A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
MPN: A3PE3000-1FG324I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.5 | $2,625.00 |
| 100 | $238 | $23,800.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $196 | $196,000.00 |
Drop-in alternatives for A3PE3000-1FG324I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000-1FGG324I
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View Datasheet →A3PE3000-FG324I
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View Datasheet →A3PE3000-2FG324I
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View Datasheet →A3PE3000L-1FG324I
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View Datasheet →A3PE3000-1FG324I Maximum Ratings & Electrical Characteristics
| Logic Cells | 75264 |
| System Gates | 3000000 |
| Family | ProASIC3E |
| Series | A3PE3000 |
| Number of I/Os | 221 |
| Maximum Operating Frequency | 272 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| Package / Case | 324-FBGA |
| Mounting Style | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Quiescent Supply Current | 25 mA |
| Configuration Memory | Flash (non-volatile, single-chip) |
| Programming Type | In-system reprogrammable |
| Packaging | Tray |
A3PE3000-1FG324I 324-fbga Pin Configuration Guide
Complete pinout information for A3PE3000-1FG324I (324-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-1FG324I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-1FG324I is suitable for 6 applications: Industrial Automation and Motor Control, Military and Aerospace Embedded Processing, Communications Line Cards and Networking, Test and Measurement Instrumentation, Medical Diagnostic Equipment, Secure Embedded Control Systems.
Industrial Automation and Motor Control
The A3PE3000-1FG324I suits industrial automation because its -40C to +85C industrial rating, instant-on flash configuration, and 221 user I/Os support multi-axis PWM generation, quadrature encoder decoding, and fieldbus interfaces (CAN, RS-485, Ethernet MAC soft cores) in a single 1.5V-core chip. In a typical design the FPGA implements deterministic motion-control loops between a host processor and power stages, with 3M gates providing headroom for a 32-bit soft processor plus control logic. Because the configuration is stored in on-chip flash, the logic is live within microseconds of power-up, eliminating configuration-boot latency critical to safety interlocks, and avoiding configuration-image corruption from noisy industrial power transients.
Recommended
Military and Aerospace Embedded Processing
Flash-based ProASIC3E FPGAs are widely deployed in defense and space-adjacent systems because the on-chip flash configuration provides inherent resistance to configuration upsets and cannot be read out as easily as SRAM bitstreams, supporting design security requirements. The A3PE3000-1FG324I offers 3M gates for embedding soft processors, crypto wrappers, and interface bridging between legacy MIL-STD buses and modern interfaces. The 324-FBGA with 221 I/Os supports differential standards for high-integrity signaling. The -1 speed grade at 272 MHz balances throughput with lower dynamic power for convection- or conduction-cooled enclosures where thermal budget is constrained.
Recommended
Communications Line Cards and Networking
In telecom and data communications equipment, the A3PE3000-1FG324I acts as a glueless bridge between backplane interfaces, line-card PHYs, and control processors. Its 221 user I/Os in the 324-FBGA handle parallel bus aggregation, and the ProASIC3E fabric supports multiple differential I/O standards for clock-forwarded and source-synchronous links, noting per datasheet DS0098 that each used differential pair reduces single-ended I/O count by two. The 272 MHz maximum system frequency supports 8b/10b-style framer and per-channel processing in soft logic, while flash boot gives sub-millisecond link bring-up, reducing card-provisioning time in redundant systems.
Recommended
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A3PE3000-1FG324I's instant-on operation and reprogrammability: stimulus/response engines, timing generators, and protocol exercisers can be reconfigured per test profile over JTAG or via on-board flash update without changing hardware. The 3M-gate density hosts acquisition state machines, memory controllers, and a soft processor for local analysis; 221 I/Os connect to front-end ADCs, level shifters, and backplane connectors. Because configuration is non-volatile, instruments power up ready to acquire, matching user expectations for turnkey bench equipment and eliminating boot delays in high-throughput production test.
Recommended
Medical Diagnostic Equipment
Medical imaging and diagnostic front ends use the A3PE3000-1FG324I for sensor-interface logic where deterministic, low-latency control matters: ultrasound beamforming sequencers, detector readout for lab analyzers, and patient-safety interlock logic. The 272 MHz fabric timing supports real-time channel processing, and the flash fabric's low static power (~25 mA quiescent at 1.5V core) aids compliance with line-powered equipment energy budgets. Single-chip non-volatile configuration avoids the boot-time window where an SRAM FPGA is unconfigured - important for power-fail-safe behavior in patient-connected systems. The industrial -40C to +85C range comfortably covers clinical ambient requirements.
Recommended
Secure Embedded Control Systems
The A3PE3000-1FG324I's on-chip flash provides design security advantages for industrial IoT gateways, access-control controllers, and anti-counterfeiting logic: unlike SRAM FPGAs whose bitstreams are intercepted during load, ProASIC3E configuration resides on-chip and supports FlashLock-protected JTAG programming. The 3M gates host a 32-bit soft processor, cryptographic wrappers, and multiple UART/SPI/I2C masters for sensor and actuator control within one 1.5V-core chip. Instant-on behavior means security logic is active before external processors boot, closing power-up attack windows. The 221 I/Os support comprehensive tamper-signal fan-in across the 324-FBGA footprint.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-1FG324I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-1FGG324I | A3PE3000-FG324I | A3PE3000-2FG324I | A3PE3000L-1FG324I |
|---|---|---|---|---|---|
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Maximum Frequency | 272 MHz (-1 speed grade) | 272 MHz | ~231 MHz (standard) | ~310 MHz (-2) | 272 MHz class (-1) |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V to 1.5 V |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Ball Metallurgy / RoHS | Standard FG balls | Lead-free FGG balls | Standard FG balls | Standard FG balls | Standard FG balls |
| Quiescent Current | ~25 mA | ~25 mA | ~25 mA | ~25 mA | Lower (L low-power core) |
Key Differentiators
- Higher performance speed grade (vs A3PE3000-FG324I)
- Standard ball metallurgy for legacy assembly lines (vs A3PE3000-1FGG324I)
- Higher static-power budget vs low-power variant (vs A3PE3000L-1FG324I)
- Cost-optimal speed for control applications (vs A3PE3000-2FG324I)
Design Notes
Power the 1.5V core from a dedicated low-noise regulator with at least 500 mA headroom; the device draws roughly 25 mA static, but dynamic core current scales with the 272 MHz maximum fabric frequency and design activity. Sequence the core rail before or simultaneously with I/O bank rails and use the Microchip Libero SoC SmartPower analyzer to model worst-case current before selecting regulators - dynamic current can exceed static current by an order of magnitude in I/O-heavy designs.
The 324-FBGA (typically 1.0 mm ball pitch, ~15 x 15 mm body) requires a minimum of 4 layers: dedicated core and I/O ground planes via stitching vias at every GND ball, and short escape routing on the outer layers. For FG (standard ball) assembly, follow the datasheet reflow profile for the ball metallurgy; if moving to FGG (lead-free) variants, re-qualify the reflow profile. Place 0.1uF ceramic decoupling within 3 mm of each VCC ball pair plus bulk 10uF per bank.
Per datasheet DS0098, each used differential I/O pair reduces single-ended I/O availability by two, and A3PE3000 devices have specific limits on which I/O standards may be used together - budget I/O assignments early in Libero to avoid late-stage pin rework. Also note the FG vs FGG ball-metallurgy distinction when second-sourcing: the FGG variant is required for RoHS/lead-free assembly lines, while functionally the parts are identical.
Compliance Information
The FG suffix uses standard ball metallurgy; the FGG suffix denotes lead-free (RoHS) balls per Microchip nomenclature. Verify RoHS/REACH certificates on the Microchip product page for the exact orderable code.
