ATSAME70Q20B-CFN - ARM Cortex-M7 MCU 300MHz 1MB Flash | Microchip
部品番号: ATSAME70Q20B-CFN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.76 | $13.76 |
| 10 | $12.18 | $121.80 |
| 100 | $10.49 | $1,049.00 |
| 500 | $9.32 | $4,660.00 |
| 1,000 | $8.47 | $8,470.00 |
ATSAME70Q20B-CFN 概要
A Cortex-M7 microcontroller is a 32-bit ARM processor core featuring a six-stage pipeline, hardware single-precision and double-precision floating-point unit, branch prediction, and tightly-coupled memories for deterministic low-latency code and data access. The Cortex-M7 sits at the top of the Cortex-M family and belongs to the ARM microcontroller taxonomy (ARM Cortex-M -> 32-bit MCU -> microcontroller -> semiconductor), bridging the gap between classic microcontrollers and application processors for high-performance DSP and control workloads.
Key features include the 300 MHz Cortex-M7 core with double-precision FPU, 16 KB I-cache and 16 KB D-cache, 1 MB dual-bank Flash with ECC, 384 KB multi-port SRAM, an embedded Flash controller, high-speed USB 2.0 High-Speed with on-chip PHY, dual CAN-FD controllers, an Ethernet MAC with IEEE 1588 1588v2 support, and a 12-bit 2 MSPS ADC. Communication peripherals include HS USB, FS USB, dual CAN-FD, Ethernet GMII/MII, multiple USART/UART/SPI/TWI/I2S, and an SD-card / eMMC-compatible HSMCI interface. The UFBGA-144 package exposes up to 109 GPIO with multiple 5V-tolerant I/O lines.
Typical applications include industrial automation controllers, building automation and HVAC, smart-energy and IEC 62054-21 metering platforms, motor control and field-oriented control drives, automotive body and chassis ECUs, medical instrumentation, point-of-sale terminals, multi-axis CNC and robotics controllers, and high-speed IoT gateways. The Cortex-M7 core paired with the Ethernet MAC, USB HS PHY, and CAN-FD makes this MCU a strong fit for connected industrial nodes requiring real-time control with on-chip connectivity.
When designing with this device, ensure the PCB layout respects the UFBGA-144 0.5 mm ball pitch and 6x6 mm body. Use the on-chip voltage regulator with proper decoupling per the datasheet, keep HS-USB differential pairs length-matched, and validate external SDRAM timing when using the External Bus Interface for extended memory. Always review the latest errata before committing to a board revision.
This page synthesizes Microchip product documentation, distributor pricing, drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet alone.
ドロップイン代替品: ATSAME70Q20B-CFN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAME70Q20B-CFN （同一形状・フットプリント） — 相違点: Package, Core, ADC, External Bus Interface, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAME70Q20B-CFNT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAME70Q20A-CFN
✅ ドロップイン✓ 在庫あり
$9.05 / 個
データシートを見る →ATSAME70Q21B-CFN
✅ ドロップイン✓ 在庫あり
$19.95 / 個
データシートを見る →ATSAMS70Q20B-CFN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAME70N20B-CFN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAME70Q20B-AN
✅ ドロップイン✓ 在庫あり
$10.85 / 個
データシートを見る →ATSAME70Q20B-CFN 最大定格＆電気的特性
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 1 MB (1024 KB) dual-bank with ECC |
| SRAM | 384 KB multi-port SRAM |
| L1 Cache | 16 KB I-cache + 16 KB D-cache |
| パッケージ | 144-ball UFBGA (6x6 mm, 0.5 mm pitch) |
| USB | 1x USB 2.0 High-Speed with on-chip PHY + 1x FS USB |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 Mbit MAC with IEEE 1588 hardware support (GMII/MII) |
| ADC | 12-bit, up to 2 MSPS |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount (UFBGA) |
| RoHS ステータス | Compliant |
ATSAME70Q20B-CFN 144-ball ufbga (6x6 mm, 0.5 mm pitch) ピン配置ガイド
ATSAME70Q20B-CFN (144-ball ufbga (6x6 mm, 0.5 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAME70Q20B-CFN.
詳細は データシート をご参照ください。
主な用途
ATSAME70Q20B-CFN の用途: 8 件s: Industrial Automation and PLC Controllers, Building Automation and HVAC Controllers, Motor Control and Field-Oriented Control Drives, Smart Energy and IEC 62054-21 Metering, High-Speed IoT Gateways and Edge Nodes, Medical Instrumentation and Patient Monitors, Automotive Body and Chassis ECUs, Point-of-Sale Terminals and Multi-Interface Printers.
Industrial Automation and PLC Controllers
The ATSAME70Q20B-CFN's 300 MHz Cortex-M7 with double-precision FPU and 384 KB SRAM handle real-time PID loops at sub-millisecond rates for high-axis-count industrial controllers. Its dual CAN-FD controllers let the part network multiple servo drives and I/O slices over a single bus, and the 10/100 Ethernet MAC with IEEE 1588 hardware timestamping enables tight synchronization with distributed motion controllers. Compared to a Cortex-M4 part running at 180 MHz, the SAME70 roughly doubles the floating-point throughput while retaining deterministic interrupt latency thanks to tightly-coupled SRAM, making it a strong fit for 32-axis machine tools and high-speed packaging lines.
おすすめ
Building Automation and HVAC Controllers
Building-automation controllers benefit from the SAME70's mix of CAN-FD for sensor-bus connectivity, USB HS for firmware updates from a service laptop, and Ethernet MAC for BACnet/IP or Modbus-TCP uplink. The 1 MB Flash holds rich BACnet/Modbus protocol stacks plus a graphical HMI, and the 384 KB SRAM keeps multiple concurrent TCP sockets and real-time scheduling data in zero-wait-state memory. The industrial -40C to +85C operating range covers rooftop and mechanical-room deployment without derating, and the part's Cortex-M7 DSP extensions accelerate FFTs used in vibration-based predictive-maintenance algorithms for HVAC motor health.
おすすめ
Motor Control and Field-Oriented Control Drives
Field-oriented control (FOC) of PMS or AC induction motors demands fast deterministic current-loop math, which the SAME70's Cortex-M7 single-precision FPU and zero-wait-state SRAM deliver at 300 MHz with sub-microsecond loop times. The on-chip 12-bit 2 MSPS ADC synchronizes three-phase current sampling to PWM timing without external analog front ends, and the HSMCI interface logs drive telemetry to SD cards. Across a 10 kHz current loop, the SAME70 typically leaves 60-70% headroom for safety and communication tasks versus roughly 30% on a Cortex-M4 part, supporting sensorless FOC plus CANopen or EtherCAT at the same node.
おすすめ
Smart Energy and IEC 62054-21 Metering
Electricity meters need accurate metrology, secure communications, and a long-life platform, which the ATSAME70Q20B-CFN addresses with its DSP-capable Cortex-M7 core for harmonic analysis, dual CAN-FD or RS-485 interfaces for AMI uplink, and Ethernet MAC for IP-based AMI head-end communication. The 1 MB Flash supports DLMS/COSEM plus tamper-detection firmware with margin, and the 384 KB SRAM buffers simultaneous sampling across multiple voltage and current channels. Unlike a low-end Cortex-M0+ metering MCU that struggles with complex energy-quality algorithms, the SAME70 runs IEC 62053-22 class 0.2 metering and Class A power-quality FFTs in real time.
おすすめ
High-Speed IoT Gateways and Edge Nodes
Edge gateways need on-chip TCP/IP plus TLS without offloading to a separate Wi-Fi module, and the ATSAME70Q20B-CFN's Cortex-M7 300 MHz plus 384 KB SRAM can run lwIP plus mbedTLS with measured TLS-1.2 handshakes under 200 ms on a Cortex-M7. The USB HS PHY provides a high-throughput diagnostic channel, the dual CAN-FD bridges industrial sensors into the IP backhaul, and the Ethernet MAC with 1588 timestamping enables deterministic uplink. The B-silicon revision also resolves errata important for long-lived industrial deployments, which the A revision exposed, making the B revision the preferred baseline for new gateway designs.
おすすめ
Medical Instrumentation and Patient Monitors
Patient monitors combine signal acquisition, DSP analysis, and a graphical display, which the SAME70's 300 MHz Cortex-M7 plus double-precision FPU supports at high sample rates while running an embedded GUI on an LCD or OLED display. The on-chip 12-bit ADC handles ECG and SpO2 front ends, the HS USB port streams waveforms to a host PC for post-analysis, and the 384 KB SRAM keeps rolling waveform buffers in zero-wait-state memory. Compared with a Cortex-M3-based patient monitor that needs an external DSP for FFT analysis, the SAME70 integrates DSP and control on one die, simplifying the medical IEC 60601-1 BOM and reducing overall board area.
おすすめ
Automotive Body and Chassis ECUs
Body controllers and chassis ECUs use the ATSAME70Q20B-CFN's dual CAN-FD interfaces to gateway body-domain messages at 5 Mbit/s, replacing legacy 1 Mbit/s CAN with deterministic low-latency error handling. The 300 MHz Cortex-M7 executes AUTOSAR-classical scheduling plus sensor-fusion DSP for body-domain features such as ride-height estimation, while the 1 MB Flash accommodates the full AUTOSAR stack plus application code. Unlike an entry-level Cortex-M0+ body controller, the SAME70 hosts gateway logic, gateway security, and limited sensor fusion in one MCU, reducing ECU count and CAN bus load on the vehicle network.
おすすめ
Point-of-Sale Terminals and Multi-Interface Printers
POS terminals and multi-function retail peripherals benefit from the SAME70's mix of USB HS device plus host, Ethernet MAC, SD/eMMC HSMCI, and dual CAN-FD or UART peripherals in a UFBGA-144 form factor. The Cortex-M7 runs TLS-secured payment stacks plus printer rasterization and graphical UI concurrently, while the 384 KB SRAM keeps payment transaction buffers and print raster data in zero-wait-state memory. Compared with discrete USB-plus-Ethernet solutions that need two MCUs, the SAME70 collapses the BOM and shortens PCI-PTS certification timelines because the security boundary is a single validated MCU.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAME70Q20B-CFN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAME70Q20B-CFNT | ATSAME70Q20A-CFN | ATSAME70Q21B-CFN | ATSAMS70Q20B-CFN | ATSAME70N20B-CFN |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UFBGA-144 (6x6 mm) | UFBGA-144 (6x6 mm) - same | UFBGA-144 (6x6 mm) - same | UFBGA-144 (6x6 mm) - same | UFBGA-144 (6x6 mm) - same | UFBGA-144 (6x6 mm) - same |
| Core | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Max CPU Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 2 MB (+100%) | 1 MB | 1 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | No (SAMS70 omits Ethernet) | Varies by part variant |
| USB HS PHY | Yes (USB 2.0 High-Speed) | Yes | Yes | Yes | Yes | Yes |
| Silicon Revision | B (current) | B | A (previous, has errata) | B | B | B |
主な差別化要因
- Highest-frequency Cortex-M7 in the Microchip line at 300 MHz （vs ATSAME54N20A-AU)
- Largest on-chip SRAM in the SAME70 family at 384 KB （vs ATSAME70Q20A-CFN)
- Integrated USB 2.0 High-Speed PHY on-chip （vs ATSAMS70Q20B-CFN (SAMS70 line))
- Dual-bank Flash with in-application programming （vs ATSAME70Q21B-CFN (2 MB Flash))
設計ノート
The UFBGA-144 6x6 mm package on 0.5 mm pitch demands via-in-pad escape with microvias and a 4-layer stack-up at minimum. Per the SAM E70 family datasheet, place at least one stitching via per quadrant under the package's central thermal pad, and route HS-USB differential pairs with 90 ohm differential impedance and length matching better than 150 mil. Maintain a continuous reference plane beneath the BGA to control return paths for high-speed signals and to suppress simultaneous-switching-output noise.
The SAME70 integrates a 1.2V core LDO regulator that draws power from the 3.3V VDDIO rail. Place a 10 uF + 100 nF + 10 nF decoupling network as close as possible to VDDCORE pins, and use a separate 3.3V plane for VDDIOP0/VDDIOP1. The on-chip regulator can source the full MCU current at 300 MHz; for designs that exceed thermal or load-current limits, consider an external switching regulator feeding VDDCORE for higher efficiency at full CPU load.
Estimated: at ambient 25C and full 300 MHz CPU load with all peripherals active, internal dissipation is roughly 500-800 mW depending on I/O switching. The UFBGA-144 theta_JA on a 4-layer JEDEC test board is approximately 35 C/W, yielding a 18-28 C junction rise above ambient, which stays inside the 125C max junction. For designs with sustained 100% CPU plus high GPIO toggling, add thermal vias under the central thermal pad to keep junction below 100C in industrial -40C to +85C ambient enclosures.
Do not skip the ERASE pin pull-up on first prototypes - the SAME70 will not boot without correct ERASE/NRESET sequencing at power-up. When using the External Bus Interface with external SDRAM, validate the SMC timing in the datasheet's timing diagrams against your SDRAM datasheet; many field failures come from tRP and tRFC mismatches. Finally, always consult the latest SAM E70 errata document before committing to a board revision; the B silicon fixed several USB HS PHY and CAN-FD issues documented in the A revision errata.
Keep the 50 MHz external crystal traces shorter than 5 mm and shield them with a ground guard ring to prevent noise coupling into the PLL. For Ethernet, route RMII or MII signals away from switching power nodes and keep the 25 MHz Ethernet PHY clock trace length-matched to within 50 mil of the data lines. Place the SD-card / eMMC HSMCI bus on inner layers with reference ground beneath, and decouple the SD-card connector supply with 100 uF bulk plus 10 nF to absorb inrush during card hot-plug events.
コンプライアンス情報
RoHS compliant per Microchip product documentation. Halogen-free UFBGA-144 package. AEC-Q100 not applicable - this part is qualified for industrial/consumer, not automotive; check Microchip automotive catalog for SAME70 AEC-Q100 variants.
