ATSAME70Q21B-CFN - ARM Cortex-M7 MCU 300MHz 2MB Flash 144-UFBGA | Microchip
部品番号: ATSAME70Q21B-CFN ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.93 | $259.30 |
| 100 | $23.07 | $2,307.00 |
| 500 | $21.2 | $10,600.00 |
| 1,000 | $19.95 | $19,950.00 |
ATSAME70Q21B-CFN 概要
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, working memory, and a range of on-chip peripherals. ARM Cortex-M7 is a high-end Cortex-M core featuring superscalar pipelining, tightly-coupled memories (TCM), branch prediction, and an optional FPU optimized for DSP-style algorithms; the SAM E70 specifically adds DSP extensions, MPU, and a deterministic cache architecture. Within the broader taxonomy, ATSAME70Q21B-CFN sits under Microcontrollers -> Integrated Circuits -> Semiconductors, serving as the central compute element in motor control, industrial automation, and audio/graphics subsystems.
Key differentiating features include 2 MB dual-bank Flash allowing live firmware updates without downtime, 384 KB SRAM arranged as 256 KB system + 128 KB for tightly-coupled data access, an integrated 480 Mbps High-Speed USB PHY (Device/Host/OTG), an integrated 10/100 Ethernet MAC with 1588 precision time stamping, dual CAN-FD controllers, a 12-bit 2 Msps ADC with up to 24 channels, and hardware crypto accelerators for AES, TRNG, and SHA. The Cortex-M7 DSP extensions (single-precision MAC and SIMD) deliver sustained DSP throughput that is competitive with low-end DSP parts.
Architecturally, the SAM E70 uses Microchip's Event System, parallel capture peripherals, and a 16-channel Peripheral DMA controller to keep I/O offload efficient. Voltage is supplied via a built-in LDO and on-chip buck-capable regulator chain, supporting 3.3 V single-supply operation with internal core regulation. The 300 MHz core, combined with 16 KB I-cache and 16 KB D-cache, makes the device effective for high-rate signal chains and HMI applications.
Typical applications include industrial drives and motor control (Field-Oriented Control of PMSM/BLDC), automotive CAN-FD body controllers, building automation gateways, point-of-sale terminals, audio amplifiers and DSP front-ends, robotics controllers, and connected IoT edge nodes with Ethernet or USB. The part is well-suited to graphical HMI panels that pair the MCU with an external display via the 16-bit HSIF.
When designing with the ATSAME70Q21B-CFN, pay attention to the UFBGA-144 6x6 mm land pattern and provide adequate via-in-pad thermal dissipation; the 300 MHz core draws significant dynamic current, so a 4-layer PCB with a continuous GND plane is recommended for signal integrity and EMI. Use Microchip's MPLAB Harmony 3 framework and the SAME70 Xplained Ultra board for rapid prototyping.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical layout notes that go beyond the manufacturer datasheet, giving engineers a single decision-ready reference.
ドロップイン代替品: ATSAME70Q21B-CFN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAME70Q21B-CFN （同一形状・フットプリント） — 相違点: Ethernet, Package, SRAM, USB, CAN.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAME70Q21B-CFNT
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9.95 / 個
データシートを見る →ATSAME70Q21B-CN
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$16.75 / 個
データシートを見る →ATSAME70Q20B-CFN
✅ ドロップイン✓ 在庫あり
$8.47 / 個
データシートを見る →ATSAME70N21B-CFN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAMS70N21B-CFN
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAME70Q21B-CFN 最大定格＆電気的特性
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum Core Clock | 300 MHz |
| Flash Memory | 2 MB (dual-bank) |
| SRAM | 384 KB |
| パッケージ | 144-UFBGA (6x6 mm) |
| USB | USB 2.0 High-Speed with on-chip PHY (Device/Host/OTG) |
| CAN | 2x CAN-FD |
| Ethernet | 10/100 MAC with 1588 PTP hardware assist |
| Crypto Accelerator | AES, TRNG, SHA |
| External Bus Interface | 16-bit HSIF (up to 133 MHz) for SRAM/FPGA |
| DMA | 16-channel Peripheral DMA + Event System |
| DSP Extensions | Single-precision MAC, SIMD instructions |
ATSAME70Q21B-CFN 144-ufbga (6x6 mm) ピン配置ガイド
ATSAME70Q21B-CFN (144-ufbga (6x6 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: ATSAME70Q21B-CFN.
詳細は データシート をご参照ください。
主な用途
ATSAME70Q21B-CFN の用途: 6 件s: Field-Oriented Control of PMSM and BLDC Motors, Industrial CAN-FD Gateway and Body Controller, Audio DSP Front-End and Amplifier Controller, USB 2.0 High-Speed Data Acquisition and Streaming, Connected IoT Edge Node with Ethernet and TLS, Robotics Controller and Human-Machine Interface.
Field-Oriented Control of PMSM and BLDC Motors
The ATSAME70Q21B-CFN's 300 MHz Cortex-M7 with FPU and DSP extensions executes Park/Clarke transforms and PI current loops in single-digit microseconds, making it a strong fit for Field-Oriented Control (FOC) of PMSM and BLDC motors in industrial drives, drones, and e-mobility. On-chip peripherals include 16-bit PWM with complementary outputs and dead-time insertion, a 12-bit 2 Msps ADC with up to 24 channels for phase current sensing, and quadrature-decoder interfaces for incremental encoders. The 384 KB SRAM fits sensorless observers and field-weakening tables without external memory, and the dual-bank 2 MB Flash enables live OTA tuning of motor parameters. Designers typically pair it with a high-side gate driver like the Microchip MCP8026 and a 3-phase inverter using six 40 V MOSFETs; the chip can sustain 20 kHz PWM without leaving CPU headroom for housekeeping tasks.
おすすめ
Industrial CAN-FD Gateway and Body Controller
Dual integrated CAN-FD controllers on the ATSAME70Q21B-CFN make it a natural choice for industrial CAN-FD gateways that bridge classical CAN 2.0B traffic with high-bandwidth CAN-FD segments at up to 5 Mbps. The Cortex-M7 core parses CAN-FD frames in real time and routes them to Ethernet via the integrated 10/100 MAC with 1588 PTP hardware assist, enabling sub-millisecond timestamping for synchronized drive systems. The 2 MB dual-bank Flash lets gateway firmware be updated in the field without downtime, while the 384 KB SRAM holds multiple protocol stacks (CANopen, J1939, or CAN-FD profiles) concurrently. A typical design uses a TJA1044GT CAN transceiver, an Ethernet transformer, and the HS USB port as a service/diagnostic channel; the part runs the gateway stack from open-source libsockets or a commercial CANopen library without external memory.
おすすめ
Audio DSP Front-End and Amplifier Controller
Audio products that need high-rate signal processing - such as active speakers, smart amplifiers, and automotive headrest audio - benefit from the ATSAME70Q21B-CFN's Cortex-M7 DSP extensions (single-precision MAC and SIMD) running at 300 MHz. The part can sustain multi-channel EQ, compression, and active-noise-cancellation algorithms in real time, while the 384 KB SRAM holds 50-100 ms of audio buffers per channel at 48 kHz without external memory. The 16-bit HSIF external bus interface connects to a dedicated audio DAC like the Microchip MCP4728 or an external SRAM for buffer expansion in higher-channel-count designs. A typical 4-channel Class-D amplifier board pairs the SAM E70 with four gate drivers and uses I2S inputs from a Bluetooth audio SoC; the chip can apply loudness compensation and dynamic EQ with zero audible latency.
おすすめ
USB 2.0 High-Speed Data Acquisition and Streaming
The integrated USB 2.0 High-Speed PHY on the ATSAME70Q21B-CFN eliminates the ULPI bridge chip typically required for HS USB on Cortex-M parts, reducing BOM cost and freeing board space in data-acquisition and streaming designs. The part can sustain 480 Mbps USB throughput into an external 16 MB SRAM buffer via HSIF while the Cortex-M7 performs 12-bit ADC captures at up to 2 Msps across multiple channels. This makes it well suited to USB oscilloscope probes, USB spectrum analyzers, and USB streaming audio interfaces where the device appears to the host as a high-speed audio or vendor-class endpoint. A practical implementation uses the Microchip USB stack from MPLAB Harmony and a USB-C connector with USB Power Delivery negotiation handled by an external FUSB302 chip; the SAM E70 manages the application layer and the bulk transfers.
おすすめ
Connected IoT Edge Node with Ethernet and TLS
The ATSAME70Q21B-CFN targets connected IoT edge nodes that require Ethernet for wired backhaul plus hardware cryptography for TLS 1.3 handshakes. The integrated 10/100 Ethernet MAC with 1588 PTP, paired with an external PHY, delivers deterministic latency on industrial Ethernet networks such as PROFINET or EtherCAT (with software stack), while the on-chip AES, TRNG, and SHA accelerators offload the cryptographic heavy-lifting that would otherwise stall the Cortex-M7. The 384 KB SRAM fits an MQTT-SN or OPC-UA stack plus TLS buffers, and the 2 MB dual-bank Flash hosts the application firmware with OTA updates. A typical industrial sensor hub design uses a 4-pin RJ45 with integrated magnetics, an external PHY, and a backup CAN-FD link for redundancy; the chip can sustain hundreds of TLS sessions per minute without measurable CPU saturation.
おすすめ
Robotics Controller and Human-Machine Interface
Robotics applications need deterministic, multi-axis motor control plus a high-bandwidth link to sensors, actuators, and a graphical HMI panel. The ATSAME70Q21B-CFN drives up to six axes of servo control via its PWM and ADC peripherals while reserving CPU headroom to drive an external LCD over the 16-bit HSIF bus, a 10/100 Ethernet link to the supervisory PLC, and dual CAN-FD channels to safety or expansion modules. The 2 MB Flash accommodates real-time operating systems such as FreeRTOS with FAT file system plus bootloader and application slots, and the 384 KB SRAM fits a multi-tasking kernel plus graphics buffers. Designers typically pair it with a 4.3-inch TFT display, a 6-axis IMU over SPI, and CAN-FD motor controllers in each joint; the chip can refresh the HMI at 60 Hz while maintaining 1 kHz servo update rates without jitter.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAME70Q21B-CFN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAME70Q21B-CFNT | ATSAME70Q20B-CFN | ATSAME70N21B-CFN |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-UFBGA (6x6 mm) | 144-UFBGA (6x6 mm) - same | 144-UFBGA (6x6 mm) - same | 144-UFBGA (6x6 mm) - same |
| Core | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz |
| Flash | 2 MB dual-bank | 2 MB dual-bank | 1 MB (-50%) | 2 MB dual-bank |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | Yes (10/100 with 1588) | Yes | Yes | No |
| USB HS | On-chip HS PHY | On-chip HS PHY | On-chip HS PHY | On-chip HS PHY |
| CAN-FD | 2x | 2x | 2x | 2x |
| Crypto Accelerator | AES, TRNG, SHA | AES, TRNG, SHA | AES, TRNG, SHA | AES, TRNG, SHA |
| 1-piece Price (USD) | $28.50 | $28.50 (T&R) | $24.20 (est. -15%) | $26.10 (est. -8%) |
主な差別化要因
- Highest-density Flash and dual-bank OTA in this UFBGA-144 footprint （vs ATSAME70Q20B-CFN)
- Dual CAN-FD plus integrated 10/100 Ethernet MAC in one chip （vs ATSAME70N21B-CFN)
- On-chip USB 2.0 High-Speed PHY eliminates external ULPI bridge （vs STM32F746IGT6)
- AES, TRNG, and SHA hardware crypto on-chip （vs STM32F746IGT6)
設計ノート
The 144-UFBGA 6x6 mm package requires via-in-pad PCB technology for reliable assembly and thermal dissipation. Use 0.3 mm ball pitch with 0.4 mm drilled micro-vias and a 4-layer stack-up: top signal + GND + power + bottom signal. The exposed die pad under the UFBGA must be soldered to a continuous ground plane for heat spreading; an interrupted ground plane will raise junction temperature and reduce reliability. Estimated: a typical 144-UFBGA 6x6 mm PCB layout with via-in-pad and a 1 oz copper ground plane yields theta_JA around 25-30 C/W, sufficient for industrial applications. Use ENIG surface finish and HASL is NOT recommended for fine-pitch BGA assembly.
Estimated: at 300 MHz active core and full peripheral set, the ATSAME70Q21B-CFN draws approximately 120-150 mA from a 3.3 V supply, requiring a regulator capable of delivering at least 200 mA with adequate headroom. Use a low-noise LDO such as the Microchip MCP1703 or a small buck regulator ahead of the VDD pin; place the bulk 10 uF ceramic + 0.1 uF decoupling pair within 5 mm of each power pin pair. The internal core regulator chain (LDO + main regulator) must have a 4.7 uF capacitor on VDDCORE and a 1 uF on VDDPLL to maintain phase margin per the datasheet's power-supply sequencing diagram.
A common pitfall is treating the UFBGA-144 footprint as a drop-in for a different MCU family such as STM32F746 in LQFP-176 - they are NOT pin-compatible and require a new PCB. Another common pitfall is leaving the on-chip USB HS PHY unpowered while toggling USB-related GPIO pins, which can back-power the transceiver through ESD diodes; always strap VDDUTMI to 3.3 V before any USB activity. When migrating from ATSAME70Q21A to the Q21B revision, confirm the errata list - the B revision typically fixes USB suspend behavior but introduces a new note on DMA descriptor alignment that must be observed in custom drivers.
Estimated: route the 16-bit HSIF external memory bus with impedance-controlled traces (typically 50 ohm single-ended with 100 ohm differential clocks) and length-match data, address, and clock within 25 ps to avoid capture-clock skew. Keep the analog VDDA and VDDANA pins separated from the digital 3.3 V plane by a 2 mm moat or a ferrite bead, and place the AVSS analog ground pin directly under the 12-bit ADC traces for noise immunity. The 12 MHz crystal pads should have guard rings to GND and the load capacitors should be NPO/C0G to minimize temperature drift of the USB 480 MHz PLL multiplication.
コンプライアンス情報
RoHS compliance and lead-free termination confirmed per Microchip product page; REACH and halogen-free status not explicitly stated in provided data and marked unknown.
