A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
部品番号: A3PE3000-2FG324I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3PE3000-2FG324I 概要
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. In the programmable logic hierarchy - programmable logic device (PLD) to FPGA to system-on-chip - flash FPGAs occupy the single-chip niche: they power up instantly, require no boot device, and resist radiation-induced configuration upset better than SRAM FPGAs.
Key features of the A3PE3000-2FG324I include single-chip operation with no external configuration memory, low total cost of ownership (TOC), reprogrammability, and industrial temperature operation from -40C to +85C. The speed grade 2 rating delivers up to 310 MHz system performance, and the 221 available I/Os support a broad set of single-ended and differential standards.
Technically, the ProASIC3E fabric is built from versatile logic elements on Microsemi's (now Microchip's) 130 nm flash process. The non-volatile flash switch architecture eliminates configuration loading time, reduces bill-of-materials cost, and improves board-level security because the bitstream is never exposed on an external bus. Embedded block RAM, PLL support, and optional soft ARM Cortex-M1 capability (in related M1 ProASIC3 devices) make the family suitable for system-level integration.
Typical applications include industrial automation controllers, aerospace and defense subsystems, medical instrumentation, and communications bridge logic, where instant-on operation, single-chip configuration, and long product lifecycle are essential requirements.
When designing with this device, plan power distribution around the 1.5V core rail and verify I/O bank voltage assignments early in the pin-planning stage; Libero SoC design software provides pin-report checks before layout freeze.
This page synthesizes distributor pricing, drop-in same-footprint alternatives across speed grades and temperature ranges, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: A3PE3000-2FG324I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3PE3000-2FG324I （同一形状・フットプリント） — 相違点: Configuration Memory, Operating Temperature, Package, Family, System Gates.
クイック比較ツール — 並列比較する代替部品を選択:
A3PE3000-2FG324
✅ ドロップイン✓ 在庫あり
$59 / 個
データシートを見る →A3PE3000-FG324I
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →A3PE3000-2FGG324
✅ ドロップイン✓ 在庫あり
$216 / 個
データシートを見る →A3PE3000-FGG324I
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →A3PE3000L-1FG324I
✅ ドロップイン✓ 在庫あり
$135 / 個
データシートを見る →A3PE3000L-FGG324
✅ ドロップイン✓ 在庫あり
$86.15 / 個
データシートを見る →A3PE3000-2FG324I 最大定格＆電気的特性
| Manufacturer | Microchip Technology (Microsemi) |
| Family | ProASIC3E |
| Logic Elements (LEs) | 35000 LEs |
| System Gates | 3M gates |
| Maximum System Performance | 310 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of I/Os | 221 I/O |
| パッケージ / ケース | 324-Ball FBGA |
| 実装スタイル | SMD/SMT |
| Operating Temperature (Min) | -40 C |
| Operating Temperature (Max) | +85 C |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| Configuration Memory | Non-volatile Flash (single chip) |
| Packaging | Tray |
| Product Series | A3PE3000 |
A3PE3000-2FG324I 324-ball fbga ピン配置ガイド
A3PE3000-2FG324I (324-ball fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: A3PE3000-2FG324I.
詳細は データシート をご参照ください。
主な用途
A3PE3000-2FG324I の用途: 6 件s: Industrial Automation and Control, Aerospace and Defense Subsystems, Medical Instrumentation, Communications Bridge and Line-Card Logic, Secure and Anti-Cloning Designs, Instant-On Embedded Systems.
Industrial Automation and Control
The A3PE3000-2FG324I fits industrial automation because its 221 user I/Os absorb the mixed-signal glue logic of PLC backplanes, motor-control interfaces, and fieldbus bridges, while the industrial -40C to +85C rating covers unconditioned cabinet environments. Its 3 million gates and 310 MHz speed grade 2 fabric implement state machines, encoders, and protocol translation without external logic. Because configuration lives in on-chip non-volatile flash, the system is operational within microseconds of power-up - no configuration device to fail - and the fabric can be reprogrammed in the field for control-logic updates. Place it behind a 1.5V core rail with I/O banks set to match 3.3V or 2.5V field signals, and budget headroom in Libero timing closure for long routing paths in large state machines.
おすすめ
Aerospace and Defense Subsystems
Defense and aerospace boards benefit from the flash-based fabric of the A3PE3000-2FG324I: the non-volatile configuration is inherently more robust than SRAM configuration against power interruption, exposes no bitstream on an external bus for a reduced attack surface, and comes from a Microchip/Microsemi product line with a long lifecycle suited to multi-year programs. The 35,000 LEs and 221 I/Os handle bus interfaces, telemetry formatting, and bridge logic between processors and custom peripherals, while 310 MHz-class performance covers high-rate serial formatting tasks. Designers should verify the specific environmental qualification level required by the program - the standard I-grade covers -40C to +85C, and defense programs often procure via authorized channels with traceability. Reuse the FG324 footprint across speed grades to derate or upgrade without respinning the PCB.
おすすめ
Medical Instrumentation
Medical devices such as imaging front ends, patient-monitoring base stations, and lab analyzers use the A3PE3000-2FG324I as a reprogrammable interface controller between sensors, ADCs, and host processors. Its instant-on flash configuration shortens boot time - valuable in devices that must become operational quickly at power-up - and the single-chip design removes an external configuration memory whose failure would otherwise be a regulatory reliability concern. With 3 million gates, 35,000 LEs, and 221 I/Os, it implements timing generators, data formatting, and safety interlock logic, while the 310 MHz rating accommodates demanding acquisition pipelines. The industrial temperature range and SMD/SMT 324-FBGA mounting support compact, fanless enclosures typical of clinical hardware; in-field flash reprogramming enables controlled firmware updates across installed fleets.
おすすめ
Communications Bridge and Line-Card Logic
In networking equipment, the A3PE3000-2FG324I serves as bridge logic between MACs, PHYs, backplane connectors, and system controllers. Speed grade 2 supports system performance up to 310 MHz, sufficient for parallel data-path retiming and protocol adaptation at line-card rates, and the 221 I/Os terminate multiple parallel buses with independent I/O-bank voltages. The flash fabric's instant-on behavior lets boards participate in the backplane immediately at power-up, simplifying bring-up sequencing in rack systems, and on-chip configuration removes the boot-device availability concern in high-availability designs. Designers should plan I/O bank assignments so mixed-voltage interfaces do not constrain floorplanning, and use Libero power estimation early since high I/O toggle rates dominate the power budget beyond the 1.5V core draw.
おすすめ
Secure and Anti-Cloning Designs
The A3PE3000-2FG324I strengthens anti-cloning and IP-protection strategies because its configuration is stored in on-chip flash cells that are never exposed on an external configuration bus, unlike SRAM FPGAs whose bitstream can be intercepted during load. This makes the 3M-gate ProASIC3E a common home for proprietary algorithms, authentication state machines, and key-handling logic in commercial and defense products. The 35,000 LEs provide ample room to combine security logic with functional bridge logic on one chip, reducing the attack surface further, and the 310 MHz fabric keeps authentication overhead out of critical paths. For strongest protection, combine flash FPGA configuration with design-level measures such as readback-disabled programming and lifecycle management through Microchip's programming tools in the production flow.
おすすめ
Instant-On Embedded Systems
Systems that must be functional within milliseconds of power application - camera trigger controllers, test-fixture sequencers, sensor hubs, and industrial gateways - exploit the defining property of the A3PE3000-2FG324I: non-volatile flash configuration with no external boot device. There is no configuration load time, so 3 million gates of custom logic begin operating essentially at power-good, eliminating the hundreds of milliseconds SRAM FPGAs spend loading from external flash. With 35,000 LEs, 221 I/Os, and a 1.5V core on a 130 nm flash process, the device implements substantial control planes while the I suffix guarantees -40C to +85C operation. Design tip: still sequence I/O banks deliberately relative to the core rail, because instant-on logic can drive pins before connected processors are ready.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3PE3000-2FG324I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3PE3000-2FG324 | A3PE3000-FG324I | A3PE3000-2FGG324 | A3PE3000L-1FG324I |
|---|---|---|---|---|---|
| Package | 324-Ball FBGA | 324-Ball FBGA - same | 324-Ball FBGA - same | 324-Ball FBGA - same | 324-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 (310 MHz) | -2 (310 MHz) | -1 (slower) | -2 (310 MHz) | -1 (slower) |
| Temperature Range | -40C to +85C (Industrial) | Commercial | -40C to +85C (Industrial) | Commercial | -40C to +85C (Industrial) |
| System Gates | 3M gates | 3M gates | 3M gates | 3M gates | 3M gates |
| Logic Elements | 35000 LEs | 35000 LEs | 35000 LEs | 35000 LEs | 35000 LEs |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2V-1.5V (flexible, L family) |
| Power Optimization | Standard ProASIC3E | Standard ProASIC3E | Standard ProASIC3E | Standard ProASIC3E | Flash*Freeze: ~40% lower dynamic / ~50% lower static power |
主な差別化要因
- Fastest standard speed grade in the FG324 footprint （vs A3PE3000-FG324I)
- Industrial temperature qualification （vs A3PE3000-2FG324)
- Full performance versus low-power option （vs A3PE3000L-1FG324I)
- Non-volatile single-chip flash configuration （vs SRAM FPGAs (cross-family))
設計ノート
Budget the 1.5V core rail using Libero SoC power estimation with your actual utilization and toggle-rate assumptions, not the family maximum. ProASIC3E power is dominated by core switching at speed grade 2 and by I/O bank current when many of the 221 I/Os toggle. Decouple each VCC/VCCI bank with bulk and high-frequency ceramics near the balls, and sequence core before or per the datasheet power-up requirements to avoid latch-up during hot insertion. For battery or thermally limited builds, consider the pin-compatible A3PE3000L-1FG324I, which adds Flash*Freeze and cuts dynamic power about 40% and static power about 50% versus the standard die.
The 324-ball FBGA requires a defined land pattern and careful escape routing; download the verified footprint from SnapEDA or the Microchip library rather than deriving one, and export to Altium, KiCad, or Allegro as needed. Plan I/O bank voltage assignment early: each VCCI bank must match its connected bus standard (e.g., 3.3V or 2.5V), and bank boundaries constrain which balls can serve which interface. Reserve programming access per the ProASIC3E datasheet programming chapter, and keep configuration/programming traces short and referenced to a solid ground plane. Verify ball-map symmetry across FG324 and FGG324 variants so alternate speed grades remain footprint-compatible.
Three recurring mistakes with this part: (1) assuming all A3PE3000 324-ball suffixes are identical - the -I suffix means industrial -40C to +85C and the -2 means speed grade 2; substituting a commercial or slower part silently degrades timing and temperature margins. (2) Skipping static timing analysis after swapping speed grades; re-run STA in Libero SoC because a grade-1 replacement may fail paths that closed at 310 MHz. (3) Forgetting that instant-on flash logic drives I/Os immediately at power-up - add pull resistors or output-enable control so external devices are not driven before the host is ready.
コンプライアンス情報
The FG suffix denotes the standard FBGA package; FGG-suffixed siblings (e.g., A3PE3000-FGG324I) denote Microchip green/lead-free packaging. Confirm RoHS/REACH status on the official Microchip product page for the exact ordering code.
