ATSAM3S1CB-CUR - 64MHz Cortex-M3 MCU 64KB Flash | Microchip
部品番号: ATSAM3S1CB-CUR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.18 | $4.18 |
| 10 | $3.9 | $39.00 |
| 100 | $3.25 | $325.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $1.74 | $1,740.00 |
ATSAM3S1CB-CUR 概要
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the lowest tier of the embedded processing hierarchy (MCU -> embedded processor -> system-on-chip). The SAM3S family belongs to Microchip (formerly Atmel) ARM-based flash MCU portfolio, positioning it as a mid-range 32-bit solution between small 8-bit MCUs and application processors.
Key features include the ARM Cortex-M3 core with a 3-stage pipeline and Harvard architecture, operation from a single 1.62V to 3.6V supply, and integrated analog peripherals including a 12-bit ADC (the family also offers 10-bit and 12-bit converter options per LCSC data). The -CUR suffix denotes the industrial temperature range in the lead-free TFBGA ball-grid-array package suitable for compact, high-density boards.
From an architecture standpoint, the Cortex-M3 core delivers deterministic interrupt handling via the Nested Vectored Interrupt Controller and Thumb-2 instruction efficiency. A DMA controller offloads data transfers from the CPU, according to the Microchip SAM3S1C product page, improving real-time throughput for peripheral-heavy designs. Flash memory allows in-system reprogramming, and the wide 1.62V-3.6V supply range supports battery-powered operation.
Typical applications include industrial control and automation nodes, consumer devices, and portable battery-powered instruments where 64 KB of code space and a dense 9x9 mm BGA footprint are sufficient. The 100-terminal TFBGA saves board area versus QFP alternatives.
Design consideration: verify the flash density matches your code size headroom; the pin-compatible SAM3S2C and SAM3S4C family members double and quadruple flash if 64 KB proves tight.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Prices as of 2026-09-19.
ドロップイン代替品: ATSAM3S1CB-CUR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM3S1CB-CUR （同一形状・フットプリント） — 相違点: ADC Resolution, Core Processor, SRAM.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM3S2CA-CUR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.89 / 個
データシートを見る →ATSAM3S4CA-CUR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ATSAM3S1CC-CUR
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ATSAM3S1CA-CUR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAM3S1CB-CUR 最大定格＆電気的特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB (16K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Series | SAM3S |
| パッケージ | 100-TFBGA (9x9 mm) |
| 実装タイプ | Surface Mount |
| Number of Terminals | 100 |
| Terminal Form | Ball (BGA) |
| ADC Resolution | 12-bit (10-bit and 12-bit options in family) |
| DMA | Yes |
| Temperature Grade | Industrial |
| Supplier Device Package | 100-TFBGA (9x9) |
ATSAM3S1CB-CUR 100-tfbga (9x9) ピン配置ガイド
ATSAM3S1CB-CUR (100-tfbga (9x9) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAM3S1CB-CUR.
詳細は データシート をご参照ください。
主な用途
ATSAM3S1CB-CUR の用途: 6 件s: Industrial Control and Automation Nodes, Portable Battery-Powered Instruments, Consumer Embedded Devices, Data Acquisition Systems, Building Automation and Smart Sensors, Test and Measurement Accessories.
Industrial Control and Automation Nodes
The ATSAM3S1CB-CUR fits factory automation sensor and actuator nodes where a 64 MHz Cortex-M3 provides sufficient headroom for communication stacks while the 12-bit ADC samples analog process signals. Its 1.62V-3.6V supply range tolerates noisy industrial rails, and the DMA controller offloads UART and ADC transfers, keeping CPU cycles free for control-loop execution. The 100-TFBGA (9x9 mm) package packs 100 I/O-capable terminals into one square centimeter, enabling compact DIN-rail or PCB-mounted node designs. When flash requirements grow beyond 64 KB, the pin-compatible ATSAM3S2CA-CUR or ATSAM3S4CA-CUR upgrades without a board respin, protecting the layout investment over the product lifecycle.
おすすめ
Portable Battery-Powered Instruments
Handheld meters and portable data loggers benefit from the ATSAM3S1CB-CUR's 1.62V minimum operating voltage, which extracts usable energy from partially discharged cells, and the Cortex-M3's multiple low-power modes for sleep between measurements. The 12-bit ADC digitizes sensor inputs without an external converter in many designs, reducing BOM cost and board area, while 64 KB Flash accommodates logging firmware and a modest display driver. The 9x9 mm TFBGA keeps the main controller within a tight enclosure footprint. Designers should profile sleep-mode current in the SAM3S datasheet tables against their duty cycle; the DMA enables burst sampling so the CPU can remain in low-power states between acquisition windows.
おすすめ
Consumer Embedded Devices
Consumer products such as small appliances, toys, and fitness accessories use the ATSAM3S1CB-CUR where 32-bit processing at 64 MHz delivers responsive user interfaces and USB-class peripheral features at commodity MCU pricing (from $1.74 at the 1000-piece break per LCSC, as of 2026-09-19). The dense 100-ball TFBGA shrinks the controller footprint, enabling thinner enclosures, while the industrial temperature grade provides margin over commercial requirements for devices left in vehicles or near heat sources. The integrated 12-bit ADC supports capacitive-sensing front ends and battery monitoring. Firmware portability across the pin-compatible SAM3S1/2/4 ladder lets one hardware platform serve multiple price tiers by swapping flash density alone.
おすすめ
Data Acquisition Systems
The ATSAM3S1CB-CUR serves compact data-acquisition front ends: its integrated 12-bit ADC converts sensor channels while the DMA controller streams conversion results to the 16 KB SRAM without CPU intervention, according to the Microchip SAM3S1C product description. The 64 MHz core then filters, timestamps, and packets data for upload over serial links. The 1.62V-3.6V supply simplifies powering from a shared 3.3V analog rail, and the 9x9 mm TFBGA fits distributed acquisition nodes mounted near sensors to shorten analog traces and improve noise performance. For systems needing more sample buffering, the same-package ATSAM3S4CA-CUR doubles and quadruples SRAM, extending record length without PCB changes.
おすすめ
Building Automation and Smart Sensors
Networked building sensors - occupancy, temperature, and air-quality nodes - deploy the ATSAM3S1CB-CUR where a 64 MHz Cortex-M3 runs protocol firmware while the 12-bit ADC reads MEMS sensor outputs. The industrial temperature grade (-40C capable family) suits rooftop and mechanical-room deployments, and the 1.62V floor supports energy-harvesting or battery backup scenarios. The 100-terminal TFBGA provides enough I/O to drive multiple sensor interfaces and status indicators from one controller. Because the SAM3S family shares pin maps across flash densities, facility managers can standardize one PCB for corridor, rooftop, and feature-rich variants, ordering ATSAM3S1CB-CUR for basic nodes and ATSAM3S2CA-CUR where larger protocol stacks run.
おすすめ
Test and Measurement Accessories
Handheld test accessories - probe interfaces, signal conditioners, and calibration modules - leverage the ATSAM3S1CB-CUR's 64 MHz throughput for real-time DSP filtering and its 12-bit ADC for measurement capture. The 16 KB SRAM buffers waveform segments for display or transfer, and DMA keeps acquisition timing deterministic by moving samples without CPU latency jitter. The compact 9x9 mm TFBGA fits probe-body and dongle form factors where a 14x14 mm LQFP would not, while the wide 1.62V-3.6V supply range adapts to instrument-internal rails. The industrial temperature grade supports bench and field use alike; verify flash utilization early, since the pin-compatible ATSAM3S4CA-CUR offers 256 KB when UI firmware grows.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM3S1CB-CUR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM3S2CA-CUR | ATSAM3S4CA-CUR | ATSAM3S1CC-CUR | ATSAM3S1CA-CUR |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64 KB | 128 KB | 256 KB | 64 KB | 64 KB |
| SRAM | 16 KB | 32 KB | 64 KB | 16 KB | 16 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
主な差別化要因
- Lowest flash density in the 100-pin SAM3S family （vs ATSAM3S2CA-CUR)
- Identical footprint across the memory ladder （vs ATSAM3S4CA-CUR)
- Densest packaging option versus QFP siblings （vs SAM3S1C in LQFP)
設計ノート
The 100-TFBGA (9x9 mm) package requires an SMT reflow process with a typical 0.8 mm ball pitch; plan PCB fanout using via-in-pad or dogbone escape patterns on outer layers. Unlike QFP, BGA joints cannot be visually inspected - specify X-ray or acoustic inspection for production qualification. Provide the standard BGA keep-out and courtyard per the SAM3S datasheet mechanical drawing, and confirm your assembler is qualified for fine-pitch BGA placement before releasing the layout.
Operate the ATSAM3S1CB-CUR from a clean 1.62V-3.6V rail; for 3.3V systems, decouple each VDD/VDDIO ball with 100 nF ceramics placed within 2 mm of the balls, plus bulk capacitance at the board entry. Verify the regulator can supply peak current during 64 MHz flash-execution with all peripherals active - consult the SAM3S datasheet power consumption tables for your mode combination. Do not exceed the 3.6V absolute rating on any I/O bank; level-shift 5V signals externally.
Budget flash headroom: 64 KB fills quickly with RTOS and protocol stacks. Because the ATSAM3S2CA-CUR and ATSAM3S4CA-CUR are pin-compatible in the same 100-TFBGA footprint, design the power and clock circuitry to the family maximum so an upward BGA swap requires no board change - though field BGA rework is impractical, so decide the density before production. Also confirm the exact -CUR ordering suffix media (tape-and-reel quantity) matches your pick-and-place setup.
Use the DMA controller for ADC and serial data movement, as Microchip's SAM3S1C product page highlights; this keeps interrupt latency deterministic for time-stamped acquisition. Keep high-speed crystal traces short and guarded, route fast I/O away from the analog ADC reference net, and provide a solid ground return under the BGA via the thermal/ground ball pattern per the datasheet layout guidelines.
コンプライアンス情報
Compliance data not present in verified web data. The -CU suffix typically denotes Microchip lead-free/RoHS packaging; confirm on the official Microchip product page environmental data before design-in.
