of each VCC ball pair plus bulk 10uF per bank.
Per datasheet DS0098, each used differential I/O pair reduces single-ended I/O availability by two, and A3PE3000 devices have specific limits on which I/O standards may be used together - budget I/O assignments early in Libero to avoid late-stage pin rework. Also note the FG vs FGG ball-metallurgy distinction when second-sourcing: the FGG variant is required for RoHS/lead-free assembly lines, while functionally the parts are identical.
コンプライアンス情報
The FG suffix uses standard ball metallurgy; the FGG suffix denotes lead-free (RoHS) balls per Microchip nomenclature. Verify RoHS/REACH certificates on the Microchip product page for the exact orderable code.