ATSAM3S2CA-CU - 64MHz ARM Cortex-M3 MCU 128KB Flash | Microchip
部品番号: ATSAM3S2CA-CU ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.23 | $5.23 |
| 10 | $4.75 | $47.50 |
| 100 | $4.3 | $430.00 |
| 500 | $3.95 | $1,975.00 |
| 1,000 | $3.6 | $3,600.00 |
ATSAM3S2CA-CU 概要
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded-system hierarchy above discrete logic and below application processors. The SAM3S family belongs to the ARM Cortex-M3 class of 32-bit MCUs, widely used where deterministic performance, low power, and rich analog/digital peripherals are required at moderate cost.
Key features include the ARM Cortex-M3 core with Thumb-2 instruction set and nested vectored interrupt controller (NVIC), 1.62V to 3.6V single-supply operation, a USB 2.0 full-speed device port, multiple USART/SPI/TWI serial interfaces, a 12-bit ADC, and an internal RC oscillator option set (4/8/12 MHz plus 32 kHz) that can remove the need for an external crystal in cost-sensitive designs.
Architecturally, the device integrates a multi-layer bus matrix and peripheral DMA channels, allowing peripherals such as the ADC and USARTs to transfer data without CPU intervention. The flash accelerator keeps effective execution close to the 64 MHz core speed, while power management controllers with multiple sleep and wait modes support battery-operated designs.
Typical applications include industrial control panels, consumer appliances, data-logging and sensor-gateway products, and USB-connected portable equipment where the full-speed USB device controller and generous USART count (up to 7 UART-class ports) simplify connectivity.
Design consideration: the TFBGA (9x9) ball-grid package demands controlled-impedance multilayer PCB layout and reflow assembly; teams requiring hand soldering or simpler inspection should evaluate the pin-compatible LQFP counterpart within the SAM3S family before committing to the BGA footprint.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, drop-in same-package alternatives across the SAM3S flash-density ladder, and practical design notes for BGA layout and power-supply decoupling.
ドロップイン代替品: ATSAM3S2CA-CU — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM3S2CA-CU （同一形状・フットプリント） — 相違点: SRAM, Flash Memory, Core Processor, Package, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM3S1CA-CU
✅ ドロップイン✓ 在庫あり
$3.05 / 個
データシートを見る →ATSAM3S4CA-CU
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4.95 / 個
データシートを見る →ATSAM3S8CA-CU
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$5.25 / 個
データシートを見る →ATSAM3SD8CA-CU
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.41 / 個
データシートを見る →ATSAM3S2CA-CU 最大定格＆電気的特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 32 KB (32K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| パッケージ | 100-TFBGA (9x9 mm) |
| Pin/Ball Count | 100 |
| 実装タイプ | Surface Mount (BGA) |
| 動作温度 | -40C to +85C (Industrial) |
| UART/USART Count | 7 |
| SPI Count | 4 |
| I2C (TWI) Count | 3 |
| USB | USB 2.0 Full-Speed Device |
| Internal Oscillator | 4/8/12 MHz RC + 32 kHz RC |
| Crypto Engine | No |
ATSAM3S2CA-CU 100-tfbga (9x9 mm) ピン配置ガイド
ATSAM3S2CA-CU (100-tfbga (9x9 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAM3S2CA-CU.
詳細は データシート をご参照ください。
主な用途
ATSAM3S2CA-CU の用途: 6 件s: Industrial Control Panels, USB Data Loggers and Gateways, Consumer Appliance Control, Sensor Network Nodes, Motor Control Interface Boards, Test and Measurement Accessories.
Industrial Control Panels
The ATSAM3S2CA-CU fits industrial HMI and control-panel controllers because its seven UART-class ports, four SPI and three I2C interfaces connect PLC front-ends, touch controllers, and field displays simultaneously on one 64 MHz Cortex-M3 core. The 128 KB flash accommodates a state-machine application plus a Modbus or custom protocol stack, while 32 KB SRAM buffers communication frames. Operating from 1.62V to 3.6V, it runs directly from a 3.3V industrial rail, and the industrial -40C to +85C rating covers cabinet environments. Peripheral DMA offloads serial transfers so the CPU can dedicate cycles to control loops, and the TFBGA-100's dense 9x9 mm footprint conserves PCB area in modular panel controllers.
おすすめ
USB Data Loggers and Gateways
Data-logging products benefit from the ATSAM3S2CA-CU's integrated USB 2.0 full-speed device controller, which enumerates as CDC or MSC without an external USB chip, cutting BOM cost. Sensor data captured via the 12-bit ADC or TWI-connected sensors is buffered in 32 KB SRAM and streamed over USB or stored in external SPI flash via one of the four SPI peripherals. The 64 MHz Cortex-M3 with Thumb-2 code density keeps firmware compact within 128 KB flash. Multi-mode power management allows sleep between samples, extending battery life in portable loggers, and the internal RC oscillators enable crystal-less designs where timing accuracy requirements are relaxed.
おすすめ
Consumer Appliance Control
Appliance control boards - coffee machines, air-conditioner user interfaces, small kitchen equipment - use the ATSAM3S2CA-CU to drive segment LCDs or serial displays, read capacitive touch via TWI-attached controllers, and manage relays through GPIO with adequate drive configuration. The 9x9 mm TFBGA-100 saves board space in compact appliance PCBs, while the 1.62V-3.6V single-supply range simplifies power design from a mains-derived 3.3V rail. Internal 4/8/12 MHz RC oscillators remove crystal cost in applications with loose timing tolerances. Industrial temperature rating adds margin for near-heat-source mounting, and 128 KB flash holds UI firmware, Unicode font tables, and OTA-updatable logic.
おすすめ
Sensor Network Nodes
Wired sensor nodes and gateways leverage the ATSAM3S2CA-CU's seven USARTs and three TWI ports to aggregate multiple sensor streams into a single uplink. The 12-bit ADC samples analog sensors directly, and peripheral DMA moves results to SRAM without CPU wake-ups, reducing average current in sleep-dominated duty cycles. At 64 MHz the Cortex-M3 executes protocol stacks (Modbus RTU, custom framing) with headroom, while 128 KB flash supports in-field firmware updates over the same serial links. The 1.62V-3.6V supply range tolerates long-cable rail droop, and the -40C to +85C industrial rating suits outdoor and rooftop enclosures.
おすすめ
Motor Control Interface Boards
As the supervisory controller in motor-driven systems, the ATSAM3S2CA-CU communicates with dedicated motor drivers over SPI or USART, samples current shunts through its 12-bit ADC, and enforces safety interlocks with fast GPIO interrupt response from the Cortex-M3 NVIC. While the SAM3S lacks dedicated motor-control PWM peripherals of the SAM3X/ATSAM4C families, 128 KB flash and 32 KB SRAM comfortably host a supervision state machine, fault logging, and host protocol. The 64 MHz core provides deterministic interrupt latency, and the TFBGA-100's many GPIO support encoder inputs and limit-switch monitoring in compact drive-interface PCBs.
おすすめ
Test and Measurement Accessories
USB instrument accessories - calibration adapters, multi-port serial probes, bench data front-ends - use the ATSAM3S2CA-CU because the full-speed USB device port plus abundant UARTs let one MCU bridge a PC application to several targets. Thumb-2 code density and 128 KB flash hold command parsers and DSP-style filtering, while 32 KB SRAM buffers waveform captures from the 12-bit ADC at moderate sample rates. Peripheral DMA sustains continuous streaming to USB without CPU stalls. Operation from a single 3.3V rail drawn over USB bus power keeps accessory hardware simple, and the industrial temperature spec tolerates bench-top thermal variation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM3S2CA-CU — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM3S1CA-CU | ATSAM3S4CA-CU | ATSAM3S8CA-CU | ATSAM3SD8CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology (Atmel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 128 KB | 64 KB | 256 KB | 512 KB | 512 KB |
| Supply Voltage | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V | 1.62 V - 3.6 V |
| USB | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device | Full-Speed Device (high-speed-capable family variant) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主な差別化要因
- Balanced memory density for cost-optimized designs （vs ATSAM3S8CA-CU)
- Headroom against flash ceiling （vs ATSAM3S1CA-CU)
- Integrated full-speed USB device （vs ATSAM3N4BA-MU)
設計ノート
The 9x9 mm TFBGA-100 uses a 0.8 mm ball pitch. Plan a 4-layer minimum stackup with via-in-pad or dog-bone fanout and an unbroken ground plane under the device. Solder-mask-defined pads with non-solder-mask-defined via capture improve assembly yield. BGA assembly requires reflow; budget for X-ray or optical inspection and rework capability before committing to the -CU package instead of the -AU LQFP equivalent.
Supply the VDDIO/VDDCORE rails from a clean 3.3V source within the 1.62V-3.6V range. Place 100 nF ceramic capacitors within 2 mm of each supply ball pair, plus bulk 10 uF near the regulator. Follow Microchip's SAM3S hardware design application note for internal-regulator capacitor requirements on VDDCORE; omitting or misplacing this capacitor is a common cause of brown-out during flash writes.
Do not assume the -CU (TFBGA) and -AU (LQFP) variants are interchangeable: identical silicon, different footprints. Also verify USB full-speed routing with 90-ohm differential impedance and keep the 1.5 kOhm pull-up per USB device spec handled by the on-chip transceiver. When using internal RC oscillators for cost savings, remember flash self-write timing and USB accuracy requirements may still mandate the external crystal.
コンプライアンス情報
Compliance data was not present in the provided verified web data. The -CU suffix generally denotes lead-free/halogen-free processing for Microchip parts, but RoHS/REACH status must be confirmed from the official Microchip product page before release.
