ATSAM4N16CA-CUR - Cortex-M4 100MHz 1MB Flash MCU | Microchip
部品番号: ATSAM4N16CA-CUR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.29 | $6.29 |
| 10 | $5.79 | $57.90 |
| 100 | $5.35 | $535.00 |
| 500 | $4.95 | $2,475.00 |
| 1,000 | $4.58 | $4,580.00 |
ATSAM4N16CA-CUR 概要
A microcontroller unit (MCU) integrates a processor core, memory, and peripherals on a single die, forming the lowest layer of the embedded-system hierarchy that spans MCUs, microprocessors (MPUs), and system-on-chip (SoC) devices. The SAM4N family belongs to Microchip (formerly Atmel) ARM-based SAM portfolio, built around the ARM Cortex-M4 core with Thumb-2 instruction set, DSP instructions, and a Memory Protection Unit (MPU).
Key features include the 100 MHz Cortex-M4 core with hardware DSP instructions for fast multiply-accumulate operations, 1 MB of zero-wait-state embedded Flash for code and data storage, and rich serial connectivity with seven UARTs, four SPIs, and three I2C interfaces - enabling multi-protocol designs without external expanders.
The device operates from a 1.62V to 3.6V supply (2.5V/3.3V typical rails), and offers pin-to-pin compatibility with SAM3S, SAM3N, SAM4S (64/100-pin versions), and SAM7S legacy devices, providing a low-risk migration path within the SAM portfolio. SAM4N positions itself as the ideal migration from SAM4S for applications requiring reduced BOM cost.
Typical applications include industrial control and factory automation nodes, consumer and building appliances, motor-control auxiliary boards, and general-purpose embedded systems that need headroom for protocol bridging across multiple UART/SPI/I2C buses.
When designing with this device, verify that the Flash/SRAM split (1 MB/80 KB) matches your application footprint, and account for the industrial operating range of -40C to +85C in thermal placement on the PCB.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: ATSAM4N16CA-CUR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAM4N16CA-CUR （同一形状・フットプリント） — 相違点: RoHS Status, Series, Package, Flash Memory, Maximum Clock Frequency.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAM4N16CA-CU
✅ ドロップイン✓ 在庫あり
$4.05 / 個
データシートを見る →ATSAM4N16CA-CFUR
✅ ドロップイン✓ 在庫あり
$4.95 / 個
データシートを見る →ATSAM4SA16CA-CUR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAM4S16CA-CU
✅ ドロップイン✓ 在庫あり
$4.89 / 個
データシートを見る →ATSAM4S8CA-CUR
✅ ドロップイン✓ 在庫あり
$5.05 / 個
データシートを見る →ATSAM4E16CA-CUR
✅ ドロップイン✓ 在庫あり
$7.48 / 個
データシートを見る →ATSAM4LC8BA-UUR
✅ ドロップイン✓ 在庫あり
$3.95 / 個
データシートを見る →ATSAM4LS8BA-AUR
✅ ドロップイン✓ 在庫あり
$4.72 / 個
データシートを見る →ATSAM4N16CA-CUR 最大定格＆電気的特性
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| 最大クロック周波数 | 100 MHz |
| Flash Memory Size | 1 MB (1M x 8) |
| SRAM Size | 80 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Supply Voltage (Typical) | 2.5 V / 3.3 V |
| Instruction Set | Thumb-2 |
| DSP Instructions | Yes |
| Memory Protection Unit (MPU) | Yes |
| Number of UARTs | 7 |
| Number of SPI Interfaces | 4 |
| Number of I2C Interfaces | 3 |
| パッケージ | 100-TFBGA (9x9 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (Industrial) |
| Series | SAM4N |
| RoHS ステータス | Compliant (Green, MRL A) |
ATSAM4N16CA-CUR 100-tfbga (9x9 mm) ピン配置ガイド
ATSAM4N16CA-CUR (100-tfbga (9x9 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAM4N16CA-CUR.
詳細は データシート をご参照ください。
主な用途
ATSAM4N16CA-CUR の用途: 6 件s: Industrial Control and Automation, Sensor Aggregation and Data Acquisition, Protocol Bridge and Gateway Modules, Motor Control Auxiliary Boards, Building Automation and Smart Appliances, Legacy SAM3S/SAM7S Migration Designs.
Industrial Control and Automation
The ATSAM4N16CA-CUR fits industrial control nodes because its seven UARTs allow simultaneous Modbus RTU channels, RS-485 trunks, and HMI links without external UART expanders, while the 100 MHz Cortex-M4 with DSP instructions executes PID loops and digital filtering in hardware-accelerated fixed-point math. The 1 MB Flash holds protocol stacks, firmware updaters, and logging code with headroom, and the 80 KB SRAM buffers multi-channel acquisition data. Operating at -40C to +85C in a 9x9 mm TFBGA, it mounts on compact PLC I/O modules; the MPU supports partitioned firmware for robustness in continuous-duty factory environments.
おすすめ
Sensor Aggregation and Data Acquisition
For multi-sensor data acquisition, the ATSAM4N16CA-CUR offers four SPI and three I2C interfaces that connect ADCs, MEMS sensors, and front-end devices concurrently. The Cortex-M4 DSP instructions accelerate calibration math, FFT-based vibration analysis, and digital filtering directly on-chip, removing the need for a companion DSP. With 1 MB Flash, an entire acquisition firmware plus self-test and OTA bootloader fits on-chip, and the industrial temperature rating supports field-deployed enclosures. Data is staged in the 80 KB SRAM and streamed out over any of the seven UARTs, making the device a compact single-chip acquisition hub for condition-monitoring systems.
おすすめ
Protocol Bridge and Gateway Modules
The seven UARTs, four SPIs, and three I2C buses of the ATSAM4N16CA-CUR make it a natural single-chip protocol converter, translating between field buses such as RS-485-based Modbus, SPI-attached radio modules, and I2C sensors. The 100 MHz Cortex-M4 core handles concurrent packet parsing and checksum computation with Thumb-2 code density that keeps the firmware well inside 1 MB Flash. Dual-bank-free but generously sized Flash leaves room for a fail-safe bootloader, while the 9x9 mm TFBGA keeps gateway dongles small. Industrial temperature compliance ensures reliable operation in outdoor cabinets and building-automation risers.
おすすめ
Motor Control Auxiliary Boards
In motor-drive systems, the ATSAM4N16CA-CUR serves as the supervisory and communication MCU alongside a dedicated gate driver or power stage. Its DSP instructions execute speed-ramp calculations and field-oriented control auxiliary math at 100 MHz, while multiple UART/SPI channels link the board to host controllers, safety monitoring, and parameter-storage EEPROMs. The 1.62V to 3.6V single-supply operation simplifies integration with standard 3.3V logic rails common on drive boards, and the -40C to +85C rating matches cabinet environments near drive heat. The MPU helps isolate the real-time control firmware from the communication stack.
おすすめ
Building Automation and Smart Appliances
Smart appliances and building-control panels benefit from the ATSAM4N16CA-CUR's balance of memory and connectivity: seven UARTs interface touch panels, NFC readers, and communication modules, while I2C buses connect environmental sensors and EEPROMs storing usage profiles. The 100 MHz Cortex-M4 with 1 MB Flash runs display drivers and local control logic with room for field-updatable firmware, and the industrial temperature range covers unconditioned spaces such as utility rooms. The 9x9 mm TFBGA fits behind panel PCBs with limited height, and single-supply 3.3V operation aligns with typical appliance standby power architectures.
おすすめ
Legacy SAM3S/SAM7S Migration Designs
The ATSAM4N16CA-CUR is the documented migration target for designs built on Atmel SAM3S, SAM3N, and SAM7S devices, thanks to Microchip's pin-to-pin compatibility across 48/64/100-pin versions. Existing PCB layouts can adopt the SAM4N with a firmware port to gain the Cortex-M4 DSP instruction set, 100 MHz performance, and 1 MB Flash without a respin on 100-pin footprints. This makes the part ideal for extending the life of mature industrial products that need added algorithm performance - such as added filtering or encryption - while preserving validated boards, tooling, and regulatory test history built on earlier SAM silicon.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAM4N16CA-CUR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAM4N16CA-CU | ATSAM4N16CA-CFUR | ATSAM4S16CA-CU | ATSAM4E16CA-CUR | ATSAM4LC8BA-UUR |
|---|---|---|---|---|---|---|
| Package | TFBGA-100 (9x9 mm) | TFBGA-100 - same | TFBGA-100 - same | TFBGA-100 - same | TFBGA-100 - same | BGA-100 - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Clock | Cortex-M4, 100 MHz | Cortex-M4, 100 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, lower clock (low-power) | |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | |
| USB / Ethernet | None | None | USB OTG | USB HS + Ethernet MAC | USB device | |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | |
| Pin Compatibility | SAM4N 100-pin (SAM3S/SAM3N/SAM4S compatible) | Identical ball map | Identical ball map | Pin-to-pin (Microchip documented) | Pin-to-pin (Microchip documented) |
主な差別化要因
- Lowest-cost SAM4 100-pin option without unused USB silicon （vs ATSAM4S16CA-CU)
- Broader serial connectivity than most same-class MCUs （vs ATSAM4S8CA-CUR)
- Documented legacy migration path （vs ATSAM4E16CA-CUR)
- Trade-off: no USB or Ethernet （vs ATSAM4E16CA-CUR)
設計ノート
The 100-ball TFBGA (9x9 mm, typically 0.8 mm ball pitch) requires controlled-impedance fanout and via-in-pad or dogbone escapes on a minimum 4-layer PCB. Define power (VDD/VDDCORE/VDDIO) and ground balls early in the fanout and place a solid ground plane on layer 2 directly under the package. Verify your fabricator's minimum via and trace/space capability (generally 4/4 mil or better) before routing, and follow the SAM4N datasheet package drawing for the exact ball map rather than reusing another family's drawing.
Design the power tree around the 1.62V to 3.6V input range with a clean 3.3V rail (or 2.5V for lower-power operation). Each VDD ball needs a local 100 nF decoupling capacitor placed within 2 mm of the ball, with bulk 4.7-10 uF near the package. Note that SAM4N, unlike SAM4S, does not add USB, so the 3.3V rail can be sized smaller. Confirm VDDCORE/VDDIO supply guidance in the SAM4N datasheet electrical characteristics section before finalizing the rail structure.
When migrating from SAM3S/SAM3N/SAM7S, do not assume firmware binaries port without changes: the SAM4N Cortex-M4 core uses Thumb-2 with DSP extensions and a different peripheral register map than SAM7S ARM7 parts. Microchip documents pin-to-pin compatibility, which covers the board, not the code. Additionally, when substituting ATSAM4S parts on the same board, remember they run at 120 MHz and add USB - review clock configuration and Errata before production. Always order industrial (-40C to +85C) grade suffixes for field equipment.
コンプライアンス情報
Mouser lists the part as 'TFBGA GREEN, IND TEMP, MRL A' - GREEN denotes Microchip lead-free/halogen-free green packaging and MRL A is the top material restriction level. REACH and conflict mineral certificates should be requested from Microchip directly.
